CN106287294A - Light bar manufacturing system and the method utilizing this light bar manufacturing system making light bar - Google Patents
Light bar manufacturing system and the method utilizing this light bar manufacturing system making light bar Download PDFInfo
- Publication number
- CN106287294A CN106287294A CN201610720033.2A CN201610720033A CN106287294A CN 106287294 A CN106287294 A CN 106287294A CN 201610720033 A CN201610720033 A CN 201610720033A CN 106287294 A CN106287294 A CN 106287294A
- Authority
- CN
- China
- Prior art keywords
- light bar
- printed substrates
- components
- parts
- liquid metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to a kind of light bar manufacturing system and the method utilizing this light bar manufacturing system to make light bar, this system includes: design device, is used for generating virtual light bar pattern, and according to virtual light bar pattern, generates corresponding print command；Liquid metal printing device, including printed substrates and with the liquid metal printer of design device communication connection, liquid metal printer for according to print command, sprays in printed substrates or scribbles liquid metal, to form circuit trace；Components and parts apparatus for placing, for being placed on the position corresponding with placement location of printed substrates by components and parts；Packaging system, utilizes encapsulating material to be packaged for the entity light bar pattern forming the circuit trace in printed substrates and components and parts；Solidification equipment, for solidifying the encapsulating material on entity light bar pattern.The present invention can improve the degree of freedom that light bar makes, low cost, is suitable to the production of high-volume light bar.
Description
Technical field
The present invention relates to light bar manufacture technology field, especially relate to a kind of light bar manufacturing system and utilize this light bar to make
System makes the method for light bar.
Background technology
Along with the increase of people's income, the requirement to quality of life is more and more higher, and light bar can be used in decoration, illumination,
Increase infinite happiness and atmosphere can to various festival activities, have been obtained for huge market.Either advertising sector, dress
Decorations industry, building trade, commercial industry and gift industry, light bar all occupies advantage with the feature that its visual effect is splendid.
But, in the case of light bar demand is the most big, the current present situation on light bar market is but light bar shape list
One, the various problems such as function singleness, length limited, restricted width.Light bar is all to make of flexible PCB at present, this circuit
Plate nonrecurring cost is high, the most only special applications design and manufacture, is not properly suited for widely applying.And, flexible PCB
Technique arrowhead, being easily damaged, this is also one of reason that tradition light bar cost is high.
Summary of the invention
For disadvantages described above, the present invention provides a kind of light bar manufacturing system and utilizes this light bar manufacturing system to make light bar
Method, can improve the degree of freedom that light bar makes, low cost, is suitable to the production of high-volume light bar.
First aspect, the light bar manufacturing system that the present invention provides includes:
Design device, for drawing the setting operated and to components and parts placement location according to user to circuit trace
Operation, generates virtual light bar pattern, and according to described virtual light bar pattern, generates corresponding print command；
Liquid metal printing device, the liquid metal including printed substrates with the communication connection of described design device is beaten
Print machine, described liquid metal printer, for according to described print command, sprays or scribbles liquid gold in described printed substrates
Belong to, to form circuit trace；
Components and parts apparatus for placing, for according to described print command, components and parts are placed on described printed substrates with institute
State on the position that placement location is corresponding；
Packaging system, utilizes for the entity light bar pattern forming the circuit trace in described printed substrates and components and parts
Encapsulating material is packaged；
Solidification equipment, for solidifying the encapsulating material on described entity light bar pattern.
Optionally, described system also includes:
Shaping equipment, for being fixed to described printed substrates and limit the district of described packaging system spraying encapsulating material
Territory scope.
Optionally, described shaping equipment includes shaped as frame stereotyped structure and rectangle stereotyped structure, wherein:
Described shaped as frame stereotyped structure is for being fixed the edge of described printed substrates；
Described rectangle stereotyped structure is arranged on the center of described printed substrates；
Forming groove between described rectangle stereotyped structure and described rectangle stereotyped structure, described groove is used for limiting described envelope
The spray range of package material.
Optionally, described packaging system includes the containing cavity for housing described encapsulating material and connects with described containing cavity
Spray head.
Optionally, described system also includes:
Detection of connectivity device, is carried out even for the circuit trace being formed the liquid metal stating in printed substrates spraying
The general character detects.
Second aspect, what the present invention provided utilizes the method for this light bar manufacturing system making light bar to include:
Utilize described design device to make virtual light bar pattern, and generate corresponding print command, described light bar figure
Case includes the placement location of circuit trace and components and parts；
Utilize described liquid metal printer spray in described printed substrates or scribble liquid metal, walk forming circuit
Line；
Utilize described components and parts apparatus for placing that components and parts are placed on the corresponding with described placement location of described printed substrates
Position on；
Utilize the entity light bar pattern that the circuit trace in described printed substrates and components and parts are formed by described packaging system
Encapsulating material is utilized to be packaged；
Utilize described solidification equipment that the encapsulating material being sprayed on described entity light bar pattern is solidified.
Optionally, described light bar manufacturing system is the light bar manufacturing system described in claim 5；Utilizing described components and parts
Before components and parts are placed on the position corresponding with described placement location of described printed substrates by apparatus for placing, described method is also
Including:
The circuit trace being formed the liquid metal of spraying in described printed substrates carries out detection of connectivity, and described
In the case of circuit trace meets connectivity platform, it is allowed to perform to utilize described components and parts apparatus for placing that components and parts are placed on institute
State the operation on the position corresponding with described placement location of printed substrates.
Optionally, described light bar manufacturing system is the light bar manufacturing system described in Claims 2 or 3；Utilizing described envelope
The entity light bar pattern that circuit trace in described printed substrates and components and parts are formed by assembling device utilizes encapsulating material to seal
Before dress, described method also includes:
Described shaping equipment is utilized described printed substrates to be fixed and limited described packaging system spraying encapsulating material
Regional extent.
Optionally, described method also includes:
After the solidification is complete, described entity light bar pattern is separated with described printed substrates；
In the one side that entity light bar pattern after isolation contacts with described printed substrates, components and parts and power supply lead wire are set；
The circuit in the one side that described entity light bar pattern contacts by described packaging system with described printed substrates is utilized to walk
Line, components and parts and power supply lead wire utilize encapsulating material to be packaged；
Utilize described solidification equipment that described encapsulating material is solidified.
Optionally, described light bar manufacturing system is the light bar manufacturing system described in Claims 2 or 3, is utilizing described envelope
Circuit trace, components and parts and the power supply lead wire in one side that described entity light bar pattern is contacted by assembling device with described printed substrates
Before utilizing encapsulating material to be packaged, described method also includes:
Described shaping equipment is utilized the entity light bar pattern after separating to be fixed and limited the spraying of described packaging system
The regional extent of encapsulating material；Described entity light bar pattern contact with described printed substrates one facing to described shaping equipment.
The light bar manufacturing system that the present invention provides and the method utilizing this light bar manufacturing system to make light bar, the present invention provides
Light bar manufacturing system, use design device design light bar pattern, personalized customization can be carried out as required so that lamp
The degree of freedom that band makes increases substantially；User can draw any type of light bar, either simple light bar pattern voluntarily,
Or complicated light bar pattern, can quickly realize, improve make efficiency.And, use liquid metal printing device beating
Substrates printed upper print circuit cabling, uses encapsulating material to be packaged simultaneously, relative to using flexible PCB in prior art
Mode, have and be hardly damaged, do not limited by process and the advantage of low cost, be suitable to large batch of light bar and make.
Accompanying drawing explanation
In order to be illustrated more clearly that disclosure embodiment or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only this
Discloseder embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to
Other accompanying drawing is obtained according to these figures.
Fig. 1 shows the structural representation of light bar manufacturing system in one embodiment of the invention；
Fig. 2 shows the patterned schematic diagram of virtual lamp generated in one embodiment of the invention；
Fig. 3 shows that one embodiment of the invention Playsization connects the schematic diagram of interface；
Description of reference numerals:
1-liquid metal printer；2-printed substrates；3-shaping equipment；4-packaging system；5-detection of connectivity device；6-
Components and parts apparatus for placing；7-liquid metal；8-encapsulating material；9-components and parts；10-single-chip microcomputer；11-liquid metal pad；12-magnetic
Inhale terminal base；13-magnetic terminal.
Detailed description of the invention
Below in conjunction with the accompanying drawing in disclosure embodiment, the technical scheme in disclosure embodiment is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on
Embodiment in the disclosure, it is every other that those of ordinary skill in the art are obtained under not making creative work premise
Embodiment, broadly falls into the scope of disclosure protection.
First aspect, the present invention provides a kind of light bar manufacturing system, and as shown in Figure 1, 2, this system includes:
Design device, for drawing the setting operated and to components and parts placement location according to user to circuit trace
Operation, generates virtual light bar pattern, and according to described virtual light bar pattern, generates corresponding print command；
Liquid metal printing device, including printed substrates 2 and with described design device communication connection liquid metal
Printer 1, described liquid metal printer 1, for according to described print command, sprays in described printed substrates 2 or scribbles liquid
State metal 7, to form circuit trace；
Components and parts apparatus for placing 6, for according to described print command, components and parts 9 are placed on described printed substrates 2 with
On the position that described placement location is corresponding；
Packaging system 4, for the entity light bar pattern forming the circuit trace in described printed substrates 2 and components and parts 9
Encapsulating material 8 is utilized to be packaged；
Solidification equipment, for solidifying the encapsulating material 8 on described entity light bar pattern.
The light bar manufacturing system that the present invention provides, uses design device design light bar pattern, can enter as required
Row personalized customization so that the degree of freedom that light bar makes increases substantially；User can draw any type of light bar, nothing voluntarily
Opinion is simple light bar pattern, or the light bar pattern of complexity, can quickly realize, and improves make efficiency.And, use liquid
State metal printing device print circuit cabling in printed substrates 2, uses encapsulating material 8 to be packaged, relative to existing simultaneously
Technology uses the mode of flexible PCB, has and be hardly damaged, do not limited by process and the advantage of low cost, be suitable to
Large batch of light bar makes.
In the specific implementation, user can carry out the drafting of circuit trace on design device and put components and parts 9
Seated position operation is set etc., thus obtain virtual light bar pattern.Design device stores with good grounds user circuit is walked
The setting of line and components and parts 9 placement location automatically generates lamp patterned core graphic Processing Algorithm and corresponding source code, with
The communication of algorithms of liquid metal printer 1 and corresponding source code, can also store other functional algorithms and supporting certainly
Source code etc..
For example, as in figure 2 it is shown, user can input " lamp " word on design device, adjusting size and font,
Selecting light bar circuit types for circle two wires, select use to control components and parts, selecting connected mode is that connection in series-parallel combines, and clicks on generation
Circuit button, automatically generates virtual light bar pattern.
In the specific implementation, printed substrates 2 can be high molecular polymer, glass, pottery, timber, paper, solid metal
One or more in simple substance and alloy, organic-biological body etc., described high molecular polymer include polyethylene, polrvinyl chloride,
Polypropylene, polyimides, polystyrene, Merlon, polyether-ether-ketone, polymethyl methacrylate, poly terephthalic acid second two
Ester, epoxy resin or acrylonitrile-butadiene-styrene copolymer, polylactic acid, polyvinyl alcohol, polydimethylsiloxane, silica gel,
Rubber etc..
In the specific implementation, liquid metal printer 1 can be printer, liquid metal circuit writing pencil, liquid metal
Circuit mask spray equipment or the other kinds equipment that can make monolayer or multilamellar liquid metal circuit.
In the specific implementation, liquid metal 7 can use fusing point low-melting-point metal below 300 degrees Celsius or alloy,
Composition can be in gallium, indium, stannum, zinc, bismuth, lead, cadmium, copper, silver, gold, hydrargyrum, sodium, potassium, magnesium, aluminum, ferrum, cobalt, nickel, manganese, titanium, vanadium etc.
One or more, its form can be metal simple-substance, alloy, it is also possible to is that metal nanoparticle mixes shape with fluid dispersion
The electrical-conductive nanometer fluid become.
In the specific implementation, the communication between liquid metal printer 1 and design device can be wire communication side
Formula, it is also possible to be communication.
In the specific implementation, standardised connection interfaces based on liquid metal printing technique, including standardized liquid gold
Belong to pad and the connected mode of patch-type components and parts, liquid metal pad and the connected mode of direct insertion components and parts, it is also possible to be
Liquid metal pad 11 in Fig. 3 and the magnetic-type method of attachment of magnetic metal terminal 13, wherein magnetic terminal 13 passes through magnetic
Terminal base 12 is arranged in printed substrates.Liquid metal pad and wire utilize little copper post or little brass screw to carry out the company of grafting
Connect mode, utilize standardised connection interfaces the least copper post can realize the printing of single or multiple lift light bar circuit.
In the specific implementation, utilize components and parts apparatus for placing 6 carry out components and parts 9 place time, can depend on along direction of routing
Secondary each periodic structure to circuit carries out the placement of components and parts 9, according to the kind of device in each periodic circuit
Class is placed.Wherein, components and parts 9 can be LED, fluorescent lamp, Halogen light, electric filament lamp such as long bubble color lamp and rice bubble color lamp,
The device of the electrified light emittings such as fluorescent material, it is also possible to be various functional chips, such as the voltage stabilizing chip of voltage stabilizing with for compiling
The single-chip microcomputer 10 etc. of journey.
In the specific implementation, packaging system 4 can be to cover encapsulating material 8 in liquid with any-modes such as spraying, be coated with, smear
Metal 7 formed circuit trace on device, such as, packaging system 4 include the containing cavity for housing encapsulating material 8 and with institute
State the spray head of containing cavity connection.
In the specific implementation, encapsulating material 8 can be polydimethylsiloxane, silica gel, latex, sulphur rubber, polymer paint,
Optic-solidified adhesive such as G3311 and G381 etc. can be via the material of liquid curing.
In the specific implementation, solidification equipment can use various structures, for example, it is possible to make encapsulating material rapid photocuring
Light-solidified lamp, the Slow curing drying baker etc. of encapsulating material can be made.
In the specific implementation, the system that the present invention provides can also include shaping equipment 3, to enter described printed substrates 2
Row is fixed and is limited described packaging system 4 and sprays the regional extent of encapsulating material 8, so that printed substrates in encapsulation process
2 maintain static, and can be defined the spray range of encapsulating material 8.
In the specific implementation, the corresponding different shaping equipment 3 of different types of light bar, obtain different light bar shapes after encapsulation
Shape.Such as, conventional round two wires, circle three lines, flat three lines and flat four lines etc. all correspond to different shaping equipments.Certainly, sizing
Device 3 can also be self-defining combination wire shaping equipment, the most non-single wire or non-linear shape shaping equipment.
As it is shown in figure 1, the optional structure of the one of shaping equipment 3 is as follows:
Described shaping equipment 3 includes shaped as frame stereotyped structure and rectangle stereotyped structure, wherein:
Described shaped as frame stereotyped structure is for being fixed the edge of described printed substrates 2；
Described rectangle stereotyped structure is arranged on the center of described printed substrates 2；
Forming groove between described rectangle stereotyped structure and described rectangle stereotyped structure, described groove is used for limiting described envelope
The spray range of package material 8.
In the specific implementation, the light bar manufacturing system that the present invention provides also includes:
Detection of connectivity device 5, enters for the circuit trace being formed the liquid metal 7 stating in printed substrates 2 spraying
Row detection of connectivity.
It will be appreciated that on the premise of only connectedness is good, components and parts apparatus for placing 6 just can be utilized to perform components and parts 9
Placement operation, formed entity light bar pattern.
Here, by detection of connectivity device 5, the circuit trace in printed substrates 2 is carried out detection of connectivity, to spray
The connection situation being coated with the circuit trace formed carries out certain understanding, decides whether that again spraying circuit walks on this basis
Line, or place components and parts 9 further, to ensure the quality of made light bar.
In the specific implementation, detection of connectivity device 5 can utilize photographic head shooting circuit trace to carry out connective point
Analysis mode, it is also possible to utilize double probe or multiprobe to carry out the modes such as continuity testing.
Second aspect, the present invention also provides for a kind of method utilizing any of the above-described light bar manufacturing system to make light bar, the party
Method includes:
S1, utilize described design device make virtual light bar pattern, and generate correspondence print command, described light bar
Pattern includes the placement location of circuit trace and components and parts；
S2, described liquid metal printer 1 is utilized to spray or scribble liquid metal 7 in described printed substrates 2, to be formed
Circuit trace；
S3, utilize components and parts apparatus for placing 6 that components and parts 9 are placed on described printed substrates 2 with described placement location pair
On the position answered；
S4, utilize the entity light bar figure that the circuit trace in described printed substrates 2 and components and parts 9 form by packaging system 4
Case utilizes encapsulating material 8 to be packaged；
S5, utilize described solidification equipment that the encapsulating material 8 being sprayed on described entity light bar pattern is solidified.
In the method for the making light bar that the present invention provides, the light bar manufacturing system using first aspect to provide carries out light bar system
Make, therefore there is the technique effect identical with the light bar manufacturing system in first aspect, repeat no more here.
In the specific implementation, if light bar manufacturing system also includes detection of connectivity device 5, perform step S3 it
Before, detection of connectivity can be carried out to stating the circuit trace that in printed substrates 2, the liquid metal 7 of spraying is formed, and described
In the case of circuit trace meets connectivity platform, it is allowed to perform step S3.
In the specific implementation, if light bar producing device also including shaping equipment 3, the most before step S 4, it is also possible to profit
With described shaping equipment 3, described printed substrates 2 is fixed and limits described packaging system 4 and spray the region of encapsulating material 8
Scope, performs step S4 the most again.
Above method is to carry out the behaviour such as the placement of components and parts 9, encapsulation in printed substrates 2 one side (being called for short the first face) upward
Make, in the specific implementation, it is also possible to one side (being called for short the second face) down carries out identical operation, and accordingly, the present invention provides
Method also include:
S6, after the solidification is complete, separates described entity light bar pattern and described printed substrates 2；
In the one side (the i.e. second face) that S7, entity light bar pattern after isolation contact with described printed substrates 2, unit is set
Device 9 and power supply lead wire；
S8, utilize the one side (the i.e. second face) that described entity light bar pattern contacts by packaging system 4 with described printed substrates 2
On circuit trace, components and parts 9 and power supply lead wire utilize encapsulating material 8 to be packaged；
S9, utilize described solidification equipment that described encapsulating material 8 is solidified.
So, the entity light bar pattern obtained includes that two sides encapsulating material and the circuit encapsulated by two sides encapsulating material are walked
Line, components and parts, power supply lead wire etc..
It is similar to, if light bar producing device also being included shaping equipment 3, then before S8, it is also possible to utilize described sizing
Device 3 is fixed and limits described packaging system 4 to the entity light bar pattern after separating and sprays the regional extent of encapsulating material；
The one side (the i.e. second face) that entity light bar pattern contacts with described printed substrates 2 is towards described shaping equipment 3.
For example, liquid metal printer 1 is electromagnetic drive type liquid metal circuit printer, the liquid used gold
Genus material is gallium-indium alloy, and the printed substrates 2 used is polyvinyl chloride film, and the encapsulating material 8 used is poly dimethyl
Siloxanes, the solidification equipment used is vacuum drying oven, and the light bar circuit of making is hollow circle two wires light bar circuit.
User utilizes design device to finish circuit diagram, generates print command and leads to liquid metal printer 1
News, electromagnetic drive type liquid metal circuit printer is mirror-printed for circuit on polyvinyl chloride film, and test connectedness guarantees
Circuit, without open circuit, uses shaping equipment 3 to fix polyvinyl chloride film, forms a hollow frame structure, and centre is also put
Put square stereotyped structure, between hollow frame structure and square stereotyped structure, form groove.Add in a groove encapsulating material-
Polydimethylsiloxane, uniformly adds along circuit place dead slot, treats liquid level stabilizing bubble-free, be placed into vacuum drying oven.Poly-two
Take out after methylsiloxane solidification, use immersing in liquid nitrogen or water pouring, separate polyvinyl chloride film, place LED at the circuit back side
And power supply lead wire.Reuse shaping equipment 3 to fix, use encapsulating material 8-polydimethylsiloxane to carry out second time and encapsulate,
It is placed again into vacuum drying oven to be dried, i.e. can obtain the hollow light bar of design.
It is, of course, also possible to the entity light bar pattern obtained is pruned, wrap up other waterproof or fluorescence at outer surface, with
And splicing, combination and the connection in series-parallel etc. of multiple light bar, thus obtain the integrated light bar finished product with self-defined pattern.
In the description of the present invention, illustrate a large amount of detail.It is to be appreciated, however, that embodiments of the invention are permissible
Put into practice in the case of there is no these details.In some instances, it is not shown specifically known method, structure and skill
Art, in order to do not obscure the understanding of this description.
Above example only in order to technical scheme to be described, is not intended to limit；Although with reference to previous embodiment
The present invention is described in detail, it will be understood by those within the art that；It still can be to aforementioned each enforcement
Technical scheme described in example is modified, or wherein portion of techniques feature is carried out equivalent；And these amendment or
Replace, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1. a light bar manufacturing system, it is characterised in that including:
Design device, operates for drawing circuit trace according to user and components and parts placement location is arranged behaviour
Make, generate virtual light bar pattern, and according to described virtual light bar pattern, generate corresponding print command；
Liquid metal printing device, the liquid metal including printed substrates with the communication connection of described design device prints
Machine, described liquid metal printer, for according to described print command, sprays in described printed substrates or scribbles liquid metal,
To form circuit trace；
Components and parts, for according to described print command, are placed on putting with described of described printed substrates by components and parts apparatus for placing
On the position that seated position is corresponding；
Packaging system, utilizes encapsulation for the entity light bar pattern forming the circuit trace in described printed substrates and components and parts
Material is packaged；
Solidification equipment, for solidifying the encapsulating material on described entity light bar pattern.
System the most according to claim 1, it is characterised in that also include:
Shaping equipment, for being fixed to described printed substrates and limit the region model of described packaging system spraying encapsulating material
Enclose.
System the most according to claim 2, it is characterised in that described shaping equipment includes that shaped as frame stereotyped structure and rectangle are fixed
Type structure, wherein:
Described shaped as frame stereotyped structure is for being fixed the edge of described printed substrates；
Described rectangle stereotyped structure is arranged on the center of described printed substrates；
Forming groove between described rectangle stereotyped structure and described rectangle stereotyped structure, described groove is used for limiting described encapsulation material
The spray range of material.
System the most according to claim 1, it is characterised in that described packaging system includes for housing described encapsulating material
Containing cavity and the spray head that connects with described containing cavity.
System the most according to claim 1, it is characterised in that also include:
Detection of connectivity device, carries out connectedness for the circuit trace being formed the liquid metal stating in printed substrates spraying
Detection.
6. one kind utilizes the method that the arbitrary described light bar manufacturing system of claim 1-5 makes light bar, it is characterised in that bag
Include:
Utilize described design device to make virtual light bar pattern, and generate corresponding print command, described light bar pattern bag
Include the placement location of circuit trace and components and parts；
Described liquid metal printer is utilized to spray in described printed substrates or scribble liquid metal, to form circuit trace；
Utilize described components and parts apparatus for placing that components and parts are placed on the position corresponding with described placement location of described printed substrates
Put；
The entity light bar pattern utilizing described packaging system to form the circuit trace in described printed substrates and components and parts utilizes
Encapsulating material is packaged；
Utilize described solidification equipment that the encapsulating material being sprayed on described entity light bar pattern is solidified.
Method the most according to claim 6, it is characterised in that described light bar manufacturing system is the lamp described in claim 5
Band manufacturing system；Utilizing described components and parts apparatus for placing that components and parts are placed on described printed substrates with described placement location
Before on corresponding position, described method also includes:
The circuit trace being formed the liquid metal of spraying in described printed substrates carries out detection of connectivity, and at described circuit
In the case of cabling meets connectivity platform, it is allowed to perform to utilize described components and parts apparatus for placing that components and parts are placed on described beating
The substrates printed operation on the position corresponding with described placement location.
Method the most according to claim 6, it is characterised in that described light bar manufacturing system is described in Claims 2 or 3
Light bar manufacturing system；At the entity lamp utilizing described packaging system that the circuit trace in described printed substrates and components and parts are formed
Before band pattern utilizes encapsulating material to be packaged, described method also includes:
Described shaping equipment is utilized described printed substrates to be fixed and limited the district of described packaging system spraying encapsulating material
Territory scope.
Method the most according to claim 6, it is characterised in that also include:
After the solidification is complete, described entity light bar pattern is separated with described printed substrates；
In the one side that entity light bar pattern after isolation contacts with described printed substrates, components and parts and power supply lead wire are set；
Utilize the circuit trace in the one side that described entity light bar pattern contacts by described packaging system with described printed substrates, unit
Device and power supply lead wire utilize encapsulating material to be packaged；
Utilize described solidification equipment that described encapsulating material is solidified.
Method the most according to claim 9, it is characterised in that described light bar manufacturing system is described in Claims 2 or 3
Light bar manufacturing system, in the one side utilizing described packaging system that described entity light bar pattern is contacted with described printed substrates
Circuit trace, components and parts and power supply lead wire utilize encapsulating material to be packaged before, described method also includes:
Described shaping equipment is utilized the entity light bar pattern after separating to be fixed and limited the spraying encapsulation of described packaging system
The regional extent of material；Described entity light bar pattern contact with described printed substrates one facing to described shaping equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610720033.2A CN106287294A (en) | 2016-08-24 | 2016-08-24 | Light bar manufacturing system and the method utilizing this light bar manufacturing system making light bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610720033.2A CN106287294A (en) | 2016-08-24 | 2016-08-24 | Light bar manufacturing system and the method utilizing this light bar manufacturing system making light bar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106287294A true CN106287294A (en) | 2017-01-04 |
Family
ID=57616162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610720033.2A Pending CN106287294A (en) | 2016-08-24 | 2016-08-24 | Light bar manufacturing system and the method utilizing this light bar manufacturing system making light bar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106287294A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111318707A (en) * | 2018-12-17 | 2020-06-23 | 北京梦之墨科技有限公司 | DIY system of liquid metal product |
| CN112333928A (en) * | 2020-11-25 | 2021-02-05 | 青岛理工大学 | Flexible circuit integrated printing and packaging method based on liquid metal |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102788284A (en) * | 2012-08-16 | 2012-11-21 | 重庆平伟实业股份有限公司 | Flexible light-emitting diode (LED) lamp band and manufacturing method thereof |
| CN104118222A (en) * | 2013-04-26 | 2014-10-29 | 中国科学院理化技术研究所 | Liquid metal needle-type printing device and printing method |
| CN104299533A (en) * | 2014-09-30 | 2015-01-21 | 上海丽雨光电有限公司 | Manufacturing method for flexible neon lamp sign and flexible neon lamp sign |
| EP2871920A1 (en) * | 2013-11-08 | 2015-05-13 | Osram Sylvania Inc. | Fixture design for flexible LED circuit boards |
| CN105611753A (en) * | 2016-02-24 | 2016-05-25 | 北京梦之墨科技有限公司 | Manufacturing method and apparatus for liquid metal multilayer circuit |
-
2016
- 2016-08-24 CN CN201610720033.2A patent/CN106287294A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102788284A (en) * | 2012-08-16 | 2012-11-21 | 重庆平伟实业股份有限公司 | Flexible light-emitting diode (LED) lamp band and manufacturing method thereof |
| CN104118222A (en) * | 2013-04-26 | 2014-10-29 | 中国科学院理化技术研究所 | Liquid metal needle-type printing device and printing method |
| EP2871920A1 (en) * | 2013-11-08 | 2015-05-13 | Osram Sylvania Inc. | Fixture design for flexible LED circuit boards |
| CN104299533A (en) * | 2014-09-30 | 2015-01-21 | 上海丽雨光电有限公司 | Manufacturing method for flexible neon lamp sign and flexible neon lamp sign |
| CN105611753A (en) * | 2016-02-24 | 2016-05-25 | 北京梦之墨科技有限公司 | Manufacturing method and apparatus for liquid metal multilayer circuit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111318707A (en) * | 2018-12-17 | 2020-06-23 | 北京梦之墨科技有限公司 | DIY system of liquid metal product |
| CN112333928A (en) * | 2020-11-25 | 2021-02-05 | 青岛理工大学 | Flexible circuit integrated printing and packaging method based on liquid metal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102032528B (en) | Lighting device and light spreading plate | |
| CN102956797B (en) | Manufacturing method for LED (Light Emitting Diode) | |
| CN208315167U (en) | A kind of LED display panel | |
| CN107077028A (en) | Substrate, its manufacture method and the display device including it changed for color | |
| CN109155346A (en) | For phosphor to be applied to the method and its equipment of light emitting diode | |
| CN108533993A (en) | light emitting device | |
| CN103872227B (en) | The manufacture method of a kind of 360 degree of luminous LED filament light sources | |
| CN106287294A (en) | Light bar manufacturing system and the method utilizing this light bar manufacturing system making light bar | |
| CN110931147A (en) | Transparent circuit board with self-assembled nano particles, and preparation method and application thereof | |
| CN105990496A (en) | LED package structure and manufacturing method thereof | |
| CN102931328A (en) | Manufacturing method of LED (Light-Emitting Diode) packaging body | |
| CN109713112A (en) | White-light LED chip, lamp bead and White-light LED chip, lamp bead preparation method | |
| CN105957974A (en) | Organic light-emitting diode device and display device | |
| CN105006509B (en) | Quantum dot LED encapsulation method and encapsulating structure | |
| CN209180714U (en) | The flexible filament and filament lamp that can be independently formed | |
| CN107123727B (en) | A kind of quantum spot white light LED of low operating temperature and preparation method thereof | |
| CN107346801A (en) | LED integrated encapsulation structures and its method for packing | |
| US20130258298A1 (en) | LED image projection apparatus | |
| CN106848036B (en) | A kind of LED encapsulation structure and its packaging method | |
| CN108909343B (en) | A kind of intelligent graphic is drawn and preparation method thereof | |
| CN106409821A (en) | Light-emitting device without using pre-stored power supply and light-emitting diode packaging structure thereof | |
| CN205723614U (en) | A kind of anti-sulfuration and halogenation and there is the LED light source of anti-oxidation function | |
| CN214254420U (en) | LED film screen | |
| US20060029744A1 (en) | Method of making an energetic beam markable | |
| CN211040539U (en) | Curved surface conductive circuit and L ED luminous wick based on cylindrical surface tubular printing stock |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |
|
| RJ01 | Rejection of invention patent application after publication |