CN106328610B - 一种多模式集成电路封装装置 - Google Patents
一种多模式集成电路封装装置 Download PDFInfo
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- CN106328610B CN106328610B CN201610865235.6A CN201610865235A CN106328610B CN 106328610 B CN106328610 B CN 106328610B CN 201610865235 A CN201610865235 A CN 201610865235A CN 106328610 B CN106328610 B CN 106328610B
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- packaging system
- integrated circuit
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- fixed
- lid
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 101
- 238000005538 encapsulation Methods 0.000 claims abstract description 16
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 239000007769 metal material Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000012423 maintenance Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
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CN201610865235.6A CN106328610B (zh) | 2016-09-25 | 2016-09-25 | 一种多模式集成电路封装装置 |
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CN201610865235.6A CN106328610B (zh) | 2016-09-25 | 2016-09-25 | 一种多模式集成电路封装装置 |
Publications (2)
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CN106328610A CN106328610A (zh) | 2017-01-11 |
CN106328610B true CN106328610B (zh) | 2018-12-07 |
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CN201610865235.6A Active CN106328610B (zh) | 2016-09-25 | 2016-09-25 | 一种多模式集成电路封装装置 |
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CN (1) | CN106328610B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108198930B (zh) * | 2017-12-29 | 2020-05-19 | 深圳市眼福光亮照明科技有限公司 | 一种易于安装固定的深紫外led封装结构 |
CN110072365A (zh) * | 2019-05-21 | 2019-07-30 | 三七知明(北京)科技有限公司 | 一种汽车集成电路封装装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5398160A (en) * | 1992-10-20 | 1995-03-14 | Fujitsu General Limited | Compact power module with a heat spreader |
CN104201158A (zh) * | 2014-08-28 | 2014-12-10 | 中国电子科技集团公司第二十九研究所 | 一种硅基微通道散热器集成冷却装置 |
US9076892B2 (en) * | 2011-05-13 | 2015-07-07 | Sharp Kabushiki Kaisha | Method of producing semiconductor module and semiconductor module |
CN105324836A (zh) * | 2013-06-20 | 2016-02-10 | 日东电工株式会社 | 电子器件的密封方法、电子器件封装件的制造方法及密封片 |
CN105914191A (zh) * | 2016-06-20 | 2016-08-31 | 东莞市联洲知识产权运营管理有限公司 | 一种水冷散热的集成电路封装 |
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2016
- 2016-09-25 CN CN201610865235.6A patent/CN106328610B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5398160A (en) * | 1992-10-20 | 1995-03-14 | Fujitsu General Limited | Compact power module with a heat spreader |
US9076892B2 (en) * | 2011-05-13 | 2015-07-07 | Sharp Kabushiki Kaisha | Method of producing semiconductor module and semiconductor module |
CN105324836A (zh) * | 2013-06-20 | 2016-02-10 | 日东电工株式会社 | 电子器件的密封方法、电子器件封装件的制造方法及密封片 |
CN104201158A (zh) * | 2014-08-28 | 2014-12-10 | 中国电子科技集团公司第二十九研究所 | 一种硅基微通道散热器集成冷却装置 |
CN105914191A (zh) * | 2016-06-20 | 2016-08-31 | 东莞市联洲知识产权运营管理有限公司 | 一种水冷散热的集成电路封装 |
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CN106328610A (zh) | 2017-01-11 |
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Effective date of registration: 20181025 Address after: 312030 coastal industrial zone of Keqiao District, Shaoxing, Zhejiang Applicant after: SHAOXING KEQIAO DONGJIN TEXTILE CO.,LTD. Address before: 523000 productivity building 406, high tech Industrial Development Zone, Songshan Lake, Dongguan, Guangdong Applicant before: Dongguan Lianzhou Intellectual Property Operation Management Co.,Ltd. |
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Address after: 312030 No. 4636 Xingbin Road, Ma'an Town, Keqiao District, Shaoxing City, Zhejiang Province Patentee after: ZHEJIANG DONGJIN NEW MATERIAL Co.,Ltd. Address before: 312030 Binhai Industrial Area, Keqiao District, Zhejiang, Shaoxing Patentee before: SHAOXING KEQIAO DONGJIN TEXTILE CO.,LTD. |
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Effective date of registration: 20191129 Address after: 233010 No.2, third floor, No.319, zhanggongshan Road, zhanggongshan street, Yuhui District, Bengbu City, Anhui Province Patentee after: Bengbu aochuang Intellectual Property Operation Co.,Ltd. Address before: 312030 No. 4636 Xingbin Road, Ma'an Town, Keqiao District, Shaoxing City, Zhejiang Province Patentee before: ZHEJIANG DONGJIN NEW MATERIAL Co.,Ltd. |
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Effective date of registration: 20201113 Address after: No.17, District 8, Huashan Gangcheng, Fengxian County, Xuzhou City, Jiangsu Province Patentee after: Xuzhou zhifanglian Electronic Technology Co.,Ltd. Address before: 233010 No.2, third floor, No.319, zhanggongshan Road, zhanggongshan street, Yuhui District, Bengbu City, Anhui Province Patentee before: Bengbu aochuang Intellectual Property Operation Co.,Ltd. |
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Application publication date: 20170111 Assignee: XUZHOU RONGLIDA ELECTRONIC TECHNOLOGY CO.,LTD. Assignor: Xuzhou zhifanglian Electronic Technology Co.,Ltd. Contract record no.: X2021980016529 Denomination of invention: A multi-mode integrated circuit packaging device Granted publication date: 20181207 License type: Common License Record date: 20211224 |