CN106272125B - Preparation method of polyurethane matrix stone grinding and polishing disc - Google Patents
Preparation method of polyurethane matrix stone grinding and polishing disc Download PDFInfo
- Publication number
- CN106272125B CN106272125B CN201610719365.9A CN201610719365A CN106272125B CN 106272125 B CN106272125 B CN 106272125B CN 201610719365 A CN201610719365 A CN 201610719365A CN 106272125 B CN106272125 B CN 106272125B
- Authority
- CN
- China
- Prior art keywords
- component
- grinding
- polishing
- silicon wafer
- stone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/08—Polyurethanes from polyethers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Materials Engineering (AREA)
Abstract
The invention discloses a preparation method of a polyurethane matrix stone grinding and polishing disc, and relates to a synthesis technology adopting a prepared polyurethane matrix and mixed artificial diamond micro powder, silicon carbide, silicon oxide, aluminium oxide and zinc oxide super fine powder as abrasive components. The novel stone grinding and polishing material can better meet the requirement on high luster during the decorative stone processing process or the later renovation process, the efficiency is higher, and the material has better environmental protection property.
Description
Technical field
The present invention relates to a kind of stone grinding polishing based on polyurethane as Novel stone abrasive polishing materials
The preparation method of piece, the grinding and polishing piece is mainly used in the surface grinding polishing of TERRAZZO and stone floor renovation.Category
In stone surface grinding and polishing technical field.
Background technology
Natural and artificial stone material for decoration use surface has higher gloss and definition, can more represent the color and decoration of stone material
Effect, therefore people are often using the height of stone surface glossiness as the standard for evaluating processing of stone quality and surface effect.
Grinding and polishing when surface grinding polishing, the stone floor renovation of masonry slab, is matched somebody with somebody by the different professional equipment of performance
Close the material with grinding function to realize.Thus with the abrasive polishing materials of more preferably grinding, polishing function and efficiency
Become the problem that processing of stone and stone material nursing industry pay high attention to.
In stone grinding field, masonry slab surface is ground and is polished, it is intended to stone surface is obtained preferably
It is smooth
Or brightness effect.Polishing is ground to stone material, corase grind, three mistakes of fine grinding and polishing can be simply divided into
Journey.It is also a process from coarse to fine, from coarse to smooth on abrasive material design system and operating procedure.Certainly, stone material table
Face grinding polishing effect has larger relation with the performance of milling apparatus.In recent years the lifting of milling apparatus performance was to stone grinding
The lifting of polishing effect affects very big, and abrasive polishing materials（Piece）The raising of performance seems delayed or stagnates.
Field is ground or renovates in stone floor, due to the impact of the factor such as flatness or skill of mating formation of masonry slab,
The flatness on ground occurs the different difference of degree after stone material is mated formation, and especially these are uneven the edge of sheet material and diagonal position
Whole sense is obvious, affects the decorative effect of stone floor.In order to eliminate these problems and phenomenon, generally after stone material is mated formation
Integral grinding polishing is carried out again to stone floor using a kind of " stone floor integral grinding technique ", to obtain preferable ground
Flatness and luster effect.The core composition of this " stone floor integral grinding technique " has two parts, and one is equipment, one
It is abrasive disc.Due to restricting for the factors such as the mobility and operability by equipment, the abrasiveness of these floor grinding devices
Much not as good as those professional equipments of stone material factory, thus can there is larger difference with the original gloss of sheet material on luster effect
It is different.In order to make up this technologic defect and difference, generally grind last polishing link on floor and thrown using some chemistry
Luminescent material, to improve the brightness effect of stone surface.For example, the use of some with oxalic acid and oxalates is the main polishing into composition
Powder or polishing agent.These have some in operability and efficiency and lack with powder body or liquid as the polishing material of states of matter form
Regret, and loaded down with trivial details in program and technique, efficiency is low, high cost, to environment and and operating personnel there is also infringement etc..
Its lustrous surface also can be destroyed after stone floor is rubbed, and at this moment be also required to carry out at renovation its surface
Reason, this also becomes an important content of stone material nursing technique.The refreshing appliance and abrasive polishing materials of existing stone floor with
Above-mentioned " stone floor integral grinding technique " identical, abrasive polishing materials（Piece）Performance and efficiency equally become a key and ask
Topic.
The self-sharpening of grinding and polishing piece has large effect to the grinding of stone material and polishing effect, and this is that an industry is generally acknowledged
General knowledge.For the small-sized milling apparatus that rotating speed is low, pressure is light, work area is little, the performance of grinding and polishing piece is often determined
Determine final grinding effect.The self-sharpening of abrasive particle refer to the abrasive particle being imbedded in matrix after sharp face is worn can and
When exposure or discharge the new abrasive particle with sharp face of other.Alloy base or epoxy resin-base and phenol
The abrasive material of urea formaldehyde matrix（Abrasive disc）Often there is preferable density, also have higher chucking power to powder body abrasive particle.Epoxy resin-matrix
Body and phenolic resin as matrix resin receive thermal softening in top layer in grinding, and the self-sharpening for also causing abrasive material is deteriorated.Actually abrasive material from
Sharp property is exactly the ability of a kind of " self renewal " and " weeding out the old and bring forth the new ".
At present both at home and abroad stone grinding polished silicon wafer is manufactured and mainly have three kinds of matrixes and form, and one kind is ore deposit soil matrix body,
One kind is alloy base, and one kind is resin matrix.These three different matrixes are all will be in a certain amount of people of addition fusion
Make on the basis of the abrasive materials such as diamond, carborundum and aluminium oxide to complete grinding function.
Ore deposit soil abrasive sheet is a kind of traditional way that stone grinding polished silicon wafer is prepared using magnesia, due to production technology
It is loaded down with trivial details,
Manufacture efficiency is low, and hardness is difficult to adjust, and seldom adopts at present.
Alloy base abrasive sheet, matrix is hard nonelastic, has under the weight of milling apparatus and stone surface is scratched
Possibility, the corase grind program of stone material is used only at present.
Resin matrix abrasive sheet, matrix phase is relatively low for hardness of stone, is suitable for corase grind, fine grinding and the polishing of stone material.
Epoxy resin and phenolic resin are that the main flow of current resin matrix grinding-material is selected, and the relatively easy province in processing technique
Thing so that resinous abrasive materials become existing market main flow species.But, either epoxy resin or phenolic resin, are solidifying
The of a relatively high problem of matrix hardness and density is there is also after molding so that matrix and abrasive particle are ground the patch on surface with stone material
It is right not high.And the heat produced when working also causes matrix to become sticky, the resin clamping degree higher to abrasive particle also causes mill
The self-sharpening of grain is not good enough.These defects are a common problems and bottleneck of current industry, and the grinding and polishing for causing stone material is imitated
Fruit does not increase significantly and breaks through in a longer period.
Polished silicon wafer based on polyurethane resin is applied to the technology of precision glass polishing and has had been reported that.Through document
Retrieval and market survey find that the functional form of existing this kind of polyurethane resin polished silicon wafer typically has two kinds：One kind is free from mill
Material, use as polished die and medium, for CMP chemically mechanical polishings；A kind of is containing cerium oxide abrasives, for optics
The high accuracy such as glass and semiconductor wafer is polished.If but second polished silicon wafer of market reaction is used for glass polishing, its operability
Not high with practicality, application of this polished silicon wafer to stone polishing also has no report and case.
Applicant has carried out multiple stone polishing test using above-mentioned this kind of polished silicon wafer.From in test, this kind of polished silicon wafer
Polishing effect for stone material is poor, and its prior art and technique are not appropriate for the grinding and polishing of stone material.Theoretically analyze, it is former
Therefore one is that the formula system of existing this kind of polished silicon wafer is only suitable only for glass or other crystallites and without the fine of brilliant body surface
Polishing；The two of reason are that the formula system of existing this kind of polished silicon wafer polyurethane resin causes matrix hardness and density to be not appropriate for
Stone material, the three of reason is the grinding and polishing that its abrasive system is not appropriate for stone material.
The content of the invention
The technical problem to be solved is to provide a kind of preparation side of polyurethane matrix stone grinding polished silicon wafer
Method, for the grinding and polishing of stone surface, with higher luster effect and working performance, it may have higher economic implications and
Social meaning.Firstth, matrix is made with polyurethane resin, abrasive disc can be made to be ground surface with stone material there is more preferable stickiness, ground
Grain has more preferable self-sharpening, there is lifting by a relatively large margin in effect and efficiency；Secondth, the stone of matrix is made with polyurethane resin
Material grinding and polishing piece is used for the renovation operation of stone floor, significantly improves in effect and efficiency；3rd, with polyurethane resin work
The stone grinding polished silicon wafer of matrix is used for the grinding and polishing of stone material, is particularly useful for the renovation grinding and polishing of stone floor, can save
Go to use the chemical polishing materials such as substantial amounts of polishing powder, reduce what these chemical polishing materials brought to environment and operating personnel
Pollution and injury.
In order to solve above-mentioned technical problem, technical scheme below is present invention employs.
A kind of preparation method of polyurethane matrix stone grinding polished silicon wafer, it is characterised in that follow the steps below：
1）, prepare component A：Polyether polyol, catalyst, chain extender, foaming agent and plasticizer are poured into respectively in proportion
In stainless steel and stir, obtain component A；
The mass ratio of polyether polyol, catalyst, chain extender, foaming agent and plasticizer is：100：0.3～5：1～6：0.5
～5：1～5；
Wherein described catalyst be tertiary amine catalyst either organometallic catalysts or tertiary amine catalyst with
The combination of organometallic catalysts arbitrary proportion；
2）, prepare B component：Default powder body abrasive material is poured in proportion in component A and is uniformly mixing to obtain B component；
The powder body abrasive material is diamond, carborundum, silicon oxide, aluminium oxide and Zinc Oxide according to mass ratio 100：0
～40,100：0～10,100：0～40,100：0～5 compositionss；
Mass ratio between component A and powder body abrasive material is 100：10～50；
3）, prepare stone grinding polished silicon wafer：Polyisocyanates, modified poly ethylene wax powder and reinforcing fiber are mixed in proportion
The quick stirring time of 15～45 seconds in B component is added to as component C, the intrinsic pressure mold forming of mould is subsequently poured into, last machinery
Section molding, obtains polyurethane matrix stone grinding polished silicon wafer；
Polyisocyanates wherein as component C, the mass ratio between modified poly ethylene wax powder and reinforcing fiber are：100：
0～5：0～5；
By adjusting the mass ratio between component A and component C, 0.1～0.5 gram/cm of density is obtained3, Shore A hardness 30～
85 stone grinding polished silicon wafer.
Step 1）Described polyether polyol is one or any in different degree of functionality low molecular polyether polyhydric alcohol
Ratio it is two or more；Described chain extender is the amine or alcohol compound of two degree of functionality small-molecular-weights；Described foaming agent
For physical blowing agent；Described plasticizer is aerosil.
Step 3）Described polyisocyanates is that how sub- toluene di-isocyanate(TDI), isophorone diisocyanate, polyaryl be
One or any ratio in the modifying diisocyanates of methyl isocyanate and degree of functionality 2～4 it is two or more；Described
Modified poly ethylene wax powder is polyamide modified Tissuemat E, as grinding aid and is used to improve the abrasion resistance of matrix；Described increasing
Strong fiber is glass fibre or synthetic fibers, used as the reinforcing agent of matrix；Quick stirring refer to the rotating speed of blender 1500～
In the range of 4500 revs/min.
Described foaming agent is pentane.
In the range of 300～2000, in 50～600mg KOH/g, degree of functionality 2～3 can for hydroxyl value for polyether polyol molecular weight
Choosing.
Step 1）Described catalyst is tertiary amine catalyst.
Step 2）The powder body abrasive material is powder body of the particle diameter in 0.5-350 m.
Step 3）In, the mass ratio between component A and component C is 100：60～110.
The positive effect of the present invention is：
1st, the polyurethane matrix produced by the present invention has appropriate steep that wall and abscess, and abrasive grains mix wherein, distribution
In the polyurethane steep that wall in multidimensional structure, rub stone surface under milling apparatus pressure and turning effort, while also having
Rule in different aspects constantly discharges new, the sharp abrasive particle with work surface.Abrasive particle has preferably from sharp
Property, thus abrasive disc has higher grinding effect and efficiency.
2nd, the polyurethane matrix produced by the present invention has appropriate pliability, with stone material under the pressure effect of milling apparatus
It is ground surface and there is fabulous laminating degree and appropriate abrasive action power, thus with higher grinding effect and efficiency.
3rd, the polyurethane matrix produced by the present invention has appropriate pliability and abscess.Operationally matrix surface and stone material
It is ground surface to fit completely, by the abscess that these are distributed in matrix different aspects so that blade surface is roughened all the time,
Self-sharpening is not only provided with, maximum functional surface area has been had more.And the abrasive particle that those split away off from matrix is at these
Constantly rub again with stone surface under the lapped face of roughening, realize it is secondary using and grind again, greatly improve
Grinding rate, thus with the grinding and polishing efficiency of optimal grinding polishing effect and Geng Gao.
4th, the polyurethane grinding and polishing piece produced by the present invention be with diamond powder body for main grinding and polishing because
Son, collocation mixed proper amount of carborundum, silicon oxide, aluminium oxide and Zinc oxide powder, to reach optimal grinding and polishing effect.People
It is one kind most hard in current stone grinding polishing material system to make diamond, and the relatively low abrasive material of appropriate hardness of arranging in pairs or groups is more
Meet grinding and polishing mechanism, effect and efficiency disclosure satisfy that maximization.
5th, the polyurethane grinding and polishing piece produced by the present invention with the addition of appropriate modification high-density polyethylene wax powder, not only
Make abrasive disc matrix more wear-resisting, but also can produce " microballon effect ", reduce abrasive disc and be ground the resistance on surface, improve
Grinding and polishing speed.
6th, polyurethane grinding and polishing piece proposed by the invention is a series of or a set of or one group or a piece of with independent work(
The grinding of energy or combination function and combination or the unit of polishing function, with the thick surface grinding for adapting to stone material or surface from coarse to fine
Grinding or the different requirements for arriving polishing process again from coarse to fine.It both can be ground compared with the abrasive disc of coarse grit from containing to stone material
It is flat to process, also can select containing being processed by shot blasting to the stone surface of low gloss compared with the abrasive disc of fine grit, also can select complete
Abrasive disc stone material is carried out it is from coarse to fine arrive high glaze again stone surface process.
Specific embodiment
The present invention is further illustrated with reference to embodiment and contrast experiment's effect.
Stone grinding polished silicon wafer of the present invention is followed the steps below：
1）, prepare component A：Polyether polyol, catalyst, chain extender, foaming agent and plasticizer are poured into respectively in proportion
In stainless steel and stir, obtain component A；
The mass ratio of polyether polyol, catalyst, chain extender, foaming agent and plasticizer is：100：0.3～5：1～6：0.5
～5：1～5；
Wherein described catalyst be tertiary amine catalyst either organometallic catalysts or tertiary amine catalyst with
The combination of organometallic catalysts arbitrary proportion；
2）, prepare B component：Default powder body abrasive material is poured in proportion in component A and is uniformly mixing to obtain B component；
The powder body abrasive material is diamond, carborundum, silicon oxide, aluminium oxide and Zinc Oxide according to mass ratio 100：0
～40,100：0～10,100：0～40,100：0～5 compositionss；
Mass ratio between component A and powder body abrasive material is 100：10～50；
3）, prepare stone grinding polished silicon wafer：Polyisocyanates, modified poly ethylene wax powder and reinforcing fiber are mixed in proportion
The quick stirring time of 15～45 seconds in B component is added to as component C, the intrinsic pressure mold forming of mould is subsequently poured into, last machinery
Section molding, obtains polyurethane matrix stone grinding polished silicon wafer；
Polyisocyanates wherein as component C, the mass ratio between modified poly ethylene wax powder and reinforcing fiber are：100：
0～5：0～5；
By adjusting the mass ratio between component A and component C, 0.1～0.5 gram/cm of density is obtained3, Shore A hardness 30～
85 stone grinding polished silicon wafer.
Step 3）In, the mass ratio between component A and component C is 100：60～110.
Wherein it is used to roughly grind the abrasive sheet in stage, the mass ratio between component A and component C is 100：90～110；
Wherein it is used for the abrasive sheet in fine grinding stage, the mass ratio between component A and component C is 100：80～100；
Wherein it is used to polish the abrasive sheet in stage, the mass ratio between component A and component C is 100：60～90.
Described polyether polyol is one kind and multiple combination of different degree of functionality low molecular polyether polyhydric alcohol, its molecule
Amount is optional in 300-2000, and its hydroxyl value is optional in 50-600 KOH/g.It is preferred that polyether triol of the hydroxyl value in 200-550 KOH/g.
The amine or alcohol compound of the optional two degrees of functionality small-molecular-weight of described chain extender, preferred ethylene glycol.
Described foaming agent be physical blowing agent, preferred pentane.
Described catalyst is one or more in tertiary amine catalyst and organo-metallic catalyst, and preferred tertiary amine is catalyzed
Agent dimethyl cyclohexyl amine.
Described plasticizer be micro-size silica powder, preferred aerosil micro mist.
Described abrasive ingredients are therein by artificial stone diamond and carborundum, silicon oxide, aluminium oxide and zinc oxide ultra_fine powderses
One or more combination.
Wherein m -350 m of diamond Abrasive Particle Size 0.2 are optional.For making artificial diamond's stone grinder of corase grind abrasive disc
Grain particle diameter preferably 100 m -350 m；For making diamond Abrasive Particle Size preferably 100 m -25 m of fine grinding abrasive disc；With
In diamond Abrasive Particle Size preferably 25 m -1 m for making polished silicon wafer；
Wherein m -100 m of silicon carbide powder particle diameter 20 are optional, m -50 m of preferable particle size 20.
Wherein m -20 m of silica powder particle diameter 0.1 are optional, m -10 m of preferable particle size 1.
Wherein alumina powder jointed m -20 m of particle diameter 0.1 are optional, m -10 m of preferable particle size 1.
Wherein m -50 m of Zinc oxide powder particle diameter 1.5 are optional, m -10 m of preferable particle size 2.
Described polyisocyanates is that toluene di-isocyanate(TDI), isophorone diisocyanate, polyaryl polymethylene are different
One or any ratio in the modifying diisocyanates of cyanate and degree of functionality 2-4 it is two or more.It is preferred that average sense
Degree is more than Carbodiimide-Modified liquefied mdi of 2, the NCO mass fractions in 28%-30%.
Described modified polyethylene wax be polyamide modified Natene, micropowder shape, density 0.95-1.Preferred density
For 0.97, particle diameter D50：5.5-7um.
Described reinforcing fiber be polypropylene fibre, length 3-12mm.Preferred length is 6mm.
The density 0.1-0.5 gram/cm of stone grinding polished silicon wafer prepared by the present invention3；Shore A hardness 30-85, monolithic or
Group or multigroup function combinations.
The following is the present invention specifically prepares example.
Example one
The manufacture method that this example provides one group of marble grinding and polishing piece, by abrasive size used it is different produce 1#, 2#,
3#, 4#, 5#, 6#, 7# possess the abrasive disc combination of corase grind, fine grinding and polishing function.
（One）, prefabricated component A：With polyether triol（Mean molecule quantity 350, hydroxyl value 500）100 grams, tertiary amine catalyst diformazan
3 grams of basic ring hexylamine, 5 grams of glycol chain extender, 1.5 grams of foaming agent pentane, 5 grams of plasticizer aerosil micro mist, sequentially mix
Conjunction stirs stand-by.7 parts of the prefabricated identical component A of this example, for producing 1-7# abrasive disc groups.
（Two）, prepare B component：15 grams of 35 grams of metering 270-300 m diamonds abrasive particle and 30-35 m carbonizations silicon powder
As 1# abrasive materials；15 grams of 35 grams of metering 125-150 m diamonds abrasive particle and 30-35 m carbonizations silicon powder are used as 2# abrasive materials；
15 grams of 35 grams of metering 50-60 m diamonds abrasive particle and 30-35 m carbonizations silicon powder are used as 3# abrasive materials；Metering 25-30 m people
35 grams of diamond abrasive grain is made as 4# abrasive materials；35 grams of metering 12-15 m diamonds abrasive particle is used as 5# abrasive materials；Metering 4-6 m
35 grams of diamond abrasive particle is used as 6# abrasive materials；35 grams of metering 1-3 m diamonds abrasive particle is used as 7# abrasive materials.
（Three）, prepare C components：A kind of commercial carbonized diimine be modified 110 grams of liquefied mdi, polyamide modified high density gather
3.5 grams of ethylene waxes micropowder, 3 grams of polypropylene fibre, sequentially mixing and stirring is stand-by.Prefabricated 7 parts of the identical C components of this example, use
In producing 1#-7# abrasive disc groups.
（Four）, the B component 1# abrasive material for measuring mixed with a component A, stirred using electric blender.Again will
The C component portions for measuring are poured in above-mentioned AB mixture, using the quick mix homogeneously of electric blender, are subsequently poured in mould
Foaming is stand-by.
（Five）, by the 1# polyurethane foams of foaming according to design specification section molding, formed 1# grinding and polishings
Piece into
Product, and carry out labelling.
（Six）, respectively successively from the abrasive material component of remaining 6 specification of B component, mix with a component A, then with a C
Component mixes.Thus other 6 2#-7# grinding and polishing pieces are produced, and carries out respective markers respectively.
Example two
（One）Example two is adopted and the identical component A of example one and B component dispensing.Same A, B component each prefabricated seven
Part.
（Two）Polyamide modified high density polyethylene waxes powder and polypropylene fibre in the C components of example one are cut.It is same pre-
Seven parts of system.
（Three）1-7# grinding and polishing piece groups are produced using with the identical technique of example one and program.
Example three
（One）Example three is adopted and the identical component A of example one and C component dispensings.The each prefabricated portion of A, C component.
（Two）The B component of example three only with 7# abrasive material identical dispensings, i.e. 1-3 m artificial diamonds in the B component of example one
35 grams of stone grinder grain.The prefabricated portion of B component.
（Three）7# polished silicon wafers are produced using with the identical technique of example one and program.
（Four）The 7# grinding and polishings piece that example three is produced can be individually used for stone grinding as the polishing material of standalone feature
Polishing link, to substitute existing commercially available polished silicon wafer and polishing powder.
The experimental results and contrast test that the following is example one, example two and example three tested result.
Experiment test one
To being worn, the marble floor that loss of gloss is serious re-grind polishing, do renovation process.Milling apparatus adopt 12
Head floor grinding machine（12 abrasive discs are installed, rotating speed is 580 revs/min）, the polyurethane grinding and polishing piece for coordinating example one to produce
Marble floors of the 1-7# successively to being worn carries out renovating grinding and polishing.
Being respectively mounted 1# grinding and polishings piece and each 12 of 2# grinding and polishing pieces carries out coarse grinding treatment, grinder propulsion to floor
Speed be about 20 ms/min, often row marble grind two back and forth.
Be respectively mounted each 12 of 3# grinding and polishing pieces, 4# grinding and polishings piece and 5# grinding and polishing pieces is carried out at fine grinding to floor
Reason, the speed of grinder propulsion is about 30 ms/min, and often row marble grinds two back and forth.
It is respectively mounted 6# grinding and polishings piece and each 12 of 7# grinding and polishing pieces is processed by shot blasting to floor, grinder propulsion
Speed be about 25 ms/min, often row marble grind two back and forth.
The marble surface gloss before and after grinding is measured using mirror luster instrument.10 pieces of plate faces of random test, every piece of plate face
5 points of test, calculate average gloss.The results are shown in Table 1.
Table 1
Experiment test two
With being worn of the same area of experiment test one, the marble floor that loss of gloss is serious re-grinds polishing, turn over
It is new to process.
Using the polyurethane grinding and polishing 1- produced with experiment test one identical, 12 floor grinding machines, cooperation example two
Marble floors of the 7# successively to being worn carries out renovating grinding and polishing, and fltting speed and technique and the experiment of grinder are surveyed
Try one identical.
The measurement of luster method of experiment test two is identical with experiment test one, as a result table 2.
Table 2
Contrast test one
With being worn of the same area of experiment test one, the marble floor that loss of gloss is serious re-grinds polishing, turn over
It is new to process.
Using with experiment test one identical, 12 floor grinding machines, coordinate commercial phenolic resin soft abrasive disk 1-7#（Equally
With corase grind, fine grinding and polishing function, for marble floor grinding and polishing）Successively the marble floor to being worn is carried out
Renovation grinding and polishing.
The fltting speed and technique of grinder is identical with experiment test one.
The measurement of luster method of contrast test one is identical with experiment test one, the results are shown in Table 3.
Table 3
Contrast test two
10 square metres of area is selected in the region after the grinding and polishing of contrast test one, is used and experiment test one
Identical
12 floor grinding machines, with the use of the 7# grinding and polishing pieces that example three is produced（Use as independent polishing function）
Re-polishing is carried out to marble floor.
The fltting speed and technique of grinder is identical with experiment test one.
The measurement of luster method of contrast test two is identical with experiment test one, the results are shown in Table 4.
Table 4
Contrast test three
10 square metres of area is selected in the region after the grinding and polishing of contrast test one, is thrown using disc shape floor board
Ray machine（Rotating speed is 175 revs/min）Re-polishing is carried out to marble floor with the use of commercially available marble polishing powder.Polishing velocity
About 2 square metres/3 minutes.Clean out polishing powder serosity.
The measurement of luster method of contrast test three is identical with experiment test one, the results are shown in Table 5.
Table 5
Contrast test four
Remaining 10 square metres of areas are selected in the region after the grinding and polishing of contrast test one, using disc type ground
Plate-polishing machine（Rotating speed is 175 revs/min）, with the use of a kind of commercially available precision glass polyurethane polishing disc（Containing particle diameter 0.8-2
M cerium oxide）Re-polishing is carried out to marble floor.Polishing velocity is about 2 square metres/5 minutes.The gloss of contrast test four is surveyed
Method for testing is identical with experiment test one, the results are shown in Table 6.
Table 6
Experiment test and contrast test result are summarized：
By examples detailed above test and contrast test, it is apparent that the new polyurethane stone grinding produced of the present invention
Polished silicon wafer not only has significant grinding polishing effect, and more has higher work efficiency, solves and compensate for existing stone material
Gloss has the problem of the not enough and inefficiency of larger difference than raw sheet when floor is renovated, and also eliminates using polishing powder to making
The harm that industry personnel and environment bring.
1st, by experiment test one and the Comparative result of experiment test two, the grinding that example one and example two are produced is reflected
Difference of the polished silicon wafer in performance.Example one add modified poly ethylene wax powder to the effect of grinding and polishing piece of the present invention, efficiency and
Ruggedness has preferably to be improved.
2nd, found out by the test result of experiment test one, experiment test two and contrast test one, it is new that the present invention is produced
Type polyurethane stone grinding polished silicon wafer increases significantly with existing market main flow phenolic resin grinding and polishing piece in effect.
3rd, found out by experiment test one, experiment test two and contrast test two, the test result of contrast test three, this
The bright new polyurethane stone grinding polished silicon wafer produced and existing market main flow grinding and polishing piece plus the method for marble polishing powder
Not only luster effect is high, and has significant advantage in efficiency.The way of prior art is generally exactly contrast test one and right
Than the combination of test three.But from effect and efficiency, the experiment test one of the present invention（Example one）With experiment test two（It is real
Example two）Result be significantly larger than existing way.From in terms of single polishing program, either effect or efficiency, of the invention
Contrast test two（Example three）Obviously higher than existing polishing powder（Contrast test three）.
4th, found out by the test result of contrast test one, contrast test two and contrast test three, the 7# that example three is produced
Grinding and polishing piece is used as the polished silicon wafer with independent polishing function, equally with significant effect and efficiency.
5th, found out by the test result of contrast test four, it is existing it is commercially available containing cerium oxide abrasive particle for precision glass
Polyurethane polishing disc Deng polishing does not have obvious effect and efficiency for the polishing of stone material.
Explanation：
1st, the novel polyurethane grinding and polishing piece that examples detailed above is produced, density is 0.35-0.42 gram/cm3, shore hardness A
For 60-80.
2nd, can add appropriate coloring agent to obtain different colours according to different specifications or model when above-mentioned abrasive disc is produced
Abrasive disc,
Be conducive to distinguishing different size and model.
3rd, examples detailed above material therefor and combination, do not represent the whole the present invention relates to technology.
4th, new grinding polished silicon wafer of the present invention, can according to the kind of stone material and hardness, adjust A, B, in component C material into
Point, the density and hardness of mixing ratio, specification and foam base plate, to obtain optimum efficiency and efficiency.
5th, grinding disk of the present invention, can adjust the profile and specification of abrasive disc, install for the large-scale of processing of stone factory specialty
Grinder is used for the grinding and polishing of large stone material plate.
Claims (6)
1. a kind of preparation method of polyurethane matrix stone grinding polished silicon wafer, it is characterised in that follow the steps below：
1）, prepare component A：Polyether polyol, catalyst, chain extender, foaming agent and plasticizer are poured into respectively in proportion mixing
In container and stir, obtain component A；
The mass ratio of polyether polyol, catalyst, chain extender, foaming agent and plasticizer is：100：0.3～5：1～6：0.5～5：
1～5；
Wherein described catalyst be tertiary amine catalyst either organometallic catalysts or tertiary amine catalyst with it is organic
The combination of metal-based catalysts arbitrary proportion；
2）, prepare B component：Default powder body abrasive material is poured in proportion in component A and is uniformly mixing to obtain B component；
The powder body abrasive material is diamond, carborundum, silicon oxide, aluminium oxide and Zinc Oxide according to mass ratio 100：0～40：
0～10：0～40：0～5 compositionss；
Mass ratio between component A and powder body abrasive material is 100：10～50；
3）, prepare stone grinding polished silicon wafer：Polyisocyanates, modified poly ethylene wax powder and reinforcing fiber are mixed in proportion as
Component C is added to the quick stirring time of 15～45 seconds in B component, is subsequently poured into the intrinsic pressure mold forming of mould, last machinery section
Molding, obtains polyurethane matrix stone grinding polished silicon wafer；
Polyisocyanates wherein as component C, the mass ratio between modified poly ethylene wax powder and reinforcing fiber are：100：0～
5：0～5；
Mass ratio between adjustment component A and component C is 100：60～110, obtain 0.1～0.5 gram/cm of density3, Shore A hardness
30～85 stone grinding polished silicon wafer.
2. the preparation method of polyurethane matrix stone grinding polished silicon wafer as claimed in claim 1, it is characterised in that：Step 1）Institute
The polyether polyol stated is the two or more of the one or any ratio in different degree of functionality low molecular polyether polyhydric alcohol；Institute
The chain extender stated is the amine or alcohol compound of two degree of functionality small-molecular-weights；Described foaming agent is physical blowing agent；It is described
Plasticizer be aerosil.
3. the preparation method of polyurethane matrix stone grinding polished silicon wafer as claimed in claim 1, it is characterised in that：Step 3）Institute
The polyisocyanates stated is toluene di-isocyanate(TDI), isophorone diisocyanate, polyaryl polymethylene isocyanates and official
One or any ratio in the modifying diisocyanates of energy degree 2～4 it is two or more；Described modified poly ethylene wax powder is
Polyamide modified Tissuemat E, as grinding aid and for improving the abrasion resistance of matrix；Described reinforcing fiber is glass fibre
Or synthetic fibers, as the reinforcing agent of matrix；Quick stirring refers to the rotating speed of blender in 1500～4500 revs/min of scopes
It is interior.
4. the preparation method of polyurethane matrix stone grinding polished silicon wafer as claimed in claim 2, it is characterised in that：Described sends out
Infusion is pentane.
5. the preparation method of polyurethane matrix stone grinding polished silicon wafer as claimed in claim 2, it is characterised in that：Polyether polyols
In the range of 300～2000, hydroxyl value is in 50～600mg KOH/g, and degree of functionality 2～3 is optional for alcohol molecular weight.
6. the preparation method of polyurethane matrix stone grinding polished silicon wafer as claimed in claim 1, it is characterised in that：Step 2）Institute
It is powder body of the particle diameter in 0.5-350 m to state powder body abrasive material.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610719365.9A CN106272125B (en) | 2016-08-25 | 2016-08-25 | Preparation method of polyurethane matrix stone grinding and polishing disc |
| CN201710377504.9A CN107127691B (en) | 2016-08-25 | 2016-08-25 | Polyurethane matrix stone grinding polished silicon wafer and preparation method thereof |
| PCT/CN2017/098586 WO2018036502A1 (en) | 2016-08-25 | 2017-08-23 | Polyurethane matrix stone grinding and polishing pad and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610719365.9A CN106272125B (en) | 2016-08-25 | 2016-08-25 | Preparation method of polyurethane matrix stone grinding and polishing disc |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710377504.9A Division CN107127691B (en) | 2016-08-25 | 2016-08-25 | Polyurethane matrix stone grinding polished silicon wafer and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106272125A CN106272125A (en) | 2017-01-04 |
| CN106272125B true CN106272125B (en) | 2017-04-19 |
Family
ID=57616105
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710377504.9A Active CN107127691B (en) | 2016-08-25 | 2016-08-25 | Polyurethane matrix stone grinding polished silicon wafer and preparation method thereof |
| CN201610719365.9A Active CN106272125B (en) | 2016-08-25 | 2016-08-25 | Preparation method of polyurethane matrix stone grinding and polishing disc |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710377504.9A Active CN107127691B (en) | 2016-08-25 | 2016-08-25 | Polyurethane matrix stone grinding polished silicon wafer and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN107127691B (en) |
| WO (1) | WO2018036502A1 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107127691B (en) * | 2016-08-25 | 2018-03-23 | 王建秋 | Polyurethane matrix stone grinding polished silicon wafer and preparation method thereof |
| CN106938446A (en) * | 2017-04-14 | 2017-07-11 | 龙口东润砂轮有限公司 | Polyurethane emery wheel |
| CN107674304A (en) * | 2017-10-17 | 2018-02-09 | 昆山纳诺新材料科技有限公司 | Thermoplasticity abrasive material and its manufacture method are used in a kind of hard alloy polishing |
| CN108247529B (en) * | 2018-04-02 | 2020-11-10 | 上海欧柏森环境工程管理有限公司 | Stone polishing, crystallizing, grinding and cleaning pad |
| CN108747863B (en) * | 2018-06-01 | 2020-09-11 | 上海欧柏森环境工程管理有限公司 | Polishing and crystallizing cleaning pad for combined stone |
| CN110271184A (en) * | 2019-05-04 | 2019-09-24 | 西北农林科技大学 | A kind of complex curved surface parts Special precision grinding and polishing piece and its 3D printing preparation method |
| CN111171271B (en) * | 2020-02-25 | 2022-08-19 | 广州市环友高分子新材料有限公司 | Preparation method of heat-resistant polyurethane elastomer |
| CN111690113B (en) * | 2020-07-30 | 2022-02-11 | 安徽大松树脂有限公司 | Preparation method of microporous diamond elastic module resin |
| CN113787468A (en) * | 2021-09-15 | 2021-12-14 | 王文婷 | Polyurethane matrix wear-resistant stone polishing material and preparation method thereof |
| CN113956421A (en) * | 2021-11-16 | 2022-01-21 | 上海映智研磨材料有限公司 | Polyurethane polishing pad material and preparation method and application thereof |
| CN114952643A (en) * | 2022-05-25 | 2022-08-30 | 成都贝瑞光电科技股份有限公司 | Manufacturing method of fixed abrasive polishing asphalt disc |
| CN115319649B (en) * | 2022-09-03 | 2023-08-04 | 深圳市永霖科技有限公司 | PU polishing sand paper for glass polishing and preparation method thereof |
| CN116144166B (en) * | 2023-04-23 | 2023-08-01 | 山西中格矿山机械有限公司 | Impact-resistant and wear-resistant polyurethane plate and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101228216A (en) * | 2005-07-20 | 2008-07-23 | 株式会社Skc | Polishing pad containing interpenetrating liquified vinyl monomer network with polyurethane matrix therein |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6802877B2 (en) * | 2001-04-20 | 2004-10-12 | Thomas J. Drury | Polyvinyl acetal composition roller brush with abrasive outer surface |
| CN2487501Y (en) * | 2001-05-23 | 2002-04-24 | 霍锦煊 | Composite grinding block |
| CN1230280C (en) * | 2001-05-25 | 2005-12-07 | 惠安县三利源磨具厂 | Stone polishing abrasive tool |
| CN104057403B (en) * | 2013-03-23 | 2016-12-28 | 厦门宇信金刚石工具有限公司 | A kind of preparation method of the epoxy resin binder diamond grinding tool with high polishing performance |
| CN104175244B (en) * | 2013-05-22 | 2016-12-28 | 北京斯科瑞化工有限公司 | A kind of method preparing novel polishing wheel |
| CN107127691B (en) * | 2016-08-25 | 2018-03-23 | 王建秋 | Polyurethane matrix stone grinding polished silicon wafer and preparation method thereof |
-
2016
- 2016-08-25 CN CN201710377504.9A patent/CN107127691B/en active Active
- 2016-08-25 CN CN201610719365.9A patent/CN106272125B/en active Active
-
2017
- 2017-08-23 WO PCT/CN2017/098586 patent/WO2018036502A1/en active Application Filing
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101228216A (en) * | 2005-07-20 | 2008-07-23 | 株式会社Skc | Polishing pad containing interpenetrating liquified vinyl monomer network with polyurethane matrix therein |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107127691A (en) | 2017-09-05 |
| CN106272125A (en) | 2017-01-04 |
| WO2018036502A1 (en) | 2018-03-01 |
| CN107127691B (en) | 2018-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106272125B (en) | Preparation method of polyurethane matrix stone grinding and polishing disc | |
| KR102117902B1 (en) | Soft and conditionable chemical mechanical polishing pad | |
| KR101929055B1 (en) | Acrylate polyurethane chemical mechanical polishing layer | |
| TWI602647B (en) | Chemical mechanical polishing layer formulation with conditioning tolerance and method of chemical mechanical polishing substrate | |
| JP2017052079A (en) | Manufacturing method for composite polishing layer for chemical polishing pad | |
| KR20110010573A (en) | Multi-functional polishing pad | |
| TW201515770A (en) | Soft and conditionable chemical mechanical window polishing pad | |
| TWI574793B (en) | Soft and conditionable chemical mechanical polishing pad stack | |
| KR100963968B1 (en) | Polishing pad and manufacturing method of the same | |
| JP6783563B2 (en) | How to make a polishing layer for a chemical mechanical polishing pad | |
| CN114560989A (en) | Polishing pad based on low-free polyurethane prepolymer and preparation method thereof | |
| CN104302446B (en) | From conditioning polishing pad and preparation method thereof | |
| KR102527087B1 (en) | Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity | |
| CN106607772B (en) | Grinding tool | |
| CN113199414A (en) | Ceramic polishing grinding tool and preparation method thereof | |
| US6949589B2 (en) | Elastic foamed grinder material and method for producing the same | |
| CN108789135B (en) | Chemical mechanical polishing pads | |
| CN113787468A (en) | Polyurethane matrix wear-resistant stone polishing material and preparation method thereof | |
| CN108136563A (en) | It polymerize polishing material, the medium comprising polymerization polishing material and system and its formation and application method | |
| CN114986260A (en) | Method for grinding roller and mirror roller | |
| CN106695587B (en) | The manufacturing method of grinding tool | |
| KR102477528B1 (en) | Chemical mechanical polishing pad and method of making same | |
| CN206287032U (en) | A kind of grinding tool | |
| CN106607776B (en) | The manufacturing method of grinding tool with multi-layer heat dissipation layer | |
| JP5738728B2 (en) | Polishing pad |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |