CN106371040B - A kind of apparatus for testing chip and system - Google Patents
A kind of apparatus for testing chip and system Download PDFInfo
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- CN106371040B CN106371040B CN201610762681.4A CN201610762681A CN106371040B CN 106371040 B CN106371040 B CN 106371040B CN 201610762681 A CN201610762681 A CN 201610762681A CN 106371040 B CN106371040 B CN 106371040B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
The invention discloses a kind of apparatus for testing chip, comprising: test platform, multiple test benches；Wherein, each test bench is equipped with magnetic pole, and test platform is equipped with the magnetic inductor being correspondingly arranged with each magnetic pole for exporting electric signal.The invention also discloses a kind of chip test systems.By the above-mentioned means, the present invention can electric signal is of different sizes to prevent test bench to be installed to position not corresponding with test station according to exporting.
Description
Technical field
The present invention relates to chip testing fields, more particularly to a kind of apparatus for testing chip and system.
Background technique
In chip production, by for example classifying the time required to chip testing than chip, laser printing, the processes institute such as packaging
Take time length, therefore, in actual production, multiple test stations can be arranged simultaneously to chip testing in testing this process,
But multistation test can occur contacting in test bench it is tired, stained, need by test bench take out debugged, repaired when, hold
Easily occur test bench being installed to the mistake in the test station of non-corresponding, causes test result chaotic.
In the prior art, general use is arranged on the positioning pin and test bench of different location on the slideway of test station
The corresponding mode of location hole prevents the mistake that test bench is installed in the test station of non-corresponding, but this mode, can make
Cross validation cannot be carried out in test bench on different station by obtaining.
Summary of the invention
The present invention provides a kind of apparatus for testing chip and system, it is intended to solve in multistation test, test bench is easy
The problem of existing installation site mistake.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: a kind of test device is provided, the device
It include: test platform, multiple test benches；Wherein, each test bench is equipped with magnetic pole, and the test platform is equipped with and each magnetic
The magnetic inductor that pole is correspondingly arranged is for exporting electric signal.
Wherein, the test bench and the test platform are relatively fixed, and each test bench and the magnetic inductor
It is respectively arranged at the test platform different surfaces.
Wherein, the magnetic pole is set to the test bench bottom, and different in the setting position of each test bench bottom.
Wherein, the test bench quantity is four.
It wherein, further comprise detector, the detector is electrically connected with the magnetic inductor, for detecting the telecommunications
Number size.
Wherein, when the magnetic inductor output signal is low level 0, the test bench is worked normally；The magnetic induction
When device output signal includes high level 1, the test bench cisco unity malfunction.
Wherein, when the magnetic inductor output signal is low level 0, the installation of test bench position is correct；The magnetic induction
When device output signal includes high level 1, test bench position setup error.
In order to solve the above technical problems, another technical solution used in the present invention is: a kind of chip test system is provided,
The system includes above-mentioned test device.
It wherein, further comprise manipulator, the manipulator is equipped with test station, for placing chip to be tested.
Wherein, the manipulator is rotary type tower manipulator.
The beneficial effects of the present invention are: be in contrast to the prior art, the present invention by the way that magnetic pole is arranged on test bench,
On test platform with magnetic pole corresponding position setting magnetic inductor in a manner of exporting electric signal, so that if test bench installation is wrong
Accidentally, not corresponding with magnetic inductor below, then magnetic inductor output electric signal is high level signal, and test macro is unable to work
Make, test bench setup error, not corresponding with test station is prevented with this.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of apparatus for testing chip embodiment provided by the invention；
Structural schematic diagram when Fig. 2 is test bench setup error in Fig. 1；
Fig. 3 is the part-structure electrical connection schematic diagram for the apparatus for testing chip embodiment that invention provides；
Fig. 4 is chip test system structural schematic diagram provided by the invention；
Fig. 5 is robot manipulator structure schematic diagram in Fig. 4.
Specific embodiment
To make those skilled in the art more fully understand technical solution of the present invention, with reference to the accompanying drawing and it is embodied
Mode is described in further detail a kind of apparatus for testing chip provided by the present invention and system.
Refering to fig. 1, apparatus for testing chip of the present invention includes: test platform 10, multiple test benches 12.
Wherein, test bench 12 and test platform 10 are relatively fixed.
Specifically, test platform 10 is fixed in the setting of test bench 12 above test platform, is needed, the present invention
In, the quantity of test bench 12 be it is multiple, be specifically not construed as limiting, in the present embodiment diagram for four.
Wherein, each test bench 12 is equipped with magnetic pole 122, and test platform 10 is equipped with and is correspondingly arranged with each magnetic pole 122
Magnetic inductor 102 for exporting electric signal, and each test bench 12 and magnetic inductor 102 are respectively arranged at test platform 10 not
Same surface.
Specifically, test bench 12 is set to 10 upper surface of test platform, 12 bottom of test bench is equipped with magnetic pole 122, and each
The magnetic pole 122 of 12 bottom of test bench is arranged position and is all different, and the magnetic inductor 102 on test platform 10 is set to test platform
Lower surface, and different location is correspondingly arranged at according to 122 position of magnetic pole of 12 bottom of test bench；Magnetic inductor 102 and magnetic pole 122
The magnetic field of formation makes magnetic inductor 102 export electric signal, and the electric signal size that the magnetic force size of different magnetic field is exported is not
Together.
Wherein, when 102 output signal of magnetic inductor is low level 0, test bench 12 is worked normally；Magnetic inductor 102
When output signal includes high level 1,12 cisco unity malfunction of test bench；When 102 output signal of magnetic inductor is low level 0,
The installation of 12 position of test bench is correct；When 102 output signal of magnetic inductor includes high level 1,12 position setup error of test bench.
Specifically, as shown in Figure 1, test bench 12 is arranged on test platform 10, when the electrode 122 of 12 bottom of test bench
With 102 position of magnetic inductor of the lower section of test platform 10 to it is corresponding when then magnetic inductor 102 exports electric signal is low level 0, at this time
The installation of 12 position of test bench is correct and can work normally；As shown in Fig. 2, when the electrode 122 and test platform 10 of test bench bottom
Illustrate that at least there are two test bench 12 and test platforms 10 in the test device when 102 position of magnetic inductor of lower section is not to correspondence
102 position of magnetic inductor of lower section does not correspond to, then it is high level 1 that magnetic inductor 102, which exports electric signal, at this time 12 position of test bench
Setup error and cisco unity malfunction.
Wherein, magnetic inductor 102 can be Hall magnetic inductor, it has to magnetic-field-sensitive, structure is simple, it is small in size,
The advantages that frequency response is wide, output voltage changes greatly with long service life.
Refering to Fig. 3, which further includes test machine 14, detector 142.
Detector 142 is electrically connected with magnetic inductor 102, and the size of electric signal, test are exported for detecting magnetic inductor 102
Machine 14 is electrically connected with test bench 12, is worked for controlling test bench 12.It should be noted that in the present embodiment, detector 142
It can be all-in-one machine with test machine 14, i.e., include detector 142,102 electricity of test machine 14 and magnetic inductor in test machine 14
Connection detects magnetic inductor 102 by test machine 14 and exports electric signal size.
Refering to Fig. 4, the present invention also provides a kind of test macro, which includes above-mentioned test device.
Further, which further includes manipulator 16, and manipulator 16 is equipped with test station 162, for putting
Set chip to be tested.
Refering to Fig. 5, there is multiple stations on manipulator 16, for chip placement including but not limited to be tested, be classified,
Laser printing, appearance optical check, tape package processing step.It should be noted that the embodiment of the present invention is surveyed for chip
This process is tried, therefore, in multiple stations on manipulator, chip test system embodiment of the present invention is only with test station 162
It makes an explanation, and 162 quantity of test station is for four in the present embodiment, test station 162 is for placing core to be tested
Piece.
Wherein, manipulator 16 is rotary type tower manipulator.
Fig. 4 is further regarded to, when manipulator 16 works, when carrying out this process of chip testing, manipulator 16 is turned to
Test station 162 is located at above-mentioned test device, and test station 162 is located at the top of test bench 12, and each test work at this time
The corresponding test bench 12 in position 162 illustrates all tests if the output electric signals of magnetic inductor 102 all at this time is 0
Seat 12 is respectively mounted that position is correct, corresponding with the test station 162 above it, which works normally；If there is magnetic induction
It is 1 that device 102, which exports electric signal, then illustrates the 12 installation site mistake of test bench of the position, not with the test station 162 above it
It is corresponding, the test macro cisco unity malfunction.
It is different from the prior art, the present invention answers position with pole pair on test platform by the way that magnetic pole is arranged on test bench
Magnetic inductor is installed in a manner of exporting electric signal, so that if the test station of chip to be measured is placed in test bench and its top
It does not correspond to, then magnetic inductor output signal is high level signal, and test macro cisco unity malfunction, and then prevents to test
Seat is installed to the test station of non-corresponding；And since the present invention does not make a change test station, when needing to test bench
When carrying out the cross validation of different station, it is only necessary to, will be corresponding with the test bench bottom magnetic pole when intersecting installation test bench
Magnetic inductor is arranged in the corresponding position of magnetic pole, and therefore, the present invention is convenient, and the intersection for carrying out different station to test bench is tested
Card.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (9)
1. a kind of apparatus for testing chip characterized by comprising test platform, multiple test benches；
Wherein, each test bench is equipped with magnetic pole, and the test platform is equipped with the magnetic inductor being correspondingly arranged with each magnetic pole
For exporting electric signal；
The magnetic pole is set to the test bench bottom, and different in the setting position of each test bench bottom.
2. test device according to claim 1, which is characterized in that the test bench is opposite with the test platform solid
It is fixed, and each test bench and the magnetic inductor are respectively arranged at the test platform different surfaces.
3. test device according to claim 2, which is characterized in that the test bench quantity is four.
4. test device according to claim 1, which is characterized in that it further comprise detector, the detector and institute
Magnetic inductor electrical connection is stated, for detecting the electric signal size.
5. test device according to claim 1, which is characterized in that the magnetic inductor output signal is low level 0
When, the test bench works normally；When the magnetic inductor output signal includes high level 1, the test bench cannot normal work
Make.
6. test device according to claim 1, which is characterized in that the magnetic inductor output signal is low level 0
When, the installation of test bench position is correct；When the magnetic inductor output signal includes high level 1, the test bench position installation is wrong
Accidentally.
7. a kind of chip test system, which is characterized in that including the described in any item test devices of claim 1~6.
8. test macro according to claim 7, which is characterized in that further comprise manipulator, set on the manipulator
There is test station, for placing chip to be tested.
9. test macro according to claim 8, which is characterized in that the manipulator is rotary type tower manipulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610762681.4A CN106371040B (en) | 2016-08-30 | 2016-08-30 | A kind of apparatus for testing chip and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610762681.4A CN106371040B (en) | 2016-08-30 | 2016-08-30 | A kind of apparatus for testing chip and system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106371040A CN106371040A (en) | 2017-02-01 |
| CN106371040B true CN106371040B (en) | 2019-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610762681.4A Active CN106371040B (en) | 2016-08-30 | 2016-08-30 | A kind of apparatus for testing chip and system |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109013402B (en) * | 2018-09-26 | 2020-08-07 | 通富微电子股份有限公司 | Semiconductor test system, test sorting machine and test machine |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1084971A (en) * | 1992-09-28 | 1994-04-06 | 吴友农 | Double-working position identify sensor |
| JP2003177004A (en) * | 2001-10-05 | 2003-06-27 | Tyco Electronics Amp Kk | Angle sensor |
| CN200944131Y (en) * | 2006-08-21 | 2007-09-05 | 广东省电子技术研究所 | Battery testing machine |
| CN201616521U (en) * | 2010-01-22 | 2010-10-27 | 沁业科技有限公司 | Positioning structure for chip test socket |
| CN103579788A (en) * | 2012-07-25 | 2014-02-12 | 阿自倍尔株式会社 | Controlling device |
| KR20140046426A (en) * | 2014-02-12 | 2014-04-18 | 이언주 | Method and system of managementing test by cell type |
-
2016
- 2016-08-30 CN CN201610762681.4A patent/CN106371040B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1084971A (en) * | 1992-09-28 | 1994-04-06 | 吴友农 | Double-working position identify sensor |
| JP2003177004A (en) * | 2001-10-05 | 2003-06-27 | Tyco Electronics Amp Kk | Angle sensor |
| CN200944131Y (en) * | 2006-08-21 | 2007-09-05 | 广东省电子技术研究所 | Battery testing machine |
| CN201616521U (en) * | 2010-01-22 | 2010-10-27 | 沁业科技有限公司 | Positioning structure for chip test socket |
| CN103579788A (en) * | 2012-07-25 | 2014-02-12 | 阿自倍尔株式会社 | Controlling device |
| KR20140046426A (en) * | 2014-02-12 | 2014-04-18 | 이언주 | Method and system of managementing test by cell type |
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| CN106371040A (en) | 2017-02-01 |
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Address after: 226001 Jiangsu Province, Nantong City Chongchuan District, No. 288 Applicant after: Tongfu Microelectronics Co., Ltd. Address before: 226001 Jiangsu Province, Nantong City Chongchuan District, No. 288 Applicant before: Fujitsu Microelectronics Co., Ltd., Nantong |
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