CN106328790A - Production method of vertical LED packaged part and vertical LED packaged part - Google Patents
Production method of vertical LED packaged part and vertical LED packaged part Download PDFInfo
- Publication number
- CN106328790A CN106328790A CN201610970732.2A CN201610970732A CN106328790A CN 106328790 A CN106328790 A CN 106328790A CN 201610970732 A CN201610970732 A CN 201610970732A CN 106328790 A CN106328790 A CN 106328790A
- Authority
- CN
- China
- Prior art keywords
- vertical led
- production method
- crystal grain
- packaging part
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000004806 packaging method and process Methods 0.000 claims abstract description 52
- 239000013078 crystal Substances 0.000 claims abstract description 35
- 239000002390 adhesive tape Substances 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 7
- 229910052594 sapphire Inorganic materials 0.000 abstract description 3
- 239000010980 sapphire Substances 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
The invention provides a production method of a vertical LED packaged part and the vertical LED packaged part. The vertical LED packaged part comprises vertical LED crystal particles with upper electrodes and lower electrodes and a packaging body used for wrapping the vertical LED crystal particles. The upper electrodes and the lower electrodes are exposed outwards from the packaging body. Because the electrodes are arranged on the upper and lower sides of the vertical LED packaged part, a sapphire substrate and a basal plate are omitted, the problems of current crowding and poor cooling are solved, meanwhile money and the basal plate are saved, and cost can be lowered; according to the production method of the vertical LED packaged part, the technology is simple, the vertical LED packaged part is suitable for production on a large scale, and meanwhile cost is low.
Description
Technical field
The present invention relates to production method and the vertical LED packaging part of a kind of vertical LED packaging part.
Background technology
Along with the purposes of LED is more and more extensive, in productive life, the cost requirement to LED is more and more lower, how to reduce LED
Production cost be the task of top priority of producer.Existing LED packaged type still uses general diode mode to be packaged, such
Encapsulation needs to use gold thread welding procedure, on the one hand relatively costly on material, and on the other hand processing cost is the highest.
In view of this, it is necessary to production method and vertical LED packaging part to existing vertical LED packaging part are changed
Enter, to solve the problems referred to above.
Summary of the invention
It is an object of the invention to provide production method and the vertical LED packaging part of a kind of vertical LED packaging part, to solve
The problem that existing LED production cost is too high.
For achieving the above object, the invention provides the production method of a kind of vertical LED packaging part, comprise the steps:
S1: some vertical LED crystal grain with upper electrode and bottom electrode is provided；
Some described vertical LED crystal grain are arranged on described first carrier by S2: provide the first carrier, some described vertically
LED grain is spaced, and the bottom electrode of some vertical LED crystal grain contacts with described first carrier；
S3: utilize packaging body to be packaged some described vertical LED crystal grain forming assembly；
S4: described assembly is taken off from described first carrier；
S5: cut described assembly and form some vertical LED packaging parts.
As a further improvement on the present invention, between S2 and S3, also include providing Second support, and carry described second
Body is installed to the step with the upper electrode contact of some described vertical LED crystal grain.
As a further improvement on the present invention, described S4 also includes from described Second support, take off described assembly
Step.
As a further improvement on the present invention, described first carrier and/or Second support has stickum, with by institute
State vertical LED crystal grain to be fixed on described first carrier and/or Second support.
As a further improvement on the present invention, described first carrier and/or Second support are adhesive tape.
As a further improvement on the present invention, there is the vertical LED crystal grain of upper electrode and bottom electrode by upper and lower both sides described in
The Silicon Wafer cutting being provided with electrode is formed.
As a further improvement on the present invention, described electrode is formed by etching or print.
As a further improvement on the present invention, described packaging body is fluorescent glue.
The present invention also provides for a kind of vertical LED packaging part obtained by the production method of above-mentioned vertical LED packaging part, described
Vertical LED packaging part includes the vertical LED crystal grain with upper electrode and bottom electrode and in order to be coated with the envelope of described vertical LED crystal grain
Dress body, described upper electrode and described bottom electrode outwards expose from described packaging body.
The invention has the beneficial effects as follows: the vertical LED packaging part of present patent application is upper and lower both sides because electrode is arranged on, and save
Sapphire Substrate and substrate, solve current crowding and the problem of radiating effect difference.Save gold thread and substrate simultaneously, can reduce into
This, the production method of the vertical LED packaging part of the present invention, technique is simple, is suitable for a large amount of production, and cost is relatively low simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation of vertical LED packaging part of the present invention；
Fig. 2 is that some vertical LED packaging parts are arranged on the schematic diagram on the first carrier；
Fig. 3 is the schematic diagram being arranged on by Second support on some vertical LED packaging parts；
Fig. 4 is the schematic diagram utilizing packaging body to be packaged some described vertical LED crystal grain.
Detailed description of the invention
In order to make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the accompanying drawings with specific embodiment pair
The present invention is described in detail.
As shown in Figures 1 to 4, the vertical LED packaging part 100 of the present invention includes having the vertical of upper electrode 1 and bottom electrode 3
LED grain 2 and in order to be coated with the packaging body 4 of described vertical LED crystal grain 2, described upper electrode 1 and described bottom electrode 3 are from described envelope
Dress body 4 outwards exposes.
The N pole of described upper electrode 1 and described vertical LED crystal grain 2 is electrically connected with, and described bottom electrode 3 and described vertical LED are brilliant
The P pole of grain 2 is electrically connected with.
The vertical LED packaging part 100 of present patent application is upper and lower both sides because electrode is arranged on, and save Sapphire Substrate and base
Plate, solves current crowding and the problem of radiating effect difference.Save gold thread and substrate simultaneously, cost can be reduced.
The present invention also provides for the production method of above-mentioned vertical LED packaging part 100, the production of described vertical LED packaging part 100
Method comprises the steps:
S1: some vertical LED crystal grain 2 with upper electrode 1 and bottom electrode 3 is provided.
The Silicon Wafer that the described vertical LED crystal grain 2 with upper electrode 1 and bottom electrode 3 is provided with electrode by upper and lower both sides is cut
Cut formation.Described electrode is formed, certainly by etching or print, it is possible to realized by pressure metal electrode or other modes, this
Bright it is not restricted.
Some described vertical LED crystal grain 2 are arranged on described first carrier 5, Ruo Gansuo by S2: provide the first carrier 5
State vertical LED crystal grain 2 to be spaced, and the bottom electrode 3 of some vertical LED crystal grain 2 contacts with described first carrier 5.
The present embodiment also include provide Second support 6, and described Second support 6 is installed to some described vertical LEDs
The step that the upper electrode 1 of crystal grain 2 contacts.
On described first carrier 5 and/or Second support 6, there is stickum, to be fixed on by described vertical LED crystal grain 2
On described first carrier 5 and/or Second support 6, described first carrier 5 and/or Second support 6 are adhesive tape.
In the present embodiment, the adhesive tape as the first carrier 5 is tiled, by some vertical LED crystal grain 2 array arrangements first
On carrier 5, and bottom electrode 3 is fixed on described first carrier 5, then the adhesive tape as Second support 6 is covered some
Fixing on described vertical LED crystal grain 2 and with described upper electrode 1, described first carrier 5 and Second support 6 play fixing and protect
Protect the first electrode and the purpose of the second electrode.
S3: utilize packaging body 4 to be packaged some described vertical LED crystal grain 2 forming assembly.
In the present embodiment, fluorescent glue is moulded between described first carrier 5 and Second support 6, after freezing off, i.e. forms envelope
Dress body 4.
S4: described assembly is taken off from described first carrier 5.
The present embodiment also includes the step taken off from described Second support 6 by described assembly.Because of the first carrier 5 He
Second support 6 contacts with bottom electrode 3 and upper electrode 1 respectively, therefore notes between the first carrier 5 and Second support 6 in S3 step
Electrode 1 and bottom electrode 3 will not be touched when moulding.After i.e. taking off described first carrier 5 and Second support 6, described upper electrode 1 He
Described bottom electrode 3 outwards exposes from described packaging body 4.
S5: cut described assembly and form some vertical LED packaging parts 100.
In the present embodiment, each described vertical LED packaging part 100 only includes electrode on a vertical LED crystal grain 2 and a group
1 and bottom electrode 3.Certainly, each vertical LED encapsulating structure may also comprise multiple vertical LED crystal grain 2 and many groups be correspondingly arranged
Upper electrode 1 and bottom electrode 3.The vertical LED packaging part 100 that cutting obtains is finished product, can be directly connected to external circuit and use.
The vertical LED packaging part 100 of the present invention, solves current crowding and the problem of radiating effect difference, saves gold simultaneously
Line and substrate, can reduce cost；The production method of the vertical LED packaging part 100 of the present invention, technique is simple, is suitable for a large amount of raw
Producing, cost is relatively low simultaneously.
Above example is only in order to illustrate technical scheme and unrestricted, although with reference to preferred embodiment to this
Bright it is described in detail, it will be understood by those within the art that, technical scheme can be modified
Or equivalent, without deviating from the spirit and scope of technical solution of the present invention.
Claims (9)
1. the production method of a vertical LED packaging part, it is characterised in that comprise the steps:
S1: some vertical LED crystal grain with upper electrode and bottom electrode is provided；
Some described vertical LED crystal grain are arranged on described first carrier by S2: provide the first carrier, some described vertically
LED grain is spaced, and the bottom electrode of some vertical LED crystal grain contacts with described first carrier；
S3: utilize packaging body to be packaged some described vertical LED crystal grain forming assembly；
S4: described assembly is taken off from described first carrier；
S5: cut described assembly and form some vertical LED packaging parts.
The production method of vertical LED packaging part the most according to claim 1, it is characterised in that: also wrap between S2 and S3
Offer Second support is provided, and described Second support is installed to the step with the upper electrode contact of some described vertical LED crystal grain.
The production method of vertical LED packaging part the most according to claim 2, it is characterised in that: described S4 also includes by
The step that described assembly takes off from described Second support.
The production method of vertical LED packaging part the most according to claim 2, it is characterised in that: described first carrier and/or
There is stickum, to be fixed on described first carrier and/or Second support by described vertical LED crystal grain on Second support.
The production method of vertical LED packaging part the most according to claim 4, it is characterised in that: described first carrier and/or
Second support is adhesive tape.
The production method of vertical LED packaging part the most according to claim 1, it is characterised in that have described in: upper electrode and
The Silicon Wafer cutting that the vertical LED crystal grain of bottom electrode is provided with electrode by upper and lower both sides is formed.
The production method of vertical LED packaging part the most according to claim 6, it is characterised in that: described electrode by etching or
Printing is formed.
The production method of vertical LED packaging part the most according to claim 1, it is characterised in that: described packaging body is fluorescence
Glue.
9. the vertical LED that the production method of the vertical LED packaging part utilized as described in claim 1-8 any one obtains
Packaging part, it is characterised in that: vertical LED crystal grain that described vertical LED packaging part includes having upper electrode and bottom electrode and in order to
Being coated with the packaging body of described vertical LED crystal grain, described upper electrode and described bottom electrode outwards expose from described packaging body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610970732.2A CN106328790A (en) | 2016-11-04 | 2016-11-04 | Production method of vertical LED packaged part and vertical LED packaged part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610970732.2A CN106328790A (en) | 2016-11-04 | 2016-11-04 | Production method of vertical LED packaged part and vertical LED packaged part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106328790A true CN106328790A (en) | 2017-01-11 |
Family
ID=57816659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610970732.2A Pending CN106328790A (en) | 2016-11-04 | 2016-11-04 | Production method of vertical LED packaged part and vertical LED packaged part |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106328790A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102104012A (en) * | 2009-12-21 | 2011-06-22 | 鸿富锦精密工业（深圳）有限公司 | Manufacturing method of light-emitting diode |
| US20110198626A1 (en) * | 2005-02-23 | 2011-08-18 | Cree, Inc. | Substrate removal process for high light extraction leds |
| US20140159096A1 (en) * | 2011-01-13 | 2014-06-12 | Tsmc Solid State Lighting Ltd. | Micro-Interconnects for Light-Emitting Diodes |
| CN104851961A (en) * | 2015-03-24 | 2015-08-19 | 湘能华磊光电股份有限公司 | Chip scale packaging method and structure for light-emitting device |
-
2016
- 2016-11-04 CN CN201610970732.2A patent/CN106328790A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110198626A1 (en) * | 2005-02-23 | 2011-08-18 | Cree, Inc. | Substrate removal process for high light extraction leds |
| CN102104012A (en) * | 2009-12-21 | 2011-06-22 | 鸿富锦精密工业（深圳）有限公司 | Manufacturing method of light-emitting diode |
| US20140159096A1 (en) * | 2011-01-13 | 2014-06-12 | Tsmc Solid State Lighting Ltd. | Micro-Interconnects for Light-Emitting Diodes |
| CN104851961A (en) * | 2015-03-24 | 2015-08-19 | 湘能华磊光电股份有限公司 | Chip scale packaging method and structure for light-emitting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200705519A (en) | Semiconductor package without chip carrier and fabrication method thereof | |
| US8089166B2 (en) | Integrated circuit package with top pad | |
| CN102820384B (en) | The manufacture method of package structure for LED | |
| US9041019B2 (en) | Method of and device for manufacturing LED assembly using liquid molding technologies | |
| CN101442040B (en) | Encapsulation structure for LED and method of manufacturing the same | |
| CN102255034A (en) | Light emitting diode (LED) packaging structure | |
| CN102446868A (en) | Novel dual-interface smart card module and implementation method thereof | |
| CN106328790A (en) | Production method of vertical LED packaged part and vertical LED packaged part | |
| CN204216033U (en) | Lead frame, semiconductor package body | |
| CN104465596A (en) | Lead frame, semiconductor packaging body and manufacturing method thereof | |
| CN203503689U (en) | Flip-chip-type LED chip | |
| CN103000794A (en) | LED package structure | |
| CN203641955U (en) | LED lamp structure | |
| CN203617344U (en) | Surface mount type LED lead frame | |
| WO2008138182A1 (en) | Chip type light-emitting diode | |
| CN113380778A (en) | Lamp-drive integrated LED and manufacturing method thereof | |
| CN101494260B (en) | LED element | |
| CN103972194B (en) | A kind of encapsulating structure | |
| CN103700757A (en) | Surface-mounted LED (light-emitting diode) lead frame and manufacturing method thereof | |
| CN204179103U (en) | Light-emitting diode flat bracket, carrier unit and LED device | |
| CN103904194A (en) | Method for manufacturing light emitting diodes | |
| CN212695150U (en) | LED packaging product | |
| KR101956128B1 (en) | Tape type optical component package and manufacturing method thereof | |
| CN202796950U (en) | Semiconductor light-emitting device | |
| TW201306314A (en) | LED chip manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170111 |