CN106366914A - Shaping method for heat conductive silica gel material - Google Patents
Shaping method for heat conductive silica gel material Download PDFInfo
- Publication number
- CN106366914A CN106366914A CN201610725160.1A CN201610725160A CN106366914A CN 106366914 A CN106366914 A CN 106366914A CN 201610725160 A CN201610725160 A CN 201610725160A CN 106366914 A CN106366914 A CN 106366914A
- Authority
- CN
- China
- Prior art keywords
- silica gel
- heat conductive
- conductive silica
- gel material
- forming method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
- B29C69/001—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
The invention relates to silica gel sheets and particularly relates to a shaping method for a heat conductive silica gel material. The method includes the steps of: mixing and fusing the following raw materials: 10-20 parts of vinyl silicone oil, 1-2 parts of a platinum catalyst, 1-3 parts of aluminum nitride, 0.5-1 part of ferric oxide, 1-2 parts of a crosslinker, 1-2 parts of graphene, 1-2 parts of polypropylene, and 0.5 parts of nitric acid; extruding the fused mixture and coating a silica gel base material with the mixture, and when the mixture is cooled, cutting the silica gel base material into heat conductive silica gel sheets. The heat conductive silica gel material can be tolerated at 260 DEG C and has better high-temperature resistant effect.
Description
Technical field
The present invention relates to silica gel piece field is and in particular to a kind of forming method of heat conductive silica gel material.
Background technology
Current heat conductive silica gel material, cannot tolerate long high temperature after molding, may deform.
Content of the invention
The present invention is directed to the deficiencies in the prior art, there is provided prevent the forming method of the heat conductive silica gel material of high temperature deformation.
In order to realize foregoing invention purpose, the present invention employs the following technical solutions: a kind of molding side of heat conductive silica gel material
Method it is characterised in that: aoxidize two by 10-20 part vinyl silicone oil, 1-2 part platinum catalyst, 1-3 part aluminium nitride, 0.5-1 part three
Ferrum, 1-2 part cross-linking agent, 1-2 part Graphene, polypropylene 1-2 part, 0.5 part of nitric acid melt after mixing, and after extrusion, melt coating is to silicon
In gum base materials, after cooling, cut into heat-conducting silica gel sheet.
Cut using cutter.By 10 parts of vinyl silicone oils, 1 part of platinum catalyst, 1 part of aluminium nitride, 0.5 part of three oxidation
Two ferrum, 1 part of cross-linking agent, 1 part of Graphene, 1 part of polypropylene, 0.5 part of nitric acid melt after mixing, and after extrusion, melt coating is to silica gel base
On material, after cooling, cut into heat-conducting silica gel sheet.
Described nitric acid is 5% salpeter solution, and percentage ratio accounts for the mass percent of salpeter solution for nitric acid solute.Described
Cross-linking agent is the mixture of stannum oxide and cumyl peroxide.The mass ratio of stannum oxide and cumyl peroxide is 1:1.
The heat conductive silica gel material of present invention preparation, is resistant to 260 degrees Celsius of high temperature, high-temperature resistant result is more preferable.
Specific embodiment
With reference to specific embodiment, the present invention is further described in detail.
Embodiment 1
A kind of forming method of heat conductive silica gel material, by 10 parts of vinyl silicone oils, 1 part of platinum catalyst, 1 part of aluminium nitride, 0.5 part
Iron sesquioxide, 1 part of cross-linking agent, 1 part of Graphene, 1 part of polypropylene, 0.5 part of nitric acid melt after mixing, and after extrusion, melt coating arrives
On silica gel substrate, after cooling, cut into heat-conducting silica gel sheet.Cut using cutter.Described nitric acid is 5% salpeter solution,
Percentage ratio accounts for the mass percent of salpeter solution for nitric acid solute.Described cross-linking agent is stannum oxide and cumyl peroxide
Mixture.The mass ratio of stannum oxide and cumyl peroxide is 1:1.
Through overtesting, under 260 celsius temperatures, 2h is indeformable for the product of embodiment 1.
Comparative example 1
With embodiment 1, aluminium nitride, nitric acid, Graphene are lacked.
Through overtesting, the product of comparative example 1, under 260 celsius temperatures, deforms after 1h.
It should be noted that the foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention,
Every equivalent structure being done using present specification or equivalent flow conversion, or directly or indirectly it is used in other phases
Close technical field, be included within the scope of the present invention.
Claims (6)
1. a kind of forming method of heat conductive silica gel material it is characterised in that: by 10-20 part vinyl silicone oil, 1-2 part platinum catalysis
Agent, 1-3 part aluminium nitride, 0.5-1 part iron sesquioxide, 1-2 part cross-linking agent, 1-2 part Graphene, polypropylene 1-2 part, nitric acid 0.5
Melt after part mixing, after extrusion, melt coating, on silica gel substrate, cuts into heat-conducting silica gel sheet after cooling.
2. a kind of heat conductive silica gel material according to claim 1 forming method it is characterised in that: carried out using cutter
Cutting.
3. a kind of heat conductive silica gel material according to claim 1 forming method it is characterised in that: by 10 parts of vinyl silicon
Oil, 1 part of platinum catalyst, 1 part of aluminium nitride, 0.5 part of iron sesquioxide, 1 part of cross-linking agent, 1 part of Graphene, 1 part of polypropylene, nitric acid
Melt after 0.5 part of mixing, after extrusion, melt coating, on silica gel substrate, cuts into heat-conducting silica gel sheet after cooling.
4. a kind of heat conductive silica gel material according to claim 1 forming method it is characterised in that: described nitric acid be 5%
Salpeter solution, percentage ratio accounts for the mass percent of salpeter solution for nitric acid solute.
5. a kind of heat conductive silica gel material according to claim 1 forming method it is characterised in that: described cross-linking agent is
Stannum oxide and the mixture of cumyl peroxide.
6. a kind of heat conductive silica gel material according to claim 5 forming method it is characterised in that: stannum oxide and peroxidating
The mass ratio of diisopropylbenzene (DIPB) is 1:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610725160.1A CN106366914A (en) | 2016-08-26 | 2016-08-26 | Shaping method for heat conductive silica gel material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610725160.1A CN106366914A (en) | 2016-08-26 | 2016-08-26 | Shaping method for heat conductive silica gel material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106366914A true CN106366914A (en) | 2017-02-01 |
Family
ID=57878567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610725160.1A Pending CN106366914A (en) | 2016-08-26 | 2016-08-26 | Shaping method for heat conductive silica gel material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106366914A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101429339A (en) * | 2008-11-19 | 2009-05-13 | 安徽华菱电缆集团有限公司 | Industrial process for producing silicon rubber polyolefin alloy cable material |
| CN103627179A (en) * | 2013-11-29 | 2014-03-12 | 中国科学院金属研究所 | Graphene-containing silicone rubber composite material with high thermal conductivity and preparation method thereof |
| CN105315958A (en) * | 2015-10-28 | 2016-02-10 | 苏州天脉导热科技有限公司 | Addition heat-conducting self-adhesive silicone rubber and preparation method thereof |
-
2016
- 2016-08-26 CN CN201610725160.1A patent/CN106366914A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101429339A (en) * | 2008-11-19 | 2009-05-13 | 安徽华菱电缆集团有限公司 | Industrial process for producing silicon rubber polyolefin alloy cable material |
| CN103627179A (en) * | 2013-11-29 | 2014-03-12 | 中国科学院金属研究所 | Graphene-containing silicone rubber composite material with high thermal conductivity and preparation method thereof |
| CN105315958A (en) * | 2015-10-28 | 2016-02-10 | 苏州天脉导热科技有限公司 | Addition heat-conducting self-adhesive silicone rubber and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 周文英等: "《导热高分子材料》", 30 April 2014, 国防工业出版社 * |
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20170201 |