CN106398618A - High density resin adhesive - Google Patents

High density resin adhesive Download PDF

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Publication number
CN106398618A
CN106398618A CN201610747957.1A CN201610747957A CN106398618A CN 106398618 A CN106398618 A CN 106398618A CN 201610747957 A CN201610747957 A CN 201610747957A CN 106398618 A CN106398618 A CN 106398618A
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CN
China
Prior art keywords
parts
butadiene
block copolymer
styrene
styrene block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610747957.1A
Other languages
Chinese (zh)
Inventor
吴家猛
吴刚
陈铖
丁维
李伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANHUI SKY EYE INTELLIGENT TECHNOLOGY Co Ltd
Original Assignee
ANHUI SKY EYE INTELLIGENT TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANHUI SKY EYE INTELLIGENT TECHNOLOGY Co Ltd filed Critical ANHUI SKY EYE INTELLIGENT TECHNOLOGY Co Ltd
Priority to CN201610747957.1A priority Critical patent/CN106398618A/en
Publication of CN106398618A publication Critical patent/CN106398618A/en
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/06—Unsaturated polyesters having carbon-to-carbon unsaturation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Abstract

The invention discloses a high density resin adhesive, which comprises the following raw materials by weight: 100 parts of 189 unsaturated polyester resin, 10-30 parts of modified styrene-butadiene-styrene block copolymer, 1-5 parts of benzoyl peroxide, 10-20 parts of rosin, 5-15 parts of a cellulose thickener, 1-6 parts of gas phase titanium dioxide, 2-8 parts of heavy calcium carbonate, 5-12 parts of kaolin, 5-10 parts of silicon nitride micropowder, 2-10 parts of graphene nanosheet, 1-5 parts of graphene clay, 5-12 parts of mica powder, 1-6 parts of barite powder, 1-2 parts of organic bentonite, 2-6 parts of calcined clay, 1-2 parts of a dispersing agent, and 80-140 parts of water. The high density resin adhesive provided by the invention has the advantages of excellent high temperature resistance, high polymerization density and high mechanical strength.

Description

A kind of high-density resin adhesive
Technical field
The present invention relates to field of adhesive technology, more particularly, to a kind of high-density resin adhesive.
Background technology
Resin adhesive is widely used in life various aspects at present.Resin adhesive adopts medicated bag packaged form, containing tree Fat clay and firming agent two component.One or more peroxide such as benzoyl peroxide are adopted at present as initiation in firming agent Agent, adds that plasticizer, water, thickening agent, inorganic filler etc. are configured to pasty state or paste, then comes into operation.But current resin is gluing The density of agent and mechanical strength also can not meet demand it would be highly desirable to improve.
Content of the invention
The technical problem being existed based on background technology, the present invention proposes a kind of high-density resin adhesive, heat-resisting quantity Can be excellent, polymerization density is high, and mechanical strength is big.
A kind of high-density resin adhesive proposed by the present invention, its raw material includes by weight：189 unsaturated polyester resins 100 parts, 10～30 parts of modified styrene-butadiene-styrene block copolymer, 1～5 part of benzoyl peroxide, Colophonium 10～ 20 parts, 5～15 parts of cellulose thickener, 1～6 part of gas phase titanium dioxide, 2～8 parts of ground calcium carbonate, 5～12 parts of Kaolin, nitrogen 5～10 parts of SiClx micropowder, 2～10 parts of graphene nanometer sheet, 1～5 part of Graphene clay, 5～12 parts of mica powder, blanc fixe 1 ～6 parts, 1～2 part of organobentonite, 2～6 parts of calcinated argil, 1～2 part of dispersant, 80～140 parts of water.
Preferably, 189 unsaturated polyester resins, modified styrene-butadiene-styrene block copolymer, benzoyl peroxide The weight of formyl is than for 100：15～25：2～4.
Preferably, modified styrene-butadiene-styrene block copolymer, Colophonium, dispersant weight than for 15～ 25：12～18：1.3～1.5.
Preferably, its raw material includes by weight：189 100 parts of unsaturated polyester resins, modified styrene-butadiene-benzene 15～25 parts of ethylene block copolymer, 2～4 parts of benzoyl peroxide, 12～18 parts of Colophonium, 8～12 parts of cellulose thickener, gas 3～5 parts of phase titanic oxide, 4～6 parts of ground calcium carbonate, 8～10 parts of Kaolin, 6～8 parts of silicon nitride powder, graphene nanometer sheet 4～8 parts, 2～4 parts of Graphene clay, 8～10 parts of mica powder, 2～4 parts of blanc fixe, 1.3～1.7 parts of organobentonite, forge Burn 3～5 parts of potter's clay, 1.3～1.5 parts of dispersant, 100～120 parts of water.
Preferably, modified styrene-butadiene-styrene block copolymer adopts following technique preparation：By Colophonium, poly- second Alkene wax, styrene butadiene styrene block copolymer (SBS) mixing, heating, stirring, addition sulfur continuation stirring, cooling, insulation, It is cooled to room temperature, dry, pulverize and obtain modified styrene-butadiene-styrene block copolymer.
Preferably, modified styrene-butadiene-styrene block copolymer adopts following technique preparation：By weight will 20～40 parts of Colophoniumes, 1～5 part of Tissuemat E, 5～15 parts of styrene butadiene styrene block copolymer (SBS) mixing, heating, stir Mix, add 0.5～1.5 part of sulfur to continue stirring, cooling, insulation, be cooled to room temperature, dry, pulverize and obtain modified phenylethylene-fourth Styrene block copolymer.
Preferably, modified styrene-butadiene-styrene block copolymer adopts following technique preparation：By weight will 20～40 parts of Colophoniumes, 1～5 part of Tissuemat E, 5～15 parts of styrene butadiene styrene block copolymer (SBS) mixing, are heated to 190～200 DEG C, stir 20～50min, mixing speed is 300～500r/min, add 0.5～1.5 part of sulfur to continue stirring 1 ～5min, is cooled to 150～160 DEG C, is incubated 80～120min, is cooled to room temperature, dry, pulverize and obtain modified phenylethylene-fourth Styrene block copolymer.
In the modified styrene-butadiene-styrene block copolymer of the present invention, Colophonium, styrene-butadiene-benzene second , under Tissuemat E effect, the compatibility is fabulous for alkene block copolymer, good with sulfur effect crosslinking degree under certain condition, makes institute The resistance to elevated temperatures obtaining product is excellent, and the compatibility is good and between 189 unsaturated polyester resins, benzoyl peroxide, enters simultaneously One step strengthens the resistance to elevated temperatures after solidification polymerization, and polymerization density is high, high mechanical strength；Modified styrene-butadiene-styrene Block copolymer and Colophonium synergism, with ground calcium carbonate, Kaolin, silicon nitride powder, Graphene under dispersant effect Nanometer sheet, Graphene clay, mica powder, blanc fixe, organobentonite, calcinated argil phase separation, can be quickly fully in moistening State material, reduce interfacial tension, prevent from settling and condense, so that the density of the present invention and mechanical strength is further enhanced, Er Qiecheng This is low.
Specific embodiment
Below, by specific embodiment, technical scheme is described in detail.
Embodiment 1
A kind of high-density resin adhesive proposed by the present invention, its raw material includes by weight：189 unsaturated polyester resins 100 parts, 10 parts of modified styrene-butadiene-styrene block copolymer, 5 parts of benzoyl peroxide, 10 parts of Colophonium, cellulose 15 parts of thickening agent, 1 part of gas phase titanium dioxide, 8 parts of ground calcium carbonate, 5 parts of Kaolin, 10 parts of silicon nitride powder, graphene nano 2 parts of piece, 5 parts of Graphene clay, 5 parts of mica powder, 6 parts of blanc fixe, 1 part of organobentonite, 6 parts of calcinated argil, dispersant 1 Part, 140 parts of water.
Embodiment 2
A kind of high-density resin adhesive proposed by the present invention, its raw material includes by weight：189 unsaturated polyester resins 100 parts, 30 parts of modified styrene-butadiene-styrene block copolymer, 1 part of benzoyl peroxide, 20 parts of Colophonium, cellulose 5 parts of thickening agent, 6 parts of gas phase titanium dioxide, 2 parts of ground calcium carbonate, 12 parts of Kaolin, 5 parts of silicon nitride powder, graphene nanometer sheet 10 parts, 1 part of Graphene clay, 12 parts of mica powder, 1 part of blanc fixe, 2 parts of organobentonite, 2 parts of calcinated argil, dispersant 2 Part, 80 parts of water.
Modified styrene-butadiene-styrene block copolymer adopts following technique preparation：By weight 30 parts are dripped Blue or green, 3 parts of Tissuemat Es, 10 parts of styrene butadiene styrene block copolymer (SBS) mixing, heating, stirring, add 1 part of sulfur to continue Continuous stirring, cooling, insulation, it is cooled to room temperature, dry, pulverize and obtain modified styrene-butadiene-styrene block copolymer.
Embodiment 3
A kind of high-density resin adhesive proposed by the present invention, its raw material includes by weight：189 unsaturated polyester resins 100 parts, 15 parts of modified styrene-butadiene-styrene block copolymer, 4 parts of benzoyl peroxide, 12 parts of Colophonium, cellulose 12 parts of thickening agent, 3 parts of gas phase titanium dioxide, 6 parts of ground calcium carbonate, 8 parts of Kaolin, 8 parts of silicon nitride powder, graphene nanometer sheet 4 parts, 4 parts of Graphene clay, 8 parts of mica powder, 4 parts of blanc fixe, 1.3 parts of organobentonite, 5 parts of calcinated argil, dispersant 1.3 Part, 120 parts of water.
Modified styrene-butadiene-styrene block copolymer adopts following technique preparation：By weight 40 parts are dripped Blue or green, 1 part of Tissuemat E, 15 parts of styrene butadiene styrene block copolymer (SBS) mixing, are heated to 190 DEG C, stir 50min, Mixing speed is 300r/min, adds 1.5 parts of sulfur to continue stirring 1min, is cooled to 160 DEG C, is incubated 80min, is cooled to room Temperature, dry, pulverize and obtain modified styrene-butadiene-styrene block copolymer.
Embodiment 4
A kind of high-density resin adhesive proposed by the present invention, its raw material includes by weight：189 unsaturated polyester resins 100 parts, 25 parts of modified styrene-butadiene-styrene block copolymer, 2 parts of benzoyl peroxide, 18 parts of Colophonium, cellulose 8 parts of thickening agent, 5 parts of gas phase titanium dioxide, 4 parts of ground calcium carbonate, 10 parts of Kaolin, 6 parts of silicon nitride powder, graphene nanometer sheet 8 parts, 2 parts of Graphene clay, 10 parts of mica powder, 2 parts of blanc fixe, 1.7 parts of organobentonite, 3 parts of calcinated argil, dispersant 1.5 parts, 100 parts of water.
Modified styrene-butadiene-styrene block copolymer adopts following technique preparation：By weight 20 parts are dripped Blue or green, 5 parts of Tissuemat Es, 5 parts of styrene butadiene styrene block copolymer (SBS) mixing, are heated to 200 DEG C, stir 20min, stir Mixing speed is 500r/min, adds 0.5 part of sulfur to continue stirring 5min, is cooled to 150 DEG C, is incubated 120min, is cooled to room temperature, Dry, pulverize and obtain modified styrene-butadiene-styrene block copolymer.
Embodiment 5
A kind of high-density resin adhesive proposed by the present invention, its raw material includes by weight：189 unsaturated polyester resins 100 parts, 20 parts of modified styrene-butadiene-styrene block copolymer, 3 parts of benzoyl peroxide, 15 parts of Colophonium, cellulose 10 parts of thickening agent, 4 parts of gas phase titanium dioxide, 5 parts of ground calcium carbonate, 9 parts of Kaolin, 7 parts of silicon nitride powder, graphene nanometer sheet 6 parts, 3 parts of Graphene clay, 9 parts of mica powder, 3 parts of blanc fixe, 1.5 parts of organobentonite, 4 parts of calcinated argil, dispersant 1.4 Part, 110 parts of water.
Modified styrene-butadiene-styrene block copolymer adopts following technique preparation：By Colophonium, Tissuemat E, benzene Ethylene-butadiene-styrene block copolymer mixes, heating, stirring, adds sulfur to continue stirring, cooling, insulation, is cooled to Room temperature, dry, pulverize and obtain modified styrene-butadiene-styrene block copolymer.
The above, the only present invention preferably specific embodiment, but protection scope of the present invention is not limited thereto, Any those familiar with the art the invention discloses technical scope in, technology according to the present invention scheme and its Inventive concept equivalent or change in addition, all should be included within the scope of the present invention.

Claims (7)

1. a kind of high-density resin adhesive is it is characterised in that its raw material includes by weight：189 unsaturated polyester resins 100 Part, 10～30 parts of modified styrene-butadiene-styrene block copolymer, 1～5 part of benzoyl peroxide, Colophonium 10～20 Part, 5～15 parts of cellulose thickener, 1～6 part of gas phase titanium dioxide, 2～8 parts of ground calcium carbonate, 5～12 parts of Kaolin, nitridation 5～10 parts of silicon powder, 2～10 parts of graphene nanometer sheet, 1～5 part of Graphene clay, 5～12 parts of mica powder, blanc fixe 1～6 Part, 1～2 part of organobentonite, 2～6 parts of calcinated argil, 1～2 part of dispersant, 80～140 parts of water.
2. according to claim 1 high-density resin adhesive it is characterised in that 189 unsaturated polyester resins, modified benzene second Alkene-butadiene-styrene block copolymer, the weight of benzoyl peroxide are than for 100：15～25：2～4.
3. high-density resin adhesive according to claim 1 or claim 2 is it is characterised in that modified styrene-butadiene-benzene second Alkene block copolymer, Colophonium, the weight of dispersant are than for 15～25：12～18：1.3～1.5.
4. according to any one of claim 1-3 high-density resin adhesive it is characterised in that its raw material wraps by weight Include：189 100 parts of unsaturated polyester resins, 15～25 parts of modified styrene-butadiene-styrene block copolymer, benzoyl peroxide 2～4 parts of formyl, 12～18 parts of Colophonium, 8～12 parts of cellulose thickener, 3～5 parts of gas phase titanium dioxide, ground calcium carbonate 4～6 Part, 8～10 parts of Kaolin, 6～8 parts of silicon nitride powder, 4～8 parts of graphene nanometer sheet, 2～4 parts of Graphene clay, mica powder 8 ～10 parts, 2～4 parts of blanc fixe, 1.3～1.7 parts of organobentonite, 3～5 parts of calcinated argil, 1.3～1.5 parts of dispersant, water 100～120 parts.
5. according to any one of claim 1-4 high-density resin adhesive it is characterised in that modified styrene-butadiene- Styrene block copolymer adopts following technique preparation：By Colophonium, Tissuemat E, s-B-S block copolymerization Thing mixes, heating, stirring, adds sulfur to continue stirring, cooling, insulation, is cooled to room temperature, dry, pulverize and obtain modified benzene second Alkene-butadiene-styrene block copolymer.
6. according to any one of claim 1-5 high-density resin adhesive it is characterised in that modified styrene-butadiene- Styrene block copolymer adopts following technique preparation：By weight by 20～40 parts of Colophoniumes, 1～5 part of Tissuemat E, 5～15 Part styrene butadiene styrene block copolymer (SBS) mixing, heating, stirring, add 0.5～1.5 part of sulfur continuation stirring, fall Temperature, insulation, it is cooled to room temperature, dry, pulverize and obtain modified styrene-butadiene-styrene block copolymer.
7. according to any one of claim 1-6 high-density resin adhesive it is characterised in that modified styrene-butadiene- Styrene block copolymer adopts following technique preparation：By weight by 20～40 parts of Colophoniumes, 1～5 part of Tissuemat E, 5～15 Part styrene butadiene styrene block copolymer (SBS) mixing, is heated to 190～200 DEG C, stirs 20～50min, mixing speed For 300～500r/min, add 0.5～1.5 part of sulfur to continue stirring 1～5min, be cooled to 150～160 DEG C, insulation 80～ 120min, is cooled to room temperature, dry, pulverize and obtains modified styrene-butadiene-styrene block copolymer.
CN201610747957.1A 2016-08-27 2016-08-27 High density resin adhesive Pending CN106398618A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610747957.1A CN106398618A (en) 2016-08-27 2016-08-27 High density resin adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610747957.1A CN106398618A (en) 2016-08-27 2016-08-27 High density resin adhesive

Publications (1)

Publication Number Publication Date
CN106398618A true CN106398618A (en) 2017-02-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1646632A (en) * 2002-02-07 2005-07-27 克拉通聚合物研究有限公司 Polymer modified bitumen compositions
CN103205210A (en) * 2013-03-19 2013-07-17 江苏鹿山光伏科技有限公司 High-temperature-resistant hot melt adhesive membrane for aluminum honeycomb boards, and preparation method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1646632A (en) * 2002-02-07 2005-07-27 克拉通聚合物研究有限公司 Polymer modified bitumen compositions
CN103205210A (en) * 2013-03-19 2013-07-17 江苏鹿山光伏科技有限公司 High-temperature-resistant hot melt adhesive membrane for aluminum honeycomb boards, and preparation method thereof

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Application publication date: 20170215