CN106346169A - Pasty brazing filler metal for brazing diamond in air as well as preparation method and application of pasty brazing filler metal - Google Patents
Pasty brazing filler metal for brazing diamond in air as well as preparation method and application of pasty brazing filler metal Download PDFInfo
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- CN106346169A CN106346169A CN201610999923.1A CN201610999923A CN106346169A CN 106346169 A CN106346169 A CN 106346169A CN 201610999923 A CN201610999923 A CN 201610999923A CN 106346169 A CN106346169 A CN 106346169A
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- solder
- diamond
- air
- preparation
- filler metal
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3033—Ni as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Abstract
The invention discloses a pasty brazing filler metal for brazing a diamond in air as well as a preparation method and application of the pasty brazing filler metal. The pasty brazing filler metal for brazing the diamond in the air is prepared from 88wt% to 92wt% of brazing filler metal, 1wt% to 2wt% of soldering flux and a rest part, wherein the rest part is prepared from a binder and water; the brazing filler metal is prepared from BNi-2 and titanium powder in a mass ratio of (1 : 0.05) to (1 : 0.1); the soldering flux is prepared from aluminum fluoride and potassium fluoride in a mass ratio of (1 : 0.1) to (1 : 1.8). According to the pasty brazing filler metal for brazing the diamond in the air, which is provided by the invention, a vacuum or protective atmosphere is not needed in a brazing process; the brazing can be completed in the air; therefore, the machining flexibility is greatly improved; the production cost is decreased; the production efficiency is improved; meanwhile, the use level of the brazing filler metal is also more easily controlled; the service life of a tool can be drastically prolonged; the preparation method of the pasty brazing filler metal for brazing the diamond in the air is simple, is easy in condition control, and is suitable for large-scale production.
Description
Technical field
The present invention be more particularly directed to a kind of paste solder of in the air soldering diamond, its preparation method and application.
Background technology
Diamond tool be particularly suitable for process hard brittle material especially be nonmetallic materials, for example stone material, Wall or floor tile, glass,
Pottery etc.；Can be used for processing non-ferrous metal, alloy, timber, such as copper, aluminum, hard alloy, hardened steel, cast iron etc..At present
Diamond tool is widely used to the industry such as building, building materials, geology, metallurgy, machinery, electronics, pottery, timber, automobile.
In practical application, the solder of soldering diamond needs to have following characteristics: one, solder has to diamond and matrix
Good wellability and bond strength；2nd, solder is preferably no aggressivity or micro- aggressivity to diamond；3rd, the softening of solder
Point necessarily be greater than the local temperature when cutting for the brazed diamond tool.The bond strength of diamond and matrix is mainly determined by solder
Fixed, solder will generate chemical bond in diamond surface and diamond could be formed with effective holding, and this requires in solder composition
The element (ti, v, cr etc.) that can generate carbide at high temperature with diamond must be contained.
At present, the mostly chromium containing 10 about or the titanium of the solder used by most of manufacturers, but, the unit such as ti, cr
When element heats in atmosphere, easily aoxidize, lose activity.The solution of prior art be usually in soldering diamond,
Carry out under the conditions of vacuum or inert gas shielding, with respect to soldering in atmosphere, this considerably increases processing cost, reduce life
Produce efficiency.
Content of the invention
Present invention is primarily targeted at providing a kind of paste solder of in the air soldering diamond, its preparation method and answering
With to overcome deficiency of the prior art.
For realizing aforementioned invention purpose, the technical solution used in the present invention includes:
Embodiments provide a kind of paste solder of in the air soldering diamond, comprising: 88wt%～
92wt% solder, 1wt%～2wt% scaling powder, remainder comprises binding agent and water；
Described solder includes bni-2 and the titanium valve that mass ratio is 1:0.05～1:0.1；
Described scaling powder includes aluminium fluoride and the potassium fluoride that mass ratio is 1:0.1～1:1.8.
Further, in described solder, bni-2 and the mass ratio of titanium valve are 1:0.06～1:0.08.
Further, in described scaling powder, aluminium fluoride and the mass ratio of potassium fluoride are preferably 1:1.2～1:1.5.
Wherein, described scaling powder can effective scale removal, and stop the oxidation further of the alloy powder as solder.
In some more preferred embodiment, described paste solder includes 8wt%～10wt% water and binding agent.
In some more preferred embodiment, described binding agent is (1～2): (98～99) with the mass ratio of water.
Further, described binding agent includes methylcellulose or ethyl cellulose, and not limited to this.
Further, aforementioned bni-2 is nickel-based solder, and its main component, based on ni, secondly also contains the molten unit of fall
Plain (melting point depressant element) b and si, and other element (refering to " heat processing technique ", 2004,
6(1):47-50).
Further, the particle diameter of aforementioned titanium valve is preferably 10 μm～100 μm, especially preferably 30 μm～50 μm.With this phase
The layer structure more uniform compact that the paste solder answered is formed, has more preferably bond strength with base material.
The embodiment of the present invention additionally provide described paste solder in air atmosphere the purposes of soldering diamond or system
Purposes in standby diamond tool.
The embodiment of the present invention additionally provides a kind of preparation method of the paste solder of in the air soldering diamond, comprising:
Binding agent and water are uniformly mixed to form glue-like mastic,
Solder and scaling powder are uniformly mixed to form described paste solder with described glue-like mastic, described solder includes matter
Amount than bni-2 for 1:0.05～1:0.1 and titanium valve, described scaling powder include aluminium fluoride that mass ratio is 1:0.1～1:1.8 and
Potassium fluoride；
Wherein, described paste solder includes 88wt%～92wt% solder and 1wt%～2wt% scaling powder.
Further, in described solder, bni-2 and the mass ratio of titanium valve are 1:0.06～1:0.08.
Further, in described scaling powder, aluminium fluoride and the mass ratio of potassium fluoride are preferably 1:1.2～1:1.5.
In some more preferred embodiment, the quality of described glue-like mastic is described paste solder quality
8%～10%.
In some more preferred embodiment, described glue-like mastic comprises 1wt%～2wt% binding agent.
Further, described binding agent includes methylcellulose or ethyl cellulose, and not limited to this.
Further, the particle diameter of aforementioned titanium valve is preferably 10 μm～100 μm, especially preferably 30 μm～50 μm.
In some more specific embodiment, the preparation method of the paste solder of described in the air soldering diamond can
To include:
Using the mixture of aluminium fluoride and potassium fluoride as scaling powder,
Using the mixture of bni-2 powder and titanium valve as solder,
The glue being dispersed at a high speed in water using ethyl cellulose (powder) is mixed to form paste pricker as mastic, stirring
Material.
The embodiment of the present invention additionally provides a kind of preparation method of diamond tool, comprising: by described in the air pricker
The paste solder of weldering diamond is coated on matrix, so that diamond is adsorbed on described paste solder, then directly in sky afterwards
It is heated to 1000～1100 DEG C in gas and be incubated 10～25s, prepared diamond tool.
In some more specific embodiment, described preparation method may include that described in the air soldering gold
The paste solder of hard rock is applied on matrix, then so that diamond is adsorbed on solder with modes such as Electrostatic Absorption again, directly exists
In the air high-frequency heating to 1000～1100 DEG C and is incubated 10～25s and obtains diamond tool.
Further, described matrix can be selected from the material such as metal, pottery, and not limited to this.
The embodiment of the present invention additionally provides the diamond tool prepared by preceding method.
Compared with prior art, the paste solder of the in the air soldering diamond that the present invention provides is not required in brazing process
Want vacuum or protective atmosphere, soldering can be completed in atmosphere, therefore substantially increase process flexibility, reduce and produce into
This, improve production efficiency, and solder usage amount is also easier to control simultaneously, and significantly can extend tool life, and its system
Preparation Method is simple, and condition is easily-controllable, is suitable for large-scale production.
Specific embodiment
In view of deficiency of the prior art, inventor, through studying for a long period of time and putting into practice in a large number, is proposed the present invention's
Technical scheme.In conjunction with some preferred embodiments, this technical scheme, its implementation process and principle etc. will be made with further solution as follows
Release explanation.
Embodiment 1
The paste solder of the in the air soldering diamond of the present embodiment comprises following component: 92wt% solder, and 1.5wt% helps
Solder flux, 0.1wt% ethyl cellulose and 6.4wt% water.
Described solder is the bni-2 (commercial) of 1:0.05 for mass ratio and the mixing of titanium valve (about 10 μm～25 μm of particle diameter) is golden
Belong to powder.
Described scaling powder is the aluminium fluoride of 1:0.1 and the mixture of potassium fluoride for mass ratio.
The preparation method of the paste solder of described in the air soldering diamond includes:
According to aforementioned proportioning preparation raw material；
Using aluminium fluoride and potassium fluoride mix homogeneously as scaling powder, using bni-2 and titanium valve mix homogeneously as solder
By formation glue soluble in water for ethyl cellulose；
Scaling powder and solder are added in described glue, is uniformly mixed with planetary mixer, that is, described air is obtained
The paste solder of middle soldering diamond.
The paste solder of described in the air soldering diamond is coated on steel body, so that diamond is inhaled with electrostatic afterwards
Attached mode is attached on described paste solder, and then directly high frequency is electrically heated to 1100 DEG C and is incubated 15s in atmosphere, is obtained
Diamond tool.
This diamond tool is suitable for processing of stone industry.
Embodiment 2
The paste solder of the in the air soldering diamond of the present embodiment comprises following component: 88wt% solder, and 2wt% helps weldering
Agent, 0.1wt% ethyl cellulose and 9.9wt% water.
Described solder is the bni-2 (commercial) of 1:0.06 for mass ratio and the mixing of titanium valve (about 30 μm～50 μm of particle diameter) is golden
Belong to powder.
Described scaling powder is the aluminium fluoride of 1:1.5 and the mixture of potassium fluoride for mass ratio.
The preparation method of the paste solder of described in the air soldering diamond includes:
According to aforementioned proportioning preparation raw material；
Using aluminium fluoride and potassium fluoride mix homogeneously as scaling powder, using bni-2 and titanium valve mix homogeneously as solder
By formation glue soluble in water for ethyl cellulose；
Scaling powder and solder are added in described glue, is uniformly mixed with planetary mixer, that is, described air is obtained
The paste solder of middle soldering diamond.
The paste solder of described in the air soldering diamond is coated on zirconia ceramicss matrix, make afterwards diamond with
The mode of Electrostatic Absorption is attached on described paste solder, and then directly high frequency is electrically heated to 1000 DEG C and is incubated in atmosphere
20s, prepared diamond tool.
This diamond tool is suitable for Ceramic manufacturing industry.
Embodiment 3
The paste solder of the in the air soldering diamond of the present embodiment comprises following component: 90wt% solder, and 1wt% helps weldering
Agent, 0.1wt% ethyl cellulose and 8.9wt% water.
Described solder is the bni-2 (commercial) of 1:0.08 for mass ratio and the mixing of titanium valve (about 30 μm～50 μm of particle diameter) is golden
Belong to powder.
Described scaling powder is the aluminium fluoride of 1:1.2 and the mixture of potassium fluoride for mass ratio.
The preparation method of the paste solder of described in the air soldering diamond includes:
According to aforementioned proportioning preparation raw material；
Using aluminium fluoride and potassium fluoride mix homogeneously as scaling powder, using bni-2 and titanium valve mix homogeneously as solder
By formation glue soluble in water for ethyl cellulose；
Scaling powder and solder are added in described glue, is uniformly mixed with planetary mixer, that is, described air is obtained
The paste solder of middle soldering diamond.
The paste solder of described in the air soldering diamond is coated on titanium alloy substrate, makes diamond afterwards with electrostatic
The mode of absorption is attached on described paste solder, and then directly high frequency is electrically heated to 1050 DEG C and is incubated 10s in atmosphere, system
Obtain this diamond tool of diamond tool and be suitable for wood working industry.
Embodiment 4
The paste solder of the in the air soldering diamond of the present embodiment comprises following component: 91wt% solder, and 1wt% helps weldering
Agent, 0.08wt% ethyl cellulose and 7.92wt% water.
Described solder is the bni-2 of 1:0.1 and the mixed metal powder of titanium valve (about 100 μm～120 μm of particle diameter) for mass ratio
End.
Described scaling powder is the aluminium fluoride of 1:1.8 and the mixture of potassium fluoride for mass ratio.
The preparation method of the paste solder of described in the air soldering diamond includes:
According to aforementioned proportioning preparation raw material；
Using aluminium fluoride and potassium fluoride mix homogeneously as scaling powder, using bni-2 and titanium valve mix homogeneously as solder
By formation glue soluble in water for ethyl cellulose；
Scaling powder and solder are added in described glue, is uniformly mixed with planetary mixer, that is, described air is obtained
The paste solder of middle soldering diamond.
The paste solder of described in the air soldering diamond is coated on silicon nitride ceramics matrix, make afterwards diamond with
The mode of Electrostatic Absorption is attached on described paste solder, and then directly high frequency is electrically heated to 1080 DEG C and is incubated in atmosphere
18s, prepared diamond tool.
This diamond tool is suitable for metal-working industry.
Reference examples 1: with reference to embodiment 1, take commercially available bni-2 solder to be scattered in water and the glue of ethyl cellulose formation,
It is uniformly mixed formation paste solder with planetary mixer.This paste solder is coated on steel body, makes Buddha's warrior attendant afterwards
Stone is attached on described paste solder in the way of Electrostatic Absorption, and then directly high frequency is electrically heated to 1100 DEG C and protects in atmosphere
Warm 15s, prepared diamond tool.
Reference examples 2: with reference to embodiment 1, take commercially available bni-2 solder to be scattered in water and the glue of methylcellulose formation,
It is uniformly mixed formation paste solder with planetary mixer.This paste solder is coated on steel body, makes Buddha's warrior attendant afterwards
Stone is attached on described paste solder in the way of Electrostatic Absorption, is then electrically heated to 1000 DEG C in nitrogen atmosphere medium-high frequency and protects
Warm 20s, prepared diamond tool.
With the tangent plane to embodiment 1- embodiment 4 and the obtained diamond tool of reference examples 1- reference examples 2 for the high magnification microscope
Pattern is observed it is found that diamond is all firmly bonded in solder in embodiment 1- embodiment 4, diamond and solder
Between no sharp interface, solder structure is fine and close, basic flawless, bubble etc., and penetrates into matrix in the junction part with matrix,
And there is sharp interface in reference examples 1 between diamond and the solder of surrounding, solder structure is loose, in reference examples 2 diamond with
Combination situation between solder has improvement than documents 1, but exists in solder compared with multiple crackses, the junction of solder and matrix
There is also sharp interface.Embodiment 1- embodiment 4, the obtained diamond tool of reference examples 1- reference examples 2 are carried out by metallographic structure and divide
Analysis, also it can be seen that, the solder layer of embodiment 2,3 is more finer and close than embodiment 1,4, wherein goes back Dispersed precipitate and minimum carbide
Granule.
Again embodiment 1- embodiment 4, the obtained diamond tool of reference examples 1- reference examples 2 are fixed on grinding machine, to rotate
The alundum wheel of motion carries out Dry Grinding to diamond tool surface, and grinding speed is 35.0m/s, and grinding depth is 30
μm, table feed speed is 15mm/s.Utilize 3 D video microscope and scanning electron microscope to diamond tool simultaneously
The breakage of upper diamond is observed.Can see, the diamond on embodiment 1, the diamond tool of embodiment 4
The only little fritter of grain crushes, and no comes off, the diamond particles on embodiment 2, the diamond tool of embodiment 3 keep substantially
Complete crystal form, no comes off, and the diamond particles on the diamond tool of reference examples 1 have more serious dropping situations, comparison
Diamond particles on the diamond tool of example 2 have partial exfoliation and the situation of bulk breakage.
It should be appreciated that above-described embodiment technology design only to illustrate the invention and feature, its object is to allow and be familiar with this
The personage of item technology will appreciate that present disclosure and implements according to this, can not be limited the scope of the invention with this.All
The equivalence changes made according to spirit of the invention or modification, all should be included within the scope of the present invention.
Claims (10)
1. a kind of paste solder of in the air soldering diamond is it is characterised in that include: 88wt%～92wt% solder, 1wt%
～2wt% scaling powder, remainder comprises binding agent and water；
Described solder includes bni-2 and the titanium valve that mass ratio is 1:0.05～1:0.1；
Described scaling powder includes aluminium fluoride and the potassium fluoride that mass ratio is 1:0.1～1:1.8.
2. in the air soldering diamond according to claim 1 paste solder it is characterised in that: described paste solder bag
Include 8wt%～10wt% water and binding agent.
3. in the air soldering diamond according to claim 1 and 2 paste solder it is characterised in that: described binding agent
Mass ratio with water is (1～2): (98～99).
4. in the air soldering diamond according to claim 1 and 2 paste solder it is characterised in that: described binding agent
Including methylcellulose or ethyl cellulose.
5. the paste solder any one of claim 1-4 in air atmosphere the purposes of soldering diamond or preparation
Purposes in diamond tool.
6. a kind of preparation method of the paste solder of in the air soldering diamond is it is characterised in that include:
Binding agent and water are uniformly mixed to form glue-like mastic,
Solder and scaling powder are uniformly mixed to form described paste solder with described glue-like mastic, described solder includes mass ratio
Bni-2 for 1:0.05～1:0.1 and titanium valve, described scaling powder includes aluminium fluoride and the fluorination that mass ratio is 1:0.1～1:1.8
Potassium；
Wherein, described paste solder includes 88wt%～92wt% solder and 1wt%～2wt% scaling powder.
7. preparation method according to claim 6 it is characterised in that: the quality of described glue-like mastic be described paste pricker
The 8%～10% of material quality；And/or, described glue-like mastic comprises 1wt%～2wt% binding agent.
8. the preparation method according to claim 6 or 7 it is characterised in that: described binding agent includes methylcellulose or second
Base cellulose.
9. a kind of preparation method of diamond tool is it is characterised in that include: by the paste any one of claim 1-4
Solder is coated on matrix, so that diamond is adsorbed on described paste solder afterwards, is then directly heated to 1000 in atmosphere
～1100 DEG C and be incubated 10～25s, prepared diamond tool.
10. by the diamond tool of claim 9 methods described preparation.
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| CN201610999923.1A CN106346169B (en) | 2016-11-14 | 2016-11-14 | Paste solder, preparation method and the application of diamond are brazed in air |
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| CN201610999923.1A CN106346169B (en) | 2016-11-14 | 2016-11-14 | Paste solder, preparation method and the application of diamond are brazed in air |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108544385A (en) * | 2018-03-05 | 2018-09-18 | 华侨大学 | Using tungsten carbide as the diamond grinding head of matrix and its method for welding |
| CN111050986A (en) * | 2017-08-03 | 2020-04-21 | 霍尼韦尔国际公司 | Free-flowing potassium aluminum fluoride flux |
| CN113319464A (en) * | 2020-09-01 | 2021-08-31 | 郑州机械研究所有限公司 | Annular nickel-based self-brazing solder and preparation method and application thereof |
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| PL217000B1 (en) * | 2010-12-17 | 2014-06-30 | Univ West Pomeranian Szczecin Tech | Method for soldering carbide steels to chrome-nickel steel within large areas |
| RU2552810C1 (en) * | 2013-12-30 | 2015-06-10 | Федеральное государственное бюджетное учреждение науки Институт физико-технических проблем Севера им. В.П. Ларионова Сибирского отделения Российской академии наук | Alloy for diamond monocrystal connection with metals |
| CN105619272A (en) * | 2016-01-11 | 2016-06-01 | 苏州科技学院 | Method for manufacturing single-layer diamond grinding wheel in laser brazing manner |
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| PL217000B1 (en) * | 2010-12-17 | 2014-06-30 | Univ West Pomeranian Szczecin Tech | Method for soldering carbide steels to chrome-nickel steel within large areas |
| RU2552810C1 (en) * | 2013-12-30 | 2015-06-10 | Федеральное государственное бюджетное учреждение науки Институт физико-технических проблем Севера им. В.П. Ларионова Сибирского отделения Российской академии наук | Alloy for diamond monocrystal connection with metals |
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| CN108544385B (en) * | 2018-03-05 | 2020-06-26 | 华侨大学 | Diamond grinding head with tungsten carbide as substrate and brazing method thereof |
| CN113319464A (en) * | 2020-09-01 | 2021-08-31 | 郑州机械研究所有限公司 | Annular nickel-based self-brazing solder and preparation method and application thereof |
| CN113319464B (en) * | 2020-09-01 | 2023-02-21 | 郑州机械研究所有限公司 | Annular nickel-based self-brazing solder and preparation method and application thereof |
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| CN106346169B (en) | 2018-08-21 |
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