CN106373912A - In-situ turnover mechanism of chip - Google Patents
In-situ turnover mechanism of chip Download PDFInfo
- Publication number
- CN106373912A CN106373912A CN201610898540.5A CN201610898540A CN106373912A CN 106373912 A CN106373912 A CN 106373912A CN 201610898540 A CN201610898540 A CN 201610898540A CN 106373912 A CN106373912 A CN 106373912A
- Authority
- CN
- China
- Prior art keywords
- chip
- connecting seat
- vacuum cups
- middle connecting
- fork
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 44
- 230000007306 turnover Effects 0.000 title abstract description 11
- 238000011065 in-situ storage Methods 0.000 title abstract description 6
- 238000010521 absorption reaction Methods 0.000 claims description 21
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims description 3
- 230000008450 motivation Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 230000009102 absorption Effects 0.000 description 20
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
Abstract
The invention discloses an in-situ turnover mechanism of a chip. The in-situ turnover mechanism comprises an intermediate connection seat, a turnover execution mechanism and a linear driving mechanism, wherein turnover execution mechanism is arranged on the intermediate connection seat and is used for turning over the chip, the linear driving mechanism is used for driving the intermediate connection seat to get close to or deviate from the chip to be turned over, the turnover execution mechanism comprises a vacuum suction nozzle, a swinging rod and a telescopic cylinder, the vacuum suction nozzle is connected with a negative pressure device, a cylinder body of the telescopic cylinder is connected with the intermediate connection seat by a first rotation structure, a telescopic rod of the telescopic cylinder is connected with one end of the swinging rod by a second rotation structure, the other end of the swinging rod is connected with the vacuum suction nozzle, the middle part of the swinging rod is connected with the intermediate connection seat by a third rotation structure, and a rotation central axis of the third rotation structure is coincided with a geometric center of a suction surface of the vacuum suction nozzle. By the turnover mechanism, in-situ turnover of the chip can be achieved, the levelness of the chip after being turned over can be ensured, moreover, the chip can also be enabled to be accurately aligned to a chip groove, and subsequent package processing is facilitated.
Description
Technical field
The present invention relates to smart card manufacturing equipment is and in particular to a kind of chip switching mechanism.
Background technology
In smart card production process, need chip package in card.The packaging technology of chip include successively groove milling,
Take-up, butt-joint, encapsulation etc., wherein, two strip antennas stretching out in the chip slot of card during butt-joint are in vertical state, chip to be welded
Link together with antenna butt-joint in erected state；Before carrying out follow-up encapsulation, need allow butt-joint in erected state
Chip be turned into horizontality, to allow chip be aligned chip slot, and then by chip package in chip slot.Said chip
Upset is completed by chip switching mechanism, and existing chip switching mechanism is mainly by the antenna bending mechanism structure of one group of relative motion
Become, two antenna bending mechanisms mutually stagger in the height direction, two antenna bending mechanism move toward one another difference during work
Act on so that antenna bends at two application points round about on two strip antennas holded up, thus allow holding up
Chip is converted into horizontality.Existing this chip switching mechanism has the disadvantage that
Indirectly realize the upset of chip by meandered antenna, the levelness of the chip after upset is difficult to ensure that, and overturns
Position relationship between chip afterwards and chip slot is also difficult to ensure that (chip can not be aligned exactly) with chip slot, thus affecting
Follow-up encapsulation process.
Content of the invention
It is an object of the invention to overcoming the deficiencies in the prior art, provide a kind of chip original position switching mechanism, this tipper
Structure is capable of the original position upset to chip so that the chip after upset is not only able to guarantee levelness, and also can ensure that
It is accurately aimed at chip slot, be easy to follow-up encapsulation process.
The purpose of the present invention is realized by following technical scheme:
A kind of chip original position switching mechanism is it is characterised in that by middle connecting seat, be arranged on being used on middle connecting seat
What chip was overturn overturns actuator and for driving middle connecting seat to be toward or away from the straight line of chip to be flipped
Drive mechanism is constituted；Wherein:
Described upset actuator includes vacuum cups, fork and telescoping cylinder, and wherein, described vacuum cups is filled with negative pressure
Put connection；The cylinder body of described telescoping cylinder is passed through the first rotational structure and is connected with middle connecting seat, and the expansion link of this telescoping cylinder passes through
Second rotational structure is connected with one end of fork, and the other end of fork is connected with vacuum cups, and the middle part of this fork passes through the 3rd
Rotational structure is connected with middle connecting seat；The center of rotation axis of described 3rd rotational structure is several with the absorption face of vacuum cups
What center coincides.
The operation principle of said chip original position switching mechanism is: before carrying out chip upset, described telescoping cylinder flexible
Bar is in retracted mode, and the absorption face of described vacuum cups is in vertical state, and is located remotely from chip position to be flipped
Its normal orientation, wait card send into；Be welded with chip card be sent to chip station turning after, straight line driving mechanism drive
Middle connecting seat and upset actuator thereon towards chip to be flipped mobile so that the absorption face of vacuum cups and core to be flipped
Chip is simultaneously held by the surface laminating of piece；Subsequently upset actuator work, the expansion link of telescoping cylinder stretches out, promote fork around
The center of rotation axis of the 3rd rotational structure carries out 90 ° of upsets, and described vacuum cups and chip also one act as 90 ° and turn over accordingly
Turn, in above-mentioned switching process, the absorption face of described vacuum cups and the chip surface fitted therewith all weigh around with them
The center of rotation axis of the 3rd rotational structure closed rotates, due to center of rotation axis and the vacuum cups of the 3rd rotational structure
The geometric center in absorption face coincides, also fit with the geometric center on surface fit with the face of absorption in chip so that chip around
The geometric center upset on its surface, that is, realize overturning in situ；After the completion of upset, vacuum cups unclamps the chip after upset, with
Straight line driving mechanism drives middle connecting seat and upset actuator thereon to reset afterwards, and meanwhile, the expansion link of telescoping cylinder is retracted
The absorption face making vacuum cups is recovered to erected state, waits chip upset operation next time.
One preferred version of the present invention, wherein, described fork include for be connected with the expansion link of telescoping cylinder first
Linking arm, for the second linking arm of being connected with vacuum cups and rotary shaft, wherein, described rotary shaft and middle connecting seat company
Connect formation the 3rd rotational structure, and this rotary shaft is fixedly connected with described first linking arm and the second linking arm；Shown second even
Connecing arm is square component, and described vacuum cups is fixed on the end of this square component.By the fork using said structure,
Realize the connection with expansion link, middle connecting seat and vacuum cups；Wherein, it is using the purpose of square second linking arm
The absorption face of vacuum cups is allowed to overlap with the center of rotation axis of the 3rd rotational structure, specifically, because vacuum cups has one
Fixed length, makes its end leave turning of the 3rd rotational structure radial and axial by arranging the second linking arm of square
Dynamic central axis certain distance, thus making it oppositely extending in radial direction in the end of the second linking arm setting vacuum cups, just may be used
The absorption face of allowing is overlapped with the center of rotation axis of the 3rd rotational structure.
Preferably, it is provided with the vacuum passage with vacuum cups inner space in described second linking arm, on this vacuum passage
It is provided with the pore for being connected with negative pressure device.
One preferred version of the present invention, wherein, described middle connecting seat is passed through by the first linkage section and the second linkage section
Mode connects for screw forms, and wherein, the cylinder body of described telescoping cylinder is connected with the end of the first linkage section by the first rotational structure, described
Fork is connected with the end of the second linkage section by the 3rd rotational structure.Had using the middle connecting seat of two-part and be easy to process
Advantage with assembling.
One preferred version of the present invention, wherein, described straight line driving mechanism is made up of cylinder, the extensible member of this cylinder with
Described middle connecting seat connects.
The present invention compared with prior art has a following beneficial effect:
1st, around fixing axis of rotation during chip upset, because this rotating shaft is overlapped with the geometric center of chip surface, because
After the upset of this chip, the geometric center position on its surface is constant, and this is it is ensured that the chip after upset is just being located at chip slot
Top, and be accurately aimed at chip slot.
2nd, because chip is held by vacuum cups in switching process, vacuum cups may insure its absorption face after upset
Strictly it is in horizontality, thus the levelness of the chip after ensureing to overturn, be easy to follow-up accurate encapsulation.
3rd, the switching mechanism of the present invention is only arranged at the side of chip, and structure is compacter.
Brief description
Fig. 1-Fig. 3 is that the structural representation of a specific embodiment of chip original position switching mechanism of the present invention (is in
Wait chip rollover states), wherein, Fig. 1 is front view, and Fig. 2 is top view, and Fig. 3 is axonometric chart.
Fig. 4-Fig. 6 is in the structural representation under chip rollover states for chip original position switching mechanism shown in Fig. 1-Fig. 3, its
In, Fig. 4 is front view, and Fig. 5 is top view, and Fig. 6 is axonometric chart.
Fig. 7 is the perspective view of fork and vacuum cups in chip original position switching mechanism shown in Fig. 1-Fig. 3.
Fig. 8-Figure 10 is the use state figure of chip original position switching mechanism shown in Fig. 1-Fig. 3, and wherein, Fig. 8 is entering for chip
Schematic diagram before row upset；Fig. 9 and Figure 10 carries out the schematic diagram after 90 ° of upsets for chip, and wherein, Fig. 9 is front view, Tu10Wei
Axonometric chart.
Specific embodiment
With reference to embodiment and accompanying drawing, the present invention is described in further detail, but embodiments of the present invention do not limit
In this.
Referring to Fig. 1-Fig. 7, the chip original position switching mechanism of present embodiment by middle connecting seat 4, be arranged on middle connection
On seat 4 for upset actuator that chip 9 is overturn and be used for driving middle connecting seat 4 to be toward or away from and wait to turn over
The straight line driving mechanism of core piece 9 is constituted.Wherein: described upset actuator includes vacuum cups 1, fork 2 and telescoping cylinder
3, wherein, described vacuum cups 1 is connected with negative pressure device.The cylinder body 3-1 of described telescoping cylinder 3 pass through the first rotational structure 6 with
Between connecting seat 4 connect, the expansion link 3-2 of this telescoping cylinder 3 is connected with one end of fork 2 by the second rotational structure 7, fork 2
The other end is connected with vacuum cups 1, and the middle part of this fork 2 is passed through the 3rd rotational structure 8 and is connected with middle connecting seat 4；Described
The center of rotation axis 2-4 of three rotational structures 8 is coincided with the geometric center of the absorption face 1-1 of vacuum cups 1, that is, the 3rd turn
The center of rotation axis 2-4 of dynamic structure 8 was both overlapped with the absorption face 1-1 of vacuum cups 1, and intersected with vacuum cups 1 axial line.
Referring to Fig. 1-Fig. 7, described fork 2 include for be connected with the expansion link 3-2 of telescoping cylinder 3 the first linking arm 2-1,
For the second linking arm 2-2 of being connected with vacuum cups 1 and rotary shaft 2-3, wherein, described rotary shaft 2-3 is connected with centre
Seat 4 connects formation the 3rd rotational structure 8, and this rotary shaft 2-3 is fixed with described first linking arm 2-1 and the second linking arm 2-2
Connect；Shown second linking arm 2-2 is square component, and described vacuum cups 1 is fixed on the end of this square component.Pass through
Using the fork 2 of said structure, realize the connection with expansion link 3-2, middle connecting seat 4 and vacuum cups 1；Wherein, adopt
The purpose of square the second linking arm 2-2 is to allow the absorption face 1-1 of vacuum cups 1 and the center of rotation of the 3rd rotational structure 8
Axis 2-4 overlaps, specifically, because vacuum cups 1 has certain length, by arranging the second linking arm 2-2 of square
Make its end in the radial and axial center of rotation axis 2-4 certain distance leaving the 3rd rotational structure 8, thus second even
The end setting vacuum cups 1 meeting arm 2-2 makes it radially oppositely extending, just can allow absorption face 1-1 and the 3rd rotational structure 8
Center of rotation axis 2-4 overlaps.
Referring to Fig. 7, in described second linking arm 2-2, it is provided with the vacuum passage with vacuum cups 1 inner space, this vacuum is led to
Road is provided with the pore 2-5 for being connected with negative pressure device.
Referring to Fig. 1-Fig. 6, described middle connecting seat 4 is connected by screw by the first linkage section 4-1 and the second linkage section 4-2
Form, wherein, the cylinder body 3-1 of described telescoping cylinder 3 is connected with the end of the first linkage section 4-1 by the first rotational structure 6, described
Fork 2 is connected with the end of the second linkage section 4-2 by the 3rd rotational structure 8.Middle connecting seat 4 using two-part has just
Advantage in processing and assembling.
Referring to Fig. 1-Fig. 6, described straight line driving mechanism is made up of cylinder 5, the extensible member 5-2 of this cylinder 5 and described centre
Connecting seat 4 connects, and described extensible member 5-2 is connected with the cylinder body 5-1 of cylinder 5.Additionally, described straight line driving mechanism also have can be by
Oil cylinder, linear electric motors etc. other can export straight reciprocating motion mechanism constitute.
Referring to Fig. 1-Figure 10, the operation principle of the chip original position switching mechanism of the present invention is:
Referring to Fig. 8-Figure 10, in production, chip 9 to be flipped is welded on the antenna 11 of card 10, antenna 11 and to be welded
Connect chip 9 and be in erected state, card 10 is fed forward by card transport in card delivery track 12, when card 10
When reaching chip station turning, by clamping sheet positioning mechanism 13, card 10 is positioned.
Before carrying out chip 9 upset, the expansion link 3-2 of described telescoping cylinder 3 is in retracted mode, described vacuum cups 1
Absorption face 1-1 be in vertical state, and be located remotely from its normal orientation of chip 9 position to be flipped, wait card 10 to send
Enter；Be welded with chip 9 card 10 be sent to chip 9 station turning after, straight line driving mechanism drive in the middle of connecting seat 4 and thereon
Upset actuator towards chip 9 to be flipped mobile so that the absorptions face 1-1 of vacuum cups 1 is pasted with the surface of chip 9 to be flipped
Merge and chip 9 is held；Subsequently upset actuator work, the expansion link 3-2 of telescoping cylinder 3 stretches out, and promotes fork 2 around the 3rd
The center of rotation axis 2-4 of rotational structure 8 carries out 90 ° of upsets, and described vacuum cups 1 and chip 9 also one act as 90 ° and turn over accordingly
Turn, in above-mentioned switching process, the absorption face 1-1 of described vacuum cups 1 and chip 9 surface fitted therewith all around with it
The center of rotation axis 2-4 of the 3rd rotational structure 8 that overlaps rotate, due to the center of rotation axis 2-4 of the 3rd rotational structure 8
Coincide with the geometric center of the absorption face 1-1 of vacuum cups 1, also the geometry with the surface fitted with absorption face 1-1 in chip 9
Center laminating is so that the geometric center around its surface for the chip 9 overturns, that is, realizes overturning in situ；After the completion of upset, vacuum cups
1 unclamps the chip 9 after upset, and subsequent straight line driving mechanism drives middle connecting seat 4 and upset actuator thereon to reset, with
When, the expansion link 3-2 of telescoping cylinder 3 retracts and the absorption face 1-1 of vacuum cups 1 is recovered to erected state, waits next time
Chip 9 overturns operation.
It is above-mentioned that but embodiments of the present invention are not limited by the above for the present invention preferably embodiment, its
His any spirit without departing from the present invention and the change made under principle, modification, replacement, combine, simplify, all should be
The substitute mode of effect, is included within protection scope of the present invention.
Claims (5)
1. a kind of chip original position switching mechanism it is characterised in that by middle connecting seat, be arranged on middle connecting seat for right
The upset actuator that chip is overturn and the straight line for driving middle connecting seat to be toward or away from chip to be flipped drive
Motivation structure is constituted；Wherein:
Described upset actuator includes vacuum cups, fork and telescoping cylinder, and wherein, described vacuum cups is with negative pressure device even
Connect；The cylinder body of described telescoping cylinder is passed through the first rotational structure and is connected with middle connecting seat, and the expansion link of this telescoping cylinder passes through second
Rotational structure is connected with one end of fork, and the other end of fork is connected with vacuum cups, and the middle part of this fork is passed through the 3rd and rotated
Structure is connected with middle connecting seat；In the geometry in absorption face of the center of rotation axis of described 3rd rotational structure and vacuum cups
The heart coincides.
2. chip original position switching mechanism according to claim 1 it is characterised in that described fork include for telescoping cylinder
Expansion link connect the first linking arm, for the second linking arm of being connected with vacuum cups and rotary shaft, wherein, described turn
Moving axis is connected formation the 3rd rotational structure with middle connecting seat, and this rotary shaft is solid with described first linking arm and the second linking arm
Fixed connection；Shown second linking arm is square component, and described vacuum cups is fixed on the end of this square component.
3. chip original position switching mechanism according to claim 2 it is characterised in that be provided with described second linking arm with very
The vacuum passage of suction head inner space, this vacuum passage is provided with the pore for being connected with negative pressure device.
4. the chip original position switching mechanism according to any one of claim 1-3 it is characterised in that described middle connecting seat by
First linkage section and the second linkage section are connected by screw and form, and wherein, the cylinder body of described telescoping cylinder passes through the first rotational structure
It is connected with the end of the first linkage section, described fork is connected with the end of the second linkage section by the 3rd rotational structure.
5. chip original position switching mechanism according to claim 1 is it is characterised in that described straight line driving mechanism is by cylinder structure
Become, the extensible member of this cylinder and described middle connecting seat connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610898540.5A CN106373912A (en) | 2016-10-14 | 2016-10-14 | In-situ turnover mechanism of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610898540.5A CN106373912A (en) | 2016-10-14 | 2016-10-14 | In-situ turnover mechanism of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106373912A true CN106373912A (en) | 2017-02-01 |
Family
ID=57895714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610898540.5A Pending CN106373912A (en) | 2016-10-14 | 2016-10-14 | In-situ turnover mechanism of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106373912A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108054130A (en) * | 2018-01-22 | 2018-05-18 | 广安市嘉乐电子科技有限公司 | A kind of automatic turning machine of MB bridges heap |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1613146A (en) * | 2002-01-07 | 2005-05-04 | 先进***自动化有限公司 | Flip chip bonder and method therefor |
| JP2005335936A (en) * | 2004-05-31 | 2005-12-08 | Autec Mechanical Co Ltd | Work reversing device |
| CN101423125A (en) * | 2008-11-28 | 2009-05-06 | 张远忠 | Automatic banknote countering and bundling one-piece machine |
| CN201522998U (en) * | 2009-11-06 | 2010-07-07 | 华中科技大学 | Chip pickup and overturn device |
-
2016
- 2016-10-14 CN CN201610898540.5A patent/CN106373912A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1613146A (en) * | 2002-01-07 | 2005-05-04 | 先进***自动化有限公司 | Flip chip bonder and method therefor |
| JP2005335936A (en) * | 2004-05-31 | 2005-12-08 | Autec Mechanical Co Ltd | Work reversing device |
| CN101423125A (en) * | 2008-11-28 | 2009-05-06 | 张远忠 | Automatic banknote countering and bundling one-piece machine |
| CN201522998U (en) * | 2009-11-06 | 2010-07-07 | 华中科技大学 | Chip pickup and overturn device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108054130A (en) * | 2018-01-22 | 2018-05-18 | 广安市嘉乐电子科技有限公司 | A kind of automatic turning machine of MB bridges heap |
| CN108054130B (en) * | 2018-01-22 | 2023-07-21 | 广安市嘉乐电子科技有限公司 | Automatic overturning machine for MB bridge stack |
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| C06 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Su Chen Inventor after: Wu Baisheng Inventor after: Wu Xiaofang Inventor after: Huang Zhanzhong Inventor after: Wang Nanyang Inventor after: Peng Haoyi Inventor after: Guo Shuchao Inventor after: Jiang Quming Inventor after: Yu Yanxiong Inventor before: Su Chen Inventor before: Huang Zhanzhong Inventor before: Jiang Quming Inventor before: Peng Haoyi Inventor before: Sun Binhua Inventor before: Guo Shuchao Inventor before: Yu Yanxiong Inventor before: Chen Ping Inventor before: Wu Liang Inventor before: Wu Baisheng |
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Application publication date: 20170201 |
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