CN106282714A - A kind of preparation method of self-lubricating copper tungsten material - Google Patents
A kind of preparation method of self-lubricating copper tungsten material Download PDFInfo
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- CN106282714A CN106282714A CN201610846921.9A CN201610846921A CN106282714A CN 106282714 A CN106282714 A CN 106282714A CN 201610846921 A CN201610846921 A CN 201610846921A CN 106282714 A CN106282714 A CN 106282714A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/04—Alloys based on tungsten or molybdenum
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
Abstract
The invention discloses the preparation method of a kind of self-lubricating copper tungsten material, boron nitride, tungsten powder and induction copper powder carried out mechanical mixture, be then passed through binder-treatment, dry, sieve powder process, obtain mixed-powder；Mixed-powder is pressed into blank by cold stamping die, then blank is contained in high purity graphite crucible, under hydrogen shield atmosphere, is sintered infiltration, obtain self-lubricating copper tungsten material.The preparation method of preparation method self-lubricating copper tungsten material of the present invention, by adding boron nitride in preparation process, improves the performance of copper tungsten material, improves the hardness of copper tungsten material, reduces its coefficient of friction；In use can be produced from the effect of lubrication, extend its service life.
Description
Technical field
The invention belongs to copper-tungsten technical field of material, be specifically related to the preparation side of a kind of self-lubricating copper tungsten material
Method.
Background technology
Copper tungsten (CuW) electrical contact is the contact element of electric switch, be mainly responsible for contact, disconnecting consumers electric current appoint
Business.Safety, the reliability of switch, cut-off and close characteristic and be heavily dependent on physical property and the electricity thereof of contact material
Learn characteristic.Copper tungsten (CuW) is that contact material has good resistance to arc erosion, resistance fusion welding and high intensity and extensive because of it
It is applied to various chopper, on-load switch and the element of transformator permutator.
Copper-tungsten needs the folding through thousands of the most up to ten thousand times in actual applications, all can in each moving process
There is wear phenomenon, thus seriously reduce the service life of copper-tungsten.Rubbing of the most copper-tungstens applied in the market
Wiping coefficient higher, wear resistance is poor, result in the inefficacy caused in the actual application of copper-tungsten because of abrasion
Situation is more, thus seriously reduces the service life of copper-tungsten.So based on case above, the present invention proposes to close at copper tungsten
Gold adds the scheme of high-temperature lubricant, so that copper-tungsten in use can be produced from the effect of lubrication, extends
Its service life.
Summary of the invention
It is an object of the invention to provide the preparation method of a kind of self-lubricating copper tungsten material, the copper tungsten (CuW) prepared closes
Gold utensil has higher hardness, relatively low coefficient of friction and longer service life.
The technical solution adopted in the present invention is, the preparation method of a kind of self-lubricating copper tungsten material, specifically according to following step
Rapid enforcement:
Step 1, carries out mechanical mixture by boron nitride, tungsten powder and induction copper powder, is then passed through binder-treatment, dries, sieves powder
Process, obtain mixed-powder；
Step 2, mixed-powder step 1 obtained is pressed into blank by cold stamping die, is then contained in by blank high-purity
In graphite crucible, under hydrogen shield atmosphere, it is sintered infiltration, obtains self-lubricating copper tungsten material.
The feature of the present invention also resides in,
In step 1, the mass ratio of boron nitride, tungsten powder and copper powder is 0.2～1:70:10.
In step 1, mechanical mixture is to carry out in batch mixer, and wherein tungsten carbide milling balls is 1 with the mass ratio of mixed-powder:
1, batch mixer mixes powder 4～4.5h with the rotating speed of 100～200r/min.
In step 2, the pressure of compacting is 300～350KN, and the dwell time is 30～35s.
In step 2, the design parameter of sintering and infiltration is: 20 DEG C were warming up to 900～950 DEG C through 40～60 minutes, then protect
Temperature 30～60 minutes, then 960～1000 DEG C it were warming up to through 5～10 minutes, then it is incubated 30～60 minutes, then through 40～80 points
Clock is warming up to 1350～1400 DEG C, is incubated 120～180 minutes, cools to room temperature with the furnace.
The invention has the beneficial effects as follows, the preparation method of preparation method self-lubricating copper tungsten material of the present invention, by preparation
During add boron nitride, improve the performance of copper tungsten material, improve the hardness of copper tungsten material, reduce its coefficient of friction；
In use can be produced from the effect of lubrication, extend its service life.
Accompanying drawing explanation
Fig. 1 is the self-lubricating copper tungsten materials microstructure shape appearance figure that preparation method of the present invention prepares；
Fig. 2 is the hardness profile of the self-lubricating copper tungsten material that embodiment 1～5 prepares；
Fig. 3 is the friction coefficient curve figure of the self-lubricating copper tungsten material that embodiment 1～5 prepares.
Detailed description of the invention
The present invention is described in detail with detailed description of the invention below in conjunction with the accompanying drawings.
The preparation method of self-lubricating copper tungsten material of the present invention, specifically implements according to following steps:
Step 1, puts into boron nitride, tungsten powder and induction copper powder and carries out mechanical mixture in batch mixer, (boron nitride, tungsten powder and
The mass ratio of copper powder is 0.2～1:70:10) mass ratio of tungsten carbide milling balls and mixed-powder is 1:1, batch mixer with 100～
The rotating speed of 200r/min mixes powder 4～4.5h；
Step 2, dries mixed for step 1 powder through binder-treatment, sieves powder (200 eye mesh screen) process, mixed
Close powder；
Step 3, mixed-powder step 2 obtained is pressed into blank by cold stamping die, the pressure of compacting be 300～
350KN, the dwell time is 30～35s；
Step 4, is contained in the blank that step 3 compacting obtains in high purity graphite crucible, burns under hydrogen shield atmosphere
Knot infiltration (20 DEG C were warming up to 900～950 DEG C through 40～60 minutes, then insulation 30～60 minutes, then through 5～10 minutes
It is warming up to 960～1000 DEG C, then is incubated 30～60 minutes, then be warming up to 1350～1400 DEG C through 40～80 minutes, be incubated 120
～180 minutes, cool to room temperature with the furnace), obtain self-lubricating copper tungsten material.
Boron nitride Heat stability is good, in neutral reduction atmosphere, can heat-resisting to 2000 DEG C, in nitrogen and argon use temperature
Up to 2800 DEG C.BN stable chemical nature, does not reacts with Cu and W below 1500 DEG C.Boron nitride disclosure satisfy that copper tungsten
(CuW) alloy various exacting terms in preparation process and in actual application.
Boron nitride (BN) hardness is high, adds and can put forward heavy alloyed hardness in the alloy.
Boron nitride is commonly called as white graphite, its crystal structure presentation layer lamellar, has a certain degree of aligning, this structure
Reduce its coefficient of friction, so the alloy adding BN also has relatively low coefficient of friction.
The present invention prepares copper tungsten (CuW) alloy by adding BN, and the various excellent performance being had due to BN changes
The performance of whole copper tungsten (CuW) alloy.The hardness of the CuW70 alloy prepared by this scheme can reach 207HB, and
The standard hardness of CuW70 alloy is 175HB, so the hardness of the CuW alloy prepared in this way exceeds GB 18%.Use this
The coefficient of friction of CuW70 alloy prepared by kind of scheme can be reduced to 0.082, and the friction of copper tungsten (CuW) alloy without BN
Coefficient is 0.099, so the coefficient of friction of the CuW alloy prepared in this way reduces 17%.
Embodiment 1
Weigh submicron order W powder 70%, BN powder 0.2%, induction Cu powder 10%, load in batch mixer, by powder gross mass
1:1 add tungsten carbide milling balls, mix powder 4h with the rotating speed of 100r/min, the powder after mechanical mixture carried out binder-treatment, dries in the air
Dry, sieve powder processes, and powder is suppressed by cold stamping die, pressing pressure 300KN, and pressurize forms blank in 30 seconds, pre-stamped formation
Blank, places copper billet on blank and is sintered infiltration, and i.e. 20 DEG C were warming up to 950 DEG C through 40 minutes, then insulation 40 minutes,
It is warming up to 960 DEG C through 10 minutes again, then is incubated 50 minutes, then be warming up to 1350 DEG C through 80 minutes, be incubated 150 minutes, with
Stove is cooled to room temperature, obtains self-lubricating copper tungsten material.
The hardness of gained CuW alloy is 194HB, electrical conductivity 34.17MS/m, and coefficient of friction is 0.097.
Embodiment 2
Weigh submicron order W powder 70%, BN powder 0.4%, induction Cu powder 10%, load in batch mixer, by powder gross mass
1:1 add tungsten carbide milling balls, mix powder 4h with the rotating speed of 120r/min, the powder after mechanical mixture carried out binder-treatment, dries in the air
Dry, sieve powder processes, and powder is suppressed by cold stamping die, pressing pressure 300KN, and pressurize forms blank in 30 seconds, pre-stamped formation
Blank, places copper billet on blank and is sintered infiltration, and i.e. 20 DEG C were warming up to 900 DEG C through 50 minutes, then insulation 30 minutes,
It is warming up to 980 DEG C through 8 minutes again, then is incubated 40 minutes, then be warming up to 1360 DEG C through 40 minutes, be incubated 180 minutes, with stove
It is cooled to room temperature, obtains self-lubricating copper tungsten material.
The hardness of gained CuW alloy is 196HB, electrical conductivity 33.07MS/m, and coefficient of friction is 0.095.
Embodiment 3
Weigh submicron order W powder 70%, BN powder 0.6%, induction Cu powder 10%, load in batch mixer, by powder gross mass
1:1 add tungsten carbide milling balls, mix powder 4h with the rotating speed of 140r/min, the powder after mechanical mixture carried out binder-treatment, dries in the air
Dry, sieve powder processes, and powder is suppressed by cold stamping die, pressing pressure 300KN, and pressurize forms blank in 30 seconds, pre-stamped formation
Blank, places copper billet on blank and is sintered infiltration, and i.e. 20 DEG C were warming up to 920 DEG C through 60 minutes, then insulation 35 minutes,
It is warming up to 1000 DEG C through 6 minutes again, then is incubated 30 minutes, then be warming up to 1370 DEG C through 70 minutes, be incubated 120 minutes, with
Stove is cooled to room temperature, obtains self-lubricating copper tungsten material.
The hardness of gained CuW alloy is 199HB, electrical conductivity 31.33MS/m, and coefficient of friction is 0.093.
Embodiment 4
Weigh submicron order W powder 70%, BN powder 0.8%, induction Cu powder 10%, load in batch mixer, by powder gross mass
1:1 add tungsten carbide milling balls, mix powder 4h with the rotating speed of 160r/min, the powder after mechanical mixture carried out binder-treatment, dries in the air
Dry, sieve powder processes, and powder is suppressed by cold stamping die, pressing pressure 300KN, and pressurize forms blank in 30 seconds, pre-stamped formation
Blank, places copper billet on blank and is sintered infiltration, and i.e. 20 DEG C were warming up to 930 DEG C through 45 minutes, then insulation 60 minutes,
It is warming up to 970 DEG C through 5 minutes again, then is incubated 60 minutes, then be warming up to 1380 DEG C through 50 minutes, be incubated 160 minutes, with stove
It is cooled to room temperature, obtains self-lubricating copper tungsten material.
The hardness of gained CuW alloy is 204HB, electrical conductivity 30.07MS/m, and coefficient of friction is 0.087.
Embodiment 5
Weigh submicron order W powder 70%, BN powder 1%, induction Cu powder 10%, load in batch mixer, by powder gross mass
1:1 adds tungsten carbide milling balls, mixes powder 4.5h with the rotating speed of 180r/min, the powder after mechanical mixture carries out binder-treatment, dries in the air
Dry, sieve powder processes, and powder is suppressed by cold stamping die, pressing pressure 300KN, and pressurize forms blank in 30 seconds, pre-stamped formation
Blank, places copper billet on blank and is sintered infiltration, and i.e. 20 DEG C were warming up to 910 DEG C through 55 minutes, then insulation 45 minutes,
It is warming up to 990 DEG C through 9 minutes again, then is incubated 45 minutes, then be warming up to 1400 DEG C through 60 minutes, be incubated 170 minutes, with stove
It is cooled to room temperature, obtains self-lubricating copper tungsten material.
The hardness of gained CuW alloy is 207HB, electrical conductivity 28.67MS/m, and coefficient of friction is 0.082.
As it is shown in figure 1, the little granule of black is BN in figure, the bulky grain of white is tungsten particle, and the region of full wafer Lycoperdon polymorphum Vitt is
Copper substrate.Can be seen that BN is evenly dispersed between tungsten particle, such that it is able to play the effect changing substrate performance.
As shown in Figure 2, it can be seen that BN addition is the most, the hardness of copper-tungsten is the highest, electrical conductivity is the lowest.Such as Fig. 3 institute
Showing, it can be seen that BN addition is the most, the coefficient of friction of copper-tungsten is the lowest, and the anti-wear performance of copper-tungsten is the best.
Claims (5)
1. the preparation method of a self-lubricating copper tungsten material, it is characterised in that specifically implement according to following steps:
Step 1, carries out mechanical mixture by boron nitride, tungsten powder and induction copper powder, be then passed through binder-treatment, dry, sieve powder process,
Obtain mixed-powder；
Step 2, mixed-powder step 1 obtained is pressed into blank by cold stamping die, then blank is contained in high purity graphite
In crucible, under hydrogen shield atmosphere, it is sintered infiltration, obtains self-lubricating copper tungsten material.
The preparation method of self-lubricating copper tungsten material the most according to claim 1, it is characterised in that boron nitride, tungsten in step 1
The mass ratio of powder and copper powder is 0.2～1:70:10.
The preparation method of self-lubricating copper tungsten material the most according to claim 1 and 2, it is characterised in that in step 1, machinery is mixed
Conjunction is to carry out in batch mixer, and wherein tungsten carbide milling balls is 1:1 with the mass ratio of mixed-powder, and batch mixer is with 100～200r/
The rotating speed of min mixes powder 4～4.5h.
The preparation method of self-lubricating copper tungsten material the most according to claim 1, it is characterised in that the pressure of compacting in step 2
Power is 300～350KN, and the dwell time is 30～35s.
5. according to the preparation method of the self-lubricating copper tungsten material described in claim 1 or 4, it is characterised in that in step 2, sintering is molten
The design parameter oozed is: 20 DEG C were warming up to 900～950 DEG C through 40～60 minutes, then insulation 30～60 minutes, then through 5
～within 10 minutes, it is warming up to 960～1000 DEG C, then it is incubated 30～60 minutes, then it was warming up to 1350～1400 through 40～80 minutes
DEG C, it is incubated 120～180 minutes, cools to room temperature with the furnace.
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Cited By (4)
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| CN108149043A (en) * | 2017-12-27 | 2018-06-12 | 西安理工大学 | A kind of method added ceramic phase titanium diboride and prepare CuW alloys |
| CN109182870A (en) * | 2018-09-17 | 2019-01-11 | 西安理工大学 | A kind of preparation method with low-friction coefficient CuW alloy |
| CN111299594A (en) * | 2019-11-29 | 2020-06-19 | 安徽恒均粉末冶金科技股份有限公司 | Preparation method of copper-tungsten petal contact |
| CN113921310A (en) * | 2021-11-01 | 2022-01-11 | 西安西电高压开关有限责任公司 | Process manufacturing method of high-performance arc contact |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108149043A (en) * | 2017-12-27 | 2018-06-12 | 西安理工大学 | A kind of method added ceramic phase titanium diboride and prepare CuW alloys |
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| CN113921310A (en) * | 2021-11-01 | 2022-01-11 | 西安西电高压开关有限责任公司 | Process manufacturing method of high-performance arc contact |
| CN113921310B (en) * | 2021-11-01 | 2024-03-26 | 西安西电高压开关有限责任公司 | Technological manufacturing method of arc contact |
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