CN106352862B - A kind of digital differential relaying type micro-acceleration gauge - Google Patents
A kind of digital differential relaying type micro-acceleration gauge Download PDFInfo
- Publication number
- CN106352862B CN106352862B CN201610944688.8A CN201610944688A CN106352862B CN 106352862 B CN106352862 B CN 106352862B CN 201610944688 A CN201610944688 A CN 201610944688A CN 106352862 B CN106352862 B CN 106352862B
- Authority
- CN
- China
- Prior art keywords
- tuning fork
- ended tuning
- mass block
- double
- quartzy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 35
- 239000010703 silicon Substances 0.000 claims abstract description 35
- 239000010453 quartz Substances 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 4
- 239000004575 stone Substances 0.000 claims description 2
- 230000008901 benefit Effects 0.000 abstract description 7
- 230000004044 response Effects 0.000 abstract description 2
- 230000001133 acceleration Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
- G01C19/5621—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks the devices involving a micromechanical structure
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Abstract
A kind of digital differential relaying type micro-acceleration gauge chip, including with mass block-spring function silicon base and two quartzy double-ended tuning forks, silicon base is made of two cantilever beams of mass block and support mass block, mass block, cantilever beam composition mass block-spring system are referred to along micro-acceleration gauge chip sensitive direction, cantilever beam have elastic characteristic, cantilever beam along mass block diagonal；Quartzy double-ended tuning fork along mass block an other diagonal, the identical quartzy double-ended tuning fork of two structures is in differential fashion arrangement, the present invention can eliminate influence of the temperature to sensor, improve the nonlinearity of sensor, have many advantages, such as that fast response time, precision are high.
Description
Technical field
The invention belongs to the digital accelerometer technical fields of micromechanics electronics (MEMS), and in particular to a kind of digital difference
Ejector half micro-acceleration gauge.
Background technique
Digital accelerometer does not need digital-to-analogue conversion link, can be directly embedded into digital processing system, high with precision,
The advantages that corresponding fast, strong antijamming capability.Meanwhile there is body using micro- digital accelerometer of micromechanics electronic technology processing
The advantages that product is small, at low cost, just attract increasing attention power.Digital micro-acceleration gauge has a micro- vibration in sensor
Dynamic element is used to sense accelerations, cooperates corresponding exciting circuit, vibrating elements is in resonant state always.The vibration of vibrating elements
Dynamic frequency is related with the axial force that it is subject to.By corresponding quality-spring converting system, acceleration is converted into vibrating elements
The variation of interior axial force, the axial force change the vibration frequency of vibrating elements, and then this frequency is changed by corresponding circuit
Digital signal output is converted to, realizes the digitized measurement of acceleration signal.
The big component parts of the two of digital micro-acceleration gauge is mass-spring system and vibrating elements.For quality-spring
System can effectively be reduced the size of sensor using the micro-structure substituted metal structure being process by silicon materials, be had
Small in size, the advantages that precision is high, at low cost.In Chinese patent ZL201210240759.8, a kind of entitled " four girder construction of silicon substrate
In quartz resonance acceleration transducer chip ", quartzy double-ended tuning fork is fixed on to the mass block-bullet processed using silicon materials
In spring system, mass block-spring system is made of the inertial mass that four beams support.Since the heat of quartz and two kinds of materials of silicon is swollen
Swollen coefficient is different, and will appear thermal stress when the temperature varies, in quartz tuning-fork causes the output of sensor to generate temperature drift.For
Solution this problem, in Chinese patent ZL201210568654.5, entitled " silicon substrate quartz with temperature isolation structure adds
In velocity sensor ", a kind of propose temperature isolation structure to reduce the influence of temperature, but be previously mentioned temperature isolation structure
The sensitivity of sensor is also reduced while effectively reducing temperature influences.
Summary of the invention
In order to overcome the disadvantages of the above prior art, the purpose of the present invention is to provide a kind of micro- acceleration of digital differential relaying type
Degree meter, can eliminate influence of the temperature to sensor, improve the nonlinearity of sensor, have fast response time, precision height etc.
Advantage.
To achieve the goals above, the technical solution adopted by the present invention are as follows:
A kind of digital differential relaying type micro-acceleration gauge chip, including with mass block-spring function silicon base 1 and two
Quartzy double-ended tuning fork 2-a, 2-b, silicon base 1 are made of two cantilever beams 4-a, 4-b of mass block 3 and support mass block 3,
Mass block 3, the first cantilever beam 4-a and the second cantilever beam 4-b composition mass block-spring system are referred to along micro-acceleration gauge core
Piece sensitive direction SA, the first cantilever beam 4-a, the second cantilever beam 4-b have elastic characteristic, the first cantilever beam 4-a, the second cantilever beam
4-b along mass block 3 the direction diagonal line DC2；First quartzy double-ended tuning fork 2-a, the second quartzy double-ended tuning fork 2-b
It is arranged along an other diagonal DC1 for mass block 3, the first quartzy double-ended tuning fork 2-a, the second quartzy both-end are solid
Accordatura fork 2-b structure is identical, and quartzy double-ended tuning fork 2-a, 2-b are in differential fashion arrangement.
The silicon base 1 uses bulk silicon process, is provided with the first quartz of positioning in 1 diagonal DC1 of silicon base
Four locating slots 6-a, 6-b, 6-c, 6-d of double-ended tuning fork 2-a, the second quartzy double-ended tuning fork 2-b, quartzy both-end are solid
Two fixing ends 7-a, 7-b of accordatura fork 2 are separately fixed in four locating slots 6-a, 6-b, 6-c, 6-d of silicon base 1.
The quartzy double-ended tuning fork 2 is coated on each prong of tuning fork on four sides from quartz crystal processing
Electrode 8 is electrically connected to each other between electrode 8, when normal work, has alternating voltage on electrode 8, due to quartz crystal piezoelectricity and
Inverse piezoelectric effect, quartzy double-ended tuning fork 2 can be in the anti-phase vibration mode in same plane.
The depth of 6-a, 6-b, 6-c, 6-d need to guarantee that quartzy double-ended tuning fork 2 is attached in four locating slots
After in silicon base 1, the middle position in silicon wafer thickness section 9.
The invention has the benefit that
The silicon base of this accelerometer is manufactured using the micro- technique of silicon, have small in size, precision is high, can mass production etc. it is excellent
Point；Have many advantages, such as easy excitation, high quality factor, digital signal output as vibrating elements using quartzy double-ended tuning fork,
Digital processing system can be directly embedded into；Meanwhile quartzy double-ended tuning fork is arranged using differential fashion, can eliminate temperature
It influences；The quartzy double-ended tuning forks design of two of differential fashion arrangement is improved quality the diagonal positions of block in silicon substrate, can be subtracted
The size of small micro-acceleration gauge chip.
Detailed description of the invention
Fig. 1 is micro-acceleration gauge chip structure schematic diagram of the present invention.
Fig. 2 is silicon substrate bottom structure of the present invention using micro fabrication manufacture.
Fig. 3 is the quartzy double-ended tuning fork schematic diagram that the present invention uses, and wherein Fig. 3-1 is that quartz tuning-fork overall structure is shown
It is intended to；Fig. 3-2 is distribution and the electrical connection diagram of quartz tuning-fork top electrode.
Fig. 4 is the Section A-A schematic diagram of Fig. 1.
When Fig. 5 is micro-acceleration gauge chip operation with the connection schematic diagram of quartz resonance circuit.
Specific embodiment
Structure & working mechanism of the invention is described in detail below in conjunction with attached drawing.
Referring to Fig.1, a kind of digital differential relaying type micro-acceleration gauge chip, including with mass block-spring function silicon substrate
Bottom 1 and two quartzy double-ended tuning fork 2-a, 2-b, silicon base 1 is by mass block 3 and two cantilever beam 4- for supporting mass block 3
A, 4-b is formed, and mass block 3, the first cantilever beam 4-a and the second cantilever beam 4-b composition mass block-spring system are referred to along micro-
Accelerometer chip sensitive direction SA, the first cantilever beam 4-a, the second cantilever beam 4-b have elastic characteristic, the first cantilever beam 4-a,
Second cantilever beam 4-b along mass block 3 the direction diagonal line DC2；First quartzy double-ended tuning fork 2-a, the second quartzy both-end
Fixed tuning fork 2-b is arranged along an other diagonal DC1 for mass block 3, the first quartzy double-ended tuning fork 2-a, the
Two quartzy double-ended tuning fork 2-b structures are identical, and quartzy double-ended tuning fork 2-a, 2-b are in differential fashion arrangement, this right
The arrangement of linea angulata can reduce the size of micro-acceleration gauge chip.
Referring to Fig. 2, the silicon base 1 uses bulk silicon process, solid in order to position the first quartzy both-end during installation
2-a, the second quartzy double-ended tuning fork 2-b are pitched in accordatura, open that there are four locating slot 6-a, 6- in 1 diagonal DC1 of silicon base
b、6-c、6-d。
Referring to Fig. 3-1, two fixing ends 7-a, 7-b of the quartzy double-ended tuning fork 2 are separately fixed at silicon base 1
Four locating slots 6-a, 6-b, 6-c, 6-d in；Referring to Fig. 3-2, the quartzy double-ended tuning fork 2 is processed by quartz crystal
, it is coated with electrode 8 on four sides on each prong of tuning fork, is electrically connected to each other between electrode 8, when normal work, meeting on electrode 8
There is alternating voltage, due to the piezoelectricity and inverse piezoelectric effect of quartz crystal, quartzy double-ended tuning fork 2 can be in same plane
Anti-phase vibration mode.
Referring to Fig. 4, the depth of 6-a, 6-b, 6-c, 6-d need to guarantee quartzy both-end stationary tone in four locating slots
After fork 2 pastes on a silicon substrate 1, the middle position in silicon wafer thickness section 9, the purpose designed in this way is to can be improved micro- acceleration
The linearity of degree meter chip.
The working principle of the invention is:
Referring to Fig. 5, described two quartz double-ended tuning fork 2-a, 2-b are connected to the stone being made of double phase inverters
In English resonance circuit 10-a, 10-b, quartz resonance circuit provides alternating voltage, and quartz resonance circuit 10-a, 10-b itself is
DC level is powered, and the resistance R1~R4 and capacitor C1 in quartz resonance circuit 10-a, 10-b need solid according to quartzy both-end
The equivalent circuit parameter of accordatura fork 2-a, 2-b are specifically set, to guarantee to motivate quartzy double-ended tuning fork 2-a, 2-b can
In conplane anti-phase vibration mode, quartz resonance circuit 10-a, 10-b output frequency digital signal, by difference frequency
Output of the difference on the frequency of both circuit countings as sensor.
Cantilever beam 4-a, 4-b in silicon base 1 and mass block 3 form mass block-spring system, when having acceleration along quick
When sense direction SA acts on micro-acceleration gauge chip, according to Newton's second law, mass block 3 will receive the effect of inertia force, matter
Inertia force is transmitted in quartzy double-ended tuning fork 2-a, 2-b by gauge block 3, is caused inside quartzy double-ended tuning fork 2-a, 2-b
Axial stress changes, this axial stress changes the vibration frequency of tuning fork, by detecting quartzy double-ended tuning fork 2-a, 2-b
The measurement of acceleration signal is realized in the variation of vibration frequency.
Since quartzy double-ended tuning fork 2-a, 2-b are in differential fashion arrangement, that is, when having acceleration effect in biography
When sensor, one therein quartzy double-ended tuning fork tension, vibration frequency becomes larger；Other one quartzy double-ended tuning fork
It is pressurized, vibration frequency becomes smaller.Output of the difference of two quartzy double-ended tuning fork frequency variations as sensor.
The present invention can eliminate influence of the temperature to sensor.The heat of two kinds of material silicons and quartz that sensor chip uses
The coefficient of expansion is different.When temperature changes, thermal stress can be generated in two quartzy double-ended tuning fork 2-a, 2-b and causes its vibration
Dynamic frequency changes.The frequency variation of the two is consistent, that is, is become larger or become smaller and absolute value is identical simultaneously, and is passed
The output signal of sensor is the difference of the two vibration frequency variation, therefore the variation of the frequency as caused by thermal stress is cancelled out each other, thus
Eliminate influence of the temperature to sensor.
Claims (4)
1. a kind of digital differential relaying type micro-acceleration gauge chip, including with mass block-spring function silicon base (1) He Lianggen
Quartzy double-ended tuning fork (2-a, 2-b), it is characterised in that: silicon base (1) by mass block (3) and support mass block (3) two
Root cantilever beam (4-a, 4-b) composition, mass block (3), the first cantilever beam (4-a) and the second cantilever beam (4-b) form mass block-bullet
Spring system refers to that, along micro-acceleration gauge chip sensitive direction SA, the first cantilever beam (4-a), the second cantilever beam (4-b) have
Elastic characteristic, the first cantilever beam (4-a), the second cantilever beam (4-b) along mass block (3) the direction diagonal line (DC2)；First stone
English double-ended tuning fork (2-a), the second quartzy double-ended tuning fork (2-b) along mass block (3) an other diagonal line side
It is arranged to (DC1), the first quartzy double-ended tuning fork (2-a), second quartzy double-ended tuning fork (2-b) structure are identical, and first
Quartzy double-ended tuning fork (2-a), the second quartzy double-ended tuning fork (2-b) are in differential fashion arrangement.
2. a kind of digital differential relaying type micro-acceleration gauge chip according to claim 1, it is characterised in that: the silicon substrate
Bottom (1) uses bulk silicon process, is provided with the quartzy double-ended tuning fork of positioning first in silicon base (1) diagonal (DC1)
Four locating slots (6-a, 6-b, 6-c, 6-d) of (2-a), the second quartzy double-ended tuning fork (2-b), the first quartzy both-end is consolidated
Two fixing ends (7-a, 7-b) of accordatura fork (2-a) are separately fixed in two locating slots (6-a, 6-b) of silicon base (1)；It will
Two fixing ends (7-a, 7-b) of the second quartzy double-ended tuning fork (2-b) are separately fixed at the another two positioning of silicon base (1)
In slot (6-c, 6-d).
3. a kind of digital differential relaying type micro-acceleration gauge chip according to claim 1, it is characterised in that: the quartz
Double-ended tuning fork (2) by quartz crystal processing from, be coated on four sides on each prong of tuning fork electrode (8), electrode (8) it
Between be electrically connected to each other, when normal work, electrode has alternating voltage on (8), due to the piezoelectricity and inverse piezoelectric effect of quartz crystal,
Quartzy double-ended tuning fork (2) can be in the anti-phase vibration mode in same plane.
4. a kind of digital differential relaying type micro-acceleration gauge chip according to claim 2, it is characterised in that: described four
After the depth of locating slot (6-a, 6-b, 6-c, 6-d) needs to guarantee that quartzy double-ended tuning fork (2) is attached on silicon base (1), place
In the middle position of silicon wafer thickness section (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610944688.8A CN106352862B (en) | 2016-10-26 | 2016-10-26 | A kind of digital differential relaying type micro-acceleration gauge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610944688.8A CN106352862B (en) | 2016-10-26 | 2016-10-26 | A kind of digital differential relaying type micro-acceleration gauge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106352862A CN106352862A (en) | 2017-01-25 |
| CN106352862B true CN106352862B (en) | 2019-04-09 |
Family
ID=57863432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610944688.8A Active CN106352862B (en) | 2016-10-26 | 2016-10-26 | A kind of digital differential relaying type micro-acceleration gauge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106352862B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108398575B (en) * | 2018-03-19 | 2024-02-27 | 重庆科技学院 | Electrostatic resonance accelerometer and acceleration measurement method |
| CN109765404B (en) * | 2018-12-28 | 2020-03-17 | 西安交通大学 | Accelerometer chip based on QoS technology, processing technology and accelerometer |
| CN110530548B (en) * | 2019-08-02 | 2020-08-18 | 西安交通大学 | Fiber grating detection method and device for measuring pressure and temperature parameters |
| CN111650401B (en) * | 2020-06-03 | 2021-05-07 | 西安交通大学 | Coplanar-mounted metal-based integrated resonant accelerometer |
| CN112611484B (en) * | 2020-12-12 | 2021-12-28 | 西安交通大学 | Metal-based flexible frame quartz differential resonance type pressure sensor |
| CN114280329A (en) * | 2021-12-27 | 2022-04-05 | 西安交通大学 | Quartz acceleration sensor with tuning fork fixedly supported at two ends |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000206141A (en) * | 1999-01-20 | 2000-07-28 | Miyota Kk | Momentum sensor |
| CN1844932A (en) * | 2006-05-23 | 2006-10-11 | 北京航空航天大学 | Dual-axis resonance type micromechanical accelerometer |
| CN102495236A (en) * | 2011-11-24 | 2012-06-13 | 北京航空航天大学 | High-sensitivity dual-axis silicon-micro resonance accelerometer |
| CN103472260A (en) * | 2013-08-15 | 2013-12-25 | 北京时代民芯科技有限公司 | MEMS cross beam capacitor accelerometer and manufacture method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015045621A1 (en) * | 2013-09-26 | 2015-04-02 | 株式会社村田製作所 | Angular velocity detection element |
-
2016
- 2016-10-26 CN CN201610944688.8A patent/CN106352862B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000206141A (en) * | 1999-01-20 | 2000-07-28 | Miyota Kk | Momentum sensor |
| CN1844932A (en) * | 2006-05-23 | 2006-10-11 | 北京航空航天大学 | Dual-axis resonance type micromechanical accelerometer |
| CN102495236A (en) * | 2011-11-24 | 2012-06-13 | 北京航空航天大学 | High-sensitivity dual-axis silicon-micro resonance accelerometer |
| CN103472260A (en) * | 2013-08-15 | 2013-12-25 | 北京时代民芯科技有限公司 | MEMS cross beam capacitor accelerometer and manufacture method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106352862A (en) | 2017-01-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106352862B (en) | A kind of digital differential relaying type micro-acceleration gauge | |
| EP2643702B1 (en) | Resonant biaxial accelerometer structure of the microelectromechanical type | |
| CN109061226B (en) | Design method of electrostatic negative stiffness type accelerometer | |
| Acar et al. | Experimental evaluation and comparative analysis of commercial variable-capacitance MEMS accelerometers | |
| US8225662B2 (en) | Acceleration sensing device | |
| Do et al. | Vacuum packaged low-power resonant MEMS strain sensor | |
| WO2014169540A1 (en) | Non-uniform cross section cantilever beam piezoelectricity acceleration sensor | |
| CN103808961B (en) | Cantilever part and apply its resonant mode acceleration transducer | |
| JP2010127763A (en) | Semiconductor mechanical quantity detection sensor and controller using the same | |
| CN103063875A (en) | Silicon substrate differential motion quartz acceleration sensor | |
| Li et al. | A micro-machined differential resonance accelerometer based on silicon on quartz method | |
| Christensen et al. | Hermetically encapsulated differential resonant accelerometer | |
| Zhang et al. | Nonlinear dynamics under varying temperature conditions of the resonating beams of a differential resonant accelerometer | |
| Li et al. | An integrated packaged resonant accelerometer with temperature compensation | |
| CN103439529A (en) | Silicon-vibrating-beam accelerometer based on chip-type integrated high-precision temperature measurement structure | |
| Zou et al. | Micro-electro-mechanical resonant tilt sensor with 250 nano-radian resolution | |
| Rao et al. | A High-resolution area-change-based capacitive MEMS accelerometer for tilt sensing | |
| KR100934217B1 (en) | Microsensor for vibration measurement | |
| Xiong et al. | Sensitivity enhancement of Mems resonant accelerometers by using electrostatic spring | |
| CN113740560B (en) | Weakly coupled resonant acceleration sensor | |
| Wang et al. | A micro-machined vibrating ring gyroscope with highly symmetric structure for harsh environment | |
| CN103983807A (en) | Silicon micromechanics accelerometer | |
| Miani et al. | Nanoresonator-based accelerometer with large bandwidth and improved bias stability | |
| Zhang et al. | Structure design and fabrication of silicon resonant micro-accelerometer based on electrostatic rigidity | |
| JP3368744B2 (en) | Vibration acceleration sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201023 Address after: No.19 Chuanghui Road, Chang'an District, Xi'an City, Shaanxi Province 710119 Patentee after: Shaanxi Lin Tak inertia Electric Co.,Ltd. Address before: Beilin District Xianning West Road 710049, Shaanxi city of Xi'an province No. 28 Patentee before: XI'AN JIAOTONG University |
|
| TR01 | Transfer of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Digital Differential Micro Accelerometer Effective date of registration: 20231225 Granted publication date: 20190409 Pledgee: Xi'an innovation financing Company limited by guarantee Pledgor: Shaanxi Lin Tak inertia Electric Co.,Ltd. Registration number: Y2023980073979 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |