CN106283132B - A kind of soft dispersant of subacidity system electroplating bright copper - Google Patents
A kind of soft dispersant of subacidity system electroplating bright copper Download PDFInfo
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- CN106283132B CN106283132B CN201610742371.6A CN201610742371A CN106283132B CN 106283132 B CN106283132 B CN 106283132B CN 201610742371 A CN201610742371 A CN 201610742371A CN 106283132 B CN106283132 B CN 106283132B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a kind of soft dispersant of subacidity system electroplating bright copper, the softness dispersant formulation is as follows：100~120g/L of o-benzoic sulfimide, 2 20~30g/L of ethylhexylsulfate sodium.The solvent that soft dispersant formulation uses is water.The present invention is using o-benzoic sulfimide and 2 ethylhexylsulfate sodium as dispersant; 2 ethylhexylsulfate sodium have low bubble wetability; so that plating solution has good dispersibility, anti-impurity, ensure that copper plate has good toughness, flexibility, scattered copper coating can be generated.
Description
Technical field
The present invention relates to field of metal surface treatment technology, and in particular to a kind of softness of subacidity system electroplating bright copper
Dispersant.
Background technology
Copper facing is most popular a kind of pre-plating layer in electroplating industry, including soldering part, terne metal, zine pressure casting
Before nickel plating, gold, silver will copper facing, for improving binding force of cladding material.At present, electro-coppering can be divided into alkaline solution copper facing and acid
Property solution copper facing.The characteristics of alkaline solution copper facing is：Copper plate is less bright, and cathode efficiency is low (45~65%), advantage
It is layers of copper and iron-based body good bonding strength, layers of copper crystal grain densification is referred to as " high density copper facing "；And the characteristics of acid copper-plating is cloudy
Electrode current is efficient (95~100%), and for coating light like minute surface, shortcoming is that copper plate crystal grain forms not fine and close, layers of copper and iron-based
Binding force is very poor, need to first carry out alkaline copper plating carries out acid copper-plating again when being also easy to produce copper displacement reaction for body, and after acid copper-plating
Cause subsequent bright plating Ni, Cr binding force bad due to coating surface has the surface reactive material of absorption.Wherein, mainly by
The dispersibility of dispersant in electroplate liquid is poor, anti-impurity is poor.It is a kind of suitable for subacidity system therefore, it is necessary to develop
Soft dispersant.
Invention content
In order to overcome the deficiencies of the prior art, present invention aim to provide, a kind of dispersibility is strong, anti-impurity performance
The soft dispersant of high subacidity system electroplating bright copper.
In order to achieve this, a kind of soft dispersant of subacidity system electroplating bright copper provided by the present invention, soft
Soft dispersant formulation is as follows：
100~120g/L of o-benzoic sulfimide
20~30g/L of 2- ethylhexylsulfate sodium.
Preferably, the soft dispersant formulation of the subacidity system electroplating bright copper is as follows：
105~115g/L of o-benzoic sulfimide
22~28g/L of 2- ethylhexylsulfate sodium.
Preferably, the soft dispersant formulation of the subacidity system electroplating bright copper is as follows：
112~118g/L of o-benzoic sulfimide
26~28g/L of 2- ethylhexylsulfate sodium.
Further, the solvent that the soft dispersant formulation uses is water.
Further, the temperature of the solvent is 50~60 DEG C.
Compared with prior art, the present invention is used as dispersion using o-benzoic sulfimide and 2- ethylhexylsulfates sodium
Agent, 2- ethylhexylsulfates sodium have low bubble wetability so that plating solution has good dispersibility, anti-impurity, ensures copper facing
Layer has good toughness, can generate flexibility, scattered copper coating.
Specific embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail：
Embodiment 1：
It for 50 DEG C of distilled water is solvent that the present embodiment, which uses temperature, and soft dispersant formulation is as follows：
O-benzoic sulfimide 100g/L
2- ethylhexylsulfate sodium 20g/L.
The technique that electroplating bright copper is carried out using above-mentioned soft dispersant, the formula of electroplate liquid are as follows：
The present embodiment uses distilled water as solvent, plating solution formula：
The electroplating technology of the present embodiment：Electroplating temperature is 40 DEG C, the pH value of electroplate liquid is 4.5, cathode-current density is
0.2A/dm2。
In the electroplating process of the present embodiment, slot positive pressure is normal, anodic passivity, nigrescence phenomenon, obtained copper plating does not occur
Layer surface light, compact crystallization, density are high, binding force is good, and cathode efficiency is 56~72%.
Embodiment 2：
It for 50 DEG C of distilled water is solvent that the present embodiment, which uses temperature, and soft dispersant formulation is as follows：
O-benzoic sulfimide 120g/L
2- ethylhexylsulfate sodium 30g/L.
The technique that electroplating bright copper is carried out using above-mentioned soft dispersant, plating solution formula are as follows：
The electroplating technology of the present embodiment：Electroplating temperature is 45 DEG C, the pH value of electroplate liquid is 5, cathode-current density 3.0A/
dm2。
In the electroplating process of the present embodiment, slot positive pressure is normal, anodic passivity, nigrescence phenomenon, obtained copper plating does not occur
Layer surface light, compact crystallization, density are high, binding force is good, and cathode efficiency is 56~78%.
Embodiment 3：
It for 60 DEG C of distilled water is solvent that the present embodiment, which uses temperature, and soft dispersant formulation is as follows：
O-benzoic sulfimide 105g/L
2- ethylhexylsulfate sodium 22g/L.
The technique that electroplating bright copper is carried out using above-mentioned soft dispersant, plating solution formula are as follows：
The electroplating technology of the present embodiment：Electroplating temperature is 45 DEG C, the pH value of electroplate liquid is 5, cathode-current density 3.0A/
dm2。
In the electroplating process of the present embodiment, slot positive pressure is normal, anodic passivity, nigrescence phenomenon, obtained copper plating does not occur
Layer surface light, compact crystallization, density are high, binding force is good, and cathode efficiency is 56~78%.
Embodiment 4：
It for 50 DEG C of distilled water is solvent that the present embodiment, which uses temperature, and soft dispersant formulation is as follows：
O-benzoic sulfimide 115g/L
2- ethylhexylsulfate sodium 28g/L.
The technique that electroplating bright copper is carried out using above-mentioned soft dispersant, plating solution formula are as follows：
The electroplating technology of the present embodiment：Electroplating temperature is 50 DEG C, the pH value of electroplate liquid is 5.5, cathode-current density is
2.0A/dm2。
In the electroplating process of the present embodiment, slot positive pressure is normal, anodic passivity, nigrescence phenomenon, obtained copper plating does not occur
Layer surface light, compact crystallization, density are high, binding force is good, and cathode efficiency is 76~80%.
Embodiment 5：
It for 50 DEG C of distilled water is solvent that the present embodiment, which uses temperature, and soft dispersant formulation is as follows：
O-benzoic sulfimide 112g/L
2- ethylhexylsulfate sodium 26g/L.
The technique that electroplating bright copper is carried out using above-mentioned soft dispersant, plating solution formula are as follows：
The electroplating technology of the present embodiment：Electroplating temperature is 45 DEG C, the pH value of electroplate liquid is 5.5, cathode-current density is
0.2A/dm2。
In the electroplating process of the present embodiment, slot positive pressure is normal, anodic passivity, nigrescence phenomenon, obtained copper plating does not occur
Layer surface light, compact crystallization, density are high, binding force is good, and cathode efficiency is 75~80%.
Embodiment 6：
It for 60 DEG C of deionized water is solvent that the present embodiment, which uses temperature, and soft dispersant formulation is as follows：
O-benzoic sulfimide 118g/L
2- ethylhexylsulfate sodium 28g/L.
The technique that electroplating bright copper is carried out using above-mentioned soft dispersant, plating solution formula are as follows：
The electroplating technology of the present embodiment：Electroplating temperature is 45 DEG C, the pH value of electroplate liquid is 5.5, cathode-current density is
0.2A/dm2。
In the electroplating process of the present embodiment, slot positive pressure is normal, anodic passivity, nigrescence phenomenon, obtained copper plating does not occur
Layer surface light, compact crystallization, density are high, binding force is good, and cathode efficiency is 75~80%.
The content that this specification is not described in detail belongs to the prior art well known to professional and technical personnel in the field.
Claims (1)
1. a kind of technique for carrying out electroplating bright copper using soft dispersant, which is characterized in that its plating solution formula is as follows：
Wherein, soft dispersant formulation is as follows：
O-benzoic sulfimide 118g/L
2- ethylhexylsulfate sodium 28g/L
The solvent that the soft dispersant formulation uses is water that temperature is 60 DEG C；
Electroplating temperature is 45 DEG C, the pH value of electroplate liquid is 5.5, cathode-current density 0.2A/dm2。
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| CN201610742371.6A CN106283132B (en) | 2016-08-26 | 2016-08-26 | A kind of soft dispersant of subacidity system electroplating bright copper |
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| CN106283132B true CN106283132B (en) | 2018-07-10 |
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| CN107513732A (en) * | 2017-09-08 | 2017-12-26 | 湖北吉和昌化工科技有限公司 | A kind of zinc-plated dispersant of new non-cyanide alkali |
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| US6765757B2 (en) * | 2001-01-15 | 2004-07-20 | Alps Electric Co., Ltd. | Soft magnetic film having high saturation magnetic flux density, thin-film magnetic head using the same, and manufacturing method of the same |
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| DE102011055117A1 (en) * | 2011-11-08 | 2013-05-08 | Harting Kgaa | Metallizing a surface of polymeric-substrates useful for producing conductive structures during laser direct structuring-method, comprises e.g. metallizing the substrate wetted with an alkaline solution by chemical deposition of a metal |
| CN102586819A (en) * | 2012-03-05 | 2012-07-18 | 张家港市祥华电镀化工制造有限公司 | Copper plating brightener |
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| JP2016113645A (en) * | 2014-12-11 | 2016-06-23 | 住友金属鉱山株式会社 | Copper electroplating solution for flexible wiring board and method for producing laminate using the copper electroplating solution |
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