CN106376188A - PCB production line and PCB produced by PCB production line - Google Patents
PCB production line and PCB produced by PCB production line Download PDFInfo
- Publication number
- CN106376188A CN106376188A CN201610938843.5A CN201610938843A CN106376188A CN 106376188 A CN106376188 A CN 106376188A CN 201610938843 A CN201610938843 A CN 201610938843A CN 106376188 A CN106376188 A CN 106376188A
- Authority
- CN
- China
- Prior art keywords
- section
- pcb
- internal layer
- production line
- layer core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000004080 punching Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000012943 hotmelt Substances 0.000 claims description 32
- 238000002844 melting Methods 0.000 abstract description 8
- 230000008018 melting Effects 0.000 abstract description 8
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 abstract 1
- 238000003475 lamination Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 235000021050 feed intake Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insertion Pins And Rivets (AREA)
Abstract
The invention relates to PCB production equipment, in particular to a PCB production line and a PCB produced by the PCB production line. The PCB production line comprises a rack, wherein a control PC is arranged at a lower part of the rack, a transmission segment is arranged at the middle part of the rack, a material throwing segment, an alignment segment and a punching and riveting segment are sequentially arranged at an upper part of the rack, and a hot melting segment corresponding to the alignment segment is arranged on the rack at the upper part of the alignment segment. The PCB comprises at least two inner-layer cores, wherein the at least two inner-layer cores are fixed by alignment hot melting, punching and riveting, and a manual or automatic hot melting mode (a particular alignment hot melting target and a particular hot melting mode are not limited) is possessed by combined equipment of hot melting and riveting; automatic punching and riveting can be performed after hot melting, a corresponding software operation system is matched, so that the PCB has good alignment after lamination during fabrication, relatively small board edge material can be used, and the board cutting utilization ratio is improved.
Description
Technical field
The present invention relates to pcb production equipment is and in particular to what a kind of pcb production line and this pcb production line were produced
pcb.
Background technology
In pcb manufacturing process, the realization of pressing station Aligning degree generally has following several ways:
1:pin positioning mode: the made hole needing positioning in internal layer edges of boards data, by the pin borehole jack on internal layer core
Pin on jig plate, to realize interlayer positioning and the Aligning degree in bonding processes, pin alignment mode level to level alignment degree with this
Good, but edges of boards stay side considerable influence to cut out plate rate；
2: riveted positioning mode: to rush or to be drilled the hole treating riveted in internal layer edges of boards data, riveted board is carried out
Stake-fastening, to realize interlayer positioning and the Aligning degree in bonding processes with this, and riveted positioning positioning mode is stayed side little, cut out plate profit
High with rate, but the limitation due to level to level alignment degree, the plank of high-layer cannot be made；
3: hot melt positioning mode: at hot melt edges of boards target, to be realized with this by multiple internal layers core hot melt together
Interlayer positioning in bonding processes and Aligning degree, hot melt positioning positioning mode stays side little, and it is high to cut out plate utilization rate, but due to core with
The insufficient strength of bonding between pp, occurs in bonding processes that slip leads to interlayer to offset, cannot make high-layer or highly difficult
The plank of Aligning degree design.
Content of the invention
For solving above-mentioned technical problem, we have proposed the pcb that a kind of pcb production line and this pcb production line are produced, its
Purpose: pcb has good Aligning degree after pressing in making, and can utilize less edges of boards material again, improves and cuts out plate utilization rate.
For reaching above-mentioned purpose, technical scheme is as follows:
A kind of pcb production line, including frame, frame lower is provided with control pc；Central rack is provided with transportation section, upper rack
It is sequentially provided with the section that feeds intake, para-position section and punching riveted section, the frame on para-position section top is provided with hot melt section corresponding with para-position section.
A kind of pcb being produced by a kind of above-mentioned pcb production line, including at least two internal layer core, at least two
Internal layer core passes through para-position hot melt and boring stake-fastening；
Wherein, at least two internal layer core first pass through the section that feeds intake and are placed on transportation section, will at least two internal layers by transportation section
Core is sent to below para-position section, and para-position section positions at least two internal layer core, then by hot melt section at least two
Internal layer core carries out hot melt to be fixed；
At least two internal layer core after hot melt are delivered to below punching riveted section by the section that feeds intake, riveted section of punching
Bore rivet hole in edges of boards positions of materials, then carry out riveted.
Preferably, the quantity of internal layer core is at least 2 natural number.
By technique scheme, by the unit equipment of hot melt and riveted, possesses hot melt side manually or automatically
Formula (specific para-position hot melt target and hot melting way do not limit), and with automatic punching and riveted, and can be equipped with after hot melt
Corresponding operation system of software, makes pcb have good Aligning degree after pressing in making, can utilize less edges of boards material again
Material, improves sanction plate utilization rate.
Brief description
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Have technology description in required use accompanying drawing be briefly described it should be apparent that, drawings in the following description be only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, acceptable
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation of pcb production line disclosed in this invention.
Corresponding component title represented by figure numeral and letter:
1. frame 2. control pc 3. transportation section 4. feed intake section 5. para-position section 6. punching riveted section 7. hot melt section.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation description is it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of not making creative work
Embodiment, broadly falls into the scope of protection of the invention.
With reference to schematic diagram, the specific embodiment of the present invention is described in further detail.
As shown in figure 1, a kind of pcb production line, including frame 1, frame 1 bottom is provided with control pc2；It is provided with the middle part of frame 1
Transportation section 3, frame 1 top is sequentially provided with the section 4 that feeds intake, para-position section 5 and punching riveted section 6, and the frame 1 on para-position section 5 top sets
There is hot melt section 7 corresponding with para-position section 5, the production technology of this pcb production line is as follows:
(1) blanking: by feeding intake section 4 and transportation section 3 carries out blanking；
(2) para-position hot melt target: can be by the ccd automatic decimal alignment system in para-position section 5 or set pin alignment mode, it is right to come
The hot melt target of each level in position；
Wherein, ccd automatic decimal alignment system is ccd image sensor, ccd be machine vision to bit platform with
The combination of fine adjustment platform, from motion tracking coordinate, automatically revises deviation, automatically compensates and ccd visual system, ccd para-position is put down
Platform adopts 2 ccd, and 4ccd or multiple ccd forms；
(3) hot melt: at hot melt edges of boards target, internal layer core hot melt or disposably will have internal layer core heat one by one more
It is melted together or first then hot melt carries out final hot melt one by one by internal layer core；
(4) riveted: after hot melt, bore rivet hole in edges of boards positions of materials, then carry out riveted, complete to produce.
A kind of pcb, a kind of pcb production line described in above-mentioned produces, including at least two internal layer core, at least
Two internal layer core pass through para-position hot melt and boring stake-fastening；
Wherein, at least two internal layer core first pass through the section 4 that feeds intake and are placed on transportation section 3, will be at least two by transportation section 3
Layer core is sent to below para-position section 5, and para-position section 5 positions at least two internal layer core, then by hot melt section 7 at least
Two internal layer core carry out hot melt to be fixed；
At least two internal layer core after hot melt are delivered to below punching riveted section 6 by the section 4 that feeds intake, and punch riveted
Section 6 bores rivet hole in edges of boards positions of materials, then carries out riveted.
The quantity of internal layer core is at least 2 natural number.
Above-described is only the preferred embodiment of the present invention it is noted that for those of ordinary skill in the art
For, without departing from the concept of the premise of the invention, some deformation can also be made and improve, these broadly fall into the present invention
Protection domain.
Claims (3)
1. it is characterised in that including frame (1), frame (1) bottom is provided with control pc (2) to a kind of pcb production line；In frame (1)
Portion is provided with transportation section (3), and frame (1) top is sequentially provided with the section that feeds intake (4), para-position section (5) and punching riveted section (6), para-position section
(5) frame (1) on top is provided with hot melt section (7) corresponding with para-position section (5).
2. a kind of pcb is it is characterised in that produced by a kind of pcb production line described in claim 1, including at least two
Open internal layer core, at least two internal layer core pass through para-position hot melt and boring stake-fastening；
Wherein, at least two internal layer core first pass through the section that feeds intake (4) and are placed on transportation section (3), will at least two by transportation section (3)
Internal layer core is sent to below para-position section (5), and para-position section (5) positions at least two internal layer core, then passes through hot melt section
(7) carry out hot melt at least two internal layer core to fix；
At least two internal layer core after hot melt are delivered to below punching riveted section (6) by the section that feeds intake (4), and punch riveted
Section (6) bores rivet hole in edges of boards positions of materials, then carries out riveted.
3. a kind of pcb according to claim 2 is it is characterised in that the quantity of internal layer core is at least 2 nature
Number.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610938843.5A CN106376188A (en) | 2016-11-01 | 2016-11-01 | PCB production line and PCB produced by PCB production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610938843.5A CN106376188A (en) | 2016-11-01 | 2016-11-01 | PCB production line and PCB produced by PCB production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106376188A true CN106376188A (en) | 2017-02-01 |
Family
ID=57892723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610938843.5A Pending CN106376188A (en) | 2016-11-01 | 2016-11-01 | PCB production line and PCB produced by PCB production line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106376188A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107148168A (en) * | 2017-05-08 | 2017-09-08 | 江苏博敏电子有限公司 | A kind of fusion process of pressure programming |
| CN107753032A (en) * | 2017-09-11 | 2018-03-06 | 广东昭信智能装备有限公司 | A kind of micro-fluidic test card production line |
| CN109352015A (en) * | 2018-10-26 | 2019-02-19 | 南通深南电路有限公司 | Pcb board drilling equipment |
| CN109451672A (en) * | 2018-12-21 | 2019-03-08 | 深圳市铭鸿捷技术有限公司 | One kind melting boring and riveting machine |
| CN111935920A (en) * | 2020-06-30 | 2020-11-13 | 江西一诺新材料有限公司 | High-frequency LCP multi-layer board assembling method |
| CN112272454A (en) * | 2020-09-28 | 2021-01-26 | 江门崇达电路技术有限公司 | Method for preventing PCB (printed circuit board) from laminating, fusing and glue flowing |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW478713U (en) * | 2000-01-10 | 2002-03-01 | Forever Group Prec Ind Co Ltd | Automatic riveting punching device |
| CN101778535A (en) * | 2009-01-09 | 2010-07-14 | 深圳玛斯兰电路科技实业发展有限公司 | Low-cost high-efficiency method for controlling multi-layer circuit board platen manufacturing layer deviation |
| CN103249266A (en) * | 2013-04-03 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Multilayer circuit board production method capable of preventing layer deviation |
| CN105392304A (en) * | 2015-10-21 | 2016-03-09 | 胜宏科技（惠州）股份有限公司 | Circuit board press-fit method |
| CN206547219U (en) * | 2016-11-01 | 2017-10-10 | 苏州艾美德国际贸易有限公司 | The PCB that PCB production lines and the PCB production lines are produced |
-
2016
- 2016-11-01 CN CN201610938843.5A patent/CN106376188A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW478713U (en) * | 2000-01-10 | 2002-03-01 | Forever Group Prec Ind Co Ltd | Automatic riveting punching device |
| CN101778535A (en) * | 2009-01-09 | 2010-07-14 | 深圳玛斯兰电路科技实业发展有限公司 | Low-cost high-efficiency method for controlling multi-layer circuit board platen manufacturing layer deviation |
| CN103249266A (en) * | 2013-04-03 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Multilayer circuit board production method capable of preventing layer deviation |
| CN105392304A (en) * | 2015-10-21 | 2016-03-09 | 胜宏科技（惠州）股份有限公司 | Circuit board press-fit method |
| CN206547219U (en) * | 2016-11-01 | 2017-10-10 | 苏州艾美德国际贸易有限公司 | The PCB that PCB production lines and the PCB production lines are produced |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107148168A (en) * | 2017-05-08 | 2017-09-08 | 江苏博敏电子有限公司 | A kind of fusion process of pressure programming |
| CN107753032A (en) * | 2017-09-11 | 2018-03-06 | 广东昭信智能装备有限公司 | A kind of micro-fluidic test card production line |
| CN109352015A (en) * | 2018-10-26 | 2019-02-19 | 南通深南电路有限公司 | Pcb board drilling equipment |
| CN109451672A (en) * | 2018-12-21 | 2019-03-08 | 深圳市铭鸿捷技术有限公司 | One kind melting boring and riveting machine |
| CN109451672B (en) * | 2018-12-21 | 2024-02-09 | 深圳市铭鸿捷技术有限公司 | Drilling riveting machine |
| CN111935920A (en) * | 2020-06-30 | 2020-11-13 | 江西一诺新材料有限公司 | High-frequency LCP multi-layer board assembling method |
| CN111935920B (en) * | 2020-06-30 | 2022-04-19 | 江西一诺新材料有限公司 | High-frequency LCP multi-layer board assembling method |
| CN112272454A (en) * | 2020-09-28 | 2021-01-26 | 江门崇达电路技术有限公司 | Method for preventing PCB (printed circuit board) from laminating, fusing and glue flowing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170201 |
|
| WD01 | Invention patent application deemed withdrawn after publication |