CN106245076B - The preparation of double whisker reinforcement sponge structure type nickel cobalt molybdenum evanohm high temperature energy-absorbing materials - Google Patents
The preparation of double whisker reinforcement sponge structure type nickel cobalt molybdenum evanohm high temperature energy-absorbing materials Download PDFInfo
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- CN106245076B CN106245076B CN201610718166.6A CN201610718166A CN106245076B CN 106245076 B CN106245076 B CN 106245076B CN 201610718166 A CN201610718166 A CN 201610718166A CN 106245076 B CN106245076 B CN 106245076B
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- Prior art keywords
- sponge structure
- silicon carbide
- nickel cobalt
- aluminium borate
- carbide whisker
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- QZYDAIMOJUSSFT-UHFFFAOYSA-N [Co].[Ni].[Mo] Chemical compound [Co].[Ni].[Mo] QZYDAIMOJUSSFT-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 239000011358 absorbing material Substances 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 230000002787 reinforcement Effects 0.000 title abstract description 7
- 239000004698 Polyethylene Substances 0.000 claims abstract description 51
- -1 polyethylene Polymers 0.000 claims abstract description 51
- 229920000573 polyethylene Polymers 0.000 claims abstract description 51
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 46
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims abstract description 37
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 238000004070 electrodeposition Methods 0.000 claims abstract description 28
- 239000002131 composite material Substances 0.000 claims abstract description 24
- 230000002708 enhancing effect Effects 0.000 claims abstract description 23
- PRQRQKBNBXPISG-UHFFFAOYSA-N chromium cobalt molybdenum nickel Chemical compound [Cr].[Co].[Ni].[Mo] PRQRQKBNBXPISG-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000004411 aluminium Substances 0.000 claims abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 239000011733 molybdenum Substances 0.000 claims abstract description 3
- 239000002002 slurry Substances 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 18
- 239000008367 deionised water Substances 0.000 claims description 15
- 229910021641 deionized water Inorganic materials 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 14
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 13
- 239000002659 electrodeposit Substances 0.000 claims description 13
- 229920001479 Hydroxyethyl methyl cellulose Polymers 0.000 claims description 10
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 10
- 238000009792 diffusion process Methods 0.000 claims description 10
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 10
- 229910021392 nanocarbon Inorganic materials 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 10
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- 239000002134 carbon nanofiber Substances 0.000 claims description 8
- 238000000354 decomposition reaction Methods 0.000 claims description 8
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 claims description 7
- YCYBZKSMUPTWEE-UHFFFAOYSA-L cobalt(ii) fluoride Chemical compound F[Co]F YCYBZKSMUPTWEE-UHFFFAOYSA-L 0.000 claims description 7
- 229940078494 nickel acetate Drugs 0.000 claims description 7
- LVIYYTJTOKJJOC-UHFFFAOYSA-N nickel phthalocyanine Chemical compound [Ni+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 LVIYYTJTOKJJOC-UHFFFAOYSA-N 0.000 claims description 7
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 claims description 7
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 claims description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- IPLJNQFXJUCRNH-UHFFFAOYSA-L nickel(2+);dibromide Chemical compound [Ni+2].[Br-].[Br-] IPLJNQFXJUCRNH-UHFFFAOYSA-L 0.000 claims description 6
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 claims description 5
- 239000000725 suspension Substances 0.000 claims description 5
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- XVVZSEXTAACTPS-UHFFFAOYSA-N 5-[hydroxy-(4-nitrophenoxy)phosphoryl]pentanoic acid Chemical compound OC(=O)CCCCP(O)(=O)OC1=CC=C([N+]([O-])=O)C=C1 XVVZSEXTAACTPS-UHFFFAOYSA-N 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 230000031709 bromination Effects 0.000 claims 1
- 238000005893 bromination reaction Methods 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 150000004040 pyrrolidinones Chemical class 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 239000011159 matrix material Substances 0.000 abstract description 10
- 238000010521 absorption reaction Methods 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 3
- 229910052804 chromium Inorganic materials 0.000 abstract description 2
- 239000011651 chromium Substances 0.000 abstract description 2
- ZXNKRXWFQRLIQG-UHFFFAOYSA-N silicon(4+);tetraborate Chemical compound [Si+4].[Si+4].[Si+4].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-].[O-]B([O-])[O-] ZXNKRXWFQRLIQG-UHFFFAOYSA-N 0.000 abstract 2
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 235000005979 Citrus limon Nutrition 0.000 description 2
- 244000131522 Citrus pyriformis Species 0.000 description 2
- 229910003978 SiClx Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- WHDPTDWLEKQKKX-UHFFFAOYSA-N cobalt molybdenum Chemical compound [Co].[Co].[Mo] WHDPTDWLEKQKKX-UHFFFAOYSA-N 0.000 description 2
- 238000009863 impact test Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000010835 comparative analysis Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910000601 superalloy Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Abstract
Description
Claims (7)
- A kind of 1. preparation side of the sponge structure type nickel cobalt molybdenum evanohm high temperature resistant energy-absorbing material of aluminium borate/silicon carbide whisker enhancing Method, it is characterised in that:It is made up of following step:S1. sponge structure polyethylene model conductive treatment;S2. sponge structure polyethylene model surface nickel cobalt molybdenum chromium/aluminium borate-silicon carbide whisker composite electrodeposition;S3. the removal of sponge structure polyethylene model is handled;S4. the heat treatment of nickel cobalt molybdenum chromium/aluminium borate-silicon carbide whisker whisker composite material.
- 2. a kind of sponge structure type nickel cobalt molybdenum evanohm of aluminium borate according to claim 1/silicon carbide whisker enhancing is resistance to The preparation method of high temperature energy-absorbing material, it is characterised in that:Step S1 specifically includes following operation:A1. electrocondution slurry is prepared:By carbon nano-fiber, nano carbon particle, hydroxyethylmethylcellulose, methacrylic acid, N- first Base pyrrolidones is added to suspension formed in deionized water, as electrocondution slurry;A2. sponge structure polyethylene model conductive treatment:Sponge structure polyethylene model is sufficiently submerged in electrocondution slurry, After the abundant hanging of sponge structure polyethylene model surface, dry 10~50 minutes at 30~50 DEG C and gathered with completing sponge structure Ethene model conductive treatment.
- 3. a kind of sponge structure type nickel cobalt molybdenum evanohm of aluminium borate according to claim 2/silicon carbide whisker enhancing is resistance to The preparation method of high temperature energy-absorbing material, it is characterised in that:The mass percent of each component is respectively in the electrocondution slurry:Nanometer Carbon fiber 3~22%, nano carbon particle 2~18%, hydroxyethylmethylcellulose 0.8~4%, methacrylic acid 0.5~12%, 1-METHYLPYRROLIDONE 1.5~6%, remaining is deionized water.
- 4. a kind of sponge structure type nickel cobalt molybdenum evanohm of aluminium borate according to claim 1/silicon carbide whisker enhancing is resistance to The preparation method of high temperature energy-absorbing material, it is characterised in that:Step S2 specifically includes following operation:B1. the preparation of nickel cobalt molybdenum chromium electrodeposit liquid:It is analytically pure nickel sulfamic acid, nickelous hypophosphite, nickel acetate, bromination by concentration Nickel, cobaltous fluoride, cobalt chloride, NPE, tributyl phosphate, sulfuric acid, citric acid, neopelex, receive Rice chromium powder, nano Mo powder, aluminium borate whisker and silicon carbide whisker are added sequentially in deionized water, form electrodeposit liquid;B2. composite electrodeposition process:It is anode using the sponge structure polyethylene model of conductive treatment as negative electrode, nickel plate, In 120~350mA/cm2Current density under carry out electro-deposition, electrodeposit liquid temperature maintains 30~60 DEG C, electrodeposition time For 0.5~2 hour, whole electrodeposition process was stirred with ultrasonic wave.
- 5. a kind of sponge structure type nickel cobalt molybdenum evanohm of aluminium borate according to claim 4/silicon carbide whisker enhancing is resistance to The preparation method of high temperature energy-absorbing material, it is characterised in that:Each component concentration is respectively nickel sulfamic acid 20 in the electrodeposit liquid ~100g/L, 15~120g/L of nickelous hypophosphite, 10~70g/L of nickel acetate, 2~15g/L of nickelous bromide, 15~60g/L of cobaltous fluoride, chlorine Change cobalt 10~50g/L, 10~50mL/L of NPE, 5~30mL/L of tributyl phosphate, 1.5~10mL/L of sulfuric acid, 3~10g/L of citric acid, 10~40g/L of neopelex, 20~40g/L of nanometer chromium powder, 0.5~10g/ of nano Mo powder L, 40~120g/L of aluminium borate whisker, 30~80g/L of silicon carbide whisker.
- 6. a kind of sponge structure type nickel cobalt molybdenum evanohm of aluminium borate according to claim 1/silicon carbide whisker enhancing is resistance to The preparation method of high temperature energy-absorbing material, it is characterised in that:Step S3 is specially:Sponge structure polyethylene model after the completion of composite electrodeposition is fitted into electric furnace and protected in 0.1~4Mpa nitrogen atmosphere 100~360 DEG C are heated up under shield, is incubated 10~30 minutes so that sponge structure polyethylene model decomposition removes.
- 7. a kind of sponge structure type nickel cobalt molybdenum evanohm of aluminium borate according to claim 1/silicon carbide whisker enhancing is resistance to The preparation method of high temperature energy-absorbing material, it is characterised in that:Step S4 is specially:After the completion for the treatment of that sponge structure polyethylene model decomposition removes, furnace temperature is increased to 420~580 DEG C, insulation 1.2~5 Hour to realize the diffusion of cobalt atom;Then furnace temperature is increased to 600~1200 DEG C, is incubated 3~8 hours to realize molybdenum original The diffusion of son and cobalt atom, it is resistance to so as to finally obtain the sponge structure type nickel cobalt molybdenum evanohm of aluminium borate/silicon carbide whisker enhancing High temperature energy-absorbing material.
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CN201610718166.6A CN106245076B (en) | 2016-08-25 | 2016-08-25 | The preparation of double whisker reinforcement sponge structure type nickel cobalt molybdenum evanohm high temperature energy-absorbing materials |
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CN108823619B (en) * | 2018-07-16 | 2020-06-09 | 长安大学 | Method for depositing Ni-Mo-SiC-TiN composite coating on surface of closed-cell foamed aluminum |
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CN105841551A (en) * | 2016-05-10 | 2016-08-10 | 吉林大学 | Bionic energy absorbing and cushioning lining for ballistic helmet |
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