CN106328795A - Medical phototherapy pc-LEDs lamp - Google Patents

Medical phototherapy pc-LEDs lamp Download PDF

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Publication number
CN106328795A
CN106328795A CN201610919566.3A CN201610919566A CN106328795A CN 106328795 A CN106328795 A CN 106328795A CN 201610919566 A CN201610919566 A CN 201610919566A CN 106328795 A CN106328795 A CN 106328795A
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China
Prior art keywords
light
led
red
leds
lamp
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CN201610919566.3A
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Chinese (zh)
Inventor
饶海波
孟庆浩
张坤
李婷
郑伟兵
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University of Electronic Science and Technology of China
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University of Electronic Science and Technology of China
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Priority to CN201610919566.3A priority Critical patent/CN106328795A/en
Publication of CN106328795A publication Critical patent/CN106328795A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00Radiation therapy
    • A61N5/06Radiation therapy using light
    • A61N2005/065Light sources therefor
    • A61N2005/0651Diodes
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00Radiation therapy
    • A61N5/06Radiation therapy using light
    • A61N2005/0658Radiation therapy using light characterised by the wavelength of light used
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Luminescent Compositions (AREA)

Abstract

The invention discloses a manufacturing method of a medical phototherapy pc-LEDs lamp. The method includes the following steps that firstly, red fluorescent powder and colloid are mixed to form uniform powder pulp, then the powder pulp is applied to a structure provided with a blue light or ultraviolet LED chip, and a pc-LEDs device capable of outputting red light or far-infrared light on the blue light or ultraviolet LED chip is obtained. The method for outputting red light or far-infrared light on the blue light or ultraviolet LED chip is obtained. By changing components of the red fluorescent powder and the proportion of the red fluorescent powder to colloid, the intensity and the spectrum (chroma) of red light and the proportion of the red light to blue light are changed. The technology is low in cost, the structure is simple, red light, blue light and far-infrared light distribution is uniform, and the technology is well applied to the medical phototherapy field.

Description

A kind of pc-LEDs lamp of medical phototherapy
Technical field
The invention belongs to field of photoelectric technology, be specifically related to the coating technology of the pc-LEDs lamp of a kind of medical phototherapy.
Background technology
Phototherapy is called again photoirradiation treatment, and its principle is to utilize photo bio effect, makes human body with the illumination of specific wavelength Skin or some histiocyte expedite the emergence of long or Developing restraint, thus reach the purpose for the treatment of.Phototherapy is effectively faced as one Bed treatment means, because of advantages such as its noinvasive is painless, low cost, treatment are convenient, side effect is little, applies the most extensive.
Phototherapy is by absorbing the luminous energy of different wave length, and biological tissue produces a series of biochemical reaction in vivo, from And reach different curative effects.Red light (600~700nm) makes the catalase activity of human body increase by photochemical effect Add, accelerate cell metabolism, promote cell synthesis, promote wound healing, can be to multiple disease treatment.Wavelength is left at 635nm Right HONGGUANG has the features such as purity is high, energy density is uniform.In terms of skin care and treatment significantly, it is referred to as biological activity Light.HONGGUANG makes cytoactive improve, and enhances metabolism, after can penetrating epiderm skin arrival dermal layer of the skin, by light Light and heat chemical action, promotes elastic fibers and regenerated collagen fiber and rearranges, thus reaching to alleviate wrinkle of skin, increase Elastic effect, has traditional skin care to be beyond one's reach effect.Additionally, find that the HONGGUANG of 635nm can also reduce fat according to the study Fat cell size, has effect of noinvasive fat-reducing.Far-red light (700-760nm) with blood circulation promoting, can strengthen the work of cell Property.Blue light (425~475nm) promotes the secretion of the melatonin playing regulatory role human body biological periodic, strengthens brain vigor, subtracts The risk of few senile dementia is simultaneously notable to the treatment of neonatal jaundice disease.Wavelength is that the blue light of 415nm has and quickly suppresses scorching Effect of disease.Efficiently destroy the propionibacterium in acne forming process, make the acne of inflammatory phase significantly reduce.Purple light and blue light class Seemingly, the effect of bactericidal antiphlogistic can be played on a small quantity, useful to tissue in right amount.
Compared with conventional fluorescent lamps etc., LED has following significant advantage: (1) is energy-conservation, the electric energy conversion efficiency of white light LEDs Reach 80%;(2) environmental protection, LED does not produce noxious substance, and glow color is pure, without ultraviolet and infra-red radiation; (3) life-span is long, and mission reaches more than 50,000 hours, is more than 5 times of fluorescent lamp;(4) cold light source, does not has infrared and far light Spectrum composition, is a kind of cold light source, can irradiate without phenomenon skin ambustion or tissue occur close to surface, affected part.
Therefore, LED light source has been paid attention to it is considered to be the perfect light source of medical phototherapy by medical institutions.
Summary of the invention
The present invention is obtained by coated red fluorescent material on blue light or UV LED chip has HONGGUANG, far-red light and indigo plant Light or the LED of ultraviolet light, the LED (pc-LEDs) of this fluorescent material conversion type is different from traditional red chip+indigo plant chip Multi-chip structure, only needs single blueness or UV LED chip to coordinate the red fluorescence powder of photoexcitation to can be achieved with medical The output of HONGGUANG, far-red light, blue light or ultraviolet light required for phototherapy, the multiple light such as this technical costs is low, simple in construction, red indigo plant It is evenly distributed, will have well application in medical phototherapy.
The technical scheme is that the pc-LEDs lamp of a kind of medical phototherapy, it is characterised in that comprise the following steps:
(1), red fluorescence powder is mixed according to a certain percentage with colloid acquisition phosphor slurry;
(2), phosphor slurry is coated on the surface of blue light or UV LED chip light emission direction:
(3), the phosphor slurry of coating is heating and curing;
(4), to the LED being coated with fluorescent material carry out embedding process, be then assembled into LED lamp with one or plurality of LEDs.
In step (1), described colloid is silica gel, epoxy resin, polymethyl methacrylate (PMMA), Merlon (PC) one or more combinations or in photoresists;Described photosensitive colloid includes following three class negative-working photoresists: the most photosensitive Agent+film forming dosage form, i.e. photosensitive compounds+macromolecular compound type, wherein photosensitizer is bichromate, chromate, diazotising One or more combination in compound or azido cpd;Film former is polyvinyl alcohol (PVA), Arabic tree One or more combination in glue, polyimides or polyvinyl acetate Emulsion;2. the macromolecular compound with photosensitive base Type, mainly has polyvinyl cinnamate, polyvinyl alcohol Cortex Cinnamomi fork acetas, polyethylene oxygen ethyl-cinnamic acid ester, polyethylene pyrrole One or more combination in pyrrolidone or polyvinyl alcohol-p-azidobenzoic acid ester (PVAB);3. SBQ photoresists (poly-second Enol cyclic ketal styryl pyridinium resin photoresists), SBQ-PVA+ macromolecule Emulsion, SBQ-PVA+ macromolecule Emulsion+the third One or more combination in olefin(e) acid ester or organic benzene, organic vinylpyridine salt resin photoresists system;Photosensitive colloid is above-mentioned One class of three apoplexy due to endogenous wind or the combination of multiclass;
In described pc-LEDs lamp, red fluorescence powder used has wider red spectral components (600~760nm), Wherein can select 635nm wavelength is peak wavelength, and comprises far-red light (700-760nm), its emission spectrum such as accompanying drawing 1.3 institute Show.Red light (600~700nm) makes the catalase activity of human body increase by photochemical effect, accelerates cell the oldest Metabolism, promotes cell synthesis, promotes wound healing, can be to multiple disease treatment.Far-red light (700-760nm) can promote blood Circulation, strengthens the activity of cell.Wherein the HONGGUANG of 635nm wavelength is biological activity light, and beautifying skin and preserving health effect is the most notable.
In described pc-LEDs lamp, selected red fluorescence powder can select peak wavelength at 610nm~720nm model The different fluorescent material enclosed.These have the fluorescent material of HONGGUANG can be YAGG, YAGG:Ce3+, YAG:Eu2+ and nitride red Fluorescent material etc. are therein a kind of or their combination.
In described pc-LEDs lamp, its emission spectrum of the red fluorescence powder of selection is wider so that described for medical light The pc-LEDs light fixture treated has wider red-light spectrum composition (600-760nm), wherein comprises far-red light composition (700-760nm), According to different fluorescent material and the ratio joining arogel, in the output light of described pc-LEDs lamp, red and far-red light ratio, R/FR =0.2~20.
Above-mentioned red fluorescence powder used refers to send HONGGUANG under blue (or ultraviolet) LED light excites or containing red The fluorescent material of light spectral component, when some blue light (or ultraviolet) is converted into the redness required for medical phototherapy by excited fluorescence powder During composition, the luminous then outgoing of other segment chips the royal purple light providing antiinflammatory to dispel skin ulcer,;When red fluorescence powder increasing proportion Waiting, blue (ultraviolet) LED light is all converted to HONGGUANG.
Different fluorescent material mixing can obtain wider spectrum, and can produce various spectrum, such as, use ultraviolet LED Chip combines the blue output that can realize indigo plant+HONGGUANG with red fluorescence powder, arranges by controlling the ratio of fluorescent material blue, red, also may be used To realize purple+blue+red light output, or the output of different proportion between various light component, single redness can be made up The deficiency of light-emitting phosphor spectrum.
In described phosphor slurry, fluorescent material is 0.1~0.25 with the ratio joining arogel;Different phosphor concentration, it is possible to real Red light (600~760nm)/blue light (400~500nm) ratios different in existing emergent light, R/B=0.1~100, when swashing Encourage chip when being ultraviolet LED, red light (600~760nm)/purple light (320~400nm) ratio in output light, R/V=0.1 ~100.Different proportion of red blue light can meet different phototherapy demands.
Described LED is organic LED, inorganic LED or a combination of both;Described LED is single LEDs chip, or The plurality of LEDs chipset of same substrate, or whole wafer, the difference that can require according to phototherapy, chipset is synthesized not The structure (array) of similar shape and size;Or the wafer being coated with fluorescent material as required cuts into suitable size and shape Shape, to meet the requirement of medical phototherapy devices under different situations.
Described fluorescent material conversion type medical phototherapy LED is with existing multi-chip chip portfolio (LED chip blue, red) structure LED has obvious structure different, and it is fluorescent material conversion type (pc-LED), and this chip-packaging structure is more stable, Each wave band ratio uniform of different angles, technique is simpler thus obvious cost advantage.
Described fluorescent material conversion type LED is with the single-chip that there is now, single-range blue light phototherapy LED and HONGGUANG light Treatment LED is different, mixed proportion so that mutually strengthen effect between different-waveband, curative effect faster, have no side effect.Compare red Phototherapeutic instrument made by light LED chip, blue chip cost is lower, simple and convenient.
In described LED, phosphor slurry can be coated on the light-emitting area of LED chip, it is also possible to by fluorescence Powder slurry is coated on the surface of the arbitrary exit direction leaving LED chip.
In step (2), phosphor slurry can be coated in LED chip, form fluorescent material and directly contact LED chip Structure, as shown in accompanying drawing 1.1, this encapsulating structure is compact, simple and easy to do.Phosphor slurry can also be coated in simultaneously On LED lens hood, as shown in accompanying drawing 1.2, this mode fluorescent material leaves chip heating surface, can preferably dispel the heat, and Simplification of flowsheet.
Fluorescent material is coated on the lens surface of arbitrary exit direction, and if desired the red blue light of different proportion, the most permissible Combining with LED chip with the lens being coated with different phosphor concentration ratio, this mode is by more flexible and convenient satisfied difference The medical phototherapy of the demand requirement to light colour content.
In step (2), carrier fluorescent powder coated in arbitrary exit direction can also be glass substrate, it is also possible to be it The surface of his transparent material.
In described LED preparation process (2), lid fluorescent material Han different proportion can be coated in chip light outgoing side In substrates of different, needing to convert substrate to light according to phototherapy different phase, described substrate can be that glass lithographic plate can also It is various forms of lens.
In described LED preparation process (3), described curing mode can be body of heater heating or the one of Infrared Heating Plant or depending on multiple combination, required solidification temperature and the time Property requirements according to colloid (such as silica gel, epoxy resin);Also Can be photocuring, such as, use Photosetting colloid, photoresists etc..
In described LED preparation process (4), it is coated with the LED silica gel of fluorescent material, epoxy resin, poly-methyl-prop E pioic acid methyl ester (PMMA), Merlon (PC) carry out embedding, and the effect of embedding can completely cut off air and water, extend chip, device In the life-span, can reduce simultaneously and shake chip, the infringement of device, embedding structure may also operate as taking out the effect of optical lens, permissible Preferably heat radiation and raising LED go out light quality.The solidification temperature of its casting glue and time according to different colloids Property requirements Depending on.
The LED lamp structure assembled in the described LED preparation process (4) can be super flux LED lamp bar, shot-light, bulb lamp, Down lamp, fluorescent tube lamp, filament lamp, flat lamp, different structures meets different occasion, the different modes needs to phototherapy.
For the red blue light of different proportion to be obtained, can be by controlling the ratio realization of colloid and red fluorescence powder, also Can control by controlling the coated weight of phosphor slurry, it is also possible to by controlling the kind of different fluorescent material and multiple fluorescence Ratio when powder is used in mixed way controls.
Use this technology that LED can be made to go out light and contain a certain proportion of HONGGUANG, blue light (or ultraviolet light) and far-red light.
The technology of the present invention is not only suitable for the red-light LED device of red fluorescence powder+blue-light LED chip and prepares, and is also suitable for UV LED chip+multicolor phosphor (such as RGB three primary colors fluorescent powder) containing red-light LED implementation.
Use the technology of the present invention make LED component, it is provided that 400~500nm royal purple light needed for medical phototherapy and 600~700nm reddish orange light and the far-red light of 700~760nm, the redness of proper proportion, blue light, and it is specific to have other The spectral component (playing bactericidal action etc. as supplemented a little ultraviolet light) required.Can regulate accurately required spectral region, Save the energy.
Use the LED component that the technology of the present invention makes, the ratio that fluorescent material can be controlled with join arogel, suitably regulate spectrum Ratio, thus for different medical phototherapy, such as, make the Phototherapeutic instrument such as skin Caring, manicure;Treatment dermatitis, acne, speckle dispelling, scar of dispelling Deng;Can also be used for room lighting treatment melancholia and wait some mental sickness.
Accompanying drawing explanation
Accompanying drawing 1.1 is coated in LED schematic diagram after chip surface and embedding silica gel for fluorescent material.Fig. 1 .2 is to be coated with by fluorescent material Overlay on the schematic diagram of lens hood.Wherein, 1 is LED chip, and 2 is phosphor powder layer, and 3 is filling gel, and 4 is reflection cup, and 5 is lining The end, 6 is lens hood.
Accompanying drawing 1.3 is the luminescent spectrum figure of the red LED lamp of described nitride red fluorescent powder.
Accompanying drawing 1.4 is the LED luminescence relative spectral figure that red fluorescence powder is corresponding with colloid different proportion.
The light fixture schematic diagram that accompanying drawing 1.5 forms for plurality of LEDs, is coated on lens hood as a example by structure by fluorescent material, wherein 1,2,3 is different proportion or different types of phosphor powder layer.
Detailed description of the invention
Below in conjunction with the accompanying drawings and case study on implementation the invention will be further described:
Embodiment 1
Weigh 0.2g fluorescent material, 1g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp;
Record the blue light almost all that light fixture sent and be converted into HONGGUANG, HONGGUANG (600~700nm) and far-red light (700 ~760nm) ratio be 6.2:1.Relative spectral figure is shown in accompanying drawing 1.4 (1).
Embodiment 2
Weigh 0.2g fluorescent material, 1.6g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains glimmering Light powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp;
Record the HONGGUANG in the spectral component that light fixture is sent (600~700nm) and blue light (400~500nm) ratio is 30.5:1;HONGGUANG (600~700nm) is 8.4:1 with the ratio of far-red light (700~760nm).
Embodiment 3
Weigh 0.2g fluorescent material, 2g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp;
Record the HONGGUANG in the spectral component that light fixture is sent (600~700nm) and blue light (400~500nm) ratio is 25.4:1;HONGGUANG (600~700nm) is 9.7:1 with the ratio of far-red light (700~760nm).Relative spectral is shown in accompanying drawing 1.4 (2)。
Embodiment 4
Weigh 0.2g fluorescent material, 3g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp;
Record the HONGGUANG in the spectral component that light fixture is sent (600~700nm) and blue light (400~500nm) ratio is 5.9:1;HONGGUANG (600~700nm) is 9.5:1 with the ratio of far-red light (700~760nm).
Embodiment 5
Weigh 0.2g fluorescent material, 4g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.;
Record the HONGGUANG in spectral component (600~700nm) and blue light (400~500nm) ratio is 4.3:1;HONGGUANG (600~700nm) are 9.7:1 with the ratio of far-red light (700~760nm).Its relative spectral is shown in accompanying drawing 1.4 (3).
Embodiment 6
Weigh 0.2g fluorescent material, 6g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp;
Record the HONGGUANG in spectral component (600~700nm) and blue light (400~500nm) ratio is 1.6:1;HONGGUANG (600~700nm) are 15.3:1 with the ratio of far-red light (700~760nm).
Embodiment 7
Weigh 0.2g fluorescent material, 10g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp;
Record the HONGGUANG in spectral component (600~700nm) and blue light (400~500nm) ratio is 1.3:1;HONGGUANG (600~700nm) are 6.5:1 with the ratio of far-red light (700~760nm).
Embodiment 8
Weigh 0.2g fluorescent material, 15g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp;
Record the HONGGUANG in spectral component (600~700nm) and blue light (400~500nm) ratio is 0.4:1;HONGGUANG (600~700nm) are 2.1:1 with the ratio of far-red light (700~760nm).Its relative spectral is shown in accompanying drawing 1.4 (4).
Embodiment 9
Weigh 0.2g fluorescent material, 17g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp;
Record the HONGGUANG in spectral component (600~700nm) and blue light (400~500nm) ratio is 0.2:1;HONGGUANG (600~700nm) are 1.2:1 with the ratio of far-red light (700~760nm).
Embodiment 10
Weigh 0.2g red fluorescence powder, 0.2g yellow fluorescent powder, 4.4g join arogel and by three's mix homogeneously, and deaeration machine is taken out Vacuum removal of air bubbles obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 11
Weigh 0.1g red fluorescence powder, 0.3g yellow fluorescent powder, 4.4g join arogel and by three's mix homogeneously, and deaeration machine is taken out Vacuum removal of air bubbles obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 12
Weigh 0.3g red fluorescence powder, 0.1g yellow fluorescent powder, 4.4g join arogel and by three's mix homogeneously, and deaeration machine is taken out Vacuum removal of air bubbles obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 13
Weigh 0.1g red fluorescence powder, 0.1g yellow fluorescent powder, 2g join arogel and by three's mix homogeneously, and deaeration machine is taken out very The empty bubble that removes obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 14
Weigh 0.2g fluorescent material, 1g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C), Obtain phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 15
Weigh 0.2g fluorescent material, 1.5g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains glimmering Light powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C), Obtain phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 16
Weigh 0.2g fluorescent material, 2g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C), Obtain phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 17
Weigh 0.2g fluorescent material, 3g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C), Obtain phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 18
Weigh 0.2g fluorescent material, 5g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C), Obtain phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 19
Weigh 0.2g fluorescent material, 8g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C), Obtain phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 20
Weigh 0.2g fluorescent material, 2.5g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains glimmering Light powder slurry;
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C), Obtain phosphor powder layer;
Above-mentioned LED chip is covered lens hood encapsulated epoxy resin simultaneously, in drying baker, then heats (120 DEG C) solidification 2 hours;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 21
Weigh red fluorescence powder material 0.25g Sr2Si5N8:Eu2+、0.25g YAG:Ce3+:Gd3+Join arogel with 3g and incite somebody to action Three's mix homogeneously, deaeration machine evacuation removes bubble and obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C), Obtain phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 22
Weigh red fluorescence powder material 0.1g Sr2Si5N8:Eu2+、0.4gYAG:Ce3+:Gd3+Arogel is joined and by three with 3g Mix homogeneously, evacuation removes bubble and obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C), Obtain phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 23
Weigh red fluorescence powder material 0.25g Sr2Si5N8:Eu2+、0.25g YAG:Ce3+:Gd3+Join arogel with 4g and incite somebody to action Three's mix homogeneously, evacuation removes bubble and obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C), Obtain phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 24
Weigh red fluorescence powder material 0.25g Sr2Si5N8:Eu2+、0.25g YAG:Ce3+:Gd3+Join arogel with 5g and incite somebody to action Three's mix homogeneously, evacuation removes bubble and obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C), Obtain phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 25
Weigh red fluorescence powder material 0.1g Sr2Si5N8:Eu2+、0.4g YAG:Ce3+:Gd3+Arogel is joined and by three with 5g Person's mix homogeneously, evacuation removes bubble and obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C), Obtain phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 26
Weigh red fluorescence powder material 0.4g Sr2Si5N8:Eu2+、0.1g YAG:Ce3+:Gd3+Arogel is joined and by three with 2g Person's mix homogeneously, evacuation removes bubble and obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 27
Weigh red fluorescence powder material 0.25g Sr2Si5N8:Eu2+、0.25gYAG:Ce3+:Gd3+Join arogel with 4.5g and incite somebody to action Three's mix homogeneously, evacuation removes bubble and obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 28
Weigh red fluorescence powder material 0.1g Sr2Si5N8:Eu2+、0.4gYAG:Ce3+:Gd3+Arogel is joined and by three with 4.5g Person's mix homogeneously, evacuation removes bubble and obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on LED chip surface, be dried 2 with drying baker heating (150 DEG C) little Time, it is thus achieved that phosphor powder layer;
Above-mentioned LED chip is covered lens hood embedding silica gel simultaneously, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 29
Weigh 0.5g fluorescent material, 2.5g joins arogel and by both mix homogeneously, evacuation removes bubble and obtains phosphor Slurry;
Use dotting glue method to be coated in by phosphor slurry on packaged LED glass or shroud surface, heat with drying baker (150 DEG C) are dried 2 hours, it is thus achieved that phosphor powder layer;
By above-mentioned LED chip embedding silica gel, in drying baker, then heat (120 DEG C) solidify 2 hours;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 30
Weigh 0.5g fluorescent material, 3.5g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains glimmering Light powder slurry;
Use dotting glue method to be coated in by phosphor slurry on packaged LED glass or shroud surface, heat with drying baker (150 DEG C) are dried 2 hours, it is thus achieved that phosphor powder layer;
By above-mentioned LED chip embedding silica gel, in drying baker, then heat (120 DEG C) solidify 2 hours;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 31
Weigh 0.5g fluorescent material, 5g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated in by phosphor slurry on packaged LED glass or shroud surface, heat with drying baker (150 DEG C) are dried 2 hours, it is thus achieved that phosphor powder layer;
By above-mentioned LED chip encapsulated epoxy resin, in drying baker, then heat (120 DEG C) solidify 2 hours;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 32
Weigh 0.5g fluorescent material, 2.5g joins arogel and by both mix homogeneously, removes bubble with deaeration machine evacuation and obtains Phosphor slurry;Weigh 0.5g fluorescent material, 3.5g joins arogel and by both mix homogeneously, deaeration machine evacuation removes bubble and obtains Phosphor slurry;Weigh 0.5g fluorescent material, 5g joins arogel and by both mix homogeneously, evacuation removes bubble and obtains phosphor Slurry;
Dispensing method is used to be coated in by phosphor slurry respectively on three substrate lens of ready-made LED lamp, with being dried Case heating (150 DEG C) is dried 2 hours, it is thus achieved that phosphor powder layer;
By above-mentioned LED chip embedding silica gel, in drying baker, then heat (120 DEG C) solidify 2 hours;
Finally it is assembled into LED lamp.
Embodiment 33
Weigh red fluorescence powder material 0.25g Sr2Si5N8:Eu2+、0.25g YAG:Ce3+:Gd3+Join arogel with 5g and incite somebody to action Three's mix homogeneously, deaeration machine evacuation removes bubble and obtains phosphor slurry;Weigh red fluorescence powder material 0.4g Sr2Si5N8:Eu2+、0.1gYAG:Ce3+:Gd3+Joining arogel and by three's mix homogeneously with 5g, deaeration machine evacuation removes bubble and obtains Obtain phosphor slurry;Weigh red fluorescence powder material 0.1g Sr2Si5N8:Eu2+、0.4gYAG:Ce3+:Gd3+Arogel is joined also with 5g By three's mix homogeneously, deaeration machine evacuation removes bubble and obtains phosphor slurry;
Dispensing method is used to be coated in by phosphor slurry respectively on three substrate lens of ready-made LED lamp, with being dried Case heating (150 DEG C) is dried 2 hours, it is thus achieved that phosphor powder layer;
By above-mentioned LED chip embedding silica gel, in drying baker, then heat (120 DEG C) solidify 2 hours;
Finally it is assembled into LED lamp.
Embodiment 34
Weigh red fluorescence powder material 0.25g Sr2Si5N8:Eu2+、0.25g YAG:Ce3+:Gd3+Join arogel with 5g and incite somebody to action Three's mix homogeneously, deaeration machine evacuation removes bubble and obtains phosphor slurry;Weigh red fluorescence powder material 0.1g Sr2Si5N8:Eu2+、0.4gYAG:Ce3+:Gd3+Joining arogel and by three's mix homogeneously with 5g, deaeration machine evacuation removes bubble and obtains Obtain phosphor slurry;Weigh 0.5g fluorescent material, 5g joins arogel and by both mix homogeneously, evacuation removes bubble and obtains fluorescent material Slurry;
Dispensing method is used to be coated in by phosphor slurry respectively on three substrate lens of ready-made LED lamp, with being dried Case heating (150 DEG C) is dried 2 hours, it is thus achieved that phosphor powder layer;
By above-mentioned LED chip embedding silica gel, in drying baker, then heat (120 DEG C) solidify 2 hours;
Finally it is assembled into LED lamp.
Embodiment 35
Weigh 0.5g fluorescent material, 2.5ml photoresists (mix with PVA solution and ADC solution and join) and both are mixed all Even;
Using dotting glue method to be coated in by phosphor slurry on LED chip surface, exposure 0.75ms also develops;
Above-mentioned LED chip is covered lens hood, encapsulated epoxy resin, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 36
Weigh 0.5g red fluorescence powder Sr2Si5N8:Eu2+Arogel is joined and by both mix homogeneously, deaeration machine evacuation with 5g Remove bubble and obtain phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on UV LED chip surface, be dried with drying baker heating (150 DEG C) 2 hours, it is thus achieved that phosphor powder layer;
Above-mentioned UV LED chip is covered lens hood, embedding silica gel, in drying baker, then heats (120 DEG C) solidification 2 little Time, can obtain sending existing HONGGUANG also has the LED of ultraviolet;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 37
Weigh 0.5g red fluorescence powder Y2O3: Eu, 5g join arogel and by both mix homogeneously, and deaeration machine evacuation removes gas Bubble obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on UV LED chip surface, be dried with drying baker heating (150 DEG C) 2 hours, it is thus achieved that phosphor powder layer;
Above-mentioned UV LED chip is covered lens hood, embedding silica gel, in drying baker, then heats (120 DEG C) solidification 2 little Time, can obtain sending existing HONGGUANG also has the LED of ultraviolet;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 38
Weigh 0.25g red fluorescence powder Sr2Si5N8:Eu2+, blue colour fluorescent powder 0.25g YVO4:Ce3+Join arogel with 5g and incite somebody to action Both mix homogeneously, evacuation removes bubble and obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on UV LED chip surface, be dried with drying baker heating (150 DEG C) 2 hours, it is thus achieved that phosphor powder layer;
Above-mentioned UV LED chip is covered lens hood, embedding silica gel, in drying baker, then heats (120 DEG C) solidification 2 little Time, can obtain sending existing HONGGUANG and blue light also has the LED of ultraviolet;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 39
Weigh 0.25g Sr2Si5N8:Eu2+Red fluorescence powder, 0.25gYVO4:Ce3+Blue colour fluorescent powder and 2.5ml's is photosensitive Glue (PVA solution and the mixing of ADC solution are joined), and will both mix homogeneously;
Using dotting glue method to be coated in by phosphor slurry on LED chip surface, exposure 0.75ms also develops;
Above-mentioned LED chip is covered lens hood, embedding silica gel, in drying baker, then heats (120 DEG C) solidify 2 hours;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 40
Weighing 0.2g fluorescent material and 1.6g silica gel joins arogel mix homogeneously, deaeration machine evacuation removes bubble and obtains fluorescence Powder slurry;
Use dotting glue method to be coated on wafer by phosphor slurry, be dried 2 hours with drying baker heating (150 DEG C), it is thus achieved that Phosphor powder layer, is then cut into needing the dimensional structure of size;
The wafer of above-mentioned well cutting is covered lens hood, injects embedding filling gel, in drying baker, then heat (120 DEG C) solidify 2 hours;
Finally adopt one or plurality of LEDs is fabricated to LED lamp.
Embodiment 41
Weigh 0.5g burst of ultraviolel halogen calcium phosphate fluoressent powder Ca10F2P6O24: Mn:Sb:Cl and 3g joins arogel and both is mixed Closing uniformly, deaeration machine evacuation removes bubble and obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on UV LED chip surface, be dried with drying baker heating (150 DEG C) 2 hours, it is thus achieved that phosphor powder layer;
Above-mentioned UV LED chip is covered lens hood, embedding silica gel, in drying baker, then heats (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.
Embodiment 42
Weigh yellowish red color phosphor material powder 0.2gYAG:Ce3+:Gd3+Join arogel and by both mix homogeneously with 1.5g, take out true The empty bubble that removes obtains phosphor slurry;
Use dotting glue method to be coated in by phosphor slurry on LED lens hood, be dried 2 hours with drying baker heating (150 DEG C), Obtain phosphor powder layer;
Above-mentioned LED chip is covered lens hood, injects embedding silica gel, in drying baker, then heat (120 DEG C) solidification 2 little Time;
Finally employing one or plurality of LEDs are fabricated to LED lamp.

Claims (10)

1. the pc-LEDs lamp of a medical phototherapy, it is characterised in that comprise the following steps:
(1), red fluorescence powder is mixed according to a certain percentage with colloid acquisition phosphor slurry;
(2), phosphor slurry is coated on the surface of blue light (or ultraviolet) LED chip light emission direction:
(3), the phosphor slurry of coating is heating and curing;
(4), to the LED being coated with fluorescent material carry out embedding process, be then assembled into LED lamp with one or plurality of LEDs.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (1), described Colloid is epoxy resin, silica gel, polymethyl methacrylate (PMMA), Merlon (PC), or one in photosensitive colloid or Person's multiple combination.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (1), used Its emission spectrum main peak of red fluorescence powder may be selected near 635nm, and there is wider spectral component, both comprised with 635nm wavelength is the biological activity light of main raising cytoactive, contains again the different-waveband scope promoting different cellular metabolisms Red color light component.Original a small amount of blue light (or purple light) that the chip do not changed by fluorescent material sends can regulate cell biological week Phase, suppress inflammation, with HONGGUANG complementation cell activity enhancing.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (1), used Red fluorescence powder refer to excite in blue (or ultraviolet) LED light lower to send HONGGUANG or the fluorescence containing red-light spectrum composition Powder;Red fluorescence powder used can select peak wavelength at the different fluorescent material of 610nm~720nm scope.These have red The fluorescent material of light is YAGG, YAGG:Ce3+、YAG:Eu2+Therein with nitride red fluorescent powder a kind of or their combination; Or the fluorescent material that red fluorescence powder mixes by a certain percentage with other color fluorescence powder.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (1), used Its emission spectrum of red fluorescence powder wider so that the described pc-LEDs light fixture for medical phototherapy has wider HONGGUANG light Spectrum composition (600-760nm), wherein comprises far-red light composition (700-760nm), according to different fluorescent material and the ratio joining arogel Example, in the output light of described pc-LEDs lamp, red and far-red light ratio, R/FR=0.2~20.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (1), described In phosphor slurry, fluorescent material is 0.1~0.25 with the ratio joining arogel;Different fluorescent material and the ratio joining arogel, it is possible to realize Red light (600~760nm)/blue light (400~500nm) ratios different in emergent light, R/B=0.1~100;Work as excitation When chip is ultraviolet LED, output light in red light (600~760nm)/purple light (320~400nm) ratio, R/V=0.1~ 100。
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (2), permissible Phosphor slurry is coated on the light-emitting area of LED chip, it is also possible to phosphor slurry is coated in and leaves appointing of LED chip On the surface of one exit direction.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (2), described Painting method can be spraying, electrostatic spraying, electrophoretic deposition, printing, spin coating, irrigates, impregnate or point one or more group of glue Close.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (2), described LED be organic LED, inorganic LED or a combination of both;Described LED is single LEDs chip, or same substrate is many LEDs chipset, or whole wafer.
The pc-LEDs lamp of a kind of medical phototherapy the most according to claim 1, it is characterised in that: in step (4), coating The LED silica gel of fluorescent material, epoxy resin, polymethyl methacrylate (PMMA), Merlon (PC) is had to carry out embedding;Assemble LED lamp structure be super flux LED lamp bar, shot-light, bulb lamp, Down lamp, fluorescent tube lamp, filament lamp, flat lamp.Different fitting structures, can For body local phototherapy, different body parts are irradiated;Can be used for indoor phototherapy illumination, treat the spirit such as depression Disease.
CN201610919566.3A 2016-10-21 2016-10-21 Medical phototherapy pc-LEDs lamp Pending CN106328795A (en)

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CN106848041A (en) * 2017-03-23 2017-06-13 电子科技大学 A kind of LED light source for aquaculture
CN109192844A (en) * 2018-08-30 2019-01-11 合肥工业大学智能制造技术研究院 One kind is repaired and regenerated LED light emitting device and application for retina cell
CN109307200A (en) * 2017-07-28 2019-02-05 松下知识产权经营株式会社 Light bath
CN109731234A (en) * 2019-01-18 2019-05-10 深圳市深紫源光学有限公司 A kind of Portable ultraviolet phototherapy instrument
CN110016334A (en) * 2019-04-28 2019-07-16 电子科技大学 The enhanced quantum dot fluorescence powder of forward scattering for pc-LEDs encapsulation
CN110531554A (en) * 2019-08-29 2019-12-03 合肥工业大学智能制造技术研究院 Promote display light source module group, display screen and the application of retina cell and optic element growth and reparation
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CN106848041A (en) * 2017-03-23 2017-06-13 电子科技大学 A kind of LED light source for aquaculture
CN109307200A (en) * 2017-07-28 2019-02-05 松下知识产权经营株式会社 Light bath
CN109192844A (en) * 2018-08-30 2019-01-11 合肥工业大学智能制造技术研究院 One kind is repaired and regenerated LED light emitting device and application for retina cell
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CN110016334A (en) * 2019-04-28 2019-07-16 电子科技大学 The enhanced quantum dot fluorescence powder of forward scattering for pc-LEDs encapsulation
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CN112397630A (en) * 2019-08-13 2021-02-23 光宝光电(常州)有限公司 Light emitting device
US11322663B2 (en) 2019-08-13 2022-05-03 Lite-On Opto Technology (Changzhou) Co., Ltd. Lighting device
CN110531554A (en) * 2019-08-29 2019-12-03 合肥工业大学智能制造技术研究院 Promote display light source module group, display screen and the application of retina cell and optic element growth and reparation
WO2021035783A1 (en) * 2019-08-29 2021-03-04 合肥工业大学智能制造技术研究院 Display light source module for promoting growth and repair of retinal cells and visual neurons, display screen, and application
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Application publication date: 20170111