CN106398579A - Adhesive tape for processing process protection - Google Patents

Adhesive tape for processing process protection Download PDF

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Publication number
CN106398579A
CN106398579A CN201610984698.4A CN201610984698A CN106398579A CN 106398579 A CN106398579 A CN 106398579A CN 201610984698 A CN201610984698 A CN 201610984698A CN 106398579 A CN106398579 A CN 106398579A
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Prior art keywords
adhesive tape
processing procedure
layer
sensitive adhesive
tape according
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Granted
Application number
CN201610984698.4A
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Chinese (zh)
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CN106398579B (en
Inventor
邵新萍
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Ningbo Kai Xin Mstar Technology Ltd
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Ningbo Kai Xin Mstar Technology Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/16—Homopolymers or copolymers of alkyl-substituted styrenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J145/00—Adhesives based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09J157/02—Copolymers of mineral oil hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
    • C09J193/04—Rosin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/10—Presence of homo or copolymers of propene
    • C09J2423/106—Presence of homo or copolymers of propene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
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    • C09J2453/00—Presence of block copolymer
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    • C09J2475/00—Presence of polyurethane
    • C09J2475/006—Presence of polyurethane in the substrate
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2493/00—Presence of natural resin

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention provides an adhesive tape for processing process protection. The adhesive tape for processing process protection is characterized by comprising a release film layer, a pressure-sensitive adhesive layer, a thermosensitive adhesive layer and a base material layer which are laminated sequentially. The adhesive tape for processing process protection has the advantages that the thermosensitive adhesive layer is non-adhesive at the initial period of lamination and is improved in peel strength after being heated to have fixing and protecting effects, so that bubbles or imprints generated when adhesive materials wrap shells can be reduced, and the processing process protection effect is improved.

Description

A kind of processing procedure protection adhesive tape
【Technical field】
The present invention relates to adhesive area, more particularly, to a kind of processing procedure protection adhesive tape.
【Background technology】
With the fast development of electronic product, all-metal integration fuselage is one of element most popular at present.Quan Jin Belong to integral machine body in process will through a series of surface treatment, such as polishing, plating, spraying, etching, radium-shine etc. one The complicated technique of series.These processes are necessary to need a material to carry out process protection to it, it is to avoid other non-processing positions Scratch, damage.
At present, typically adopt the protecting film such as PET protection film, PE protecting film, PVC protecting film, OPP protecting film to non-processing portion Divide and carry out processing procedure protection.But, PET protection film due to base material PET harder it is impossible to stick turning and radian position well, no Effective processing procedure protection can be played；And although PE protecting film, PVC protecting film, OPP protecting film base material are softer, due to glue-line tool There is pressure-sensitive, can not perfectly stick turning and radian position in the process of sticking, lead to alveolate residual, through one be so The processing of row technique has bubble marking residual, impact product appearance and yield after peeling off protecting film.Taking i Phone shell as a example, Inside the shell because excessive turning and radian lead to general protecting film cannot completely wrap up in the course of processing, thus leading to Product yield is relatively low.
For problem above, a adhesive material that can wrap up shell turning and radian very well of present market in urgent need.
【Content of the invention】
It is an object of the invention to provide a kind of processing procedure protection adhesive tape, shell turning and radian can be wrapped up, improve system Journey protected effect.The technical scheme is that：
A kind of processing procedure protection adhesive tape it is characterised in that include fit successively release film layer, pressure-sensitive adhesive layer, heat-sensitive glue Layer and substrate layer.This adhesive tape is inviscid in laminating initial stage heat sensitive adhesive layer, and heated rear heat sensitive adhesive layer peel strength improves, and reaches solid Effect that is fixed and protecting.
Further, above-mentioned heat sensitive adhesive layer is rubber-like heat-sensitive glue.Because only that the heat sensitization temperature of rubber-like heat-sensitive glue It is suitable for processing procedure protection, other temperature are too high or viscosity is too big, and heavy industry is not so good as rubber-based products.
Further, the rubberization thickness of above-mentioned heat sensitive adhesive layer is 5-20 μm, and after 5 μm of high temperature of ＜, adhesion strength is relatively low, easily disengages, After 20 μm of high temperature of ＞, adhesion strength is too high, has cull to pollute, or even be difficult to peel off after leading to peel off.
Further, above-mentioned substrate layer be polyurethane film, polyethylene film, polyvinyl chloride film, poly ester urethane thin film, Polypropylene film, polybutylene terephthalate (PBT) thin film.Above-mentioned several thin film is softer, and followability preferably, can meet more preferably The risk pasting effect, reducing alice.
Further, above-mentioned heat sensitive adhesive layer is made up of the raw material including following parts by weight：Rubber elastomer 40-50 part, Tackifying resin 50-60 part, softening agent 0-5 part, antioxidant 0-10 divide.The heat-sensitive glue that this formula is made is temperature sensitive, certain Heat under can reach the effect of fixing protection, and can easily peel off after cooling down, be easy to use and operate.
Further, above-mentioned heat sensitive adhesive layer also includes plasticizer 0-5 part, reduces the softening temperature of glue-line, suitable control glue The Tg value of stick.
Further, above-mentioned rubber elastomer is polystyrenebutadienes polymer, s-B-S Block copolymer, styrene isoprene styrene block copolymer (SIS), styrene-ethylene-butylene-styrene block copolymerization One or more of thing, styrene ethylene-propylene-styrene block copolymer.Above-mentioned material is during producing adhesive Low cost, strong operability, cooperation process is simple, polymerizing reactor that need not be special.
Further, above-mentioned tackifying resin is terpene resin, rosin resin, Petropols, poly- a- methylstyrene resin One or more of, with rubber elastomer, there is the fabulous compatibility, on the premise of guaranteeing adhesive peel strength, have Splendid weatherability and stability.
Further, above-mentioned softening agent is one or more of alkane paraffin, microcrystalline wax, can improve the first of product Phase adhesive property, has larger effect to the levelability of adhesive.
Further, above-mentioned antioxidant is 2,6 ditertiary butyl p cresol (antioxidant 264), four [β-(3,5- bis- tertiary fourths Base -4- hydroxy phenyl) propanoic acid] pentaerythritol ester (antioxidant 1010), 2,2' methylene bis (4- methyl-6-tert butyl phenol) are (anti- Oxygen agent 2246) one or more of, add such product can be very good absorb ultraviolet, improve adhesive weatherability and Stability.
The present invention has following beneficial technique effect：
The present invention, by adopting four-layer structure, arranges heat-sensitive glue between substrate layer and pressure sensitive adhesive, and the laminating initial stage is inviscid, Adhesive tape is sticked inside shell by vac sorb, is subsequently heated intensification, and when temperature is promoted to base material softening temperature, base material starts Deliquescing and colloid is still inviscid, fine with the turning of shell and radian position now by the softer base material of vac sorb and glue-line Contact, continue intensification colloid and start to produce viscosity, heat sensitive adhesive layer peel strength improves, reach fixing and protection effect, fall After temperature, adhesive tape can stick on surface of shell well, thus avoiding scuffing or the damage to it in subsequent technique, can reduce The bubble of adhesive material parcel shell turning and the generation of radian position or the marking, and the processing procedure work conventional compared to integrated casing Skill, parcel and protected area improve 10-25%, and the incidence rate pasting bubble reduces 15-40%, reduces technology difficulty simultaneously, Yield can improve 10%-30%；The present invention not only can meet be not likely to produce between protecting film and clung body impact attractive in appearance and The bubble using, also can reach perfect heavy industry effect, when abnormal especially during pasting, convenient when heated shells From and do not stay cull；The present invention using softer polyethylene film, polyurethane film, polyvinyl chloride film, poly ester urethane thin film, The materials such as polypropylene film, polybutylene terephthalate (PBT) thin film are base material, and followability preferably, can meet and preferably paste Effect, reduces the risk of alice, improves protected effect further.
【Brief description】
Fig. 1 is the structural representation of the adhesive tape of the present invention.
Description of symbols：1, release film layer；2, heat sensitive adhesive layer；3, pressure-sensitive adhesive layer；4, substrate layer.
【Specific embodiment】
Below in conjunction with specific embodiment, the present invention is described further.
Embodiment provided below simultaneously is not used to limit the scope that the present invention is covered, and described step is not to use To limit its execution sequence.Those skilled in the art do conspicuously improved with reference to existing common knowledge to the present invention, also fall Enter within the protection domain of application claims.
Embodiment 1
Release film layer 1 that a kind of processing procedure protection adhesive tape it is characterised in that include is fitted successively, heat sensitive adhesive layer 2, pressure-sensitive Glue-line 3 and substrate layer 4, as shown in Figure 1.Wherein, substrate layer 4 is polyethylene film, and release film layer 1 is silicon systems mould release membrance, temperature-sensitive Glue-line 2 is rubber-like heat-sensitive glue.The thickness of substrate layer 4 is 30 μm.
Above-mentioned rubber-like heat-sensitive glue is made up of the component including following parts by weight：S-B-S block 45 parts of copolymer, 55 parts of terpene resin, 1 part of alkane paraffin, 5 parts of DBPC 2,6 ditertiary butyl p cresol (antioxidant 264).
The preparation method of above-mentioned adhesive tape is as follows：
1) preparation of rubber-like heat-sensitive glue：Respectively will be molten to styrene butadiene styrene block copolymer (SBS), terpene resin Solution forms the slurry that solid content is 50%, adds 90kg rubber slurry, 110kg resin slurry, 1kg alkane stone in agitating device Wax and 5kg 2,6 ditertiary butyl p cresol (antioxidant 264), dissolve and stir into the thick liquid of stable homogeneous.
2) pressure sensitive adhesive with 200 mesh filter screen filtration and is stood 30min, coat mould release membrance layer upper surface with comma axle, apply Glue thickness is 10 μm, and oven temperature is set to 50 DEG C, 60 DEG C, 80 DEG C, 100 DEG C, 120 DEG C, 110 DEG C, 100 DEG C, and coating speed is 15-30m/min, after being dried, the one side high with polyethylene film surface tension carries out curling of fitting, and forms pressure-sensitive adhesive layer 3 and base material Layer 4, this mould release membrance is peeled off when next step is fitted.
3) the rubber-like heat-sensitive glue being obtained with 200 mesh filter screen filtration and is stood 30min, coated with comma axle release Film, rubberization thickness is 5 μm, and oven temperature is set to 50 DEG C, 60 DEG C, 80 DEG C, 100 DEG C, 120 DEG C, 110 DEG C, 100 DEG C, coating speed Spend for 15-30m/min, after being dried completely, form heat sensitive adhesive layer 2 and release film layer 1, by heat sensitive adhesive layer 2 with peel off after mould release membrance Pressure-sensitive adhesive layer 3 fit, be placed in ripening under uniform temperature after the completion of winding.
Using this adhesive tape as Fructus Mali pumilae integrated mobile phone inside of metal outershell processing procedure protection adhesive tape, initial stage heat sensitive adhesive layer of fitting Inviscid, by vac sorb, material is sticked inside shell, be subsequently heated intensification, when temperature is promoted to base material softening temperature When, base material starts deliquescing and colloid is still inviscid, now by the softer base material of vac sorb and glue-line and turning and radian portion Position contacts well, continues intensification colloid and starts to produce viscosity, after cooling, adhesive tape can stick on case inside well, overcomes The insoluble problem of other adhesive tapes, can solve casing turning and radian position during making compared to conventional adhesive tape The problems such as cannot wrapping up or wrap up bad generation bubble, the marking and remain, yield improves more than 20%, not only simple production process, And easy to operate, significantly reduce the cost of product.
Embodiment 2
Release film layer 1 that a kind of processing procedure protection adhesive tape it is characterised in that include is fitted successively, heat sensitive adhesive layer 2, pressure-sensitive Glue-line 3 and substrate layer 4, as shown in Figure 1.Wherein, substrate layer 4 is polyvinyl chloride film, and release film layer 1 is silicon systems mould release membrance, heat Quick glue-line 2 is rubber-like heat-sensitive glue.The thickness of substrate layer is 50 μm.
Above-mentioned rubber-like heat-sensitive glue is made up of the component including following parts by weight：Styrene-isoprene-phenylethene is embedding 50 parts of copolymer of section, 60 parts of rosin resin, 5 parts of alkane paraffin, 5 parts of dioctyl phthalate (DOP), four [β-(3,5- bis- uncles Butyl -4- hydroxy phenyl) propanoic acid] 10 parts of pentaerythritol ester (antioxidant 1010).
The preparation method of above-mentioned processing procedure protection adhesive tape is as follows：
1) preparation of rubber-like heat-sensitive glue：Respectively by styrene isoprene styrene block copolymer (SIS), rosin resin Dissolving forms the slurry that solid content is 50%, adds 100kg rubber slurry, 120kg resin slurry, 5kg alkane in agitating device Hydrocarbon paraffin, 5kg dioctyl phthalate (DOP) and 10kg tetra- [β-(3,5- di-tert-butyl-hydroxy phenyl) propanoic acid] season penta Four alcohol esters (antioxidant 1010), dissolve completely and stir into the thick liquid of stable homogeneous.
2) pressure sensitive adhesive with 300 mesh filter screen filtration and is stood 35min, coat mould release membrance layer upper surface with comma axle, apply Glue thickness is 20 μm, and oven temperature is set to 50 DEG C, 60 DEG C, 80 DEG C, 100 DEG C, 120 DEG C, 110 DEG C, 100 DEG C, and coating speed is 15-30m/min, after being dried, face high with polyvinyl chloride film surface tension carries out fitting batching, and forms pressure-sensitive adhesive layer 3 and substrate layer 4, this mould release membrance is peeled off when next step is fitted.
3) the rubber-like heat-sensitive glue being obtained with 300 mesh filter screen filtration and is stood 35min, coated with comma axle release Film, rubberization thickness is 10 μm, and oven temperature is set to 50 DEG C, 60 DEG C, 80 DEG C, 100 DEG C, 120 DEG C, 110 DEG C, 100 DEG C, coating speed Spend for 15-30m/min, after being dried completely, form heat sensitive adhesive layer 2 and release film layer 1, by heat sensitive adhesive layer 2 with peel off after mould release membrance Pressure-sensitive adhesive layer 3 fit, be placed in ripening under uniform temperature after the completion of winding.
Using this adhesive tape as integrated mobile phone inside of metal outershell processing procedure protection adhesive tapes such as Huawei, initial stage heat-sensitive glue of fitting Layer is inviscid, is sticked material inside shell by vac sorb, is subsequently heated intensification, when temperature is promoted to base material softening temperature When, base material starts deliquescing and colloid is still inviscid, now by the softer base material of vac sorb and glue-line and turning and radian portion Position contacts well, continues intensification colloid and starts to produce viscosity, after cooling, adhesive tape can stick on case inside well, overcomes The insoluble problem of other adhesive tapes, can solve casing turning and radian portion during making compared to conventional adhesive tape It is impossible to the problems such as parcel or parcel bad generation bubble, the marking remain, yield improves more than 30%, not only production technology letter for position Single and easy to operate, significantly reduce the cost of product.
Embodiment 3
Release film layer 1 that a kind of processing procedure protection adhesive tape it is characterised in that include is fitted successively, heat sensitive adhesive layer 2, pressure-sensitive Glue-line 3 and substrate layer 4, as shown in Figure 1.Wherein, substrate layer 4 is polyethylene film, and release film layer 1 is silicon systems mould release membrance, temperature-sensitive Glue-line 2 is rubber-like heat-sensitive glue.The thickness of substrate layer is 100 μm.
Above-mentioned rubber-like heat-sensitive glue is made up of the component including following parts by weight：Styrene-ethylene-butylene-styrene 40 parts of block copolymer, 50 parts of Petropols, 2 parts of microcrystalline wax, 2,2' methylene bis (4- methyl-6-tert butyl phenol) (antioxygen Agent 2246) 2 parts.
The preparation method of above-mentioned processing procedure protection adhesive tape is as follows：
1) preparation of rubber-like heat-sensitive glue：Respectively by styrene-ethylene-butylene-styrene block copolymer, Petropols Dissolving forms the slurry that solid content is 80%, adds 50kg rubber slurry, 62.5kg resin slurry, 2kg micro- in agitating device Spar wax and 2kg 2,2'- di-2-ethylhexylphosphine oxide (4- methyl-6-tert butyl phenol) (antioxidant 2246), dissolving completely and stirs into homogeneous Stable thick liquid.
2) pressure sensitive adhesive with 150 mesh filter screen filtration and is stood 30min, coat mould release membrance layer upper surface with comma axle, apply Glue thickness is 15 μm, and oven temperature is set to 50 DEG C, 60 DEG C, 80 DEG C, 100 DEG C, 120 DEG C, 110 DEG C, 100 DEG C, and coating speed is 15-30m/min, after being dried, rear face high with polyethylene film surface tension carries out fitting batching, and forms pressure-sensitive adhesive layer 3 and substrate layer 4, this mould release membrance is peeled off when next step is fitted.
3) the rubber-like heat-sensitive glue being obtained with 150 mesh filter screen filtration and is stood 30min, coated with comma axle release Film, rubberization thickness is 5 μm, and oven temperature is set to 50 DEG C, 60 DEG C, 80 DEG C, 100 DEG C, 120 DEG C, 110 DEG C, 100 DEG C, coating speed Spend for 15-30m/min, after being dried completely, form heat sensitive adhesive layer 2 and release film layer 1, by heat sensitive adhesive layer 2 with peel off after mould release membrance Pressure-sensitive adhesive layer 3 fit, be placed in ripening under uniform temperature after the completion of winding.
Using this adhesive tape as integrated mobile phone inside of metal outershell processing procedure protection adhesive tape, initial stage heat sensitive adhesive layer of fitting is no viscous Property, by vac sorb, material is sticked inside shell, be subsequently heated intensification, when temperature is promoted to base material softening temperature, base Material starts deliquescing and colloid is still inviscid, fine with turning and radian position now by the softer base material of vac sorb and glue-line Contact, continue intensification colloid start produce viscosity, after cooling, adhesive tape can stick on case inside well, overcomes other glue Carry insoluble problem, can solve casing turning and radian position during making compared to conventional adhesive tape it is impossible to The problems such as parcel or parcel bad generation bubble, the marking remain, yield improves more than 10%, not only simple production process, and behaviour Facilitate, significantly reduce the cost of product.
Embodiment 4
Release film layer 1 that a kind of processing procedure protection adhesive tape it is characterised in that include is fitted successively, heat sensitive adhesive layer 2, pressure-sensitive Glue-line 3 and substrate layer 4, as shown in Figure 1.Wherein, substrate layer 4 is poly ester urethane thin film, and release film layer 1 is silicon systems mould release membrance, heat Quick glue-line 2 is rubber-like heat-sensitive glue.The thickness of substrate layer is 80 μm.
Above-mentioned rubber-like heat-sensitive glue is made up of the component including following parts by weight：Styrene ethylene-propylene-styrene 42 parts of block copolymer, 52 parts of poly- a- methylstyrene resin, 2 parts of DBPC 2,6 ditertiary butyl p cresol (antioxidant 264), four [β- (3,5- di-tert-butyl-hydroxy phenyl) propanoic acid] 6 parts of pentaerythritol ester (antioxidant 1010).
The preparation method of above-mentioned processing procedure protection adhesive tape is as follows：
1) preparation of rubber-like heat-sensitive glue：Respectively by styrene ethylene-propylene-styrene block copolymer, poly- a- methyl Styrene resin dissolving forms the slurry that solid content is 50%, adds 84kg rubber slurry, 104kg paste resin in agitating device Material, 2kg2,6- ditertbutylparacresol (antioxidant 264), 6kg tetra- [β-(3,5- di-tert-butyl-hydroxy phenyl) propanoic acid] season Doutrate (antioxidant 1010), dissolves completely and stirs into the thick liquid of stable homogeneous.
2) pressure sensitive adhesive with 150 mesh filter screen filtration and is stood 30min, coat mould release membrance layer upper surface with comma axle, apply Glue thickness is 15 μm, and oven temperature is set to 50 DEG C, 60 DEG C, 80 DEG C, 100 DEG C, 120 DEG C, 110 DEG C, 100 DEG C, and coating speed is 15-30m/min, after being dried, rear face high with poly ester urethane film surface tension force carries out fitting batching, and forms pressure-sensitive adhesive layer 3 and base material Layer 4, this mould release membrance is peeled off when next step is fitted.
3) the rubber-like heat-sensitive glue being obtained with 150 mesh filter screen filtration and is stood 30min, coated with comma axle release Film, rubberization thickness is 8 μm, and oven temperature is set to 50 DEG C, 60 DEG C, 80 DEG C, 100 DEG C, 120 DEG C, 110 DEG C, 100 DEG C, coating speed Spend for 15-30m/min, after being dried completely, form heat sensitive adhesive layer 2 and release film layer 1, by heat sensitive adhesive layer 2 with peel off after mould release membrance Pressure-sensitive adhesive layer 3 fit, be placed in ripening under uniform temperature after the completion of winding.
Using this adhesive tape as Integral computer inside of metal outershell processing procedure protection adhesive tape, fit initial stage heat sensitive adhesive layer no Viscosity, is sticked material inside shell by vac sorb, is subsequently heated intensification, when temperature is promoted to base material softening temperature, Base material starts deliquescing and colloid is still inviscid, now by the softer base material of vac sorb and glue-line and turning and radian position very Good contact, continues intensification colloid and starts to produce viscosity, after cooling, adhesive tape can stick on case inside well, overcomes other The insoluble problem of adhesive tape, can solve casing turning and radian position during making, no compared to conventional adhesive tape The problems such as method parcel or parcel bad generation bubble, the marking remain, yield raising more than 20%, not only simple production process, and Easy to operate, significantly reduce the cost of product.
Embodiment 5
Release film layer 1 that a kind of processing procedure protection adhesive tape it is characterised in that include is fitted successively, heat sensitive adhesive layer 2, pressure-sensitive Glue-line 3 and substrate layer 4, as shown in Figure 1.Wherein, substrate layer 4 is polyethylene film, and release film layer 1 is silicon systems mould release membrance, temperature-sensitive Glue-line 2 is rubber-like heat-sensitive glue.The thickness of substrate layer is 40 μm.
Above-mentioned rubber-like heat-sensitive glue is made up of the component including following parts by weight：S-B-S block 20 parts of copolymer, 28 parts of styrene isoprene styrene block copolymer (SIS), 10 parts of terpene resin, 10 parts of rosin resin, poly- 35 parts of a- methylstyrene resin, 3 parts of microcrystalline wax.
The preparation method of above-mentioned processing procedure protection adhesive tape is as follows：
1) preparation of rubber-like heat-sensitive glue：In proportion by styrene butadiene styrene block copolymer (SBS), styrene-different The dissolving of isoprene-styrene block copolymer forms the rubber slurry that solid content is 50%, by terpene resin, rosin resin, gathers A- methylstyrene resin dissolving formed solid content be 50% resin slurry, in agitating device add 96kg rubber slurry, 110kg resin slurry, 3kg microcrystalline wax, dissolve completely and stir into the thick liquid of stable homogeneous.
2) pressure sensitive adhesive with 100 mesh filter screen filtration and is stood 30min, coat mould release membrance layer upper surface with comma axle, apply Glue thickness is 20 μm, and oven temperature is set to 50 DEG C, 60 DEG C, 80 DEG C, 100 DEG C, 120 DEG C, 110 DEG C, 100 DEG C, and coating speed is 15-30m/min, after being dried, rear face high with polyethylene film surface tension carries out fitting batching, and forms pressure-sensitive adhesive layer 3 and substrate layer 4, this mould release membrance is peeled off when next step is fitted.
3) the rubber-like heat-sensitive glue being obtained with 100 mesh filter screen filtration and is stood 30min, coated with comma axle release Film, rubberization thickness is 5 μm, and oven temperature is set to 50 DEG C, 60 DEG C, 80 DEG C, 100 DEG C, 120 DEG C, 110 DEG C, 100 DEG C, coating speed Spend for 15-30m/min, after being dried completely, form heat sensitive adhesive layer 2 and release film layer 1, will be release with stripping first for heat sensitive adhesive layer 2 Pressure-sensitive adhesive layer 3 after film is fitted, and is placed in ripening under uniform temperature after the completion of winding.
Processing procedure protection adhesive tape inside using this adhesive tape as integral intelligent machine shell, laminating initial stage heat sensitive adhesive layer is no viscous Property, by vac sorb, material is sticked inside shell, be subsequently heated intensification, when temperature is promoted to base material softening temperature, base Material starts deliquescing and colloid is still inviscid, fine with turning and radian position now by the softer base material of vac sorb and glue-line Contact, continue intensification colloid start produce viscosity, after cooling, adhesive tape can stick on case inside well, overcomes other glue Carry insoluble problem, can solve casing turning and radian position during making compared to conventional adhesive tape it is impossible to The problems such as parcel or the parcel bad generation marking remain, yield improves more than 20%, not only simple production process, and operation side Just, significantly reduce the cost of product.
Embodiment 6
Release film layer 1 that a kind of processing procedure protection adhesive tape it is characterised in that include is fitted successively, heat sensitive adhesive layer 2, pressure-sensitive Glue-line 3 and substrate layer 4, as shown in Figure 1.Wherein, substrate layer 4 is polypropylene film, and release film layer 1 is silicon systems mould release membrance, temperature-sensitive Glue-line 2 is rubber-like heat-sensitive glue.The thickness of substrate layer is 75 μm.
Above-mentioned rubber-like heat-sensitive glue is made up of the component including following parts by weight：S-B-S block 20 parts of copolymer, 10 parts of styrene isoprene styrene block copolymer (SIS), styrene-ethylene-butylene-styrene block are altogether 10 parts of polymers, 10 parts of styrene ethylene-propylene-styrene block copolymer, 10 parts of terpene resin, 10 parts of rosin resin, oil 15 parts of resin, 10 parts of poly- a- methylstyrene resin, 4 parts of alkane paraffin, 1 part of DBPC 2,6 ditertiary butyl p cresol (antioxidant 264), Four [β-(3,5- di-tert-butyl-hydroxy phenyl) propanoic acid] 1 part of pentaerythritol ester (antioxidant 1010), 2,2'- di-2-ethylhexylphosphine oxide (4- Methyl-6-tert butyl phenol) 1 part of (antioxidant 2246).
The preparation method of above-mentioned processing procedure protection adhesive tape is as follows：
1) preparation of rubber-like heat-sensitive glue：In proportion by styrene butadiene styrene block copolymer (SBS), styrene-different Isoprene-styrene block copolymer, styrene-ethylene-butylene-styrene block copolymer, styrene ethylene-propylene-benzene Ethylene block copolymer dissolving forms the rubber slurry that solid content is 50%, in proportion by terpene resin, rosin resin, oil tree Fat, the dissolving of poly- a- methylstyrene resin form the resin slurry that solid content is 50%, add 100kg rubber in agitating device Slurry, 90kg resin slurry, alkane paraffin 4kg, 2,6 ditertiary butyl p cresol (antioxidant 264) 1kg, four [β-(3,5- bis- uncles Butyl -4- hydroxy phenyl) propanoic acid] pentaerythritol ester (antioxidant 1010) 1kg, 2,2' methylene bis (4- methyl-6-tert butyl Phenol) (antioxidant 2246) 1kg, dissolves completely and stirs into the thick liquid of stable homogeneous.
2) pressure sensitive adhesive with 200 mesh filter screen filtration and is stood 30min, coat mould release membrance layer upper surface with comma axle, apply Glue thickness is 10 μm, and oven temperature is set to 50 DEG C, 60 DEG C, 80 DEG C, 100 DEG C, 120 DEG C, 110 DEG C, 100 DEG C, and coating speed is 15-30m/min, after being dried, rear face high with polyethylene film surface tension carries out fitting batching, and forms pressure-sensitive adhesive layer 3 and substrate layer 4, this mould release membrance is peeled off when next step is fitted.
3) the rubber-like heat-sensitive glue being obtained with 200 mesh filter screen filtration and is stood 30min, coated with comma axle release Film, rubberization thickness is 10 μm, and oven temperature is set to 50 DEG C, 60 DEG C, 80 DEG C, 100 DEG C, 120 DEG C, 110 DEG C, 100 DEG C, coating speed Spend for 15-30m/min, after being dried completely, form heat sensitive adhesive layer 2 and release film layer 1, by heat sensitive adhesive layer 2 with peel off after mould release membrance Pressure-sensitive adhesive layer 3 fit, be placed in ripening under uniform temperature after the completion of winding.
Using this adhesive tape as integrated electric equipment inside of metal outershell processing procedure protection adhesive tape, initial stage heat sensitive adhesive layer of fitting Inviscid, by vac sorb, material is sticked inside shell, be subsequently heated intensification, when temperature is promoted to base material softening temperature When, base material starts deliquescing and colloid is still inviscid, now by the softer base material of vac sorb and glue-line and turning and radian portion Position contacts well, continues intensification colloid and starts to produce viscosity, after cooling, adhesive tape can stick on case inside well, overcomes The insoluble problem of other adhesive tapes, can solve casing turning and radian portion during making compared to conventional adhesive tape It is impossible to the problems such as parcel or parcel bad generation bubble, the marking remain, yield improves more than 20%, not only production technology letter for position Single and easy to operate, significantly reduce the cost of product.

Claims (10)

1. a kind of processing procedure protection adhesive tape it is characterised in that include fit successively release film layer (1), pressure-sensitive adhesive layer (2), heat Quick glue-line (3) and substrate layer (4).
2. processing procedure protection adhesive tape according to claim 1 is it is characterised in that described heat sensitive adhesive layer (3) is rubber-like heat Quick glue.
3. processing procedure protection adhesive tape according to claim 1 is it is characterised in that the rubberization thickness of described heat sensitive adhesive layer (3) For 5-20 μm.
4. processing procedure protection adhesive tape according to claim 1 it is characterised in that described substrate layer (4) be polyethylene film, Polyvinyl chloride film, poly ester urethane thin film, polypropylene film, polybutylene terephthalate (PBT) thin film.
5. the processing procedure protection adhesive tape according to claim 1 or 2 or 3 is it is characterised in that described heat sensitive adhesive layer (3) is by wrapping The raw material including following parts by weight is made：Rubber elastomer 40-50 part, tackifying resin 50-60 part, softening agent 0-5 part, antioxidant 0-10 part.
6. processing procedure protection adhesive tape according to claim 5 is it is characterised in that described heat sensitive adhesive layer (3) also includes plasticising Agent 0-5 part.
7. processing procedure protection adhesive tape according to claim 5 is it is characterised in that described rubber elastomer is polystyrene fourth Diene copolymers, styrene butadiene styrene block copolymer (SBS), styrene isoprene styrene block copolymer (SIS), benzene One of ethylene-vinyl-butylene-styrene block copolymer, styrene ethylene-propylene-styrene block copolymer or several Kind.
8. processing procedure protection adhesive tape according to claim 5 it is characterised in that described tackifying resin be terpene resin, pine One or more of balsam, Petropols, poly- a- methylstyrene resin.
9. processing procedure protection adhesive tape according to claim 5 it is characterised in that described softening agent be alkane paraffin and/or Microcrystalline wax.
10. processing procedure protection adhesive tape according to claim 5 is it is characterised in that described antioxidant is 2,6- di-t-butyl Paracresol, four [β-(3,5- di-tert-butyl-hydroxy phenyl) propanoic acid] pentaerythritol ester, 2,2 '-di-2-ethylhexylphosphine oxide (4- methyl -6- One or more of tert-butyl phenol).
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