CN106373929A - Copper pipe embedded water-cooled heat sink - Google Patents
Copper pipe embedded water-cooled heat sink Download PDFInfo
- Publication number
- CN106373929A CN106373929A CN201610907689.5A CN201610907689A CN106373929A CN 106373929 A CN106373929 A CN 106373929A CN 201610907689 A CN201610907689 A CN 201610907689A CN 106373929 A CN106373929 A CN 106373929A
- Authority
- CN
- China
- Prior art keywords
- pipe
- copper pipe
- water
- heat sink
- water inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 43
- 239000010949 copper Substances 0.000 title claims abstract description 43
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000001816 cooling Methods 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 5
- 238000004026 adhesive bonding Methods 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 238000005498 polishing Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008521 reorganization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a copper pipe embedded water-cooled heat sink, and belongs to the field of a water-cooled heat sink. Aiming at a water-cooled heat sink with a copper pipe embedded in an aluminum block by a heat conduction adhesive in the prior art, extra gluing or polishing is needed to ensure smooth surface of the heat sink during the process of fabricating the heat sink by using a traditional round copper pipe so as to cause reduction of heat dissipation efficiency and process complexity. The water-cooled heat sink comprises an aluminum block heat sink body and a heat dissipation copper pipe, wherein a groove is formed in the aluminum block heat sink body, the heat dissipation copper pipe is embedded into the groove by the heat conduction adhesive and comprises a water inlet, a water outlet, a water inlet pipe and a water outlet pipe, edges of cross sections of the water inlet pipe and the water outlet pipe are U-shaped, the cross section of an inner cavity is in a round shape, and the water inlet pipe and the water outlet pipe are traditional round pipes. By the copper pipe in a special shape, flow resistance is enabled to be unchanged, and meanwhile, extra gluing or polishing can be prevented.
Description
Technical field
The invention belongs to water-filled radiator field is and in particular to a kind of damascene copper pipe-type water-cooling radiator.
Background technology
Igbt module is commonly used water-filled radiator and is radiated, and wherein, inlays cooling water pipe made of copper inside aluminium block, can
Give full play to that copper pipe heat conductivity is good, corrosion-resistant and the low cost of aluminium block, advantage easy to process, be a kind of scheme of compromise.
In prior art, copper pipe is directly bonded in the inside grooves of aluminium block surface setting, this kind of radiator technique by heat conduction adhesive
Simply, with low cost.But, used in prior art, copper pipe is all pipe, when being inlaid in groove, due to pipe
Surface be cambered surface, and spreader surface require smooth, two kind problems therefore occur；First, when copper pipe top cambered surface exceeds
Radiator body plane, then can use glue less, but needs the techniques such as polishing；Another kind of situation, when copper pipe top cambered surface is less than radiating
Body plane, then need a large amount of glue to insert with coverage gap.Copper pipe can be completely covered by even glue.Although heat-conducting glue has necessarily leading
Heat energy power, but with respect to metal, particularly copper pipe, its capacity of heat transmission is far short of what is expected, the use of therefore traditional copper coin pipe, can drop
The radiating efficiency of low heat emission device.
Content of the invention
The technical problem to be solved is: offer one kind is improved to inlay copper pipe radiator, by by knot
The improvement of structure, improves radiator integral heat sink efficiency.
The technical solution used in the present invention is:
A kind of damascene copper pipe-type water-cooling radiator, including set reeded aluminium block radiator body and pass through heat conduction adhesive bonding
And it is embedded in the heat dissipation copper pipe in groove；Described heat dissipation copper pipe includes water inlet, outlet, water inlet pipe and outlet pipe, wherein enters
The outer rim in the section of water pipe and outlet pipe is shaped as u shape, and intracavity section is generally circular in shape, and water inlet pipe and outlet pipe are traditional circle
Pipe.
Further, the inner chamber wall of described water inlet pipe and outlet pipe is provided with spiral spoiler.
Further, described groove is u-shaped groove.
The invention has the beneficial effects as follows: by section outer rim be u shape, intracavity section be that circular copper pipe replaces traditional round copper
Pipe, due to improved copper pipe upper surface be plane, be radiator body cooperation when it is ensured that spreader surface smooth, no
Need heat-conducting glue fill up or technique for grinding rest and reorganization, the efficiency of radiator not only can be improved it is also possible to Simplified flowsheet；Separately
Outer inner chamber is identical with traditional copper pipe, does not change flow resistance.
Brief description
Fig. 1 is a kind of schematic diagram of described damascene copper pipe-type water-cooling radiator；
Fig. 2 is a kind of radiator schematic diagram of described damascene copper pipe-type water-cooling radiator；
Fig. 3 be a kind of described damascene copper pipe-type water-cooling radiator heat dissipation copper pipe schematic diagram；
Fig. 4 is a kind of inlet channel schematic cross-section of described damascene copper pipe-type water-cooling radiator.
Specific embodiment
Below in conjunction with the accompanying drawings the specific embodiment of the present invention is described in detail.
A kind of damascene copper pipe-type water-cooling radiator as shown in Figure 1,2,3, 4, including the aluminium block radiator body being provided with groove 2
1 and by heat conduction adhesive bonding be embedded in the heat dissipation copper pipe 3 in groove 2；Described heat dissipation copper pipe 3 include water inlet 31,
Outlet 32, water inlet pipe 33 and outlet pipe 34, the outer rim in the wherein section of water inlet pipe 33 and outlet pipe 34 is shaped as u shape, inner chamber
Cross sectional shape is circle, and water inlet pipe 31 and outlet pipe 32 are traditional pipe.Described water inlet pipe 33 and the inner chamber of outlet pipe 34
Wall is provided with spiral spoiler 35.Described groove 2 is u-shaped groove.
A kind of damascene copper pipe-type water-cooling radiator of the present invention, in its course of processing, heat dissipation copper pipe 3 is passed through heat conduction
Adhesive embeds in groove 2, and the amount of glue is to make the top planes of heat-conducting copper pipe 3 and radiator body surface be in same level
On, the present invention only needs in a small amount of heat conduction adhesive of inside grooves setting, and the top of heat-conducting copper pipe 3 does not need to arrange gluing
Agent, also without taking the techniques such as polishing so that spreader surface is smooth.
Ultimate principle, principal character and the advantages of the present invention of the present invention have been shown and described above.The present invention is not subject to
State the restriction of embodiment, merely illustrating the principles of the invention, without departing from the present invention described in above-described embodiment and description
On the premise of spirit and scope, the present invention also has various changes and modifications, and these changes and improvements both fall within claimed basis
In the range of invention.Claimed scope is defined by appending claims and its equivalent.
Claims (3)
1. a kind of damascene copper pipe-type water-cooling radiator, including the aluminium block radiator body (1) being provided with groove (2) and by heat-conducting glue
Glutinous agent bonding is simultaneously embedded in the heat dissipation copper pipe (3) in groove (2)；It is characterized in that: described heat dissipation copper pipe (3) includes water inlet
(31), outlet (32), water inlet pipe (33) and outlet pipe (34), the wherein outer rim in the section of water inlet pipe (33) and outlet pipe (34)
It is shaped as u shape, intracavity section is generally circular in shape, water inlet pipe (31) and outlet pipe (32) are traditional pipe.
2. a kind of damascene copper pipe-type water-cooling radiator as claimed in claim 1, is characterized in that: described water inlet pipe (33) and going out
The inner chamber wall of water pipe (34) is provided with spiral spoiler (35).
3. a kind of damascene copper pipe-type water-cooling radiator as claimed in claim 1 or 2, is characterized in that: described groove (2) is u
Type groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610907689.5A CN106373929A (en) | 2016-10-18 | 2016-10-18 | Copper pipe embedded water-cooled heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610907689.5A CN106373929A (en) | 2016-10-18 | 2016-10-18 | Copper pipe embedded water-cooled heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106373929A true CN106373929A (en) | 2017-02-01 |
Family
ID=57895670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610907689.5A Pending CN106373929A (en) | 2016-10-18 | 2016-10-18 | Copper pipe embedded water-cooled heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106373929A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108541189A (en) * | 2018-04-13 | 2018-09-14 | 苏州科尼普机电科技有限公司 | Battery pack water cooling panel forming method |
| CN110625253A (en) * | 2019-07-06 | 2019-12-31 | 佛山市众慧焊接智能技术有限公司 | Traceless welding method for elevator panel |
| CN111933595A (en) * | 2020-07-16 | 2020-11-13 | 杰群电子科技（东莞）有限公司 | Semiconductor packaging structure and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201332092Y (en) * | 2008-12-29 | 2009-10-21 | 西安机电研究所 | IGBT module open type water-filled radiator |
| CN203010757U (en) * | 2013-01-11 | 2013-06-19 | 淄博圣诺尔空调有限公司 | Surface air cooler device for intelligent heating radiator |
| CN205052048U (en) * | 2015-10-16 | 2016-02-24 | 保定四方三伊电气有限公司 | Aluminium inlays copper pipe radiator |
| CN206194734U (en) * | 2016-10-18 | 2017-05-24 | 池州脉纬散热器有限责任公司 | Inlay copper pipe type liquid cooling ware |
-
2016
- 2016-10-18 CN CN201610907689.5A patent/CN106373929A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201332092Y (en) * | 2008-12-29 | 2009-10-21 | 西安机电研究所 | IGBT module open type water-filled radiator |
| CN203010757U (en) * | 2013-01-11 | 2013-06-19 | 淄博圣诺尔空调有限公司 | Surface air cooler device for intelligent heating radiator |
| CN205052048U (en) * | 2015-10-16 | 2016-02-24 | 保定四方三伊电气有限公司 | Aluminium inlays copper pipe radiator |
| CN206194734U (en) * | 2016-10-18 | 2017-05-24 | 池州脉纬散热器有限责任公司 | Inlay copper pipe type liquid cooling ware |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108541189A (en) * | 2018-04-13 | 2018-09-14 | 苏州科尼普机电科技有限公司 | Battery pack water cooling panel forming method |
| CN110625253A (en) * | 2019-07-06 | 2019-12-31 | 佛山市众慧焊接智能技术有限公司 | Traceless welding method for elevator panel |
| CN111933595A (en) * | 2020-07-16 | 2020-11-13 | 杰群电子科技（东莞）有限公司 | Semiconductor packaging structure and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170201 |