CN106252291A - A kind of integrated circuit squash type packaging system - Google Patents
A kind of integrated circuit squash type packaging system Download PDFInfo
- Publication number
- CN106252291A CN106252291A CN201610865047.3A CN201610865047A CN106252291A CN 106252291 A CN106252291 A CN 106252291A CN 201610865047 A CN201610865047 A CN 201610865047A CN 106252291 A CN106252291 A CN 106252291A
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- CN
- China
- Prior art keywords
- packaging system
- integrated circuit
- base unit
- lid
- squash type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses a kind of integrated circuit squash type packaging system, including packaging system base unit, packaging system lid, sealing ring, fixing buckle and integrated circuit firm banking, wherein packaging system base unit is positioned at the bottom of integrated circuit squash type packaging system, packaging system lid lid is contained in the top of packaging system base unit, it is provided with sealing ring between packaging system base unit and packaging system lid, fixing buckle is arranged on the both sides of integrated circuit squash type packaging system, by packaging system base unit, packaging system lid and sealing ring are tightly secured together, integrated circuit firm banking is arranged on the bottom of packaging system base unit, integrated circuit is fixedly mounted on integrated circuit firm banking；Packaging system lid includes encapsulation cover plate.The packaging system of the present invention uses elastic crushing block that the surface-mounted integrated circuit in enclosure carries out elastic extruding location, it is to avoid the movement of surface-mounted integrated circuit, its simple in construction, it is simple to encapsulation.
Description
Technical field:
The present invention relates to integrated antenna package technical field, be specifically related to a kind of integrated circuit squash type packaging system.
Background technology:
Integrated antenna package is the development with integrated circuit, along with aerospace, aviation, machinery, light industry, chemical industry
Etc. the development of all trades and professions, complete machine is also towards multi-functional, miniaturization development.This just requires that integrated circuit integrated level is more
Coming the highest, function becomes increasingly complex.Requiring that integrated antenna package density is increasing accordingly, lead-in wire is more and more, and volume
More and more less, weight is increasingly lighter, updates increasingly faster, and the reasonability of encapsulating structure and science will directly affect integrated
The quality of circuit.
Surface-mounted integrated circuit is contained in enclosure by existing integrated antenna package, and the size of enclosure can compare integrated circuit
The size of plate is slightly larger, surface-mounted integrated circuit it may happen that in enclosure the problem of movement.
Summary of the invention:
The purpose of the present invention is aiming at the deficiencies in the prior art, it is provided that a kind of integrated circuit squash type packaging system, should
TV bench can.
The technology solution of the present invention is as follows:
A kind of integrated circuit squash type packaging system includes packaging system base unit, packaging system lid, sealing ring, fixes
Buckle and integrated circuit firm banking, wherein packaging system base unit is positioned at the end of integrated circuit squash type packaging system
End, packaging system lid lid is contained in the top of packaging system base unit, sets between packaging system base unit and packaging system lid
Being equipped with sealing ring, fixing buckle is arranged on the both sides of integrated circuit squash type packaging system, by packaging system base unit, encapsulation
Appliance cover and sealing ring are tightly secured together, and integrated circuit firm banking is arranged on the bottom of packaging system base unit, collection
Circuit is become to be fixedly mounted on integrated circuit firm banking；Packaging system lid includes encapsulation cover plate, and the top of encapsulation cover plate is provided with
Packaging system lid radiating block, is provided with packaging system lid mounting blocks at the corner, bottom of encapsulation cover plate, the both sides of encapsulation cover plate are offered
There is the second buckle mounting groove；It is T-shaped slideway that the inner side of packaging system lid radiating block is provided with two cross sections, each slideway
Upper the most adjustable being provided with two elastic crushing blocks, elastic crushing block bottom is Pop-up locating dowel, bottom Pop-up locating dowel
Offering the T-shaped fluting matched with slideway, elastic crushing block top is buffer protection set；Packaging system lid is metal material,
Offer cap cavity in packaging system lid radiating block, in cap cavity, be filled with conduction oil.
Packaging system base unit is metal material, is evenly distributed with heat dissipation metal in the bottom of packaging system base unit
Raised line, is provided with packaging system lid installing hole, in packaging system base unit in packaging system base unit at corner
Both sides offer the first buckle mounting groove.
Packaging system base unit is hollow structure, and the bottom of packaging system base unit offers lower hollow chamber,
Lower hollow intracavity is filled with conduction oil.
Sealing ring material is hydrogenated nitrile-butadiene rubber, is provided with mounting blocks punched out at the corner of sealing ring, sealing ring
Middle side part has breach.
Integrated circuit firm banking includes gripper shoe, supporting seat and integrated circuit card seat, and the corner of gripper shoe is offered
Having connecting hole, supporting seat to be arranged in connecting hole, the bottom surface of supporting seat is fixed on the bottom of packaging system base unit,
Gripper shoe top is symmetrically arranged with integrated circuit card seat, and being internally provided with of integrated circuit card seat can be with different size integrated circuit
The stepped fixture block matched.
Integrated circuit is connected with the external world by lead-in wire, and lead-in wire is passed by breach in the middle part of sealing ring.
The beneficial effects of the present invention is: the packaging system of the present invention uses elastic crushing block to the integrated electricity in enclosure
Road plate carries out elastic extruding location, it is to avoid the movement of surface-mounted integrated circuit, its simple in construction, it is simple to encapsulation.
Accompanying drawing illustrates:
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the structural representation of packaging system lid；
Fig. 3 is the structure sectional view of packaging system lid；
Fig. 4 is the structural representation taking off packaging system lid；
Fig. 5 is the structural representation of packaging system base unit；
Fig. 6 is the structure sectional view of packaging system base unit；
Fig. 7 is the structural representation of integrated circuit firm banking；
Fig. 8 is the structural representation at another visual angle of integrated circuit firm banking.
Detailed description of the invention:
Understandable, below in conjunction with the accompanying drawings to this in order to enable the above-mentioned purpose of the present invention, feature and advantage to become apparent from
Bright detailed description of the invention is described in detail.
As shown in figures 1-8, a kind of integrated circuit squash type packaging system includes packaging system base unit 1, packaging system
Lid 2, sealing ring 4, fixing buckle 3 and integrated circuit firm banking 5, wherein packaging system base unit 1 is positioned at integrated circuit
The bottom of squash type packaging system, packaging system lid 2 lid is contained in the top of packaging system base unit 1, single bottom packaging system
Being provided with sealing ring 4 between unit 1 and packaging system lid 2, fixing buckle 3 is arranged on the two of integrated circuit squash type packaging system
Side, is tightly secured together packaging system base unit 1, packaging system lid 2 and sealing ring 4, and integrated circuit firm banking 5 is pacified
Being contained in the bottom of packaging system base unit 1, integrated circuit 6 is fixedly mounted on integrated circuit firm banking 5；Packaging system lid
2 include that encapsulation cover plate 21, the top of encapsulation cover plate 21 are provided with packaging system lid radiating block 22, at the corner, bottom of encapsulation cover plate 21
Being provided with packaging system lid mounting blocks 23, the both sides of encapsulation cover plate 21 offer the second buckle mounting groove 24；Dissipate at packaging system lid
It is T-shaped slideway 25 that the inner side of hot block 22 is provided with two cross sections, adjustable on each slideway 25 is provided with two elasticity
Crushing block 26, elastic crushing block 26 bottom is Pop-up locating dowel, offers and match with slideway 25 bottom Pop-up locating dowel
T-shaped fluting, elastic crushing block 26 top is buffer protection set 261；Packaging system lid 2 is metal material, and packaging system lid dissipates
Offer cap cavity 221 in hot block 22, in cap cavity 221, be filled with conduction oil.
Packaging system base unit 1 is metal material, is evenly distributed with metal in the bottom of packaging system base unit 1 and dissipates
Hot raised line 11, is provided with packaging system lid installing hole 13, bottom packaging system in packaging system base unit 1 at corner
The both sides of unit 1 offer the first buckle mounting groove 14.
Packaging system base unit 1 is hollow structure, and the bottom of packaging system base unit 1 offers lower hollow chamber
12, in lower hollow chamber 12, it is filled with conduction oil.
Sealing ring 4 material is hydrogenated nitrile-butadiene rubber, is provided with mounting blocks punched out, the one of sealing ring 4 at the corner of sealing ring 4
There is in the middle part of avris breach.
Integrated circuit firm banking 5 includes gripper shoe 51, supporting seat 52 and integrated circuit card seat 53, gripper shoe 51
Corner offers connecting hole, and supporting seat 52 is arranged in connecting hole, and the bottom surface of supporting seat 52 is fixed on bottom packaging system
The bottom of unit 1, is symmetrically arranged with integrated circuit card seat 53, being internally provided with of integrated circuit card seat 53 on gripper shoe 51 top
The stepped fixture block 531 that can match with different size integrated circuit.
Integrated circuit 6 is connected with the external world by lead-in wire 61, and lead-in wire 61 is passed by breach in the middle part of sealing ring.
Described embodiment is in order to the illustrative present invention, not for limiting the present invention.Any those skilled in the art
All described embodiment can be modified, therefore the rights protection model of the present invention under the spirit and the scope of the present invention
Enclose, should be as listed by the claim of the present invention.
Claims (6)
1. an integrated circuit squash type packaging system, it is characterised in that: include packaging system base unit (1), packaging system
Lid (2), sealing ring (4), fixing buckle (3) and integrated circuit firm banking (5), wherein packaging system base unit (1) position
In the bottom of integrated circuit squash type packaging system, packaging system lid (2) lid is contained in the top of packaging system base unit (1),
Being provided with sealing ring (4) between packaging system base unit (1) and packaging system lid (2), fixing buckle (3) is arranged on integrated electricity
The both sides of road squash type packaging system, are tightly fastened packaging system base unit (1), packaging system lid (2) and sealing ring (4)
Together, integrated circuit firm banking (5) is arranged on the bottom of packaging system base unit (1), and integrated circuit (6) fixedly mounts
On integrated circuit firm banking (5)；Packaging system lid (2) includes that encapsulation cover plate (21), the top of encapsulation cover plate (21) are provided with
Packaging system lid radiating block (22), is provided with packaging system lid mounting blocks (23), cap at the corner, bottom of encapsulation cover plate (21)
The both sides of plate (21) offer the second buckle mounting groove (24)；The inner side of packaging system lid radiating block (22) is provided with two horizontal strokes
Cross section is T-shaped slideway (25), and each slideway (25) is the most adjustable is provided with two elastic crushing blocks (26), elastic crushing block
(26) bottom is Pop-up locating dowel, offers the T-shaped fluting matched with slideway (25) bottom Pop-up locating dowel, elastic crowded
Briquetting (26) top is buffer protection set (261)；Packaging system lid (2) is metal material, in packaging system lid radiating block (22)
Offer cap cavity (221), in cap cavity (221), be filled with conduction oil.
A kind of integrated circuit squash type packaging system the most according to claim 1, it is characterised in that: single bottom packaging system
Unit (1) is metal material, is evenly distributed with heat dissipation metal raised line (11) in the bottom of packaging system base unit (1), in encapsulation
At corner, it is provided with packaging system lid installing hole (13), in the two of packaging system base unit (1) on bottom of device unit (1)
Side offers the first buckle mounting groove (14).
A kind of integrated circuit squash type packaging system the most according to claim 1, it is characterised in that: single bottom packaging system
Unit (1) is hollow structure, and the bottom of packaging system base unit (1) offers lower hollow chamber (12), in lower hollow chamber
(12) conduction oil it is filled with in.
A kind of integrated circuit squash type packaging system the most according to claim 1, it is characterised in that: sealing ring (4) material
For hydrogenated nitrile-butadiene rubber, being provided with mounting blocks punched out at the corner of sealing ring (4), the middle side part of sealing ring (4) has scarce
Mouthful.
A kind of integrated circuit squash type packaging system the most according to claim 1, it is characterised in that: integrated circuit fixes the end
Seat (5) includes gripper shoe (51), supporting seat (52) and integrated circuit card seat (53), and the corner of gripper shoe (51) offers even
Connecing hole, supporting seat (52) is arranged in connecting hole, and the bottom surface of supporting seat (52) is fixed on packaging system base unit (1)
Bottom, is symmetrically arranged with integrated circuit card seat (53), being internally provided with of integrated circuit card seat (53) on gripper shoe (51) top
The stepped fixture block (531) that can match with different size integrated circuit.
A kind of integrated circuit squash type packaging system the most according to claim 1, it is characterised in that: integrated circuit (6) leads to
Crossing lead-in wire (61) to be connected with the external world, lead-in wire (61) is passed by breach in the middle part of sealing ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610865047.3A CN106252291B (en) | 2016-09-25 | 2016-09-25 | A kind of integrated circuit squash type packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610865047.3A CN106252291B (en) | 2016-09-25 | 2016-09-25 | A kind of integrated circuit squash type packaging system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106252291A true CN106252291A (en) | 2016-12-21 |
| CN106252291B CN106252291B (en) | 2018-09-14 |
Family
ID=57611953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610865047.3A Active CN106252291B (en) | 2016-09-25 | 2016-09-25 | A kind of integrated circuit squash type packaging system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106252291B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109649836A (en) * | 2018-11-09 | 2019-04-19 | 惠州市华星光电技术有限公司 | Liquid crystal panel-packaging box with bolster |
| CN111128924A (en) * | 2019-12-20 | 2020-05-08 | 天津智安微电子技术有限公司 | Integrated circuit packaging structure |
| CN113471150A (en) * | 2021-07-08 | 2021-10-01 | 李琴 | Integrated circuit package |
Citations (5)
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|---|---|---|---|---|
| CN102347289A (en) * | 2010-07-30 | 2012-02-08 | 赛米控电子股份有限公司 | Power conductor module having at least one positioning apparatus for substrate |
| CN102364676A (en) * | 2011-11-30 | 2012-02-29 | 江苏宏微科技有限公司 | Packaging shell structure for semiconductor power module |
| CN103208463A (en) * | 2013-04-24 | 2013-07-17 | 湖南大学 | Heat sink material element with box-type structure and manufacturing method thereof |
| US20140306329A1 (en) * | 2013-04-15 | 2014-10-16 | Kabushiki Kaisha Toshiba | Semiconductor package |
| US20150216038A1 (en) * | 2014-01-28 | 2015-07-30 | Delta Electronics (Shanghai) Co., Ltd. | Packaging shell and a power module having the same |
-
2016
- 2016-09-25 CN CN201610865047.3A patent/CN106252291B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102347289A (en) * | 2010-07-30 | 2012-02-08 | 赛米控电子股份有限公司 | Power conductor module having at least one positioning apparatus for substrate |
| CN102364676A (en) * | 2011-11-30 | 2012-02-29 | 江苏宏微科技有限公司 | Packaging shell structure for semiconductor power module |
| US20140306329A1 (en) * | 2013-04-15 | 2014-10-16 | Kabushiki Kaisha Toshiba | Semiconductor package |
| CN103208463A (en) * | 2013-04-24 | 2013-07-17 | 湖南大学 | Heat sink material element with box-type structure and manufacturing method thereof |
| US20150216038A1 (en) * | 2014-01-28 | 2015-07-30 | Delta Electronics (Shanghai) Co., Ltd. | Packaging shell and a power module having the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109649836A (en) * | 2018-11-09 | 2019-04-19 | 惠州市华星光电技术有限公司 | Liquid crystal panel-packaging box with bolster |
| CN111128924A (en) * | 2019-12-20 | 2020-05-08 | 天津智安微电子技术有限公司 | Integrated circuit packaging structure |
| CN113471150A (en) * | 2021-07-08 | 2021-10-01 | 李琴 | Integrated circuit package |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106252291B (en) | 2018-09-14 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181228 Address after: 221113 Huangji Town Industrial Park, Tongshan District, Xuzhou City, Jiangsu Province Patentee after: Xuzhou Guhan Fragrance Industry Co., Ltd. Address before: 523000 productivity building 406, high tech Industrial Development Zone, Songshan Lake, Dongguan, Guangdong Patentee before: Dongguan Lianzhou Intellectual Property Operation Management Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191113 Address after: 221000 room c506a-18, University Business Park, No. 99, University Road, Xuzhou high tech Industrial Development Zone, Jiangsu Province Patentee after: Xuzhou rongchuangda Electronic Technology Co., Ltd Address before: 221113 Huangji Town Industrial Park, Tongshan District, Xuzhou City, Jiangsu Province Patentee before: Xuzhou Guhan Fragrance Industry Co., Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210422 Address after: 221000 Liuqiao Industrial Park, Dalong lake, Xuzhou City, Jiangsu Province Patentee after: Xuzhou Weinuo Electrical Equipment Co.,Ltd. Address before: 221000 room c506a-18, University Business Park, No. 99, University Road, Xuzhou high tech Industrial Development Zone, Jiangsu Province Patentee before: Xuzhou rongchuangda Electronic Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |