CN106338800A - Horizontal coupler for optical signal transmission between optical fiber and chip - Google Patents
Horizontal coupler for optical signal transmission between optical fiber and chip Download PDFInfo
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- CN106338800A CN106338800A CN201610929509.3A CN201610929509A CN106338800A CN 106338800 A CN106338800 A CN 106338800A CN 201610929509 A CN201610929509 A CN 201610929509A CN 106338800 A CN106338800 A CN 106338800A
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- mould
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4227—Active alignment methods, e.g. procedures and algorithms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a horizontal coupler for optical signal transmission between optical fiber and chip, comprising a first collecting module for guiding and collecting the first mode spots in a first-order linear polarization mode, a second collecting module for guiding and collecting the second mode spots in a second-order linear polarization mode, and a coupling module provided with a first transmission channel, a second transmission channel and a main channel wherein the first transmission channel receives the first mode spots and the second transmission channel receives the second mode spots. Through the spatial superposition of the mode fields, a first-order transverse electric mode is outputted from the main transmission channel of the coupling module. According to the invention, it is possible to convert the first-order linear polarization mode in the optical fiber into the first-order transverse electric mode in the chip while ensuring the transparent coupling of the fundamental modes so as to achieve high coupling efficiency between the optical fiber and the chip and the transmission of signals between the optical fiber and the chip featuring low loss, large bandwidth, and high-capacity.
Description
Technical field
The present invention is applied to communication technique field, is used for optical fiber and chip chamber optical signal transmission more particularly, to a kind of
Horizontal coupler.
Background technology
Fibre Optical Communication Technology is excellent due to its super large message capacity, super large bandwidth, two-forty, low-loss and low cost etc.
Point, has become as indispensable core technology in communication networks nowadays network.In order to meet " big data " day in epoch to the full extent
Often live required data throughout and transmission speed, based on to five physical dimensions (time, frequency, space, polarization state, just
The property handed over) the making full use of of data load capability, various multiplex techniques and advanced modulation formats have been widely used in fiber optic communication
In system.While the existing fiber communications field is towards longer distance, higher rate, the development of more jumbo target, " green
The theory of communication " brings the integrated trend of device, make following low-power consumption, small size developing goal must be by it
Road.
With the extensive application in fiber optic communication systems of silicon substrate integrated device, the transceiver module based on silicon base chip and base
How to realize low-loss and connect into for a problem meriting attention between the transmission link of optical fiber: firstly, since chip and
The size difference of fiber cross-sections is too big, be directly connected to will because mould field size, distribution severe mismatch and lead to more than 27db's
Loss；Additionally, with the lifting of traffic capacity demands, all kinds of novel optical fibers based on space division multiplexing technology (such as less fundamental mode optical fibre, many
Mode fiber, multi-core fiber etc.) also arise at the historic moment.Therefore, how to design and optimize high performance coupled apparatus, all kinds of new to meet
Type optical fiber is mated thus realizing efficient coupling with chip chamber mould field, also becomes thing followed important topic.
Based on the thinking to the problems referred to above, people design and propose all kinds of coupling schemes, are wherein most widely used
Two classes are grating coupler and back taper waveguide coupler.The vertical coupled design based on optical fiber and chip for the grating coupler, that is,
Light field in optical fiber is made diffraction to occur so as to change in chip upper surface in chip upper silicon layer etching period refractive index distribution structure
The direction of propagation is simultaneously coupled into waveguide on piece.Because the program is provided that the higher coupling free degree, and do not need to chip end face
Pre-processed, therefore can effectively be reduced technique and packaging cost, be also used as excellent with what multi-core fiber array coupled simultaneously
Good alternative；But this structure has stronger wavelength and polarization selectivity, this makes its application in multidimensional multiplex system be subject to
Limit.The another kind of back taper waveguide coupler then horizontal Coupling Design based on optical fiber and chip, by back taper waveguide
Tip, the light field being coupled into chip from end face level is guided and collects, using slow increasing waveguiding structure by top covering
Energy is adiabatically coupled into transmission in waveguide on piece.In order to improve technique tolerance and coupling efficiency further, some are new
The for example multistage back taper waveguide of structure, cantilever beam, both-end waveguide, trident type waveguide etc. are suggested in succession.However, current report is each
The scheme of kind is coupled with the basic mode in waveguide on piece mainly for optical fiber, rarely has the relevant report of higher order mode coupling.
Content of the invention
For drawbacks described above, the invention provides a kind of horizontal coupler for optical fiber and chip chamber optical signal transmission,
Aim to solve the problem that conventional flat coupler is primarily due to the little technical problem being difficult to higher order mode coupling in end face section.
In order to solve above-mentioned technical problem, a kind of level for optical fiber and chip chamber optical signal transmission that the present invention provides
Coupler, including
First acquisition module, is aligned with the first mould spot transmitting in a fiber, for gathering the single order line of transmission in optical fiber
Polarization mode (lp11Pattern) the first mould spot；
Second acquisition module, is aligned with the second mould spot transmitting in a fiber, for gathering the lp of transmission in optical fiber11Pattern
The second mould spot；And
Coupling module, it includes the first transmission channel, the second transmission channel and main transmission channel, described first transmission channel
One end be connected with the first end of main transmission channel, the other end of the first transmission channel connects the first acquisition module, for receiving
And transmit the first mould spot；One end of described second transmission channel is connected with the first end of main transmission channel, and described second transmission is logical
The other end in road connects the second acquisition module, for receiving and transmitting the second mould spot；Second end of described main transmission channel is used for
Connect the output waveguide being connected with function elements other on chip, for the first mould spot and the second mould spot are coupled as single order transverse electric
Mould (te1Pattern) output；
Described first acquisition module and described second acquisition module symmetric arrays, and the first transmission channel is logical with the second transmission
Road symmetric arrays.
Due to adopting the first acquisition module to gather the first mould spot in the present invention, the second acquisition module gathers the second mould spot, real
Now to lp in optical fiber11Whole collections of pattern, simultaneously because the first acquisition module and the second acquisition module symmetric arrays, and first
Transmission channel and the second transmission channel symmetric arrays are so that the light path that experienced of the light path that experienced of the first mould spot and the second mould spot
Identical so that the first mould spot phase place and the second mould spot phase place remain in that as π, te on chip is realized by coupling module1Pattern
Output, thus reaching lp in optical fiber11Pattern te in chip1Pattern high efficiency coupling.
Further, described first acquisition module is the first back taper waveguide, the first back taper waveguide narrow end surface and optical fiber
In first mould spot be aligned, for receiving and transmitting the first mould spot；
Described second acquisition module is the second back taper waveguide, the second mould spot in the second back taper waveguide narrow end surface and optical fiber
Be aligned, for receiving and transmitting the second mould spot；
Described coupling module is y branching type waveguide, and y branching type waveguide is provided with the first branch-waveguide, the second branch-waveguide the
Two branch-waveguides and main waveguide, first branch-waveguide one end connects main waveguide first end, the first branch-waveguide other end and first
Back taper waveguide wide end surface connects, and for receiving and transmitting the first mould spot, second branch-waveguide the second branch-waveguide one end connects master
Waveguide first end, second branch-waveguide the second branch-waveguide other end is connected with the second back taper waveguide wide end surface, for receiving simultaneously
Transmit the second mould spot, main waveguide second end connects the output waveguide being connected with function elements other on chip, for by the first mould
Spot and the second mould spot couple and export lp11Pattern；
First back taper waveguide and the arrangement of the second back taper guide symmetry, the first branch-waveguide and the second branch-waveguide second
Branch-waveguide symmetric arrays.
Further, described first acquisition module is the first both-end waveguide, is provided with first end to the 4th end, the first both-end ripple
The first end led all is aligned with the first mould spot in optical fiber with the second end, for receiving and transmitting the first mould spot；
Described second acquisition module is the second both-end waveguide, is provided with first end to the 4th end, the second both-end waveguide first
End is all aligned with the second mould spot in optical fiber with the 4th end, for receiving and transmitting the second mould spot；
Cascade y branching type waveguide includes left first order waveguide, right first order waveguide and second level waveguide,
Described left first order waveguide is y branching type waveguide, and y branching type waveguide is provided with the first branch-waveguide, second branch's ripple
Lead the second branch-waveguide and main waveguide, the three-terminal link of the first branch-waveguide and the first both-end waveguide, for collecting and transmitting
4th end of the first mould spot, second branch-waveguide the second branch-waveguide of described left first order waveguide and the first both-end waveguide is even
Connect, for collecting and transmitting the first mould spot, the main waveguide of left first order waveguide is connected with first of second level waveguide, for coupling
Close the first mould spot of the first branch-waveguide transmission of left first order waveguide and the first mould spot of the second branch-waveguide transmission, output
First mould spot,
Described right first order waveguide is y branching type waveguide, and y branching type waveguide is provided with the first branch-waveguide, second branch's ripple
Lead and main waveguide, the three-terminal link of the first branch-waveguide and the second both-end waveguide is used for collecting and transmitting the second mould spot, second
Branch-waveguide is connected with the 4th end of the second both-end waveguide, for collecting and transmitting the second mould spot, the main ripple of right first order waveguide
Lead and be connected with second of second level waveguide, for couple right first order waveguide the first branch-waveguide transmission the second mould spot and
Second mould spot of the second branch-waveguide transmission, the second mould spot of output,
The waveguide of the described second level is y branching type waveguide, and y branching type waveguide is provided with the first branch-waveguide, the second branch-waveguide
With main waveguide, first branch-waveguide one end is connected with the main waveguide of left first order waveguide, the main ripple of the other end and second level waveguide
Lead first end to connect, for collecting the second mould spot with transmission, the second branch-waveguide is connected with the main waveguide of right first order waveguide,
The other end is connected with the main waveguide first end of second level waveguide, for collecting the second mould spot with transmission, the master of second level waveguide
The output waveguide that waveguide second end is connected with function elements other on chip, defeated by the main waveguide of left first order waveguide for coupling
The the second mould spot going out and the second mould spot of the main waveguide output of right first order waveguide, export te1Pattern；
Described first both-end waveguide and the second both-end waveguide are both-end waveguide, both-end waveguide include two symmetrical fall
Tapered transmission line, the narrow end surface of a back taper waveguide is first end, and its wide end surface is the 3rd end, the narrow end surface of another back taper waveguide
For the second end, its wide end surface is the 4th end.
Further, be spaced 6-11 μm at two symmetrical back taper waveguide width sections in double back taper waveguides, with ensure double fall
The effective alignment of tapered transmission line and two mould spots of single order mould field in top covering, thus improve light field in top covering be coupled into double fall
Tapered wave-guide efficiency.
Further, top covering, first end and optical fiber align are also included, the first mould spot and first of transmission in second end face
Acquisition module is aligned, and in second end face, the second mould spot of transmission is aligned with the second acquisition module, for reception and in Transmission Fibers
lp11Pattern.
Further, top covering is 12-24 μm in end face width, is passed with ensureing that light field is preferably limited in top covering
Defeated, increase mould field overlap integral.
Further, the narrow end surface of back taper waveguide is 1-3 μm apart from the distance of chip edge, realizes with existing process
Under the conditions of improve mould field in top covering and be coupled into the efficiency of back taper waveguide.
Further, the first branch-waveguide of y branching type waveguide and the width sum of the second branch-waveguide should be less than or wait
In the width of main waveguide, with reduce when mould field is transmitted in the first branch-waveguide and the second branch-waveguide issuable leakage or
Loss.
Further, the first branch-waveguide of y branching type waveguide and the linear flexural property of the second branch-waveguide Bezier, with
Realize more smooth transition and reduce the loss in transmitting procedure.
By the contemplated above technical scheme of the present invention, compared with prior art, can obtain following beneficial effect:
1st, the lp to transmission in quasi-fiber for first acquisition module11First mould spot of pattern simultaneously gathers the first mould spot, and second adopts
The lp of transmission in collection module alignment optical fiber11Second mould spot of pattern simultaneously gathers the second mould spot, realizes to lp11Phase place phase in pattern
The first mould spot of difference π and the collection of the second mould spot, the first mould spot enters the first transmission channel in coupling module, and the second mould spot enters coupling
Second transmission channel in matched moulds block, realizes the first mould spot and the coupling of the second mould spot by mould field superposition in space, by coupling
The main transmission channel output of matched moulds block, because the first transmission channel is symmetrical with the second transmission channel, this process is considered as
It is the inverse process that in main transmission channel, pattern produces super model to the first transmission channel and the second transmission channel, according to linear system
Reciprocity, in the first mould spot of the first transmission channel transmission and the second mould spot phase place still phase difference of pi of the second transmission channel transmission.
First mould spot and the second mould spot are coupled into phase difference during becoming owner of transmission waveguide and keep constant, finally in the main biography supporting multimode
The output end of defeated passage obtains te1Pattern, realizes lp in optical fiber11Pattern te in chip1Pattern high efficiency coupling.
2nd, the present invention is capable of lp in optical fiber11Pattern te in chip1Pattern high efficiency coupling, for basic mode
lp01To te0Or tm0All there is higher coupling efficiency, when transmitting basic mode in optical fiber, by the first acquisition module and the second collection mould
Block gathers the mould spot of basic mode simultaneously, and the light path that the mould spot of the basic mode of the collection of the first acquisition module experiences before coupling is adopted with second
The identical light path that experiences before coupling of mould spot of the basic mode of collection module collection identical so that the mould spot of two basic modes enters overcoupling
It is still basic mode after module coupling.
Brief description
Below in conjunction with the accompanying drawings technical scheme is further described in detail.
Fig. 1 specific embodiment of the invention tomograph, in figure, the 1, first both-end waveguide, 2 second both-end waveguides, 3,
Left first order waveguide, 4, the waveguide of the right second level, 5, second level waveguide；
Fig. 2 specific embodiment of the invention overlooking structure figure, in figure, the 1, first both-end waveguide, 2 second both-end waveguides, 3,
Left first order waveguide, 4, the waveguide of the right second level, 5, second level waveguide, 6, top covering (the most clearly characterize effect, this knot for reaching
Structure is omitted in FIG)；
The coupling process schematic diagram of fundamental mode field in first order waveguide in the embodiment that Fig. 3 (a) provides for the present invention；
The coupling process schematic diagram of single order mould field in second level waveguide in the embodiment that Fig. 3 (b) provides for the present invention；
The waveguide cross-section mode distributions figure of Fig. 4 specific embodiment of the invention, wherein: (a) top covering mode distributions figure；
Main waveguide sections mode distributions figure in the waveguide of (b) left first order；(c) second level waveguide first branch-waveguide and the second branch-waveguide
Section mode distributions figure；The main waveguide sections mode distributions figure of (d) second level waveguide.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, below in conjunction with drawings and Examples, right
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only in order to explain the present invention, and
It is not used in the restriction present invention.
The present invention proposes the horizontal coupler for optical fiber and chip chamber optical signal transmission, including the first acquisition module,
Two acquisition modules and coupling module, the first acquisition module and transmission lp in a fiber11First mould spot be aligned of pattern, second adopts
Collection module and transmission lp in a fiber11Second mould spot be aligned of pattern, the first acquisition module gathers and transmits the first mould spot, and second
Acquisition module gathers and transmits the second mould spot, realizes to lp in optical fiber11Whole collections of pattern, the first mould spot and the second mould spot exist
Phase difference of pi in phase place, due to the first acquisition module and the second acquisition module symmetric arrays so that after the first acquisition module transmission
First mould spot is still π with the second mould spot phase difference after the second acquisition module transmission.
Coupling module includes the first transmission channel, the second transmission channel and main transmission channel, first transmission channel one end
It is connected with the first end of main transmission channel, its other end connects the first acquisition module, for receiving by the first collection mould spot output
The first mould spot and the first mould spot is transmitted to main transmission channel, the first end of second transmission channel one end and main transmission channel is even
Connect, its other end connects the second acquisition module, for receive due to the second collection mould spot output the second mould spot and by the second mould
Spot transmits to main transmission channel, due to the first transmission channel with the second transmission channel symmetric arrays so that the first mould spot is coupling
The light path that the light path being experienced in module and the second mould spot are experienced in coupling module identical so that the first mould spot and the second mould
Phase difference before the first end entering to become owner of transmission channel for the spot remains as π, and the second end of main transmission channel connects chip and receives mould
Block, by the superposition in main transmission channel of the first mould spot and the second mould spot, realizes being coupled as the first mould spot and the second mould spot
lp11Pattern exports, and realizes lp in optical fiber11Pattern switchs to the te in chip1Pattern.
As another part of the present invention, the horizontal coupler providing in the present invention is for basic mode lp01To te0Or tm0All
There is higher coupling efficiency, when transmitting basic mode in optical fiber, basic mode is gathered by the first acquisition module and the second acquisition module simultaneously
Mould spot, the basic mode mould of the light path that the basic mode mould spot of the collection of the first acquisition module experiences before coupling and the collection of the second acquisition module
The identical light path that spot experiences before coupling is identical so that it is still basic mode that two basic mode mould spots enter after overcoupling module couples.
In the first embodiment that the present invention provides, the first acquisition module is the first back taper waveguide, the first back taper waveguide
Narrow end surface is aligned with the first mould spot in optical fiber, and for receiving and transmitting the first mould spot, its effect is to be drawn the light field of disperse
Lead and collect, adiabatically coupled by back taper waveguide, energization capture range, improves the efficiency of coupling；Second collection mould
Block is the second back taper waveguide, and the second back taper waveguide narrow end surface is aligned with the second mould spot in optical fiber, for receiving and transmitting the
Two mould spots；First back taper waveguide and the second back taper guide symmetry arrange so that the first mould spot is in the first back taper waveguide
After transmitting in the second back taper waveguide with the second mould spot after transmission, phase difference is still π, and coupling module is y branching type waveguide, and y divides
Prop up type waveguide and be provided with the first branch-waveguide, the second branch-waveguide and main waveguide, first branch-waveguide one end connects main waveguide first
End, its other end is connected with the first back taper waveguide wide end surface, and for receiving and transmitting the first mould spot, second branch-waveguide one end is even
Connect main waveguide first end, its other end is connected with the second back taper waveguide wide end surface, for receiving and transmitting the second mould spot, first point
Waveguide and the second branch-waveguide symmetric arrays so that the first mould spot after the first branch-waveguide transmit with the second mould spot second
Phase place still phase difference of pi after branch-waveguide transmission, realizes the first mould spot and the second mould spot in main waveguide by mould field in space overlapping
In coupling, by main waveguide export te1Pattern, main waveguide second end is used for connecting defeated with what function elements other on chip were connected
Go out waveguide.In addition, the horizontal coupler providing in first embodiment is for basic mode lp01To te0Or tm0Higher coupling is all had to imitate
Rate.By the Optical Field Superposition characteristic of the mould field guidance capability of back taper waveguide and y branching type waveguide in the embodiment that the present invention provides
Combine, propose lp between optical fiber and chip first11The horizontal coupling scheme of pattern, also ensure that the transparent coupling of basic mode simultaneously
Close, the two all can reach higher coupling efficiency.
In the second embodiment that the present invention provides, including top covering, the first back taper waveguide, the second back taper waveguide and y branch
Type waveguide, top covering, for lp in reception simultaneously Transmission Fibers11Pattern, top covering first end, to quasi-fiber, is transmitted in second end face
The first mould spot be aligned with the first acquisition module, in second end face transmission the second mould spot be aligned with the second acquisition module, employing
Covering is to the lp in optical fiber11The transmission of pattern, can be effectively protected the first back taper waveguide and the damage of the second back taper waveguide
Bad, the first back taper waveguide receives top covering output lp11First mould spot in pattern, the second back taper waveguide receives top covering output lp11
Second mould spot in pattern, the first back taper waveguide and the second back taper guide symmetry arrange so that the first mould spot is in the first back taper
After transmitting in the second back taper waveguide with the second mould spot after transmitting in shape waveguide, phase difference is still π, and coupling module is y branching type
Waveguide, y branching type waveguide is provided with the first branch-waveguide, the second branch-waveguide and main waveguide, and first branch-waveguide one end connects master
Waveguide first end, its other end is connected with the first back taper waveguide wide end surface, for receiving and transmitting the first mould spot, second branch's ripple
Lead one end and connect main waveguide first end, its other end is connected with the second back taper waveguide wide end surface, for receiving and transmitting the second mould
Spot, the first branch-waveguide and the second branch-waveguide symmetric arrays are so that the first mould spot is after the first branch-waveguide transmits and second
Phase place still phase difference of pi after the second branch-waveguide transmits for the mould spot, realizes the first mould spot and the second mould by mould field in space overlapping
Coupling in main waveguide for the spot, exports te by main waveguide1Pattern, main waveguide second end is used for connecting and effectors other on chip
The output waveguide that part is connected, realizes lp in optical fiber11Pattern switchs to the te in chip1Pattern.
As shown in figure 1, the 3rd embodiment providing for the present invention, the first acquisition module is the first both-end waveguide 1, both-end ripple
Lead including two symmetrical back taper waveguides, the narrow end surface of a back taper waveguide is first end, and its wide end surface is the 3rd end, separately
The narrow end surface of one back taper waveguide is the second end, and its wide end surface is the 4th end, and the first end of the first both-end waveguide 1 is equal with the second end
Lp with the output of top covering second end face11First mould spot be aligned of pattern, for receiving and transmitting the first mould spot, two are symmetrically divided
The back taper waveguide of cloth is realized preferably guiding and is collected the first mould spot.
Second acquisition module is the second both-end waveguide 2, and both-end waveguide includes two symmetrical back taper waveguides, a back taper
The narrow end surface of shape waveguide is first end, and its wide end surface is the 3rd end, and the narrow end surface of another back taper waveguide is the second end, its wide end
Face is the 4th end, the second both-end waveguide 2 first end and the 4th end lp all with the output of top covering second end face11Pattern the second mould spot
Be aligned, for receiving and transmitting the second mould spot.
Cascade y branching type waveguide includes left first order waveguide 3, right first order waveguide 4 and second level waveguide 5, the left first order
Waveguide 3, right first order waveguide 4 and second level waveguide 5 are y branching type waveguide, y branching type waveguide be provided with the first branch-waveguide, the
Two branch-waveguides and main waveguide.
First branch-waveguide of left first order waveguide 3 and the three-terminal link of the first both-end waveguide 1, for collecting and transmitting
First mould spot, the second branch-waveguide of left first order waveguide 3 is connected with the 4th end of the first both-end waveguide 1, for collecting and passing
Defeated first mould spot, the main waveguide of left first order waveguide 3 is connected with first of second level waveguide 5, for coupling left first order ripple
Lead 3 the first mould spot of the first branch-waveguide transmission and the first mould spot of the second branch-waveguide transmission, export the first mould spot.
The three-terminal link of right first order waveguide 4 first branch-waveguide and the second both-end waveguide 2 is used for collecting and transmit
Two mould spots, the second branch-waveguide is connected with the 4th end of the second both-end waveguide 2, for collecting and transmitting the second mould spot, right first
The level main waveguide of waveguide 4 is connected with second of second level waveguide 5, and the first branch-waveguide for coupling right first order waveguide passes
The second defeated mould spot and the second mould spot of the second branch-waveguide transmission, export the second mould spot.
Second level waveguide 5 is y branching type waveguide, and y branching type waveguide is provided with the first branch-waveguide, the second branch-waveguide and master
Waveguide, first branch-waveguide one end is connected with the main waveguide of left first order waveguide 3, the main waveguide of the other end and second level waveguide the
One end connects, and for collecting the second mould spot with transmission, the second branch-waveguide is connected with the main waveguide of right first order waveguide 4, separately
One end is connected with the main waveguide first end of second level waveguide, for collecting the second mould spot with transmission, the main ripple of second level waveguide 5
Lead the second end for the output waveguide being connected with function elements other on chip, for coupling by the main waveguide of left first order waveguide
Second mould spot of the main waveguide output of the second mould spot of output and right first order waveguide, exports te1Pattern, realizes in optical fiber
lp11Pattern switchs to the te in chip1Pattern.
The embodiment providing in the present invention is by the light field of the mould field guidance capability of both-end back taper waveguide and y branching type waveguide
Superimposed characteristics combine, and propose the horizontal coupling scheme of higher order mode between optical fiber and chip first, also ensure that base simultaneously
The transparent coupling of mould so that the two all can reach higher coupling efficiency, realize low-loss between optical fiber and chip, big bandwidth,
Large Copacity signal transmission.
The top view of the 3rd embodiment that Fig. 2 provides for the present invention, the first acquisition module, the second collection in 3rd embodiment
Module and cascade y branching type waveguide are and are etched, in chip upper silicon layer, the Luciola substriata structure obtaining completely, simultaneously for protecting
The good restriction of card light field, deposited the silica top covering 6 of one layer of finite width on chip.It should be noted that being
The coupler structure of Fig. 1 is made to characterize and be more apparent from, on silica, top covering is omitted in FIG.
As the lp in optical fiber11After level is coupled into top covering, light field is converted in silica top covering pattern
Te1Pattern continues transmission.For making light field preferably be limited in finite region, deep trench is adopted to carve silica top covering
Erosion, that is, in the both sides of both-end waveguide, from chip edge to piece on rectangular region, top covering on silica is all carved
Erosion, obtains limited top covering width thus limiting the horizontal disperse of light field.Two groups of both-end back taper waveguides are through accurate optimization
Spacing, respectively to te in silica top covering1The mould spot energy of two phase by pi of pattern guides and collects, such as Fig. 3
A shown in (), the first mould spot is gathered by both-end waveguide, by and the first branch-waveguide by left first order waveguide and the second branch
Waveguide is coupled into be become owner of in waveguide, this process can be regarded as in the main waveguide of the first order waveguide pattern to the first branch-waveguide and
Produce the inverse process of super model in second branch-waveguide, the second mould spot gathers by both-end waveguide, by and by right first order waveguide
The first branch-waveguide and the second branch-waveguide be coupled into and become owner of in waveguide, according to the reciprocity of linear system, in the left first order
The trunk waveguide output end of waveguide and right first order waveguide will respectively obtain the mould spot of two phase place phase difference of pi, such as shown in Fig. 3 (b),
Two mould spots by respectively enteing the first branch-waveguide and second branch-waveguide of second level waveguide, because two mould spots are in symmetrical structure
The light path of middle experience is identical, and during being coupled into the main waveguide in the second level, phase difference keeps constant, finally in the master supporting multimode
Waveguide output end obtains the te on piece1Pattern, thus realize lp11Pattern is to te1The efficient coupling of pattern and conversion.
Technological requirement in view of actual fabrication and loss characteristic, this specific embodiment selects the of y branching type waveguide
One branch-waveguide and the second branch-waveguide to replace traditional straight wave guide for the linear curved waveguide of Bezier, more smooth to realize
Transition reduces the loss in transmitting procedure, and the section of back taper waveguide and y branching type waveguide is square, preferably to support electric field
Along the tm pattern of chip height direction vertical vibration, the first branch-waveguide of y branching type waveguide and the width of the second branch-waveguide
Sum should be less than or is equal to the width of main waveguide, so that reduce can when mould field is transmitted in the first branch-waveguide and the second branch-waveguide
The leakage that can produce or loss.The end face width of top covering is 12-24 μm, to ensure that light field is preferably limited in top covering
Transmission, increases mould field overlap integral.When the end face width of top covering is less than 12 μm, top covering is narrow to be will be unable to device is had
Effect covers, and part light field may be led to leak；When the end face width of top covering is more than 24 μm, top covering is wide to be made to light field
Restriction effect weakens, and overlap integral reduces rapidly.It is spaced 6-11 μ at two symmetrical back taper waveguide width sections in double back taper waveguides
M, to ensure that two-arm back taper waveguide is aligned with single order mould field in top covering two the effective of mould spot, thus improve light field in top covering
It is coupled into the efficiency in back taper waveguide；After beyond this scope, the deviation being produced due to be aligned is subtracted rapidly by coupling efficiency
Little.The narrow end surface of back taper waveguide is 1-3 μm apart from the distance of chip edge, realizes wrapping with improving under the conditions of existing process
In layer, mould field is coupled into the efficiency in back taper waveguide；During less than 1 μm, may be because of the essence of chip edge deep etching or glossing
Degree error causes to the end face of back taper coupler to damage, and during more than 3 μm, light field disperse in top covering is too fast, is unfavorable for down
Effective guiding of taper coupler and collection.When the end face width of silica top covering is 16 μm, the narrow end surface of both-end waveguide
It is 1 μm with the distance of silica top covering first end face, the width of narrow end surface is 0.2 μm, the first branch of first order waveguide
Waveguide and the second branch-waveguide be spaced apart 1 μm, the width of the main waveguide of first order waveguide is 0.8 μm；The first of second level waveguide
Branch-waveguide and the second branch-waveguide are spaced apart 9 μm, when the width of the main waveguide of second level waveguide is 1.6 μm, horizontal coupler
By the lp in optical fiber11Mode Coupling enters coupling efficiency during receiver module in chip with optimum.
By the design of said structure, emulation obtains the mode distributions figure of device as shown in Figure 4 waveguide cross-section everywhere,
Wherein Fig. 4 (a) respectively show the mode distributions figure in top covering section, and the main waveguide that Fig. 4 (b) illustrates left first order waveguide cuts
The mode distributions figure in face, the mould field of the first branch-waveguide and the second branch-waveguide section that Fig. 4 (c) illustrates second level waveguide is divided
Butut, the mode distributions figure of the main waveguide sections of Fig. 4 (d) second level waveguide, thus more clearly from illustrate the transmission of mould field with
Change procedure.
Last it should be noted that implementing example above only in order to technical scheme to be described and unrestricted, although
With reference to preferred embodiment, the present invention is described in detail, it will be understood by those within the art that, can be to this
Bright technical scheme is modified or equivalent, and without deviating from the spirit and scope of technical solution of the present invention, it all should be contained
Cover in the middle of scope of the presently claimed invention.
Claims (9)
1. a kind of horizontal coupler for optical fiber and chip chamber optical signal transmission is it is characterised in that include:
First acquisition module, is aligned with the first mould spot transmitting in a fiber, for gathering single order linear polarization pattern in optical fiber
First mould spot；
Second acquisition module, is aligned with the second mould spot transmitting in a fiber, for gathering single order linear polarization pattern in optical fiber
Second mould spot；And
Coupling module, it includes the first transmission channel, the second transmission channel and main transmission channel, and the one of described first transmission channel
End is connected with the first end of main transmission channel, and the other end of the first transmission channel connects the first acquisition module, for receiving and passing
Defeated first mould spot；One end of described second transmission channel is connected with the first end of main transmission channel, described second transmission channel
The other end connects the second acquisition module, for receiving and transmitting the second mould spot；Second end of described main transmission channel is used for connecting
The output waveguide being connected with function elements other on chip, horizontal for the first mould spot and the second mould spot are coupled as single order in chip
Electric mould output；
Described first acquisition module and described second acquisition module symmetric arrays, and the first transmission channel and the second transmission channel pair
Claim arrangement.
2. the horizontal coupler according to claim 1 is it is characterised in that described first acquisition module is the first back taper
Waveguide, the first back taper waveguide narrow end surface is aligned with the first mould spot of single order linear polarization pattern in optical fiber, for receiving and transmitting
First mould spot；
Described second acquisition module is the second back taper waveguide, single order linearly polarized mode in the second back taper waveguide narrow end surface and optical fiber
Second mould spot be aligned of formula, for receiving and transmitting the second mould spot；
Described coupling module is y branching type waveguide, and y branching type waveguide is provided with the first branch-waveguide, the second branch-waveguide and main ripple
Lead, first branch-waveguide one end connects main waveguide first end, and the first branch-waveguide other end and the first back taper waveguide wide end surface are even
Connect, for receiving and transmitting the first mould spot, second branch-waveguide one end connects main waveguide first end, the second second point of branch-waveguide
Prop up the waveguide other end to be connected with the second back taper waveguide wide end surface, for receiving and transmitting the second mould spot, main waveguide second end connects
Chip output waveguide, for coupling and exporting single order transverse electric mode the first mould spot and the second mould spot；
First both-end back taper waveguide and the arrangement of the second both-end back taper guide symmetry, the first branch-waveguide and the second branch-waveguide
Symmetric arrays.
3. the horizontal coupler according to claim 1 is it is characterised in that described first acquisition module is the first both-end ripple
Lead (1), be provided with first end to the 4th end, the first end of the first both-end waveguide (1) and the second end single order all with transmission in optical fiber
First mould spot be aligned of linear polarization pattern, for receiving and transmitting the first mould spot；
Described second acquisition module is the second both-end waveguide (2), is provided with first end to the 4th end, the second both-end waveguide (2) first
End is all aligned with the second mould spot of the single order linear polarization pattern of transmission in optical fiber with the second end, for receiving and transmitting the second mould
Spot；
Cascade y branching type waveguide includes left first order waveguide (3), right first order waveguide (4) and second level waveguide (5)；
Described left first order waveguide (3) is y branching type waveguide, and y branching type waveguide is provided with the first branch-waveguide, the second branch-waveguide
With main waveguide, the first branch-waveguide of described left first order waveguide (3) and the three-terminal link of the first both-end waveguide, for collecting
With transmit the first mould spot, the second branch-waveguide of described left first order waveguide (3) is connected with the 4th end of the first both-end waveguide, use
In collecting and transmission the first mould spot, the main waveguide of left first order waveguide (3) is connected with the first branch-waveguide of second level waveguide (5)
Connect, the first mould spot and the second of left first order waveguide (3) that the first branch-waveguide for coupling left first order waveguide (3) transmits
First mould spot of branch-waveguide transmission；
Described right first order waveguide (4) is y branching type waveguide, and y branching type waveguide is provided with the first branch-waveguide, the second branch-waveguide
With main waveguide, the first branch-waveguide of right first order waveguide (4) is used for collecting with the three-terminal link of the second both-end waveguide and passes
Defeated second mould spot, the second branch-waveguide of right first order waveguide (4) is connected with the 4th end of the second both-end waveguide, for collect with
Transmit the second mould spot, the main waveguide of right first order waveguide (4) is connected with the second branch-waveguide of second level waveguide (5), for coupling
Close the second mould spot of the first branch-waveguide transmission of right first order waveguide (4) and right first order waveguide (4) second branch-waveguide passes
The second defeated mould spot；
Described second level waveguide (5) be y branching type waveguide, y branching type waveguide be provided with the first branch-waveguide, the second branch-waveguide and
Main waveguide, first branch-waveguide one end is connected with the main waveguide of left first order waveguide (3), the other end and second level waveguide (5)
Main waveguide first end connects, for collecting the second mould spot with transmission, the second branch-waveguide (5) and right first order waveguide (4)
Main waveguide connects, and the other end is connected with the main waveguide first end of second level waveguide (5), for collecting the second mould spot with transmission,
The output waveguide that main waveguide second end of second level waveguide (5) is connected with function elements other on chip, for coupling by a left side the
Second mould spot of the main waveguide output of the second mould spot of main waveguide output of one-level waveguide (3) and right first order waveguide (4), output
Single order transverse electric mode；
Described first both-end waveguide (1) and the second both-end waveguide (2) are both-end waveguide, both-end waveguide include two symmetrical
Back taper waveguide, the narrow end surface of a back taper waveguide is first end, and its wide end surface is the 3rd end, the narrow end of another back taper waveguide
Face is the second end, and its wide end surface is the 4th end.
4. the horizontal coupler according to claim 3 is it is characterised in that two symmetrical back taper ripple in double back taper waveguide
Lead and be spaced 6-11 μm at wide section.
5. the horizontal coupler according to claims 1 to 3 is it is characterised in that horizontal coupler also includes top covering, its
First end and optical fiber align, in second end face, the first mould spot of transmission is aligned with the first acquisition module, transmission in second end face
Second mould spot is aligned with the second acquisition module, for lp in reception simultaneously Transmission Fibers11Pattern.
6. the horizontal coupler according to claim 5 is it is characterised in that top covering is 12-24 μm in end face width.
7. the horizontal coupler according to claim 5 is it is characterised in that the narrow end surface of back taper waveguide is apart from chip side
The distance of edge is 1-3 μm.
8. the horizontal coupler according to claim 2 to 3 is it is characterised in that the first branch-waveguide of y branching type waveguide
Should be less than or be equal to the width of main waveguide with the width sum of second branch-waveguide the second branch-waveguide.
9. the horizontal coupler according to claim 2 to 3 is it is characterised in that the first branch-waveguide of y branching type waveguide
It is in the linear flexural property of Bezier with second branch-waveguide the second branch-waveguide.
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| CN201610929509.3A CN106338800B (en) | 2016-10-31 | 2016-10-31 | It is a kind of to be used for optical fiber and the horizontal coupler of chip chamber optical signal transmission |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109001859A (en) * | 2017-06-06 | 2018-12-14 | 日月光半导体制造股份有限公司 | Optical device packaging |
| CN114384633A (en) * | 2022-01-21 | 2022-04-22 | 合肥吕斯科技有限公司 | Horizontal coupler for optical signal transmission between rectangular-core few-mode optical fiber and chip |
| CN114397729A (en) * | 2021-12-06 | 2022-04-26 | 深圳奥斯诺导航科技有限公司 | SiN integrated optical chip based on continuous curvature bent waveguide polarizer |
| CN114859464A (en) * | 2021-01-20 | 2022-08-05 | 中国科学院微电子研究所 | Fundamental mode-mode field converter and construction method thereof |
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| JPH08234062A (en) * | 1995-02-27 | 1996-09-13 | Nippon Telegr & Teleph Corp <Ntt> | Optical coupling device and optical coupling method |
| CN1252901A (en) * | 1997-04-18 | 2000-05-10 | 西门子公司 | Laser device |
| CN101710195A (en) * | 2009-12-09 | 2010-05-19 | 中国科学院半导体研究所 | Free-etching oxidation manufacturing method of SOI submicron ridge optical waveguide back-taper coupler |
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| JPH08234062A (en) * | 1995-02-27 | 1996-09-13 | Nippon Telegr & Teleph Corp <Ntt> | Optical coupling device and optical coupling method |
| CN1252901A (en) * | 1997-04-18 | 2000-05-10 | 西门子公司 | Laser device |
| CN101710195A (en) * | 2009-12-09 | 2010-05-19 | 中国科学院半导体研究所 | Free-etching oxidation manufacturing method of SOI submicron ridge optical waveguide back-taper coupler |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109001859A (en) * | 2017-06-06 | 2018-12-14 | 日月光半导体制造股份有限公司 | Optical device packaging |
| CN114859464A (en) * | 2021-01-20 | 2022-08-05 | 中国科学院微电子研究所 | Fundamental mode-mode field converter and construction method thereof |
| CN114859464B (en) * | 2021-01-20 | 2024-04-16 | 中国科学院微电子研究所 | Fundamental mode field converter and construction method thereof |
| CN114397729A (en) * | 2021-12-06 | 2022-04-26 | 深圳奥斯诺导航科技有限公司 | SiN integrated optical chip based on continuous curvature bent waveguide polarizer |
| CN114397729B (en) * | 2021-12-06 | 2024-05-28 | 广东奥斯诺工业有限公司 | SiN integrated optical chip based on continuous curvature bending waveguide polarizer |
| CN114384633A (en) * | 2022-01-21 | 2022-04-22 | 合肥吕斯科技有限公司 | Horizontal coupler for optical signal transmission between rectangular-core few-mode optical fiber and chip |
| CN114384633B (en) * | 2022-01-21 | 2024-05-24 | 合肥知宇芯光科技有限公司 | Horizontal coupler for optical signal transmission between rectangular core few-mode optical fiber and chip |
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|---|---|
| CN106338800B (en) | 2018-06-12 |
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