CN106346345A - Beveling polishing method for ceramic product and ceramic panel - Google Patents
Beveling polishing method for ceramic product and ceramic panel Download PDFInfo
- Publication number
- CN106346345A CN106346345A CN201510442562.6A CN201510442562A CN106346345A CN 106346345 A CN106346345 A CN 106346345A CN 201510442562 A CN201510442562 A CN 201510442562A CN 106346345 A CN106346345 A CN 106346345A
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- China
- Prior art keywords
- polishing
- ceramic
- product
- ceramic product
- bevelling
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention provides a beveling polishing method for ceramic product and ceramic panel. The ceramic polishing method includes the following steps: wax pasting the ceramic product on the free end of a polishing clamp, or vacuum absorbing the ceramic product on the surface of a polishing clamp; adjusting the angle of the polishing clamp, face aligning the beveling edge of the ceramic on the level surface of the polishing disk of the disk polishing machine; polishing the disk and rotating, controlling the rotating speed at 300-600 spins per minute; polishing the beveling side of the ceramic product with a pressure of 0.05-0.5 MPa from the polishing disk; the clamping head rotating at 360 DEG C at the same time; while polishing, the touching place of the buffing with the product is cast with SiO2 nanometer polishing agent; the diameter of the particle SiO2 in the polishing agent is: 30-150 nm.
Description
Technical field
The present invention relates to panel processing technique field, especially, it is related to bevelling finishing method and the ceramic panel of a kind of ceramic product.
Background technology
Pottery tool has good wearability, and hardness is only second to diamond and reaches 9 grades of Mohs, and ceramic dense makes it have ratio simultaneously
The higher intensity of safety glass, the above-mentioned two characteristic of pottery is very suitable for for making high-end watch, mobile phone and other electronics
The accessories such as the shell of original paper.Simultaneously ceramic manufactures the manufacturing process more ring that process is than traditional plastic and glass etc.
Protect and energy-conservation, therefore ceramic material replaces traditional plastics, stainless steel material etc. as the shell of electronic product, will be that technology is sent out
The inexorable trend of exhibition.
For different products, ceramic panel structure has some difference, but primary structure is than relatively similar.As shown in Figure 1,
Several primary structures of ceramic panel are: cambered surface 01, bevelling 02, straight body position 03 and plane 04.Due to above-mentioned primary structure
Position, angle and size are all variant, from processing and fabricating to polishing process, each need using different processing methods.To fall
As a example the finishing method on side 02: in order to meet the requirement of high-end ceramic panel device development, obtain high light, the falling of low roughness
Side, must be polished to pottery, and this is the basic technology making ceramic panel reach ultra-smooth at present.
Because current ceramic panel is just emerging for the technology making the accessories such as the shell of high-end watch, mobile phone and other electronic original parts
Rise, the technical staff of present patent application finds, do not have in prior art disclosed in be specific to the polishing side of ceramic panel
, there is following weak point in method, and when being directly polished using the finishing method of presently disclosed ceramic panel: 1, tool is no
Method is mated well with the bevelling of ceramic panel, causes tool easily to wear and tear.2nd, the selection of polishing fluid and grinding force be not fine
Change, the ceramic panel bevelling after polishing has that local surfaces are rough, it is insufficient to polish.3rd, once one can only be produced
Product are polished, and the working (machining) efficiency of product is low.
Content of the invention
Present invention aim at provide and tool being avoided to damage, polish more fully, the bevelling roughness after polishing is lower, produces
The bevelling finishing method of the higher ceramic product of product polishing efficiency, to solve the technical problem that tool damages, polishing is insufficient.
For achieving the above object, the invention provides a kind of bevelling finishing method of ceramic product, comprise the following steps:
A, by ceramic product patch wax polishing chuck free end on, or by ceramic product vac sorb polishing jaw face；
B, the angle of adjustment polishing chuck, make ceramic bevelling polish the horizontal plane of card in the face of quasi- card buffing machine；
C, polishing card rotation, control rotating speed at 300～600 rpms；Polishing card is with the pressure pair of 0.05～0.5mpa
Polished in the bevelling face of ceramic product；Meanwhile, chuck carries out 360 degree of rotations；
While polishing, contain sio in the contact position cast of mill skin and product2Nanometer burnishing liquid；Sio in polishing fluid2Microgranule is straight
Footpath is: 30～150nm.
Preferably, the mill skin described grinding head being pasted is felt, epoxy resin skin or polished leather.
Preferably, ceramic product to be processed is wristwatch case, hand-set lid.
Preferably, polishing chuck rotating speed is 15-18 rev/min.
Present invention also provides the bevelling face of its ceramic panel be using above-mentioned finishing method be polished gained hand-set lid and
Wristwatch case.
The method have the advantages that
1st, matching degree is higher:
Ceramic product vac sorb in polishing chuck, is made ceramic bevelling polish the water of card in the face of quasi- card buffing machine by the present invention
Plane, can adjust position and the gradient of polishing angle, the bevelling with ceramic panel according to the size of actual product and radian
Mate well, it is to avoid tool damages.
And, realize 360 degree of product bevelling evenly to polish, Yield lmproved 20～30%, obtain higher product quality.
2nd, polishing is more abundant:
The selection of polishing fluid and grinding force all more become more meticulous, and surface is more smooth.The area of the disposable qualification rate of product polishing
More than 90%, the surface roughness of ceramic panel is less than 5nm, and preferred embodiment has even more reached 2.4nm.
3rd, production efficiency is higher:
Card buffing machine once can process multiple ceramic panels polishing in chucks so that process time is shorter simultaneously, will originally need
The polishing process wanting 240 seconds shorten to 120 seconds, about one times of improve production efficiency, greatly reduces production cost.
In addition to objects, features and advantages described above, the present invention also has other objects, features and advantages.Below
By reference picture, the present invention is further detailed explanation.
Brief description
The accompanying drawing constituting the part of the application is used for providing a further understanding of the present invention, the illustrative examples of the present invention and
It illustrates, for explaining the present invention, not constituting inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 is the common structure schematic diagram of ceramic panel.
Fig. 2 is the schematic flow sheet of the bevelling finishing method of ceramic product of the present invention.
Fig. 3 is one of processing simplified schematic diagram of single grinding head during ceramic panel bevelling polishing of the present invention.
Fig. 4 is two of the processing simplified schematic diagram of single grinding head during ceramic panel bevelling polishing of the present invention.
In prior art: 01, cambered surface, 02, bevelling, 03, straight body position, 04, plane.
In the present invention: 1, polishing disk, 2, ceramic product, 3, polishing chuck.
Specific embodiment
Below in conjunction with accompanying drawing, embodiments of the invention are described in detail, but the present invention can limit according to claim and cover
The multitude of different ways of lid is implemented.
Specific embodiment one
Referring to Fig. 2 to Fig. 4, ceramic product 2 (illustrate only one group of polishing chuck in accompanying drawing 2) to be processed is adsorbed onto corresponding
Polishing chuck 3 surface, makes the bevelling of ceramic product post, in the face of brigadier, the polishing card 1 that felt grinds skin, polishes in chuck 3
Angle between heart axle and polishing card 1 is 48 degree, makes ceramic product 2 bevelling face and the polishing card 1 of polishing chuck 3 lower end
It is fully contacted.Then, in the polishing continuous rotary course of card 1, polishing chuck 3 carries out 360 ° of rotation so that pottery produces
The bevelling face of product is all touched with polishing card 1, and the contact position cast in mill skin and product contains sio2Nanometer burnishing liquid.
Specific process parameter is as follows:
Sio in polishing fluid2Mean particle dia is: 36nm；
The speed of mainshaft: 280 revs/min；
Polishing chuck rotating speed: 15 revs/min；
Polishing time t=240min；
Polish pressure p=0.06mpa；
Polishing flow quantity: 4l/min；
The ceramic panel that cp technique according to the present embodiment obtains, the area of first-time qualification rate is 94.81%, the table of ceramic panel
Surface roughness can reach 2.5～3.2nm, and 90% product surface roughness is all in 3.6nm.
Specific embodiment two
Referring to Fig. 2 to Fig. 4, ceramic product 2 (illustrate only one group of polishing chuck in accompanying drawing 2) to be processed is adsorbed onto corresponding
Polishing chuck 3 surface, makes the bevelling of ceramic product post, in the face of brigadier, the polishing card 1 that polished leather grinds skin, polishes in chuck 3
Angle between heart axle and polishing card 1 is 68 degree, makes ceramic product 2 bevelling face and the polishing card 1 of polishing chuck 3 lower end
It is fully contacted.Then, in the polishing continuous rotary course of card 1, polishing chuck 3 carries out 360 ° of rotation so that pottery produces
The bevelling face of product is all touched with polishing card 1, and the contact position cast in mill skin and product contains sio2Nanometer burnishing liquid.
Specific process parameter is as follows:
Sio in polishing fluid2Mean particle dia is: 85.4nm；
The speed of mainshaft: 280 revs/min；
Polishing chuck rotating speed: 16 revs/min；
Polishing time t=240min；
Polish pressure p=0.08mpa；
Polishing flow quantity: 5l/min；
The ceramic panel that cp technique according to the present embodiment obtains, the area of first-time qualification rate is 94.93%, the table of ceramic panel
Surface roughness can reach 2.6nm.
Specific embodiment three
Referring to Fig. 2 to Fig. 4, ceramic product 2 (illustrate only one group of polishing chuck in accompanying drawing 2) to be processed is being thrown by pasting wax
On light chuck 3 free end, make the bevelling of ceramic product post, in the face of brigadier, the polishing card 1 that epoxy resin grinds skin, polish chuck 3
Central shaft and polishing card 1 between angle be 27 degree, make ceramic product 2 bevelling face and the polishing disk of polishing chuck 3 lower end
Face 1 is fully contacted.Then, in the polishing continuous rotary course of card 1, polishing chuck 3 carries out 360 ° of rotation so that making pottery
The bevelling face of porcelain products is all touched with polishing card 1, and the contact position cast in mill skin and product contains sio2Nano-polishing
Liquid.
Specific process parameter is as follows:
Sio in polishing fluid2Mean particle dia is: 145.3nm；
The speed of mainshaft: 280 revs/min；
Polishing chuck rotating speed: 18 revs/min；
Polishing time t=240min；
Polish pressure p=0.1mpa；
Polishing flow quantity: 5l/min；
The ceramic panel that cp technique according to the present embodiment obtains, the area of first-time qualification rate is 95.85%, the table of ceramic panel
Surface roughness can reach 2.4nm.
Wherein, the ceramic panel of embodiment 1-2 is hand-set lid, and the ceramic panel of embodiment 3 is mobile phone watchcase.
Comparative example
Ceramic panel to be processed is respectively fixed on the polishing base of buffing machine, will be right respectively for the grinding head posting polished leather mill skin
The bevelling of accurate four ceramic panels is vertical with vertical plane to the central shaft of punctual grinding head.
Specific process parameter is as follows:
Sio in polishing fluid2Mean particle dia is: 100nm；
The speed of mainshaft: 1600 revs/min；
Polishing time t=240min；
Grinding head polish pressure p=0.7mpa；
Polishing flow quantity: 4l/min；
The ceramic panel that cp technique according to the present embodiment obtains, the area of first-time qualification rate is 84.42%, the table of ceramic panel
Surface roughness reaches 4.0～4.8nm.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for those skilled in the art
For, the present invention can have various modifications and variations.All any modifications within the spirit and principles in the present invention, made, etc.
With replacing, improving etc., should be included within the scope of the present invention.
Claims (5)
1. a kind of bevelling finishing method of ceramic product is it is characterised in that comprise the following steps:
A, ceramic product patch wax is fixed on polishing chuck free end, or ceramic product vac sorb is fixed on polishing chuck
On free end；
B, the angle of adjustment polishing chuck, the bevelling making ceramic product is in the face of the horizontal plane of quasi- card buffing machine polishing card, described
Mill skin is posted on the horizontal plane of polishing card；
C, polishing card rotation, control rotating speed at 300～600 rpms；Polishing card is with the pressure pair of 0.05～0.5mpa
Polished in the bevelling face of ceramic product；Meanwhile, chuck carries out 360 degree of rotations；
While polishing, contain sio in the contact position cast of mill skin and product2Nanometer burnishing liquid；Sio in polishing fluid2Microgranule is straight
Footpath is: 30～150nm.
2. finishing method according to claim 1 is it is characterised in that described mill skin is felt, epoxy resin skin or throwing
Light is removed from office.
3. finishing method according to claim 1 is it is characterised in that ceramic product to be processed is wristwatch case, phone cover
Plate.
4. finishing method according to claim 1 is it is characterised in that polishing chuck rotating speed is 15-18 rev/min.
5. a kind of ceramic panel is it is characterised in that its bevelling face is to be entered using the finishing method described in any one of claim 1-4
Row polishing gained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510442562.6A CN106346345A (en) | 2015-07-24 | 2015-07-24 | Beveling polishing method for ceramic product and ceramic panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510442562.6A CN106346345A (en) | 2015-07-24 | 2015-07-24 | Beveling polishing method for ceramic product and ceramic panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106346345A true CN106346345A (en) | 2017-01-25 |
Family
ID=57843011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510442562.6A Pending CN106346345A (en) | 2015-07-24 | 2015-07-24 | Beveling polishing method for ceramic product and ceramic panel |
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| Country | Link |
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| CN (1) | CN106346345A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114309920A (en) * | 2021-12-23 | 2022-04-12 | 潮州三环（集团）股份有限公司 | Ceramic cleaver and preparation method thereof |
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|---|---|---|---|---|
| JP2508371B2 (en) * | 1990-06-29 | 1996-06-19 | コクヨ株式会社 | Top plate processing method |
| CN2360213Y (en) * | 1999-01-22 | 2000-01-26 | 吴德兴 | Glazing machine |
| KR20020040529A (en) * | 2000-11-23 | 2002-05-30 | 윤종용 | Polishing head of a chemical mechanical polishing machine and polishing method using the polishing head |
| CA2335396A1 (en) * | 2001-02-13 | 2002-08-13 | Yves Fortin | Tool compliance device and method |
| CN203765426U (en) * | 2014-04-11 | 2014-08-13 | 魏莲鹏 | Portable automobile surface scratch polisher |
| CN102862112B (en) * | 2012-07-19 | 2014-12-03 | 京东方科技集团股份有限公司 | Machining device for template of light guide plate and machining method thereof |
| CN104551900A (en) * | 2014-12-10 | 2015-04-29 | 盐城工学院 | Silicon carbide wafer bevel grinding, milling and polishing machine and operation method thereof |
| CN104742034A (en) * | 2015-03-27 | 2015-07-01 | 蓝思科技股份有限公司 | Polishing skin and method for polishing cambered surface of micro ceramic product through same |
| CN105196152A (en) * | 2015-09-24 | 2015-12-30 | 济南大学 | Metallographic polishing clamp |
| CN205465633U (en) * | 2016-01-29 | 2016-08-17 | 司能石油化工有限公司 | Corrosion testing of lubricating oils test block burnishing device |
-
2015
- 2015-07-24 CN CN201510442562.6A patent/CN106346345A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2508371B2 (en) * | 1990-06-29 | 1996-06-19 | コクヨ株式会社 | Top plate processing method |
| CN2360213Y (en) * | 1999-01-22 | 2000-01-26 | 吴德兴 | Glazing machine |
| KR20020040529A (en) * | 2000-11-23 | 2002-05-30 | 윤종용 | Polishing head of a chemical mechanical polishing machine and polishing method using the polishing head |
| CA2335396A1 (en) * | 2001-02-13 | 2002-08-13 | Yves Fortin | Tool compliance device and method |
| CN102862112B (en) * | 2012-07-19 | 2014-12-03 | 京东方科技集团股份有限公司 | Machining device for template of light guide plate and machining method thereof |
| CN203765426U (en) * | 2014-04-11 | 2014-08-13 | 魏莲鹏 | Portable automobile surface scratch polisher |
| CN104551900A (en) * | 2014-12-10 | 2015-04-29 | 盐城工学院 | Silicon carbide wafer bevel grinding, milling and polishing machine and operation method thereof |
| CN104742034A (en) * | 2015-03-27 | 2015-07-01 | 蓝思科技股份有限公司 | Polishing skin and method for polishing cambered surface of micro ceramic product through same |
| CN105196152A (en) * | 2015-09-24 | 2015-12-30 | 济南大学 | Metallographic polishing clamp |
| CN205465633U (en) * | 2016-01-29 | 2016-08-17 | 司能石油化工有限公司 | Corrosion testing of lubricating oils test block burnishing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114309920A (en) * | 2021-12-23 | 2022-04-12 | 潮州三环（集团）股份有限公司 | Ceramic cleaver and preparation method thereof |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170125 |
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| RJ01 | Rejection of invention patent application after publication |