CN106323916A - Wafer scanning detection location method - Google Patents
Wafer scanning detection location method Download PDFInfo
- Publication number
- CN106323916A CN106323916A CN201610686199.7A CN201610686199A CN106323916A CN 106323916 A CN106323916 A CN 106323916A CN 201610686199 A CN201610686199 A CN 201610686199A CN 106323916 A CN106323916 A CN 106323916A
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- Prior art keywords
- wafer
- signal
- scattered light
- location
- scanning detection
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/49—Scattering, i.e. diffuse reflection within a body or fluid
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
Abstract
The invention belongs to the field of optical technology and discloses a wafer scanning detection location method, wherein a wafer is fixed on a moving platform, and the moving platform drives the wafer to move, a location part is at a working state while the moving platform starts to move, a sampling part starts to acquire a scattered light signal after the moving platform moves to a stable state, the sampling part transmits a TTL signal to a signal acquisition port connected with the location part while the scattered light signal starts to be acquired, and the location part locates information according to preset frequency after the signal acquisition port receives the TTL signal. The wafer scanning detection location method solves the problem in the prior art that the sampling part and the location part cause a location error because of built-in time difference. The synchronicity of the sampling part and the location part is implemented so as to guarantee the accurate location for scanning detection of a wafer.
Description
Technical field
The present invention relates to optical technical field, particularly relate to a kind of wafer-scanning detection and location method.
Background technology
Scattering behavior based on wafer defect realizes scan-type detection: tuftlet hot spot is incident to certain region of wafer, when
During crystal column surface not existing defects, incident illumination will all reflect away from opposite direction with identical angle；When irradiation area exists
During defect, portion of incident light translates into scattered light all directions injection above wafer, and flaw size affects scattered light intensity
Degree, judges flaw size with this.
In prior art, sample unit is directed at by internal time with the sampling initial time of positioning element, the two
The internal time of parts inevitably also exists error, for the detecting instrument of high-throughput, and data acquisition intervals only tens
Nanosecond, less than the mean timing error between two parts, thus cause data dislocation location.
Summary of the invention
The embodiment of the present application, by providing a kind of wafer-scanning detection and location method, solves sample unit in prior art
The problem causing position error owing to built-in time is poor with positioning element.
The embodiment of the present application provides a kind of wafer-scanning detection and location method, and described wafer is fixing on a mobile platform, institute
State mobile platform and drive described wafer movement；While described mobile platform setting in motion, positioning element is in running order；Institute
Stating after mobile platform moves to steady statue, sample unit starts collection of scattered light signal；Described scattered light signal starts to gather
While, described sample unit sends a TTL signal to the signals collecting port being connected with described positioning element；Described signal
After collection port receives described TTL signal, described positioning element is according to predetermined frequency collection location information.
Preferably, the frequency of described collection of scattered light signal is identical with the frequency of described collection framing signal.
Preferably, described positioning element is the grating scale being built in mobile platform.
Preferably, described sample unit includes photodetector, analog-to-digital conversion card, data collecting card；Described photodetection
Device converts optical signals into analog electrical signal, and described analog electrical signal is converted into digital electric signal by described analog-to-digital conversion card, institute
State data collecting card and gather Serial No..
Preferably, described grating scale is three, including horizontal direction grating scale and Z-direction grating scale, is respectively used to gather
Horizontal position coordinate and Z-direction position coordinates.
Preferably, described horizontal direction is X, Y-direction.
Preferably, described horizontal direction is R, θ direction.
Preferably, described wafer-scanning detection and location method also includes: location information classification deposited based on scattered light signal
Storage, particularly as follows:
Spatial cache, described spatial cache caching location information are set；
Meanwhile, described scattered light signal data are processed by signal processing unit, obtain the maximum strong of scattered light signal
Degree；Maximum intensity according to described scattered light signal determines the first intensity level；If the scattered light signal collected is more than described the
One intensity level, then be judged as there may be pollution；
Find out the scattered light signal that there may be pollution according to above-mentioned determination methods, then obtain and there may be dissipating of pollution
Penetrate the location information that optical signal is corresponding, and by this location information copy to permanent storage space.
Preferably, described location information is horizontal position coordinate.
Preferably, described location information is horizontal position coordinate and Z-direction position coordinates.
The one or more technical schemes provided in the embodiment of the present application, at least have the following technical effect that or advantage:
In the embodiment of the present application, utilize TTL signal directly to communicate, make sample unit same with the initial time of positioning element
Step, it is achieved that use parts synchronization with between positioning element.
Further, sample unit is identical with the sample frequency of positioning element, it is achieved the sampling interval synchronizes, and quickly sets up not
With the corresponding relation between parts, furthermore achieved that employing parts are synchronization with positioning element, thus ensure that wafer-scanning detects
It is accurately positioned.
Further, in the embodiment of the present application, the three of multiple grating scale real time record detecting location the most in the same time is used
Dimension coordinate, prevents mobile platform movement locus error from producing position error.
Further, in the embodiment of the present application, set up independent memory space and carry out positioning information cache, based on scattering letter
Number realize location information classification, it is to avoid huge position data stream store, it is ensured that on-line checking realize.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the present embodiment, required use in embodiment being described below
Accompanying drawing is briefly described, it should be apparent that, the accompanying drawing in describing below is one embodiment of the present of invention, for this area
From the point of view of those of ordinary skill, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
The schematic diagram of a kind of wafer-scanning detection and location method that Fig. 1 provides for the embodiment of the present invention.
Detailed description of the invention
The embodiment of the present application, by providing a kind of wafer-scanning detection and location method, solves sample unit in prior art
The problem causing position error owing to built-in time is poor with positioning element.
The technical scheme of the embodiment of the present application is for solving above-mentioned technical problem, and general thought is as follows:
A kind of wafer-scanning detection and location method, described wafer is fixing on a mobile platform, and described mobile platform drives institute
State wafer movement；While described mobile platform setting in motion, positioning element is in running order；Described mobile platform moves to
After steady statue, sample unit starts collection of scattered light signal；While described scattered light signal starts to gather, described sampling unit
Part sends a TTL signal to the signals collecting port being connected with described positioning element；Described signals collecting port receives described
After TTL signal, described positioning element is according to predetermined frequency collection location information.
In order to be better understood from technique scheme, below in conjunction with Figure of description and specific embodiment to upper
State technical scheme to be described in detail.
Embodiment 1:
The embodiment of the present application provides a kind of wafer-scanning detection and location method, and described wafer is fixing on a mobile platform, institute
State mobile platform and drive described wafer movement.
While described mobile platform setting in motion, positioning element is in running order.
After described mobile platform moves to steady statue, sample unit starts collection of scattered light signal.
While described scattered light signal starts to gather, described sample unit is adopted to the signal being connected with described positioning element
Collection port sends a TTL signal.
After described signals collecting port receives described TTL signal, described positioning element is according to predetermined frequency collection location
Information.
Wherein, described positioning element is the grating scale being built in mobile platform.
Described sample unit includes photodetector, analog-to-digital conversion card, data collecting card；Light is believed by described photodetector
Number being converted into analog electrical signal, described analog electrical signal is converted into digital electric signal, described data acquisition by described analog-to-digital conversion card
Truck gathers Serial No..
The scattered light signal detected will be converted into continuous print through photodetector, analog-to-digital conversion card, data collecting card
Serial No., and signal sparse distribution is in finite series, the position of corresponding defect puts in order certainly in data ordered series of numbers with it
Fixed.
Know that motion track that mobile platform sets and data collecting card frequency acquisition just can obtain each letter in theory
Relativeness between number some position.
As it is shown in figure 1, send TTL signal by a side between described sample unit and described positioning element, the opposing party connects
The mode receiving TTL signal directly communicates.
Described TTL signal is sent by described sample unit, described positioning element receive.
Owing to using the mode of directly communication between described sample unit and described positioning element, it is not necessary to controlled by center
The process of system, communication delay is negligible, it is achieved that synchronized sampling.
Embodiment 2:
The embodiment of the present application provides a kind of wafer-scanning detection and location method, rises including positioning element and sample unit collection
The synchronization of time beginning, positioning element and the synchronization in sample unit sampling interval.
Positioning element and sample unit gather the synchronization of initial time: described wafer is fixing on a mobile platform, described shifting
Moving platform drives described wafer movement；While described mobile platform setting in motion, positioning element is in running order；Described shifting
After moving platform moves to steady statue, sample unit starts collection of scattered light signal；Described scattered light signal starts the same of collection
Time, described sample unit sends a TTL signal to the signals collecting port being connected with described positioning element；Described signals collecting
After port receives described TTL signal, described positioning element is according to predetermined frequency collection location information.
Wherein, described positioning element is the grating scale being built in mobile platform.
Described sample unit includes photodetector, analog-to-digital conversion card, data collecting card；Light is believed by described photodetector
Number being converted into analog electrical signal, described analog electrical signal is converted into digital electric signal, described data acquisition by described analog-to-digital conversion card
Truck gathers Serial No..
The scattered light signal detected will be converted into continuous print through photodetector, analog-to-digital conversion card, data collecting card
Serial No., and signal sparse distribution is in finite series, the position of corresponding defect puts in order certainly in data ordered series of numbers with it
Fixed.
Know that motion track that mobile platform sets and data collecting card frequency acquisition just can obtain each letter in theory
Relativeness between number some position.
Positioning element and the synchronization in sample unit sampling interval: described sample unit and the sample frequency of described positioning element
Identical.The frequency of the most described collection of scattered light signal is identical with the frequency of described collection framing signal.
By the way of sample unit gathers with frequency with positioning element, set up both quickly corresponding relations.
Owing to the frequency of described collection of scattered light signal is identical with the frequency of described collection framing signal, it is believed that sequence
There is relation one to one in identical data, can be obtained by associated disadvantages position according to signal data sequence.
As it is shown in figure 1, send TTL signal by a side between described sample unit and described positioning element, the opposing party connects
The mode receiving TTL signal directly communicates.
Described TTL signal is sent by described sample unit, described positioning element receive.
Owing to using the mode of directly communication between described sample unit and described positioning element, it is not necessary to controlled by center
The process of system, communication delay is negligible, it is achieved that synchronized sampling.And the sample frequency of sample unit and positioning element
Identical, it is achieved the sampling interval synchronizes, quickly set up the corresponding relation between different parts, furthermore achieved that employing parts and location
The synchronization of parts, thus ensure that wafer-scanning detection is accurately positioned.
Embodiment 3:
The embodiment of the present application provides a kind of wafer-scanning detection and location method, can be divided into synchronized sampling, track location,
Will location information classification three aspects of storage based on scattered light signal.
1. synchronized sampling:
Synchronized sampling includes that positioning element and sample unit gather the synchronization of initial time, positioning element and sample unit and adopt
The synchronization at sample interval.
Positioning element and sample unit gather the synchronization of initial time: described wafer is fixing on a mobile platform, described shifting
Moving platform drives described wafer movement；While described mobile platform setting in motion, positioning element is in running order；Described shifting
After moving platform moves to steady statue, sample unit starts collection of scattered light signal；Described scattered light signal starts the same of collection
Time, described sample unit sends a TTL signal to the signals collecting port being connected with described positioning element；Described signals collecting
After port receives described TTL signal, described positioning element is according to predetermined frequency collection location information.
Wherein, described positioning element is the grating scale being built in mobile platform.
Described sample unit includes photodetector, analog-to-digital conversion card, data collecting card；Light is believed by described photodetector
Number being converted into analog electrical signal, described analog electrical signal is converted into digital electric signal, described data acquisition by described analog-to-digital conversion card
Truck gathers Serial No..
The scattered light signal detected will be converted into continuous print through photodetector, analog-to-digital conversion card, data collecting card
Serial No., and signal sparse distribution is in finite series, the position of corresponding defect puts in order certainly in data ordered series of numbers with it
Fixed.
Know that motion track that mobile platform sets and data collecting card frequency acquisition just can obtain each letter in theory
Relativeness between number some position.
Positioning element and the synchronization in sample unit sampling interval: described sample unit and the sample frequency of described positioning element
Identical.The frequency of the most described collection of scattered light signal is identical with the frequency of described collection framing signal.
By the way of sample unit gathers with frequency with positioning element, set up both quickly corresponding relations.
Owing to the frequency of described collection of scattered light signal is identical with the frequency of described collection framing signal, it is believed that sequence
There is relation one to one in identical data, can be obtained by associated disadvantages position according to signal data sequence.
As it is shown in figure 1, send TTL signal by a side between described sample unit and described positioning element, the opposing party connects
The mode receiving TTL signal directly communicates.
Described TTL signal is sent by described sample unit, described positioning element receive.
2. track location:
Positioning element is the grating scale being built in mobile platform.In order to prevent electric moving moving platform movement locus error band
The position error come, track is located through three grating scales and measures realization in real time, and described three grating scales are arranged on mobile flat
Diverse location near platform, including horizontal direction grating scale and Z-direction grating scale, is respectively used to gather horizontal position coordinate and Z side
To position coordinates.
Described horizontal direction is X, Y-direction or for R, θ direction.
3. based on scattered light signal, location information classification is stored:
In order to improve wafer contamination detection speed, during mobile platform is in high-speed motion in detection, corresponds and need to adopt
With bigger signal sampling frequency and googol according to amount.Owing to polluting the sparse crystal column surface that is distributed in, major part data are equal
The corresponding situation that there is not pollution, the system noise of these data records does not contains any information, it is not necessary to preserves, therefore positions information
Needs carry out classification storage.
Based on scattered light signal, location information classification is stored, particularly as follows:
Spatial cache, described spatial cache caching location information are set.
Meanwhile, described scattered light signal data are processed by signal processing unit, obtain the maximum strong of scattered light signal
Degree；Maximum intensity according to described scattered light signal determines the first intensity level；If the scattered light signal collected is more than described the
One intensity level, then be judged as there may be pollution.
Find out the scattered light signal that there may be pollution according to above-mentioned determination methods, then obtain and there may be dissipating of pollution
Penetrate the location information that optical signal is corresponding, and by this location information copy to permanent storage space.
Described location information is horizontal position coordinate and Z-direction position coordinates.
Owing to crystal column surface is the most smooth, and wafer placement horizontality is required higher, measurement monitors Z-direction displacement
Should be substantially zeroed.In this case, described location information is horizontal position coordinate.
The present embodiment utilizes TTL signal directly to communicate, and makes sample unit Tong Bu with the initial time of positioning element, it is achieved that
Use parts synchronization with between positioning element.And sample unit is identical with the sample frequency of positioning element, it is achieved the sampling interval is same
Step, quickly sets up the corresponding relation between different parts, furthermore achieved that employing parts are synchronization with positioning element, thus ensures
Wafer-scanning detection is accurately positioned.Meanwhile, use the three-dimensional coordinate of multiple grating scale real time record detecting location the most in the same time, anti-
Only mobile platform movement locus error produces position error.Carry out positioning information cache additionally, set up independent memory space, based on
Scattered signal realizes location information classification, it is to avoid huge position data stream stores, it is ensured that on-line checking realizes.
A kind of wafer-scanning detection and location method that the embodiment of the present invention provides at least includes following technique effect:
1, in the embodiment of the present application, utilize TTL signal directly to communicate, make the initial time of sample unit and positioning element
Synchronize, it is achieved that use parts synchronization with between positioning element.
2, in the embodiment of the present application, sample unit is identical with the sample frequency of positioning element, it is achieved the sampling interval synchronizes,
Quickly set up the corresponding relation between different parts, furthermore achieved that employing parts are synchronization with positioning element, thus ensure crystalline substance
Circular scan detection is accurately positioned.
3, in the embodiment of the present application, the three-dimensional coordinate of multiple grating scale real time record detecting location the most in the same time is used,
Prevent mobile platform movement locus error from producing position error.
4, in the embodiment of the present application, set up independent memory space and carry out positioning information cache, realize based on scattered signal
Location information classification, it is to avoid huge position data stream stores, it is ensured that on-line checking realizes.
It should be noted last that, above detailed description of the invention only in order to technical scheme to be described and unrestricted,
Although the present invention being described in detail with reference to example, it will be understood by those within the art that, can be to the present invention
Technical scheme modify or equivalent, without deviating from the spirit and scope of technical solution of the present invention, it all should be contained
In the middle of scope of the presently claimed invention.
Claims (10)
1. a wafer-scanning detection and location method, it is characterised in that described wafer is fixing on a mobile platform, and described movement is put down
Platform drives described wafer movement；
While described mobile platform setting in motion, positioning element is in running order；
After described mobile platform moves to steady statue, sample unit starts collection of scattered light signal；
While described scattered light signal starts to gather, described sample unit is to the signals collecting end being connected with described positioning element
Mouth sends a TTL signal；
After described signals collecting port receives described TTL signal, described positioning element is according to predetermined frequency collection location information.
Wafer-scanning detection and location method the most according to claim 1, it is characterised in that described collection of scattered light signal
Frequency is identical with the frequency of described collection framing signal.
Wafer-scanning detection and location method the most according to claim 1, it is characterised in that described positioning element is for being built in
Grating scale in mobile platform.
Wafer-scanning detection and location method the most according to claim 1, it is characterised in that described sample unit includes photoelectricity
Detector, analog-to-digital conversion card, data collecting card；
Described photodetector converts optical signals into analog electrical signal, and described analog electrical signal is changed by described analog-to-digital conversion card
Becoming digital electric signal, described data collecting card gathers Serial No..
Wafer-scanning detection and location method the most according to claim 3, it is characterised in that described grating scale is three, bag
Include horizontal direction grating scale and Z-direction grating scale, be respectively used to gather horizontal position coordinate and Z-direction position coordinates.
Wafer-scanning detection and location method the most according to claim 5, it is characterised in that described horizontal direction is X, Y side
To.
Wafer-scanning detection and location method the most according to claim 5, it is characterised in that described horizontal direction is R, θ side
To.
Wafer-scanning detection and location method the most according to claim 1, it is characterised in that described wafer-scanning detection and location
Method also includes: the information classification of described location stored based on described scattered light signal, particularly as follows:
Spatial cache, described spatial cache caching location information are set；
Meanwhile, described scattered light signal data are processed by signal processing unit, obtain the maximum intensity of scattered light signal；Root
The first intensity level is determined according to the maximum intensity of described scattered light signal；If the scattered light signal collected is more than described first intensity
Value, then be judged as there may be pollution；
Find out the scattered light signal that there may be pollution according to above-mentioned determination methods, then obtain the scattered light that there may be pollution
The location information that signal is corresponding, and by this location information copy to permanent storage space.
Wafer-scanning detection and location method the most according to claim 8, it is characterised in that described location information is horizontal position
Put coordinate.
Wafer-scanning detection and location method the most according to claim 8, it is characterised in that described location information is level
Position coordinates and Z-direction position coordinates.
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| CN201610686199.7A CN106323916A (en) | 2016-08-18 | 2016-08-18 | Wafer scanning detection location method |
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Cited By (1)
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| CN117314906A (en) * | 2023-11-28 | 2023-12-29 | 无锡九霄科技有限公司 | Wafer grain detection method based on array distribution information guidance |
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