CN106348758A - Micro low temperature vitrified diamond grinder - Google Patents
Micro low temperature vitrified diamond grinder Download PDFInfo
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- CN106348758A CN106348758A CN201610761215.4A CN201610761215A CN106348758A CN 106348758 A CN106348758 A CN 106348758A CN 201610761215 A CN201610761215 A CN 201610761215A CN 106348758 A CN106348758 A CN 106348758A
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/6303—Inorganic additives
- C04B35/6316—Binders based on silicon compounds
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/36—Glass starting materials for making ceramics, e.g. silica glass
- C04B2235/365—Borosilicate glass
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Abstract
The invention provides a micro low temperature vitrified diamond grinder and preparing method thereof, which integrates a high proportion of boric acid into traditional binder to reduce sintering temperature of binder, meanwhile a certain proportion of magnesium oxide is integrated to increase strength. Adopted specific temperature curve for firing, product fired in this way has even product density and blowhole; the invention of micro low temperature vitrified diamond grinder not only fills the gap of domestic dental new materials (zirconium oxide) which cannot be ground; also promoter innovations of more dental materials because it solves grinding problems of superhard materials, bringing into the fast development of innovation in detail industry new materials.
Description
Technical field
The present invention relates to dental ceramic dismembyator field, especially, it is related to a kind of micro low-temperature pottery diamond lap.
Background technology
On gear division market, miniature ceramic grinding device is mainly carborundum and the aluminium oxide ceramics dismembyator of high-temperature firing at present,
With the continuous release of gear division industry new material, the cutting power of original carborundum and aluminium oxide ceramics dismembyator cannot meet
The grinding that the grinding demand of new material, the only dismembyator containing diamond abrasive can be only achieved these new materials requires.
And conventional high-temperature bonding agent in high-temperature firing technique diamond abrasive carbonization and lose due cutting force, therefore
It is necessary that researching and developing one kind produces miniature pottery diamond lap product using low temperature sintering technology, to meet gear division market green wood
The grinding demand of material.
Content of the invention
Present invention aim at providing a kind of micro low-temperature pottery diamond lap and preparation method thereof, to solve technology
Problem.
A kind of micro low-temperature pottery diamond lap, including the composition of following weight ratio: vitrified bond 25-35 part,
White fused alumina 6-10 part, diamond 50-70 part, dextrine powder 5-10 part, water 12-18 part.
Preferably, described micro low-temperature pottery diamond lap, including the composition of following weight ratio: vitrified bond
32 parts, 8 parts of white fused alumina, 60 parts of diamond, 8 parts of dextrine powder, 15 parts of water.
Preferably, described vitrified bond, including the composition of following weight ratio: boric acid 40-60 part, silica flour 15-25
Part, nepheline powder 25-35 part, magnesium oxide 5-8 part, brium carbonate 4-7 part；The particle diameter of described silica flour is 325 mesh.
Preferably, described white fused alumina is wa400# white fused alumina.
Preferably, described diamond particle diameter is 170/200.
Because the resistant to elevated temperatures temperature extremes of diamond abrasive is 800 DEG C, carbonization will be started higher than 800 DEG C of diamond abrasives,
Rising with temperature is reduced by original cutting hardness, last carbonization.The cutting hardness of diamond abrasive to be ensured,
It is necessary for producing ceramic metal hard rock dismembyator using low temperature sintering technology.In order to be able to meet the sintering process less than 800 DEG C,
Can only design in the vitrified bond that can dissolve less than 800 DEG C.In order to reach low sintering purpose, the present invention is in tradition
Incorporate a high proportion of boric acid in bonding agent, to reduce the sintering temperature of bonding agent, incorporate a certain proportion of magnesium oxide simultaneously
To improve the intensity of bonding agent.
A kind of preparation method of micro low-temperature pottery diamond lap, comprises the following steps:
A, the vitrified bond powder incorporating boric acid and magnesium oxide is mixed 6-10 hour in V-shaped batch mixer, make powder abundant
Mix homogeneously it is ensured that sintering after bonding agent density concordance；
B, the powder of mix homogeneously is put into Cinker clew furnace burn 1300-1450 DEG C fire 5-7 hour, be melted into liquid completely to powder
Cooling is taken out after glassy；
C, by cooling after block bonding agent ball mill adopt dry mill process, be milled to 500 mesh sieves it is ensured that bonding agent is being fired
Uniformity during product；
D, will sieve after bonding agent powder incorporated diamond abrasive, white fused alumina, put in V-shaped batch mixer after dextrine powder by proportioning
Mixing 8 hours, allows powder be sufficiently mixed the uniformity uniformly ensureing granulation material；
E, mixed powder is put into after comminutor plus a certain proportion of water makes 50-80 DEG C of baking 6-10 hour system after 80 mesh granules
Become dry granular material, ensured from the mobility expected during dynamic pressure；
F, dry granular material is put into the dismembyator idiosome that automatic tableting press is pressed into even density；
G, the idiosome suppressing is put into sintering furnace, fired with the temperature curve less than 800 DEG C, after the completion of firing, Temperature fall
?；The product density so burning out and pore are all very uniform；
H, shaping after the idiosome baking hilt can be checked warehouse-in.
The method have the advantages that micro low-temperature pottery diamond lap of the present invention and preparation method thereof,
Incorporate a high proportion of boric acid in traditional bonding agent, to reduce the sintering temperature of bonding agent, incorporated a certain proportion of simultaneously
Magnesium oxide is improving the intensity of bonding agent.Fired using specific temperature curve, the product density so burning out and pore
All very uniform；The invention of micro low-temperature pottery diamond lap, has not only filled up domestic gear division new material (zirconium oxide etc.) no
The blank that method is ground；Because superhard material grinds the solution of problem, also drive the innovation of more gear division new materials, made gear division row
The innovation of industry new material is developed rapidly.
In addition to objects, features and advantages described above, the present invention also has other objects, features and advantages.
The present invention is further detailed explanation below.
Specific embodiment
Hereinafter embodiments of the invention are described in detail, but the present invention can limit according to claim and cover
Multitude of different ways implement.
Embodiment 1
A kind of micro low-temperature pottery diamond lap, including the composition of following weight ratio: 32 parts of vitrified bond, white fused alumina 8
Part, 60 parts of diamond, 8 parts of dextrine powder, 15 parts of water.
Described vitrified bond, including the composition of following weight ratio: 50 parts of boric acid, 20 parts of silica flour, nepheline powder 30
Part, 6 parts of magnesium oxide, 6 parts of brium carbonate, the particle diameter of described silica flour is 325 mesh.
Described white fused alumina is wa400# white fused alumina.
Described diamond particle diameter is 170/200.
A kind of preparation method of micro low-temperature pottery diamond lap, comprises the following steps:
A, the vitrified bond powder incorporating boric acid and magnesium oxide is mixed 8 hours in V-shaped batch mixer, allow powder to be sufficiently mixed
Uniformly it is ensured that after sintering bonding agent density concordance；
B, the powder of mix homogeneously is put into Cinker clew furnace burn 1400 DEG C fire 6 hours, be melted into liquid glass shape completely to powder
Take out cooling afterwards；
C, by cooling after block bonding agent ball mill adopt dry mill process, be milled to 500 mesh sieves it is ensured that bonding agent is being fired
Uniformity during product；
D, will sieve after bonding agent powder incorporated diamond abrasive, white fused alumina, put in V-shaped batch mixer after dextrine powder by proportioning
Mixing 8 hours, allows powder be sufficiently mixed the uniformity uniformly ensureing granulation material；
E, mixed powder is put into after comminutor plus a certain proportion of water is made 60 DEG C of bakings after 80 mesh granules and made dry granular in 8 hours
Material, has ensured from the mobility expected during dynamic pressure；
F, dry granular material is put into the dismembyator idiosome that automatic tableting press is pressed into even density；
G, the idiosome suppressing is put into sintering furnace, fired with the temperature curve less than 800 DEG C, after the completion of firing, Temperature fall
?；The product density so burning out and pore are all very uniform；
H, shaping after the idiosome baking hilt can be checked warehouse-in.
Described temperature curve is: first from room temperature, temperature is increased to 100 DEG C, takes 2 hours, keeping temperature 2 hours；Rise
Temperature, to 250 DEG C, takes 3 hours, keeping temperature 3 hours；It is warming up to 400 DEG C, take 3 hours, keeping temperature 3 hours；It is warming up to
600 DEG C, take 4 hours, keeping temperature 4 hours, all take 24 hours.
Embodiment 2
A kind of micro low-temperature pottery diamond lap, including the composition of following weight ratio: 35 parts of vitrified bond, white fused alumina 6
Part, 70 parts of diamond, 5 parts of dextrine powder, 18 parts of water.
Described vitrified bond, including the composition of following weight ratio: 45 parts of boric acid, 15 parts of silica flour, nepheline powder 35
Part, 5 parts of magnesium oxide, 7 parts of brium carbonate, the particle diameter of described silica flour is 325 mesh.
Described white fused alumina is wa400# white fused alumina.
Described diamond particle diameter is 170/200.
A kind of preparation method of micro low-temperature pottery diamond lap, comprises the following steps:
A, the vitrified bond powder incorporating boric acid and magnesium oxide is mixed 6 hours in V-shaped batch mixer, allow powder to be sufficiently mixed
Uniformly it is ensured that after sintering bonding agent density concordance；
B, the powder of mix homogeneously is put into Cinker clew furnace burn 1300 DEG C fire 7 hours, be melted into liquid glass shape completely to powder
Take out cooling afterwards；
C, by cooling after block bonding agent ball mill adopt dry mill process, be milled to 500 mesh sieves it is ensured that bonding agent is being fired
Uniformity during product；
D, will sieve after bonding agent powder incorporated diamond abrasive, white fused alumina, put in V-shaped batch mixer after dextrine powder by proportioning
Mixing 6 hours, allows powder be sufficiently mixed the uniformity uniformly ensureing granulation material；
E, mixed powder is put into after comminutor plus a certain proportion of water is made 80 DEG C of bakings after 80 mesh granules and made dry granular in 6 hours
Material, has ensured from the mobility expected during dynamic pressure；
F, dry granular material is put into the dismembyator idiosome that automatic tableting press is pressed into even density；
G, the idiosome suppressing is put into sintering furnace, fired with the temperature curve less than 800 DEG C, after the completion of firing, Temperature fall
?；The product density so burning out and pore are all very uniform；
H, shaping after the idiosome baking hilt can be checked warehouse-in.
Described temperature curve is: first from room temperature, temperature is increased to 100 DEG C, takes 2 hours, keeping temperature 2 hours；Rise
Temperature, to 250 DEG C, takes 2.5 hours, keeping temperature 3 hours；It is warming up to 400 DEG C, take 2.5 hours, keeping temperature 3 hours；Rise
Temperature, to 600 DEG C, takes 3 hours, and keeping temperature 4 hours all takes 22 hours.
Embodiment 3
A kind of micro low-temperature pottery diamond lap, including the composition of following weight ratio: 25 parts of vitrified bond, white fused alumina 10
Part, 50 parts of diamond, 10 parts of dextrine powder, 12 parts of water.
Described vitrified bond, including the composition of following weight ratio: 60 parts of boric acid, 25 parts of silica flour, nepheline powder 25
Part, 7 parts of magnesium oxide, 5 parts of brium carbonate, the particle diameter of described silica flour is 325 mesh.
Described white fused alumina is wa400# white fused alumina.
Described diamond particle diameter is 170/200.
A kind of preparation method of micro low-temperature pottery diamond lap, comprises the following steps:
A, the vitrified bond powder incorporating boric acid and magnesium oxide is mixed 10 hours in V-shaped batch mixer, make powder fully mixed
Close uniformly it is ensured that after sintering bonding agent density concordance；
B, the powder of mix homogeneously is put into Cinker clew furnace burn 1450 DEG C fire 5 hours, be melted into liquid glass shape completely to powder
Take out cooling afterwards；
C, by cooling after block bonding agent ball mill adopt dry mill process, be milled to 500 mesh sieves it is ensured that bonding agent is being fired
Uniformity during product；
D, will sieve after bonding agent powder incorporated diamond abrasive, white fused alumina, put in V-shaped batch mixer after dextrine powder by proportioning
Mixing 10 hours, allows powder be sufficiently mixed the uniformity uniformly ensureing granulation material；
E, mixed powder is put into after comminutor plus a certain proportion of water make after 80 mesh granules 50 DEG C dry make within 10 hours dry
Pellet, has ensured from the mobility expected during dynamic pressure；
F, dry granular material is put into the dismembyator idiosome that automatic tableting press is pressed into even density；
G, the idiosome suppressing is put into sintering furnace, fired with the temperature curve less than 800 DEG C, after the completion of firing, Temperature fall
?；The product density so burning out and pore are all very uniform；
H, shaping after the idiosome baking hilt can be checked warehouse-in.
Described temperature curve is: first from room temperature, temperature is increased to 100 DEG C, takes 2 hours, keeping temperature 2 hours；Rise
Temperature, to 250 DEG C, takes 3 hours, keeping temperature 3.5 hours；It is warming up to 400 DEG C, take 3 hours, keeping temperature 3.5 hours；Rise
Temperature, to 600 DEG C, takes 4 hours, and keeping temperature 5 hours all takes 26 hours.
The dismembyator performance of embodiment 1-3 is tested, is obtained following detection data:
| The porosity (%) | Rupture strength (mpa) | Rockwell hardness (hrb) | |
| Embodiment 1 | 25.4 | 55.3 | 43.5 |
| Embodiment 2 | 24.3 | 48.3 | 39.5 |
| Embodiment 3 | 24.2 | 46.9 | 40.2 |
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for those skilled in the art
For member, the present invention can have various modifications and variations.All any modifications within the spirit and principles in the present invention, made,
Equivalent, improvement etc., should be included within the scope of the present invention.
Claims (8)
1. a kind of micro low-temperature pottery diamond lap is it is characterised in that include the composition of following weight ratio: vitrified bond
25-35 part, white fused alumina 6-10 part, diamond 50-70 part, dextrine powder 5-10 part, water 12-18 part.
2. micro low-temperature pottery diamond lap as claimed in claim 1 is it is characterised in that described micro low-temperature is ceramic
Diamond lap, including the composition of following weight ratio: 32 parts of vitrified bond, 8 parts of white fused alumina, 60 parts of diamond, dextrine powder 8
Part, 15 parts of water.
3. micro low-temperature as claimed in claim 1 or 2 pottery diamond lap is it is characterised in that described Ceramic bond
Agent, including the composition of following weight ratio: boric acid 40-60 part, silica flour 15-25 part, nepheline powder 25-35 part, magnesium oxide 5-8 part,
Brium carbonate 4-7 part；The particle diameter of described silica flour is 325 mesh.
4. micro low-temperature as claimed in claim 3 pottery diamond lap is it is characterised in that described vitrified bond,
Composition including following weight ratio: 50 parts of boric acid, 20 parts of silica flour, 30 parts of nepheline powder, 6 parts of magnesium oxide, 6 parts of brium carbonate, described
Silica flour particle diameter be 325 mesh.
5. micro low-temperature pottery diamond lap as claimed in claim 1 is it is characterised in that described white fused alumina is
Wa400# white fused alumina.
6. micro low-temperature pottery diamond lap as claimed in claim 1 is it is characterised in that described diamond particle diameter is
170/200.
7. a kind of preparation method of micro low-temperature pottery diamond lap is it is characterised in that comprise the following steps:
A, the vitrified bond powder incorporating boric acid and magnesium oxide is mixed 6-10 hour in V-shaped batch mixer, make powder abundant
Mix homogeneously it is ensured that sintering after bonding agent density concordance；
B, the powder of mix homogeneously is put into Cinker clew furnace burn 1300-1450 DEG C fire 5-7 hour, be melted into liquid completely to powder
Cooling is taken out after glassy；
C, by cooling after block bonding agent ball mill adopt dry mill process, be milled to 500 mesh sieves it is ensured that bonding agent is being fired
Uniformity during product；
D, will sieve after bonding agent powder incorporated diamond abrasive, white fused alumina, put in V-shaped batch mixer after dextrine powder by proportioning
Mixing 8 hours, allows powder be sufficiently mixed the uniformity uniformly ensureing granulation material；
E, mixed powder is put into after comminutor plus a certain proportion of water makes 50-80 DEG C of baking 6-10 hour system after 80 mesh granules
Become dry granular material, ensured from the mobility expected during dynamic pressure；
F, dry granular material is put into the dismembyator idiosome that automatic tableting press is pressed into even density；
G, the idiosome suppressing is put into sintering furnace, fired with the temperature curve less than 800 DEG C, after the completion of firing, Temperature fall
?；The product density so burning out and pore are all very uniform；
H, shaping after the idiosome baking hilt can be checked warehouse-in.
8. the preparation method of micro low-temperature as claimed in claim 7 pottery diamond lap is it is characterised in that described temperature
Line of writing music is: first from room temperature, temperature is increased to 100 DEG C, takes 2 hours, keeping temperature 2 hours；It is warming up to 250 DEG C, take 3
Hour, keeping temperature 3 hours；It is warming up to 400 DEG C, take 3 hours, keeping temperature 3 hours；It is warming up to 600 DEG C, take 4 hours,
Keeping temperature 4 hours, all takes 24 hours.
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| CN201610761215.4A CN106348758A (en) | 2016-08-30 | 2016-08-30 | Micro low temperature vitrified diamond grinder |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108503362A (en) * | 2018-05-25 | 2018-09-07 | 张剑 | A kind of preparation method of nano-graphite base grinding-material |
| CN115403956A (en) * | 2022-09-14 | 2022-11-29 | 淄博金纪元研磨材有限公司 | Preparation method of stacked group white corundum micropowder for automatic driving automobile coating |
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2016
- 2016-08-30 CN CN201610761215.4A patent/CN106348758A/en active Pending
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| CN101913122A (en) * | 2010-07-21 | 2010-12-15 | 安泰科技股份有限公司 | Method for preparing ceramic bond super-hard abrasive tool |
| CN102701593A (en) * | 2011-03-28 | 2012-10-03 | 京东方科技集团股份有限公司 | Low-melting point glass powder and manufacturing method thereof |
| CN105619266A (en) * | 2015-12-23 | 2016-06-01 | 郑州磨料磨具磨削研究所有限公司 | Low-temperature sintering ceramic binding agent, grinding wheel and preparation method thereof |
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| Title |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108503362A (en) * | 2018-05-25 | 2018-09-07 | 张剑 | A kind of preparation method of nano-graphite base grinding-material |
| CN115403956A (en) * | 2022-09-14 | 2022-11-29 | 淄博金纪元研磨材有限公司 | Preparation method of stacked group white corundum micropowder for automatic driving automobile coating |
| CN115403956B (en) * | 2022-09-14 | 2023-11-10 | 淄博金纪元研磨材有限公司 | Preparation method of stacked group white corundum micro powder for automatic driving automobile coating |
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Application publication date: 20170125 |