CN106206864A - LED lamp bar is once molded process for filling colloid and LED lamp bar thereof - Google Patents
LED lamp bar is once molded process for filling colloid and LED lamp bar thereof Download PDFInfo
- Publication number
- CN106206864A CN106206864A CN201610556157.1A CN201610556157A CN106206864A CN 106206864 A CN106206864 A CN 106206864A CN 201610556157 A CN201610556157 A CN 201610556157A CN 106206864 A CN106206864 A CN 106206864A
- Authority
- CN
- China
- Prior art keywords
- led lamp
- lamp bar
- fpc plate
- tension bus
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000084 colloidal system Substances 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000002347 injection Methods 0.000 claims abstract description 16
- 239000007924 injection Substances 0.000 claims abstract description 16
- 238000002360 preparation method Methods 0.000 claims abstract description 4
- 238000007711 solidification Methods 0.000 claims abstract description 4
- 230000008023 solidification Effects 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000005516 engineering process Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 238000007493 shaping process Methods 0.000 abstract description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED lamp bar and be once molded process for filling colloid and LED lamp bar thereof, it comprises the following steps: preparation upper surface is provided with the FPC plate of LED, and the lower surface at this FPC plate is printed with two tension bus moving towards to extend along its long limit；FPC plate is put into LED lamp bar injection mold carry out being molded encapsulating, after solidification to be cooled, form jacket layer FPC plate being coated with completely, prepare LED lamp bar；The concise in technology of the present invention, efficiency are high, the ingenious lower surface at FPC plate is directly printed with tension bus, there is preferably pull resistance and pressure drop effect, directly naked for this FPC plate LED lamp bar injection mold of putting into can be once molded encapsulating just can go out LED lamp bar by rapid shaping, effectively simplifying tradition needs the process for filling colloid of twice injection could prepare the operation of LED lamp bar, and then it is greatly improved production efficiency, and effectively use manpower and material resources sparingly, reduce production cost.
Description
Technical field
The present invention relates to LED lamp bar technical field of producing, be specifically related to a kind of LED lamp bar and be once molded encapsulating work
Skill.
Background technology
In LED application industry, flexible LED lamp bar is because of features such as soft, frivolous, color is pure, simple installations, by extensively
It is applied to building body profile, step, exhibition booth, bridge, hotel, KTV decorative lighting, and the making of advertising signboard, various large-scale dynamic
Draw, the place such as the advertisement project of calligraphy and painting.Along with the gradually maturation of flexible LED lamp bar technology, its range of application also can be more extensive.
But the production technology of existing flexible LED lamp bar is all first to be provisioned with two wires, in two wires are placed on
Pipe injection mold, then carries out being molded encapsulating and produces inner tube, this inner tube includes two wires, and purposes is for increasing tension
Power, and reduce pressure drop, facilitate artificial bracing wire to weld.The most again the FPC plate being printed with LED is filled in inner tube, and will just
Negative pole bracing wire, on wire, is molded encapsulating, the most again outside whole for colloid being coated on, with prepared LED lamp bar；I.e. need twice
The process for filling colloid of injection could prepare LED lamp bar, thus causes manufacturing process various, affects production efficiency, and needs to consume
More manpower and materials, and then add production cost.
Summary of the invention
For above-mentioned deficiency, it is an object of the invention to, it is provided that a kind of manufacturing process is succinct, efficiency is high, low cost, only needs
The LED lamp bar that once injection encapsulating just can quickly produce LED lamp bar is once molded process for filling colloid.
The present invention also aims to, promote a kind of use above-mentioned LED lamp bar be once molded process for filling colloid prepare LED
Lamp bar.
For achieving the above object, technical scheme provided by the present invention is: a kind of LED lamp bar is once molded process for filling colloid,
It comprises the following steps:
(1) preparation upper surface is provided with the FPC plate of LED, and the lower surface at this FPC plate is printed with two and prolongs along its long limit trend
The tension bus stretched；
(2) conducting wire on FPC plate is connected with tension bus；
(3) FPC plate is put into LED lamp bar injection mold；
(4) carrying out LED lamp bar injection mold after matched moulds being molded encapsulating, after solidification to be cooled, FPC plate can be coated with by formation completely
Jacket layer, prepare LED lamp bar.
A kind of above-mentioned LED lamp bar is once molded the LED lamp bar that process for filling colloid prepares, and it includes FPC plate and by this FPC plate
The jacket layer being coated with completely, the lower surface of described FPC plate is provided with two tension bus moving towards to extend, this FPC along its long limit
The upper surface of plate is provided with LED, and the corresponding tension bus corresponding thereto of positive and negative extreme foot of this LED is connected.
As a modification of the present invention, described tension bus be thickness be the copper sheet of 70～105 microns.
As a modification of the present invention, described jacket layer is PVC Waterproof glue line.
The invention have the benefit that the concise in technology of the present invention, efficiency are high, the ingenious lower surface at FPC plate directly prints
It is brushed with two tension bus moving towards along its long limit to extend, there is preferably pull resistance and pressure drop effect, can directly will be somebody's turn to do
FPC plate is naked to be put into LED lamp bar injection mold and is once molded encapsulating and just can go out LED lamp bar by rapid shaping, effectively simplifies tradition
The process for filling colloid needing twice injection could prepare the operation of LED lamp bar, and then is greatly improved production efficiency, and effectively saves
Manpower and materials, reduce production cost；The present invention provide LED lamp strip structure design ingenious, reasonable, ingenious by tension bus with
FPC plate combines, and effectively simplifies overall structure and production technology, and tensile strength is good, and service life is long, is beneficial to be widely popularized and answers
With.
Below in conjunction with the accompanying drawings with embodiment, the present invention is further described.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention.
Detailed description of the invention
Embodiment: see Fig. 1, a kind of LED lamp bar that the present embodiment provides once is molded process for filling colloid, and it includes following step
Rapid:
(1) preparation upper surface is provided with the FPC plate 2 of LED 1, the positive and negative extreme foot of LED 1 conduction accordingly and on FPC plate 2
Circuit is connected, and the lower surface at this FPC plate 2 is printed with two tension bus 3 moving towards to extend along its long limit；
(2) conducting wire on FPC plate is connected with tension bus；
(3) FPC plate 2 is put into LED lamp bar injection mold；
(4) carrying out LED lamp bar injection mold after matched moulds being molded encapsulating, after solidification to be cooled, FPC plate 2 can be wrapped by formation completely
The jacket layer 4 covered, prepares LED lamp bar.
A kind of above-mentioned LED lamp bar is once molded the LED lamp bar that process for filling colloid prepares, and it includes FPC plate 2 and by this FPC
The jacket layer 4 that plate 2 is coated with completely, the lower surface of described FPC plate 2 is provided with two tension bus 3 moving towards to extend along its long limit,
The upper surface of this FPC plate 2 is provided with LED 1, and the corresponding tension bus 3 corresponding thereto of positive and negative extreme foot of this LED 1
It is connected.The LED lamp strip structure design that the present invention provides is ingenious, reasonable, ingenious is combined with FPC plate 2 by tension bus 3,
Effectively simplifying overall structure and production technology, and tensile strength is good, service life is long, beneficially wide popularization and application.
It is also preferred that the left described tension bus 3 is the copper sheet that thickness is 70～105 microns, not only conductive effect is good, Er Qie
On the basis of not affecting LED lamp bar entirety flexibility, increasing stretching resistance, pressure drop is effective.Described jacket layer 4 is PVC marine glue
Layer, good water-proof effect.
Above-described embodiment is only the preferable embodiment of the present invention, and the present invention can not enumerate out whole embodiment party
Formula, the technical scheme of all employing above-described embodiments, or according to the equivalent variations that above-described embodiment is done, all protect model in the present invention
In enclosing.
The concise in technology of the present invention, efficiency are high, and the ingenious lower surface at FPC plate 2 is printed with two and prolongs along its long limit trend
The tension bus 3 stretched, i.e. just prints tension bus 3, not only has preferably pull resistance and pressure when producing FPC plate 2
Fall effect, returns subsequent handling and brings the convenience of high degree.Directly can put into LED lamp bar injection mold by naked for this FPC plate 2
Once being molded encapsulating and just can go out LED lamp bar by rapid shaping, effectively simplifying tradition needs the process for filling colloid ability of twice injection
Prepare the operation of LED lamp bar, and then be greatly improved production efficiency, and effectively use manpower and material resources sparingly, reduce production cost.
The announcement of book and teaching according to the above description, those skilled in the art in the invention can also be to above-mentioned embodiment party
Formula changes and revises.Therefore, the invention is not limited in detailed description of the invention disclosed and described above, to the present invention's
Some modifications and changes should also be as falling in the scope of the claims of the present invention.Although additionally, this specification using
Some specific terms, but these terms are merely for convenience of description, the present invention does not constitute any restriction.Such as the present invention
Described in above-described embodiment, use same or similar step and other moulding process of obtaining or goods, all in the present invention
In protection domain.
Claims (6)
1. a LED lamp bar is once molded process for filling colloid, it is characterised in that it comprises the following steps:
(1) preparation upper surface is provided with the FPC plate of LED, and the lower surface at this FPC plate is printed with two and prolongs along its long limit trend
The tension bus stretched；
(2) conducting wire on FPC plate is connected with tension bus；
(3) FPC plate is put into LED lamp bar injection mold；
(4) carrying out LED lamp bar injection mold after matched moulds being molded encapsulating, after solidification to be cooled, FPC plate can be coated with by formation completely
Jacket layer, prepare LED lamp bar.
LED lamp bar the most according to claim 1 is once molded process for filling colloid, it is characterised in that: described tension bus is
Thickness is the copper sheet of 70～105 microns.
LED lamp bar the most according to claim 1 and 2 is once molded process for filling colloid, it is characterised in that: described jacket layer is
PVC Waterproof glue line.
4. use the LED lamp bar described in any one of claim 1-3 to be once molded the LED lamp bar that process for filling colloid prepares, its
Including FPC plate and the jacket layer that is coated with completely by this FPC plate, the lower surface of described FPC plate is provided with two and prolongs along its long limit trend
The tension bus stretched, the upper surface of this FPC plate is provided with LED, and the positive and negative extreme foot of this LED is corresponding corresponding thereto
Tension bus be connected.
LED lamp bar the most according to claim 4, it is characterised in that: described tension bus be thickness be 70～105 microns
Copper sheet.
6. according to the LED lamp bar described in claim 4 or 5, it is characterised in that: described jacket layer is PVC Waterproof glue line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610556157.1A CN106206864A (en) | 2016-07-15 | 2016-07-15 | LED lamp bar is once molded process for filling colloid and LED lamp bar thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610556157.1A CN106206864A (en) | 2016-07-15 | 2016-07-15 | LED lamp bar is once molded process for filling colloid and LED lamp bar thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106206864A true CN106206864A (en) | 2016-12-07 |
Family
ID=57474305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610556157.1A Pending CN106206864A (en) | 2016-07-15 | 2016-07-15 | LED lamp bar is once molded process for filling colloid and LED lamp bar thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106206864A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109093909A (en) * | 2018-08-16 | 2018-12-28 | 深圳浩翔光电技术有限公司 | LED circuit board encapsulating die, method and LED circuit board encapsulating structure |
| CN110919960A (en) * | 2019-10-31 | 2020-03-27 | 深圳市美亚迪光电有限公司 | Sealing forming method and system for bendable outdoor LED soft module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202048440U (en) * | 2011-04-19 | 2011-11-23 | 张东升 | LED solid lamp strip |
| CN203131557U (en) * | 2013-03-19 | 2013-08-14 | 深圳市路森光电科技有限公司 | Indoor LED light bar |
| CN103606618A (en) * | 2013-11-25 | 2014-02-26 | 深圳市光之谷新材料科技有限公司 | Light emitting diode light bar and packaging method thereof |
| CN204513066U (en) * | 2015-02-05 | 2015-07-29 | 陈德开 | Once double-coloredly extrude soft light bar |
-
2016
- 2016-07-15 CN CN201610556157.1A patent/CN106206864A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202048440U (en) * | 2011-04-19 | 2011-11-23 | 张东升 | LED solid lamp strip |
| CN203131557U (en) * | 2013-03-19 | 2013-08-14 | 深圳市路森光电科技有限公司 | Indoor LED light bar |
| CN103606618A (en) * | 2013-11-25 | 2014-02-26 | 深圳市光之谷新材料科技有限公司 | Light emitting diode light bar and packaging method thereof |
| CN204513066U (en) * | 2015-02-05 | 2015-07-29 | 陈德开 | Once double-coloredly extrude soft light bar |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109093909A (en) * | 2018-08-16 | 2018-12-28 | 深圳浩翔光电技术有限公司 | LED circuit board encapsulating die, method and LED circuit board encapsulating structure |
| CN109093909B (en) * | 2018-08-16 | 2024-04-23 | 深圳浩翔光电技术有限公司 | LED circuit board glue filling mold, method and LED circuit board packaging structure |
| CN110919960A (en) * | 2019-10-31 | 2020-03-27 | 深圳市美亚迪光电有限公司 | Sealing forming method and system for bendable outdoor LED soft module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161207 |
|
| RJ01 | Rejection of invention patent application after publication |