CN106206332B - A kind of manufacturing method of integrated circuit package structure - Google Patents
A kind of manufacturing method of integrated circuit package structure Download PDFInfo
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- CN106206332B CN106206332B CN201610558795.7A CN201610558795A CN106206332B CN 106206332 B CN106206332 B CN 106206332B CN 201610558795 A CN201610558795 A CN 201610558795A CN 106206332 B CN106206332 B CN 106206332B
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- encapsulating material
- electromagnetic component
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- glue
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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Abstract
The present invention provides a kind of manufacturing methods of integrated circuit package structure comprising forms first through hole in the position that electromagnetic chip corresponds to multiple electrodes, is forming the second through-hole around the border of electromagnetic chip；Packaging body described in singulation is carried out along the center of the second through-hole by laser, and the width of second through-hole 5 after cutting is greater than the width of first through hole；Obtain encapsulation monomer, wherein the second through-hole includes multiple portions being connected respectively with multiple electrodes, being electrically isolated from each other.The present invention passes through the area and thickness of Control peripheral circuit layer, forms the preferable packaging body of electronic shield, without being further added by the components such as electro-magnetic shielding cover in subsequent integrated antenna package, reduces encapsulation volume, enhances the flexibility of encapsulation.
Description
Technical field
The present invention relates to integrated antenna package fields, and in particular to a kind of manufacturing method of integrated circuit package structure.
Background technique
In integrated antenna package, due to the electromagnetic radiation of electronic device itself or the electromagnetic radiation in the external world, often lead
The jitter of integrated circuit is caused, circuit malfunction is in the prior art will be easy by electromagnetic interference or sending electromagnetic wave half
Conductor element is encapsulated in specific integrated circuit, which is being given electronic shield, the component of shielding is often one
A metal cover body, such packaging body volume is larger and encapsulation is not extremely nimble.
Summary of the invention
Based on solving the problems in above-mentioned encapsulation, the present invention provides a kind of manufacturing method of integrated circuit package structure,
Itself the following steps are included:
(1) temporary base of a large area hard is provided；
(2) electromagnetic component is fixed on the temporary base, which is to be easy by electromagnetic interference or issue electricity
The semiconductor element of magnetic wave, fixed form can be fixed by fixed glue；
(3) the first encapsulating material is set on the temporary base, and electromagnetic component is completely covered；
(4) after solidifying the encapsulating material, the encapsulating material is thinned to suitable thickness but does not leak out the electromagnetism
Element；
(5) first through hole is formed in the position that electromagnetic chip corresponds to multiple electrodes, in the border shape around electromagnetic chip
At the second through-hole, the sectional area of the first through hole is identical with the area of the electrode；
(6) conductive material is formed on top of the encapsulation material, and fills full first and second through-hole, then only etching encapsulation
The first conductive material on material forms the line layer of the first and second through-holes of electrical connection.
(7) temporary base 1 is removed, packaging body described in singulation is carried out along the center of the second through-hole by laser, and
The width of second through-hole 5 after cutting is greater than the width of first through hole.
(8) encapsulation monomer is obtained, wherein the second through-hole is connected with multiple electrodes respectively, is electrically isolated from each other
Multiple portions；
(9) the reeded heat-radiating substrate of tool is provided, coats one layer of thermal conductive insulation glue in bottom portion of groove, it is thermally conductive using this
Insulating cement is fixed on bottom portion of groove for monomer is encapsulated, and is filled using the second encapsulating material and seal the encapsulation monomer；
(10) it to form the third through-hole of the exposure line layer and fills out deviateing the electromagnetic chip center position and drill
Conductive materials are filled to be formed and connect terminal outside, and are coupled by outer even terminal with other electronic components, and integrated antenna package is formed
Structure；
It is characterized by: the width of the second through-hole after cutting is more than or equal to 1mm.
The present invention also provides the manufacturing methods of another integrated circuit package structure comprising following steps:
(1) temporary base of a large area hard is provided；
(2) electromagnetic component is fixed on the temporary base, which is to be easy by electromagnetic interference or issue electricity
The semiconductor element of magnetic wave, fixed form are fixed by fixed glue；
(3) the first encapsulating material is set on the temporary base, and electromagnetic component is completely covered；
(4) after solidifying the encapsulating material, the encapsulating material is thinned to suitable thickness but does not leak out the electromagnetism
Element；
(5) first through hole is formed in the position that electromagnetic chip corresponds to multiple electrodes, in the border shape around electromagnetic chip
At the second through-hole, the sectional area of the first through hole is identical with the area of the electrode；
(6) conductive material is formed on top of the encapsulation material, and fills full first and second through-hole, then only etching encapsulation
The first conductive material on material forms the line layer of the first and second through-holes of electrical connection；
(7) temporary base 1 is removed, packaging body described in singulation is carried out along the center of the second through-hole by laser, and
The width of second through-hole 5 after cutting is greater than the width of first through hole.
(8) encapsulation monomer is obtained, wherein the second through-hole is connected with multiple electrodes respectively, is electrically isolated from each other
Multiple portions；
(9) the reeded heat-radiating substrate of tool is provided, coats one layer of thermal conductive insulation glue in bottom portion of groove, it is thermally conductive using this
Insulating cement is fixed on bottom portion of groove for monomer is encapsulated, and is filled using the second encapsulating material and seal the encapsulation monomer.
(10) it to form the third through-hole of the exposure line layer and fills out deviateing the electromagnetic chip center position and drill
The second conductive material is filled to be formed and connect terminal outside, and is coupled by outer even terminal with other electronic components, and integrated circuit is formed
Encapsulating structure；
It is characterized by: the area that second through-hole fills the lateral parts of first conductive material accounts for the encapsulation
The 50%-90% of the lateral area of monomer.
Wherein, fixed glue includes pressure-sensitive solidification glue, heat-curable glue, optic-solidified adhesive, silicone grease, epoxy resin etc..
Wherein, the temporary base is ceramic substrate, silicon substrate or plastic base.
Wherein, other described electronic components include controller, MOS transistor, resistance etc..
Advantages of the present invention is as follows:
The present invention passes through the area and thickness of Control peripheral circuit layer (the second through-hole), forms electronic shield and preferably encapsulates
Body reduces encapsulation volume, enhances encapsulation without being further added by the components such as electro-magnetic shielding cover in subsequent integrated antenna package
Flexibility.
Detailed description of the invention
Fig. 1-8,10-11 are the process schematic of the manufacturing method of integrated circuit package structure of the invention；
Fig. 9 is the top view that Fig. 8 encapsulates monomer.
Specific embodiment
Referring to Fig. 1-11, present invention firstly provides a kind of packaging method of integrated circuit, specific steps will as follows into
Capable to describe, the positions noun such as upper and lower, left and right, side is both with respect to the positional relationship in schematic diagram appeared in description.
Referring to Fig. 1, a temporary base 1 is provided, which is large area hard substrate, such as ceramic substrate, silicon substrate, modeling
Expect substrate etc..
Referring to fig. 2, electromagnetic component 2 is fixed on temporary base 1, which be easy by electromagnetic interference or sending
Semiconductor element of electromagnetic wave, such as RF element, photodetector, sensor, photelectric receiver etc., fixed form can pass through
Fixed glue is fixed, which includes pressure-sensitive solidification glue, heat-curable glue, optic-solidified adhesive, silicone grease, epoxy resin etc..
Referring to Fig. 3, encapsulating material 3 is set on temporary base 1, and electromagnetic component 2 is completely covered, which can be with
It is the sealing materials such as polyimides, heat reactive resin or light-cured resin.
Referring to fig. 4, after solidifying the encapsulating material 3, the encapsulating material 3 is thinned to suitable thickness but does not leak out institute
State electromagnetic component 2.
Referring to Fig. 5, first through hole 4 is formed in the position that electromagnetic chip 2 corresponds to electrode, in the week around electromagnetic chip 2
Circle forms the second through-hole 5, and the sectional area of the first through hole 4 is identical with the area of the electrode, the width of second through-hole 5
Greater than the width of first through hole 4, size is greater than 2mm wide, can more preferably stop in this way electromagnetic wave interference or Electromagnetic Interference its
His component.
Referring to Fig. 6, conductive material 6, and filling full described first and 5 second through-holes 4,5 are formed on encapsulating material 3, so
The conductive material 6 on encapsulating material 3 is only etched afterwards, forms the line layer of the first and second through-holes of electrical connection, the conductive material
It can be prevented from the material that electromagnetic wave penetrates, such as metal etc..
Referring to Fig. 7, temporary base 1 is removed, encapsulate described in singulation along the center of the second through-hole 5 by laser 7
Body, the laser may be replaced by machine cuts, and the width of second through-hole 5 after cutting is still greater than first through hole
4 width, the width of the second through-hole 5 after cutting are more than or equal to 1mm.
Referring to Fig. 8, obtain encapsulation monomer 100, top view as shown in figure 9, four electrodes respectively correspond four first it is logical
Hole 4, four the second through-holes 5 of surrounding are around the side of the electromagnetic component 2, also, the second through-hole 5 includes respectively with described four
Four parts that a electrode is connected, being electrically isolated from each other, certainly, the difference of electromagnetic component, number of poles, 4 and of first through hole
The number of second through-hole 5 is also different, but in any case, the area of the lateral parts of the second through-hole filling conductive material 6
The 50%-90% for accounting for encapsulation 100 lateral area of monomer, only in this way could preferably play the role of electromagnetic shielding.
Referring to Figure 10, the reeded heat-radiating substrate 8 of tool is provided, which can be ceramic substrate, macromolecule
Heat-radiating substrate etc., coats one layer of thermal conductive insulation glue 9 in bottom portion of groove, is fixed on using the thermal conductive insulation glue 9 by monomer 100 is encapsulated
Bottom portion of groove, and filled using encapsulating material 10 and seal the encapsulation monomer 100.
With reference to Figure 11, drill to form the through-hole of the exposure line layer and fill conductive material at deviation chip center position
Matter connects terminal 11 to be formed outside, and is coupled by outer even terminal with other electronic components, other described electronic components include control
Device processed, MOS transistor, resistance etc..
The present invention passes through the area and thickness of Control peripheral circuit layer (the second through-hole), forms electronic shield and preferably encapsulates
Body reduces encapsulation volume, enhances encapsulation without being further added by the components such as electro-magnetic shielding cover in subsequent integrated antenna package
Flexibility.
Finally, it should be noted that obviously, the above embodiment is merely an example for clearly illustrating the present invention, and simultaneously
The non-restriction to embodiment.For those of ordinary skill in the art, it can also do on the basis of the above description
Other various forms of variations or variation out.There is no necessity and possibility to exhaust all the enbodiments.And thus drawn
The obvious changes or variations that Shen goes out are still in the protection scope of this invention.
Claims (5)
1. a kind of manufacturing method of integrated circuit package structure comprising following steps:
(1) temporary base of a large area hard is provided；
(2) electromagnetic component is fixed on the temporary base, which is to be easy by electromagnetic interference or issue electromagnetic wave
Semiconductor element, fixed form fixed by fixed glue；
(3) the first encapsulating material is set on the temporary base, and electromagnetic component is completely covered；
(4) after solidifying first encapsulating material, first encapsulating material is thinned to suitable thickness but described in not exposing
Electromagnetic component；
(5) first through hole is formed in the position that electromagnetic component corresponds to multiple electrodes, is forming the around the border of electromagnetic component
Two through-holes, the sectional area of the first through hole are identical with the area of the electrode；
(6) the first conductive material is formed on the first encapsulating material, and fills full first and second through-hole, is then only etched
The first conductive material on encapsulating material forms the line layer of the first and second through-holes of electrical connection；
(7) temporary base is removed, singularized package body, and the institute after cutting are carried out along the center of the second through-hole by laser
The width for stating the second through-hole is greater than the width of first through hole；
(8) obtain encapsulation monomer, wherein the second through-hole include be connected respectively with multiple electrodes, be electrically isolated from each other it is more
A part；
(9) the reeded heat-radiating substrate of tool is provided, one layer of thermal conductive insulation glue is coated in bottom portion of groove, utilizes the heat conductive insulating
Glue is fixed on bottom portion of groove for monomer is encapsulated, and is filled using the second encapsulating material and seal the encapsulation monomer；
(10) the electromagnetic component center position drills the third through-hole to form the exposure line layer and filling is led deviateing
Isoelectric substance connects terminal to be formed outside, and is coupled by outer even terminal with other electronic components, forms integrated circuit package structure；
It is characterized by: the width of the second through-hole after cutting is more than or equal to 1mm.
2. a kind of manufacturing method of integrated circuit package structure comprising following steps:
(1) temporary base of a large area hard is provided；
(2) electromagnetic component is fixed on the temporary base, which is to be easy by electromagnetic interference or issue electromagnetic wave
Semiconductor element, fixed form fixed by fixed glue；
(3) the first encapsulating material is set on the temporary base, and electromagnetic component is completely covered；
(4) after solidifying first encapsulating material, first encapsulating material is thinned to suitable thickness but described in not exposing
Electromagnetic component；
(5) first through hole is formed in the position that electromagnetic component corresponds to multiple electrodes, is forming the around the border of electromagnetic component
Two through-holes, the sectional area of the first through hole are identical with the area of the electrode；
(6) the first conductive material is formed on the first encapsulating material, and fills full first and second through-hole, is then only etched
The first conductive material on encapsulating material forms the line layer of the first and second through-holes of electrical connection；
(7) temporary base is removed, singularized package body, and the institute after cutting are carried out along the center of the second through-hole by laser
The width for stating the second through-hole is greater than the width of first through hole；
(8) obtain encapsulation monomer, wherein the second through-hole include be connected respectively with multiple electrodes, be electrically isolated from each other it is more
A part；
(9) the reeded heat-radiating substrate of tool is provided, one layer of thermal conductive insulation glue is coated in bottom portion of groove, utilizes the heat conductive insulating
Glue is fixed on bottom portion of groove for monomer is encapsulated, and is filled using the second encapsulating material and seal the encapsulation monomer；
(10) it to form the third through-hole of the exposure line layer and fills the deviateing the electromagnetic component center position and drill
Two conductive materials connect terminal to be formed outside, and are coupled by outer even terminal with other electronic components, form integrated antenna package
Structure；
It is characterized by: the area that second through-hole fills the lateral parts of first conductive material accounts for the encapsulation monomer
Lateral area 50%-90%.
3. the manufacturing method of integrated circuit package structure according to claim 1 or 2, it is characterised in that: fixing glue includes
Pressure-sensitive solidification glue, heat-curable glue, optic-solidified adhesive, silicone grease or epoxy resin.
4. the manufacturing method of integrated circuit package structure according to claim 1 or 2, it is characterised in that: the interim base
Plate is ceramic substrate, silicon substrate or plastic base.
5. the manufacturing method of integrated circuit package structure according to claim 1 or 2, it is characterised in that: other described electricity
Subcomponent includes controller, MOS transistor or resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610558795.7A CN106206332B (en) | 2016-07-17 | 2016-07-17 | A kind of manufacturing method of integrated circuit package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610558795.7A CN106206332B (en) | 2016-07-17 | 2016-07-17 | A kind of manufacturing method of integrated circuit package structure |
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| Publication Number | Publication Date |
|---|---|
| CN106206332A CN106206332A (en) | 2016-12-07 |
| CN106206332B true CN106206332B (en) | 2019-04-05 |
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| CN201610558795.7A Expired - Fee Related CN106206332B (en) | 2016-07-17 | 2016-07-17 | A kind of manufacturing method of integrated circuit package structure |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200404803A1 (en) * | 2017-12-14 | 2020-12-24 | Autonetworks Technologies, Ltd. | Circuit assembly and electrical junction box |
| CN111490019B (en) * | 2020-04-24 | 2022-01-07 | 天津恒立远大仪表股份有限公司 | Integrated circuit structure and manufacturing method thereof |
| CN111863719B (en) * | 2020-07-28 | 2022-07-19 | 南通通富微电子有限公司 | Chip interconnection method |
| CN111863717B (en) * | 2020-07-28 | 2022-07-15 | 南通通富微电子有限公司 | Chip interconnection method |
| CN111863791A (en) * | 2020-07-28 | 2020-10-30 | 南通通富微电子有限公司 | Semiconductor packaging body and chip packaging body |
| CN111883439B (en) * | 2020-07-28 | 2022-07-26 | 南通通富微电子有限公司 | Chip packaging method |
| CN118038766B (en) * | 2024-04-12 | 2024-07-19 | 常州明耀半导体科技有限公司 | LED display and manufacturing method thereof |
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| CN1156949A (en) * | 1995-11-16 | 1997-08-13 | 松下电器产业株式会社 | PC board and fixing body thereof |
| CN1914727A (en) * | 2004-02-13 | 2007-02-14 | 株式会社村田制作所 | Electronic component and method for manufacturing the same |
| CN202443968U (en) * | 2012-01-16 | 2012-09-19 | 日月光半导体制造股份有限公司 | Semiconductor packaging structure |
| CN105140207A (en) * | 2011-01-31 | 2015-12-09 | 株式会社东芝 | Semiconductor device |
| CN105489593A (en) * | 2015-12-24 | 2016-04-13 | 合肥祖安投资合伙企业(有限合伙) | Electromagnetic shield packaging assembly and manufacturing method therefor |
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2016
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1156949A (en) * | 1995-11-16 | 1997-08-13 | 松下电器产业株式会社 | PC board and fixing body thereof |
| CN1914727A (en) * | 2004-02-13 | 2007-02-14 | 株式会社村田制作所 | Electronic component and method for manufacturing the same |
| CN105140207A (en) * | 2011-01-31 | 2015-12-09 | 株式会社东芝 | Semiconductor device |
| CN202443968U (en) * | 2012-01-16 | 2012-09-19 | 日月光半导体制造股份有限公司 | Semiconductor packaging structure |
| CN105489593A (en) * | 2015-12-24 | 2016-04-13 | 合肥祖安投资合伙企业(有限合伙) | Electromagnetic shield packaging assembly and manufacturing method therefor |
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| CN106206332A (en) | 2016-12-07 |
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Effective date of registration: 20190312 Address after: 253799 East Ring Road, Qingyun County Economic Development Zone, Dezhou City, Shandong Province Applicant after: Shandong core Electronics Co., Ltd. Address before: 226300 266 Century Avenue, Nantong hi tech Zone, Nantong, Jiangsu Applicant before: Wang Peipei |
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