CN106400067A - Single-layer micro-nano double-scale enhanced boiling heat transfer copper surface structure and preparing method thereof - Google Patents
Single-layer micro-nano double-scale enhanced boiling heat transfer copper surface structure and preparing method thereof Download PDFInfo
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- CN106400067A CN106400067A CN201610829432.2A CN201610829432A CN106400067A CN 106400067 A CN106400067 A CN 106400067A CN 201610829432 A CN201610829432 A CN 201610829432A CN 106400067 A CN106400067 A CN 106400067A
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- heat transfer
- copper surface
- boiling heat
- enhanced boiling
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
Abstract
The invention discloses a single-layer micro-nano double-scale enhanced boiling heat transfer copper surface structure and a preparing method thereof. A copper surface of the enhanced boiling heat transfer copper surface structure is of a single-layer surface structure composed of micron large holes and hole walls with nano hole gaps. The single-layer multi-scale micro-nano enhanced boiling heat transfer surface has the lower wall face overheat degree when boiling begins and in the boiling process. In addition, the simple low-cost large-scale preparing method for preparing the single-layer micro-nano double-scale enhanced boiling heat transfer copper surface is suitable for modifying shapes of various boiling substrate surfaces, expensive mechanical devices are not needed, and the surface saves energy, is environment-friendly, is short in generation period and has the good industrial application prospect.
Description
Technical field
The invention belongs to material science, specifically, it is related to a kind of double yardstick enhanced boiling heat transfer of micro-nano of monolayer
Copper surface texture and preparation method thereof.
Background technology
Enhanced boiling heat transfer has the characteristics that Low Temperature Difference, high heat flux, is to solve small size, High power microelectronic radiating
One of effective way of problem.Porous material, such as sintering metal loose structure（CN 105180709 A）Deng, be commonly used to increase
The critical heat flux density of boiling surface（CHF）.But generally also can along with boiling initial period, when that is, heat flow density is relatively low,
Wall superheat spends high problem.In recent years, with the development of technology, multiple dimensioned boiling surface is more and more paid attention to,
By the control of multiple dimensioned size, realize gas passage and separate with fluid passage, thus improving the CHF of boiling surface.Meanwhile,
It is known that pore scale is bigger, during bubble nucleation, required wall superheat degree is less.So, Multi-scale model boiling surface
It is expected to reach wall superheat when can reach raising CHF and reduce initial boiling and spend high problem.
With the development of nanotechnology, the surface that micron is combined with nanoscale starts to apply to pool boiling augmentation of heat transfer neck
Domain, particularly uses the appearance of the micro-nano porous structure of bubble hydrogen template preparation（S. H. Li, R. Furberg, M. S.
Toprak, B. Palm and M. Muhammed, Adv. Funct. Mater., 2008, 18, 2215-2220）, by
In it in process of production, after the effect of bubble, the natural structure beneficial to bubble formation and disengaging can be generated, it is possible to having
Improve the effect of the heat exchange of boiling well.But, it excessively enriches multilevel hierarchy（Aperture is progressively amplified）Structure, by working medium
Firmly adsorb in boiling surface bottom so that thermal resistance increases, in initial boiling, wall superheat is spent greatly（P. F. Xu,
Q. Li and Y. M. Xuan, International Journal of Heat and Mass Transfer, 2015,
80, 107-114）.
Content of the invention
For tradition hydrogen template preparation loose structure initial boiling when wall superheat spend too high problem,
It is an object of the invention to provide a kind of double yardstick enhanced boiling heat transfer copper surface texture of micro-nano of monolayer, can make when boiling is initial
There is relatively low wall superheat degree, also there is higher critical heat flux density simultaneously.
Another object of the present invention is to providing the preparation method of above-mentioned strengthening boiling surface structure.
In order to achieve the above object, the present invention employs the following technical solutions：
A kind of enhanced boiling heat transfer copper surface texture, copper surface is micron macropore and the monolayer of the composition of the hole wall with nanoaperture
Surface texture.
In above-mentioned enhanced boiling heat transfer copper surface texture, the aperture of described micron macropore is identical with top in bottom.
In above-mentioned enhanced boiling heat transfer copper surface texture, the aperture size of described micron macropore is 50 ~ 250 μm.
In above-mentioned enhanced boiling heat transfer copper surface texture, the size of described nanoaperture is in 100-900 nanometer.
In above-mentioned enhanced boiling heat transfer copper surface texture, the thickness of described monolayer surface structure is 50 ~ 400 μm.
The preparation method of above-mentioned enhanced boiling heat transfer copper surface texture, comprises the following steps：
（1）Surface preparation：Using dilution heat of sulfuric acid, hot alkaline solution, the surface oxides at deionized water cleaning cuprio bottom and oil
Dirty；
（2）Surface deposits：Using cuprio bottom as negative electrode, copper sheet is anode, puts in acidic electrolysis bath, logical unidirectional current, keeps cloudy
Electrode current density, electrodeposit reaction；
（3）Sample sinters：Under protection of reducing atmosphere, it is sintered, strengthen product mechanical strength.
In above-mentioned preparation method, step（2）Described acidic electrolysis bath consist of sulphuric acid 0.5 ~ 1.5M and copper sulfate
0.05~0.6M.
In above-mentioned preparation method, step（2）Middle electric current density is 0.5 ~ 1A/cm2.
In above-mentioned preparation method, step（2）The electrodeposit reaction time is 5 ~ 300s.
In above-mentioned preparation method, step（3）Middle sintering temperature is 400 ~ 800 DEG C.
Compared with prior art, the present invention has the advantages that：
1. the invention provides a kind of double yardstick enhanced boiling heat transfer copper table of micro-nano of easy low cost large-scale preparation of monolayer
The preparation method of face structure, be suitable for various boiling substrate surface shapes modify, and need not be valuable plant equipment, energy-conservation
Environmental protection, generates cycle is short, therefore has good prospects for commercial application.
2. the present invention compares with traditional electro-deposition micro-nano multi-scale surface, double yardstick micro-nano enhanced boiling heat transfer tables of monolayer
There is lower wall superheat degree in face when boiling is initial and in boiling process.
Brief description
Fig. 1 is the electron microscope of the double yardstick enhanced boiling heat transfer copper surface texture of micro-nano of monolayer, and (a) amplifies 100 times of electricity
Mirror figure；B () is wall partial enlarged drawing；
Fig. 2 is the pool boiling curve comparison figure with existing multiple layer of copper surface texture for the monolayer heat transfer copper surface texture of embodiment 1.
Specific embodiment
With reference to concrete accompanying drawing and preferred embodiments, the present invention is more specifically described in detail.
Embodiment 1：
（1）Surface preparation：Using dilution heat of sulfuric acid, hot alkaline solution, the surface oxides at deionized water cleaning cuprio bottom and oil
Dirty.
（2）Surface deposits：Using cuprio bottom as negative electrode, copper sheet is anode, and putting into solution ratio is 1.0M sulphuric acid, 0.4M sulfur
In the electrolyte of sour copper.Logical unidirectional current, holding cathode-current density is 1A/cm2, the electrodeposit reaction time is 30s.
（3）Sample sinters：Under protection of reducing atmosphere, carry out heat treatment, sintering temperature is 710 DEG C, to strengthen product machine
Tool intensity, thus obtain sample.
As shown in figure 1, copper surface is micron macropore and the monolayer surface structure of the composition of the hole wall with nanoaperture.State micro-
The aperture of meter great Kong is essentially identical in bottom and top.The aperture size of micron macropore is 50 ~ 250 μm.The size of nanoaperture
In 100-900 nanometer.The thickness of monolayer surface structure is 50 ~ 400 μm.
Embodiment 2：
（1）Surface preparation：Using dilution heat of sulfuric acid, hot alkaline solution, the surface oxides at deionized water cleaning cuprio bottom and oil
Dirty.
（2）Surface deposits：Using cuprio bottom as negative electrode, copper sheet is anode, and putting into solution ratio is 1.5M sulphuric acid, 0.1M sulfur
In the electrolyte of sour copper.Logical unidirectional current, holding cathode-current density is 0.5A/cm2, the electrodeposit reaction time is 200s.
（3）Sample sinters：Under protection of reducing atmosphere, carry out heat treatment, sintering temperature is 410 DEG C, to strengthen product machine
Tool intensity, thus obtaining sample, electron microscope is basically identical with Fig. 1.
Claims (10)
1. a kind of enhanced boiling heat transfer copper surface texture is it is characterised in that copper surface is micron macropore and has nanoaperture
The monolayer surface structure of hole wall composition.
2. enhanced boiling heat transfer copper surface texture as claimed in claim 1 is it is characterised in that the aperture of described micron macropore exists
Bottom is identical with top.
3. enhanced boiling heat transfer copper surface texture as claimed in claim 1 is it is characterised in that the aperture chi of described micron macropore
Very little is 50 ~ 250 μm.
4. enhanced boiling heat transfer copper surface texture as claimed in claim 1 is it is characterised in that the size of described nanoaperture exists
100-900 nanometer.
5. enhanced boiling heat transfer copper surface texture as claimed in claim 1 is it is characterised in that the thickness of described monolayer surface structure
Spend for 50 ~ 400 μm.
6. the preparation method of enhanced boiling heat transfer copper surface texture described in claim 1 is it is characterised in that comprise the following steps：
（1）Surface preparation：Using dilution heat of sulfuric acid, hot alkaline solution, the surface oxides at deionized water cleaning cuprio bottom and oil
Dirty；
（2）Surface deposits：Using cuprio bottom as negative electrode, copper sheet is anode, puts in acidic electrolysis bath, logical unidirectional current, keeps cloudy
Electrode current density, electrodeposit reaction；
（3）Sample sinters：Under protection of reducing atmosphere, it is sintered, strengthen product mechanical strength.
7. preparation method as claimed in claim 6 is it is characterised in that step（2）Described acidic electrolysis bath consist of sulphuric acid
0.5 ~ 1.5M and copper sulfate 0.05 ~ 0.6M.
8. preparation method as claimed in claim 6 is it is characterised in that step（2）Middle electric current density is 0.5 ~ 1A/cm2.
9. preparation method as claimed in claim 6 is it is characterised in that step（2）The electrodeposit reaction time is 5 ~ 300s.
10. preparation method as claimed in claim 6 is it is characterised in that step（3）Middle sintering temperature is 400 ~ 800 DEG C.
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108364806A (en) * | 2018-02-09 | 2018-08-03 | 中山大学 | A kind of tree-shaped three-dimensional structure metal material and preparation method thereof and application in the battery |
| CN109023459A (en) * | 2018-08-04 | 2018-12-18 | 中山大学 | A kind of multiple dimensioned surface texture and preparation method thereof for strengthening boiling of bilayer |
| CN110158127A (en) * | 2019-05-15 | 2019-08-23 | 重庆大学 | A kind of method for the critical heat flux density that enhanced heat transfer surfaces liquid film dryouies |
| CN110408977A (en) * | 2019-06-20 | 2019-11-05 | 吴赞 | The multiple dimensioned reinforcing boiling function surface of one kind and composite preparation process |
| CN110424041A (en) * | 2019-06-20 | 2019-11-08 | 吴赞 | A kind of modulated modified surface preparation method for being used to strengthen boiling |
| CN112176369A (en) * | 2019-07-03 | 2021-01-05 | 中国科学院苏州纳米技术与纳米仿生研究所 | High-efficiency boiling heat transfer copper material and preparation method thereof |
| CN112210802A (en) * | 2019-07-10 | 2021-01-12 | 中国科学院苏州纳米技术与纳米仿生研究所 | Flower-shaped boiling heat transfer structure and preparation method thereof |
| CN114481237A (en) * | 2022-03-11 | 2022-05-13 | 中山大学 | Porous structure surface with high capillary performance and high boiling heat transfer performance and preparation method thereof |
| CN114703534A (en) * | 2022-04-13 | 2022-07-05 | 中山大学 | Electrodeposition device and method capable of reducing edge effect and improving capillary performance |
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| CN103046088A (en) * | 2012-12-20 | 2013-04-17 | 华南理工大学 | Micro-nano composite porous copper surface structure and preparation method and device thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108364806A (en) * | 2018-02-09 | 2018-08-03 | 中山大学 | A kind of tree-shaped three-dimensional structure metal material and preparation method thereof and application in the battery |
| CN109023459A (en) * | 2018-08-04 | 2018-12-18 | 中山大学 | A kind of multiple dimensioned surface texture and preparation method thereof for strengthening boiling of bilayer |
| CN109023459B (en) * | 2018-08-04 | 2021-03-16 | 中山大学 | Double-layer multi-scale enhanced boiling surface structure and preparation method thereof |
| CN110158127A (en) * | 2019-05-15 | 2019-08-23 | 重庆大学 | A kind of method for the critical heat flux density that enhanced heat transfer surfaces liquid film dryouies |
| CN110408977A (en) * | 2019-06-20 | 2019-11-05 | 吴赞 | The multiple dimensioned reinforcing boiling function surface of one kind and composite preparation process |
| CN110424041A (en) * | 2019-06-20 | 2019-11-08 | 吴赞 | A kind of modulated modified surface preparation method for being used to strengthen boiling |
| CN112176369A (en) * | 2019-07-03 | 2021-01-05 | 中国科学院苏州纳米技术与纳米仿生研究所 | High-efficiency boiling heat transfer copper material and preparation method thereof |
| CN112210802A (en) * | 2019-07-10 | 2021-01-12 | 中国科学院苏州纳米技术与纳米仿生研究所 | Flower-shaped boiling heat transfer structure and preparation method thereof |
| CN114481237A (en) * | 2022-03-11 | 2022-05-13 | 中山大学 | Porous structure surface with high capillary performance and high boiling heat transfer performance and preparation method thereof |
| CN114703534A (en) * | 2022-04-13 | 2022-07-05 | 中山大学 | Electrodeposition device and method capable of reducing edge effect and improving capillary performance |
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Application publication date: 20170215 |