CN106304667A - 一种轮廓蚀刻方法及装置 - Google Patents
一种轮廓蚀刻方法及装置 Download PDFInfo
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- CN106304667A CN106304667A CN201610835941.6A CN201610835941A CN106304667A CN 106304667 A CN106304667 A CN 106304667A CN 201610835941 A CN201610835941 A CN 201610835941A CN 106304667 A CN106304667 A CN 106304667A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
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- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
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Priority Applications (1)
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CN201610835941.6A CN106304667B (zh) | 2016-09-20 | 2016-09-20 | 一种轮廓蚀刻方法及装置 |
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CN201610835941.6A CN106304667B (zh) | 2016-09-20 | 2016-09-20 | 一种轮廓蚀刻方法及装置 |
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CN106304667A true CN106304667A (zh) | 2017-01-04 |
CN106304667B CN106304667B (zh) | 2018-11-13 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108012432A (zh) * | 2017-11-27 | 2018-05-08 | 深南电路股份有限公司 | 一种毫米波雷达pcb的制作方法 |
CN110430686A (zh) * | 2019-07-25 | 2019-11-08 | 沪士电子股份有限公司 | 一种采用蚀刻补偿的印制线路板生产方法 |
CN111211061A (zh) * | 2018-11-21 | 2020-05-29 | 台湾积体电路制造股份有限公司 | 形成半导体器件的方法 |
CN112040660A (zh) * | 2020-08-17 | 2020-12-04 | 鹤山市中富兴业电路有限公司 | 用于图形转移的线路板及图形转移工艺 |
CN112184742A (zh) * | 2020-09-29 | 2021-01-05 | 京东数字科技控股股份有限公司 | 图形共边检测方法、装置、设备及计算机可读介质 |
CN114862987A (zh) * | 2022-05-27 | 2022-08-05 | 苏州天准科技股份有限公司 | 一种提高数据链路可靠性的方法 |
US11495558B2 (en) | 2018-11-21 | 2022-11-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit features with obtuse angles and method of forming same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1624880A (zh) * | 2003-12-02 | 2005-06-08 | 索尼株式会社 | 蚀刻方法、制造半导体装置的方法以及半导体装置 |
CN102171530A (zh) * | 2008-10-02 | 2011-08-31 | 仲巴赫电子公司 | 用于确定形状参数的方法 |
CN104678694A (zh) * | 2013-11-26 | 2015-06-03 | 中芯国际集成电路制造(上海)有限公司 | 版图修正方法及设备 |
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2016
- 2016-09-20 CN CN201610835941.6A patent/CN106304667B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1624880A (zh) * | 2003-12-02 | 2005-06-08 | 索尼株式会社 | 蚀刻方法、制造半导体装置的方法以及半导体装置 |
CN102171530A (zh) * | 2008-10-02 | 2011-08-31 | 仲巴赫电子公司 | 用于确定形状参数的方法 |
CN104678694A (zh) * | 2013-11-26 | 2015-06-03 | 中芯国际集成电路制造(上海)有限公司 | 版图修正方法及设备 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108012432A (zh) * | 2017-11-27 | 2018-05-08 | 深南电路股份有限公司 | 一种毫米波雷达pcb的制作方法 |
CN111211061A (zh) * | 2018-11-21 | 2020-05-29 | 台湾积体电路制造股份有限公司 | 形成半导体器件的方法 |
CN111211061B (zh) * | 2018-11-21 | 2022-05-13 | 台湾积体电路制造股份有限公司 | 形成半导体器件的方法 |
US11495558B2 (en) | 2018-11-21 | 2022-11-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit features with obtuse angles and method of forming same |
CN110430686A (zh) * | 2019-07-25 | 2019-11-08 | 沪士电子股份有限公司 | 一种采用蚀刻补偿的印制线路板生产方法 |
CN112040660A (zh) * | 2020-08-17 | 2020-12-04 | 鹤山市中富兴业电路有限公司 | 用于图形转移的线路板及图形转移工艺 |
CN112040660B (zh) * | 2020-08-17 | 2021-11-02 | 鹤山市中富兴业电路有限公司 | 用于图形转移的线路板及图形转移工艺 |
CN112184742A (zh) * | 2020-09-29 | 2021-01-05 | 京东数字科技控股股份有限公司 | 图形共边检测方法、装置、设备及计算机可读介质 |
CN112184742B (zh) * | 2020-09-29 | 2024-04-05 | 京东科技控股股份有限公司 | 图形共边检测方法、装置、设备及计算机可读介质 |
CN114862987A (zh) * | 2022-05-27 | 2022-08-05 | 苏州天准科技股份有限公司 | 一种提高数据链路可靠性的方法 |
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CN106304667B (zh) | 2018-11-13 |
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Address after: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee after: Lingyunguang Technology Co.,Ltd. Address before: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee before: Beijing lingyunguang Technology Group Co.,Ltd. Address after: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee after: Beijing lingyunguang Technology Group Co.,Ltd. Address before: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee before: LUSTER LIGHTTECH GROUP Co.,Ltd. |
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Effective date of registration: 20230717 Address after: 1st Floor - 2nd Floor, Building 2, Xinqi Industrial Park, No. 789, Changning Avenue, High tech Zone, Hefei City, Anhui Province, 230000 Patentee after: Hefei Jiuchuan Intelligent Equipment Co.,Ltd. Address before: 100094 701, 7 floor, 7 building, 13 Cui Hunan Ring Road, Haidian District, Beijing. Patentee before: Lingyunguang Technology Co.,Ltd. |
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