CN106195661A - A kind of heat radiation device of high-power LED - Google Patents

A kind of heat radiation device of high-power LED Download PDF

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Publication number
CN106195661A
CN106195661A CN201610633871.6A CN201610633871A CN106195661A CN 106195661 A CN106195661 A CN 106195661A CN 201610633871 A CN201610633871 A CN 201610633871A CN 106195661 A CN106195661 A CN 106195661A
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Prior art keywords
heat radiation
heat
weight portion
power led
grid
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Chinese (zh)
Inventor
郭月强
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Zhongshan Fenghua Xining Lighting Design Co Ltd
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Zhongshan Fenghua Xining Lighting Design Co Ltd
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Priority to CN201610633871.6A priority Critical patent/CN106195661A/en
Publication of CN106195661A publication Critical patent/CN106195661A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Paints Or Removers (AREA)

Abstract

nullThe invention discloses a kind of heat radiation device of high-power LED，Including installation base plate，Mounting seat is offered on described installation base plate surface，Described mounting seat internal engagement installs light source chip，Described light source chip is provided above graphite cake，Described graphite cake is fixing with capillary tube absorber plate to be connected，Described installation base plate is fixing with the support in bottom surface within lampshade to be connected，Described lampshade inner tip installs motor additional，The axle head of described motor installs turbine flabellum additional，Heat radiation grid is uniformly installed in described lampshade side upper end，Cover surface below described heat radiation grid offers heat dissipating grid，Described heat radiation grid and capillary tube absorber plate are all connected with coolant circulation unit by conduit，Described coolant circulation unit and motor are all connected with controller by wire，This Novel high-power LED lamp heat abstractor has many grades of heat-sinking capabilities，And use auto-control pattern，On the premise of ensureing heat-sinking capability，Reduce equipment energy consumption greatly.

Description

A kind of heat radiation device of high-power LED
Technical field
The present invention relates to electronic element radiating technical field, be specially a kind of heat radiation device of high-power LED.
Background technology
At present high-power and high-luminance white LED light source the most progressively replaces conventional light source, but due to the high problem of LED junction temperature not Can effectively solve, cause the problems such as the decline of LED chip luminous efficiency, light decay, aging, reduction of service life, make high-power always LED lamp can not apply high in illumination, use the longer field of street lamp lighting of bad environments, life requirements.Along with LED green is shone The needs of bright and energy-conservation situation, exploitation high brightness, the LED light source lamp of high-power applicable street lighting become a new class Topic, to this end, it is proposed that a kind of heat radiation device of high-power LED.
Summary of the invention
It is an object of the invention to provide a kind of heat radiation device of high-power LED, to solve above-mentioned background technology carries The problem gone out.
For achieving the above object, the present invention provides following technical scheme:
A kind of heat radiation device of high-power LED, including installation base plate, mounting seat is offered on described installation base plate surface, institute Stating mounting seat internal engagement and install light source chip, described light source chip is provided above graphite cake, and described graphite cake is inhaled with capillary tube Hot plate is fixing to be connected, and described installation base plate is fixing with the support in bottom surface within lampshade to be connected, and described lampshade inner tip installs electricity additional Machine, the axle head of described motor installs turbine flabellum additional, and heat radiation grid is uniformly installed in described lampshade side upper end, under described heat radiation grid The cover surface of side offers heat dissipating grid, and described heat radiation grid and capillary tube absorber plate are all by conduit and coolant circulation unit Connecting, described coolant circulation unit and motor are all connected with controller by wire, set on described heat radiation grid (5) outer wall There is thermal dispersant coatings.
Preferably, described capillary tube absorber plate surface reload temperature sensor, wire and control are passed through in described temperature sensor Device processed connects.
Preferably, silicone grease is filled between described light source chip and graphite cake.
Preferably, high-temperature conduit and low temperature water pipe, described high-temperature conduit and low temperature water pipe are offered inside described heat radiation grid Connected by N-shaped capillary channel.
Preferably, described thermal dispersant coatings, include following components by weight:
。
Compared with prior art, the invention has the beneficial effects as follows: this Novel high-power LED lamp heat abstractor uses circulation The mode of coolant, is shed heat produced by light source chip by heat radiation grid, and device interior reload temperature sensing Device, precisely detects internal temperature, and when the temperature is low, the self-loopa ability relying only on coolant is dispelled the heat, when temperature rises During to predetermined value, start coolant circulation unit, accelerate the circulation rate of device interior coolant, improve heat-sinking capability, work as temperature Degree continues to rise, then start motor, drives turbine flabellum to produce air-flow, accelerates the air velocity on heat radiation grid surface, accelerates to dissipate Thermal velocity, this equipment realizes many grades of heat radiations, effectively reduces energy loss, ensure the radiating effect of equipment simultaneously.The present invention is dispelled the heat Coating composition and reasonable mixture ratio, good heat dissipation effect.
Accompanying drawing explanation
Fig. 1 is present configuration schematic diagram；
Fig. 2 is present configuration heat radiation grid longitudinal sectional view；
Fig. 3 is present configuration heat radiation grid transverse sectional view.
In figure: 1 lampshade, 2 motors, 3 turbine flabellums, 4 coolant circulation units, 5 heat radiation grid, 6 heat dissipating grid, 7 installations Substrate, 8 light source chips, 9 silicone grease, 10 temperature sensors, 11 graphite cakes, 12 capillary tube absorber plates.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under not making creative work premise Embodiment, broadly falls into the scope of protection of the invention.
Referring to Fig. 1-3, the present invention provides a kind of technical scheme: a kind of heat radiation device of high-power LED, including installing Substrate 7, installation base plate 7 surface offers mounting seat, prevents silicone grease 9 to be heated and thinning flows everywhere, and mounting seat internal engagement installs light Source chip 8, light source chip 8 is provided above graphite cake 11, is distributed by even heat, increasing heat radiation area, accelerates heat radiation, graphite cake 11 fixing with capillary tube absorber plate 12 are connected, and installation base plate 7 is fixed with support in bottom surface lampshade 1 within and is connected, and pushes up inside lampshade 1 End installs motor 2 additional, and the axle head of motor 2 installs turbine flabellum 3 additional, and turbine flabellum 3 works, and produces air-flow, increases heat radiation grid 5 surface Air velocity, accelerate radiating rate, lampshade 1 side upper end uniformly install heat radiation grid 5, heat radiation grid 5 below lampshade 1 table Heat dissipating grid 6 is offered in face, and heat radiation grid 5 and capillary tube absorber plate 12 are all connected with coolant circulation unit 4 by conduit, it is achieved The coolant Rapid Circulation of device interior, the heat-sinking capability of lifting means, coolant circulation unit 4 and motor 2 all pass through wire Being connected with controller, capillary tube absorber plate 12 surface reload temperature sensor 10, temperature sensor 10 is by wire and controller Connect, accurately detection device interior temperature, it is achieved many grades of heat radiations of equipment, between light source chip 8 and graphite cake 11, fill silicone grease 9, silicone grease 9 has the preferable capacity of heat transmission and insulating capacity, and heat radiation grid 5 is internal offers high-temperature conduit and low temperature water pipe, high temperature Water pipe is connected by N-shaped capillary channel with low temperature water pipe, effective heat radiation ability.
The present invention is provided with thermal dispersant coatings on described heat radiation grid 5 outer wall.
Below by way of specific embodiment, the composition of the thermal dispersant coatings of the present invention is further described: embodiment 1
Thermal dispersant coatings of the present invention, includes following components by weight:
。
Thermal dispersant coatings of the present invention is prepared by the following method, and comprises the steps:
A, by water-borne acrylic resin, polycarbonate waterborne polyurethane, comprise modified Nano particle organic siliconresin, Ludox and water mixing and stirring；
B, when stirring add heat filling, auxiliary agent, stir, resulting dispersion system；
C, dispersion in step B being added in paint grinder mill and be ground to 30-50 μm, ultrasonic disperse is uniformly.
Wherein said polycarbonate waterborne polyurethane is prepared by the following method:
The PCDL of 1000 weight portions is added in the container of belt stirrer, be warmed up to 90 DEG C, distillation 0.5 of reducing pressure Hour, it is cooled to 70 DEG C, adds 280 weight portion 2,4 toluene diisocyanates, vacuum dehydration 0.5 hour, be passed through nitrogen, add 400 weight portions enter isophorone diisocyanate, react 2 hours, add the acetone of 75 weight portions, be cooled to 30 DEG C at 80 DEG C, Add in the triethylamine of 85 weight portions and react 15 minutes, adding 25 weight portion N-methyl pyrrole network alkanone, at 50 DEG C, reacting 0.5 Hour, add 80 weight portion butanone and 145 weight portions 1,4-butanediol, react 1 hour, add 1000 parts by weight of deionized water and 95 weight portion trifluoroacetic acids, dispersed with stirring is uniform,.
The wherein said organic siliconresin comprising modified Nano particle is prepared by the following method:
A, take MTES 50 weight portion, add in 650-part water, add the Catalyzed by Formic Acid of 0.05 weight portion Agent, hydrolyzes 1 hour at 0 DEG C, is warming up to 70 DEG C and carries out polyreaction, and reaction carries out decompression distillation after terminating, obtain organosilicon Resin；
B, by the organic siliconresin in step A, 1-Trifluoromethyl-1,3 butadiene 10 weight portions, titanate catalyst 0.2 Weight portion and ethyl acetate 12 weight portion mix homogeneously, under the protection of argon, be heated to 110 DEG C of dehydration condensations 1 hour, Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 80 DEG C, adds 3 parts of silester and react 1 hour, reaction knot Lowering the temperature after bundle, decompression is distilled off solvent, must comprise the organic siliconresin of modified Nano particle.
Heretofore described heat filling by weight percentage by 0.02% CNT, the Nickel Aluminium Alloy Powder of 10%, The aluminium nitride composition of the argentum powder of 2%, the gallium nitride of 20% and 67.98%.Wherein said CNT processes through following methods: Being added by CNT appropriate, volume ratio is the dense H of 3: 12SO4With dense HNO3Nitration mixture in, clean to neutral after 80 DEG C of acidifying 2h And be vacuum dried.
Described auxiliary agent is high 270 polyether silicones of wetting agent enlightening.
Embodiment 2
Thermal dispersant coatings of the present invention, includes following components by weight:
。
Thermal dispersant coatings of the present invention is prepared by the following method, and comprises the steps:
A, by water-borne acrylic resin, polycarbonate waterborne polyurethane, comprise modified Nano particle organic siliconresin, Ludox and water mixing and stirring；
B, when stirring add heat filling, auxiliary agent, stir, resulting dispersion system；
C, dispersion in step B being added in paint grinder mill and be ground to 30-50 μm, ultrasonic disperse is uniformly.
Wherein said polycarbonate waterborne polyurethane is prepared by the following method:
The PCDL of 1000 weight portions is added in the container of belt stirrer, be warmed up to 90 DEG C, distillation 0.5 of reducing pressure Hour, it is cooled to 70 DEG C, adds 280 weight portion 2,4 toluene diisocyanates, vacuum dehydration 0.5 hour, be passed through nitrogen, add 400 weight portions enter isophorone diisocyanate, react 2 hours, add the acetone of 75 weight portions, be cooled to 30 DEG C at 80 DEG C, Add in the triethylamine of 85 weight portions and react 15 minutes, adding 25 weight portion N-methyl pyrrole network alkanone, at 50 DEG C, reacting 0.5 Hour, add 80 weight portion butanone and 145 weight portions 1,4-butanediol, react 1 hour, add 1000 parts by weight of deionized water and 95 weight portion trifluoroacetic acids, dispersed with stirring is uniform,.
The wherein said organic siliconresin comprising modified Nano particle is prepared by the following method:
A, take MTES 80 weight portion, add in 950 parts of water, add the Catalyzed by Formic Acid agent of 0.4 weight portion, Hydrolyzing 5 hours at 5 DEG C, be warming up to 90 DEG C and carry out polyreaction, reaction carries out decompression distillation after terminating, obtain organosilicon tree Fat；
B, by the organic siliconresin in step A, 1-Trifluoromethyl-1,3 butadiene 20 weight portions, titanate catalyst 0.8 Weight portion and ethyl acetate 22 weight portion mix homogeneously, under the protection of argon, be heated to 120 DEG C of dehydration condensations 3 hours, Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 90 DEG C, adds 12 parts of silester and react 2 hours, reaction Lowering the temperature after end, decompression is distilled off solvent, must comprise the organic siliconresin of modified Nano particle.
Heretofore described heat filling by weight percentage by 0.2% CNT, the Nickel Aluminium Alloy Powder of 30%, The aluminium nitride composition of the argentum powder of 1.8%, the gallium nitride of 20% and 48%.Wherein said CNT processes through following methods: Being added by CNT appropriate, volume ratio is the dense H of 3: 12SO4With dense HNO3Nitration mixture in, clean to neutral after 80 DEG C of acidifying 2h And be vacuum dried.
Wherein the auxiliary agent described in 4 weight portions includes 0.2 weight portion wetting agent, 1 parts per weight dispersing agent, 2.8 weight portion film forming Auxiliary agent.Described wetting agent is high 270 polyether silicones of enlightening, and described dispersant is BYK-190 dispersant, and described coalescents is Lauryl Alcohol ester.
Embodiment 3
Thermal dispersant coatings of the present invention, includes following components by weight:
。
Thermal dispersant coatings of the present invention is prepared by the following method, and comprises the steps:
A, by water-borne acrylic resin, polycarbonate waterborne polyurethane, comprise modified Nano particle organic siliconresin, Ludox and water mixing and stirring；
B, when stirring add heat filling, auxiliary agent, stir, resulting dispersion system；
C, dispersion in step B being added in paint grinder mill and be ground to 30-50 μm, ultrasonic disperse is uniformly.
Wherein said polycarbonate waterborne polyurethane is prepared by the following method:
The PCDL of 1000 weight portions is added in the container of belt stirrer, be warmed up to 90 DEG C, distillation 0.5 of reducing pressure Hour, it is cooled to 70 DEG C, adds 280 weight portion 2,4 toluene diisocyanates, vacuum dehydration 0.5 hour, be passed through nitrogen, add 400 weight portions enter isophorone diisocyanate, react 2 hours, add the acetone of 75 weight portions, be cooled to 30 DEG C at 80 DEG C, Add in the triethylamine of 85 weight portions and react 15 minutes, adding 25 weight portion N-methyl pyrrole network alkanone, at 50 DEG C, reacting 0.5 Hour, add 80 weight portion butanone and 145 weight portions 1,4-butanediol, react 1 hour, add 1000 parts by weight of deionized water and 95 weight portion trifluoroacetic acids, dispersed with stirring is uniform,.
The wherein said organic siliconresin comprising modified Nano particle is prepared by the following method:
A, take MTES 65 weight portion, add in 800 parts of water, add the Catalyzed by Formic Acid agent of 0.2 weight portion, Hydrolyzing 2 hours at 2 DEG C, be warming up to 80 DEG C and carry out polyreaction, reaction carries out decompression distillation after terminating, obtain organosilicon tree Fat；
B, by the organic siliconresin in step A, 1-Trifluoromethyl-1,3 butadiene 15 weight portions, titanate catalyst 0.5 Weight portion and ethyl acetate 16 weight portion mix homogeneously, under the protection of argon, be heated to 115 DEG C of dehydration condensations 2 hours, Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 85 DEG C, adds 5 parts of silester and react 1.5 hours, reaction Lowering the temperature after end, decompression is distilled off solvent, must comprise the organic siliconresin of modified Nano particle.
Heretofore described heat filling by weight percentage by 0.1% CNT, the Nickel Aluminium Alloy Powder of 20%, The aluminium nitride composition of the argentum powder of 1%, the gallium nitride of 15% and 63.9%.Wherein said CNT processes through following methods: Being added by CNT appropriate, volume ratio is the dense H of 3: 12SO4With dense HNO3Nitration mixture in, clean to neutral after 80 DEG C of acidifying 2h And be vacuum dried.
Wherein the auxiliary agent described in 2 weight portions includes 0.2 weight portion wetting agent, 0.3 parts per weight dispersing agent, 1 weight portion film forming Auxiliary agent, 0.1 weight portion defoamer, 0.4 weight portion rheological agent.Described wetting agent is high 270 polyether silicones of enlightening, described dispersion Agent is BYK-190 dispersant, and described coalescents is Lauryl Alcohol ester, and described defoamer is BYK-014 defoamer, described rheology Agent is high 450 levelling agents of enlightening.
Embodiment 4
Thermal dispersant coatings of the present invention, includes following components by weight:
。
Thermal dispersant coatings of the present invention is prepared by the following method, and comprises the steps:
A, by water-borne acrylic resin, polycarbonate waterborne polyurethane, comprise modified Nano particle organic siliconresin, Ludox and water mixing and stirring；
B, when stirring add heat filling, auxiliary agent, stir, resulting dispersion system；
C, dispersion in step B being added in paint grinder mill and be ground to 30-50 μm, ultrasonic disperse is uniformly.
Wherein said polycarbonate waterborne polyurethane is prepared by the following method:
The PCDL of 1000 weight portions is added in the container of belt stirrer, be warmed up to 90 DEG C, distillation 0.5 of reducing pressure Hour, it is cooled to 70 DEG C, adds 280 weight portion 2,4 toluene diisocyanates, vacuum dehydration 0.5 hour, be passed through nitrogen, add 400 weight portions enter isophorone diisocyanate, react 2 hours, add the acetone of 75 weight portions, be cooled to 30 DEG C at 80 DEG C, Add in the triethylamine of 85 weight portions and react 15 minutes, adding 25 weight portion N-methyl pyrrole network alkanone, at 50 DEG C, reacting 0.5 Hour, add 80 weight portion butanone and 145 weight portions 1,4-butanediol, react 1 hour, add 1000 parts by weight of deionized water and 95 weight portion trifluoroacetic acids, dispersed with stirring is uniform,.
The wherein said organic siliconresin comprising modified Nano particle is prepared by the following method:
A, take MTES 50 weight portion, add in 950 parts of water, add the Catalyzed by Formic Acid of 0.05 weight portion Agent, hydrolyzes 1 hour at 0 DEG C, is warming up to 90 DEG C and carries out polyreaction, and reaction carries out decompression distillation after terminating, obtain organosilicon Resin；
B, by the organic siliconresin in step A, 1-Trifluoromethyl-1,3 butadiene 10 weight portions, titanate catalyst 0.2 Weight portion and ethyl acetate 15 weight portion mix homogeneously, under the protection of argon, be heated to 110 DEG C of dehydration condensations 1 hour, Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 80 DEG C, adds 3 parts of silester and react 1 hour, reaction knot Lowering the temperature after bundle, decompression is distilled off solvent, must comprise the organic siliconresin of modified Nano particle.
Heretofore described heat filling by weight percentage by 0.05% CNT, the Nickel Aluminium Alloy Powder of 30%, The aluminium nitride composition of the argentum powder of 0.55%, the gallium nitride of 10% and 59.4%.Wherein said CNT is at following methods Reason: being added by CNT appropriate, volume ratio is the dense H of 3: 12SO4With dense HNO3Nitration mixture in, 80 DEG C acidifying 2h after clean to Neutrality is also vacuum dried.
Wherein the auxiliary agent described in 0.2 weight portion is 0.05 wetting agent, 0.15 coalescents.Described wetting agent is that enlightening is high 270 polyether silicones, described coalescents is Lauryl Alcohol ester.
Embodiment 5
Thermal dispersant coatings of the present invention, includes following components by weight:
；
Thermal dispersant coatings of the present invention is prepared by the following method, and comprises the steps:
A, by water-borne acrylic resin, polycarbonate waterborne polyurethane, comprise modified Nano particle organic siliconresin, Ludox and water mixing and stirring；
B, when stirring add heat filling, auxiliary agent, stir, resulting dispersion system；
C, dispersion in step B being added in paint grinder mill and be ground to 30-50 μm, ultrasonic disperse is uniformly.
Wherein said polycarbonate waterborne polyurethane is prepared by the following method:
The PCDL of 1000 weight portions is added in the container of belt stirrer, be warmed up to 90 DEG C, distillation 0.5 of reducing pressure Hour, it is cooled to 70 DEG C, adds 280 weight portion 2,4 toluene diisocyanates, vacuum dehydration 0.5 hour, be passed through nitrogen, add 400 weight portions enter isophorone diisocyanate, react 2 hours, add the acetone of 75 weight portions, be cooled to 30 DEG C at 80 DEG C, Add in the triethylamine of 85 weight portions and react 15 minutes, adding 25 weight portion N-methyl pyrrole network alkanone, at 50 DEG C, reacting 0.5 Hour, add 80 weight portion butanone and 145 weight portions 1,4-butanediol, react 1 hour, add 1000 parts by weight of deionized water and 95 weight portion trifluoroacetic acids, dispersed with stirring is uniform,.
The wherein said organic siliconresin comprising modified Nano particle is prepared by the following method:
A, take MTES 60 weight portion, add in 700 parts of water, add the Catalyzed by Formic Acid agent of 0.1 weight portion, Hydrolyzing 2 hours at 1 DEG C, be warming up to 75 DEG C and carry out polyreaction, reaction carries out decompression distillation after terminating, obtain organosilicon tree Fat；
B, by the organic siliconresin in step A, 1-Trifluoromethyl-1,3 butadiene 18 weight portions, titanate catalyst 0.3 Weight portion and ethyl acetate 14 weight portion mix homogeneously, under the protection of argon, be heated to 115 DEG C of dehydration condensations 2 hours, Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 85 DEG C, adds 6 parts of silester and react 1.5 hours, reaction Lowering the temperature after end, decompression is distilled off solvent, must comprise the organic siliconresin of modified Nano particle.
Heretofore described heat filling by weight percentage by 0.15% CNT, the Nickel Aluminium Alloy Powder of 30%, The aluminium nitride composition of the argentum powder of 0.5%, the gallium nitride of 5% and 64.35%.Wherein said CNT is at following methods Reason: being added by CNT appropriate, volume ratio is the dense H of 3: 12SO4With dense HNO3Nitration mixture in, 80 DEG C acidifying 2h after clean to Neutrality is also vacuum dried.
Wherein the auxiliary agent described in 4 weight portions is for including that 0.1 weight portion wetting agent, 0.2 parts per weight dispersing agent, 2 weight portions become Film auxiliary agent, 0.3 weight portion defoamer and 1.4 weight portion rheological agents.Described wetting agent is high 270 polyether silicones of enlightening, described Dispersant is BYK-190 dispersant, and described coalescents is Lauryl Alcohol ester, and described defoamer is BYK-014 defoamer, described Rheological agent is high 450 levelling agents of enlightening.
Described anticorrosive packing is zinc phosphate.
Embodiment 6
Thermal dispersant coatings of the present invention, includes following components by weight:
Thermal dispersant coatings of the present invention is prepared by the following method, and comprises the steps:
A, by water-borne acrylic resin, polycarbonate waterborne polyurethane, comprise modified Nano particle organic siliconresin, Ludox and water mixing and stirring；
B, when stirring add heat filling, auxiliary agent, stir, resulting dispersion system；
C, dispersion in step B being added in paint grinder mill and be ground to 30-50 μm, ultrasonic disperse is uniformly.
Wherein said polycarbonate waterborne polyurethane is prepared by the following method:
The PCDL of 1000 weight portions is added in the container of belt stirrer, be warmed up to 90 DEG C, distillation 0.5 of reducing pressure Hour, it is cooled to 70 DEG C, adds 280 weight portion 2,4 toluene diisocyanates, vacuum dehydration 0.5 hour, be passed through nitrogen, add 400 weight portions enter isophorone diisocyanate, react 2 hours, add the acetone of 75 weight portions, be cooled to 30 DEG C at 80 DEG C, Add in the triethylamine of 85 weight portions and react 15 minutes, adding 25 weight portion N-methyl pyrrole network alkanone, at 50 DEG C, reacting 0.5 Hour, add 80 weight portion butanone and 145 weight portions 1,4-butanediol, react 1 hour, add 1000 parts by weight of deionized water and 95 weight portion trifluoroacetic acids, dispersed with stirring is uniform,.
The wherein said organic siliconresin comprising modified Nano particle is prepared by the following method:
A, take MTES 70 weight portion, add in 800 parts of water, add the Catalyzed by Formic Acid agent of 0.3 weight portion, Hydrolyzing 3 hours at 3 DEG C, be warming up to 80 DEG C and carry out polyreaction, reaction carries out decompression distillation after terminating, obtain organosilicon tree Fat；
B, by the organic siliconresin in step A, 1-Trifluoromethyl-1,3 butadiene 13 weight portions, titanate catalyst 0.4 Weight portion and ethyl acetate 20 weight portion mix homogeneously, under the protection of argon, be heated to 110 DEG C of dehydration condensations 1 hour, Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 80 DEG C, adds 3 parts of silester and react 1 hour, reaction knot Lowering the temperature after bundle, decompression is distilled off solvent, must comprise the organic siliconresin of modified Nano particle.
Heretofore described heat filling by weight percentage by 0.2% CNT, the Nickel Aluminium Alloy Powder of 25%, The aluminium nitride composition of the argentum powder of 1%, the gallium nitride of 16% and 57.8%.Wherein said CNT processes through following methods: Being added by CNT appropriate, volume ratio is the dense H of 3: 12SO4With dense HNO3Nitration mixture in, clean to neutral after 80 DEG C of acidifying 2h And be vacuum dried.
Wherein the auxiliary agent described in 0.2 weight portion is 0.1 weight portion wetting agent, 0.1 parts per weight dispersing agent.Described wetting agent For high 270 polyether silicones of enlightening, described dispersant is BYK-190 dispersant.
Described anticorrosive packing is the mixture of zinc phosphate, modified zinc phosphate.
Embodiment 7
Thermal dispersant coatings of the present invention, includes following components by weight:
；
Thermal dispersant coatings of the present invention is prepared by the following method, and comprises the steps:
A, by water-borne acrylic resin, polycarbonate waterborne polyurethane, comprise modified Nano particle organic siliconresin, Ludox and water mixing and stirring；
B, when stirring add heat filling, auxiliary agent, stir, resulting dispersion system；
C, dispersion in step B being added in paint grinder mill and be ground to 30-50 μm, ultrasonic disperse is uniformly.
Wherein said polycarbonate waterborne polyurethane is prepared by the following method:
The PCDL of 1000 weight portions is added in the container of belt stirrer, be warmed up to 90 DEG C, distillation 0.5 of reducing pressure Hour, it is cooled to 70 DEG C, adds 280 weight portion 2,4 toluene diisocyanates, vacuum dehydration 0.5 hour, be passed through nitrogen, add 400 weight portions enter isophorone diisocyanate, react 2 hours, add the acetone of 75 weight portions, be cooled to 30 DEG C at 80 DEG C, Add in the triethylamine of 85 weight portions and react 15 minutes, adding 25 weight portion N-methyl pyrrole network alkanone, at 50 DEG C, reacting 0.5 Hour, add 80 weight portion butanone and 145 weight portions 1,4-butanediol, react 1 hour, add 1000 parts by weight of deionized water and 95 weight portion trifluoroacetic acids, dispersed with stirring is uniform,.
The wherein said organic siliconresin comprising modified Nano particle is prepared by the following method:
A, take MTES 60 weight portion, add in 750 parts of water, add the Catalyzed by Formic Acid agent of 0.2 weight portion, Hydrolyzing 3 hours at 2 DEG C, be warming up to 75 DEG C and carry out polyreaction, reaction carries out decompression distillation after terminating, obtain organosilicon tree Fat；
B, by the organic siliconresin in step A, 1-Trifluoromethyl-1,3 butadiene 13 weight portions, titanate catalyst 0.3 Weight portion and ethyl acetate 18 weight portion mix homogeneously, under the protection of argon, be heated to 120 DEG C of dehydration condensations 3 hours, Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 90 DEG C, adds 12 parts of silester and react 2 hours, reaction Lowering the temperature after end, decompression is distilled off solvent, must comprise the organic siliconresin of modified Nano particle.
Heretofore described heat filling by weight percentage by 0.02% CNT, the Nickel Aluminium Alloy Powder of 28%, The aluminium nitride composition of the argentum powder of 0.8%, the gallium nitride of 15% and 56.18%.Wherein said CNT is at following methods Reason: being added by CNT appropriate, volume ratio is the dense H of 3: 12SO4With dense HNO3Nitration mixture in, 80 DEG C acidifying 2h after clean to Neutrality is also vacuum dried.
Wherein the auxiliary agent described in 2 weight portions is that 0.2 weight portion wetting agent, 0.1 parts per weight dispersing agent, 1 weight portion film forming help Agent, 0.2 weight portion defoamer and 0.5 weight portion rheological agent.Described wetting agent is high 270 polyether silicones of enlightening, described dispersion Agent is BYK-190 dispersant, and described coalescents is Lauryl Alcohol ester, and described defoamer is BYK-014 defoamer, described rheology Agent is high 450 levelling agents of enlightening.
Wherein anticorrosive packing described in 6 weight portions includes 2 parts by weight of phosphoric acid zinc, 1 part by weight modified zinc phosphate and 3 weight portion molybdenums The mixture of acid zinc.
The heat dispersion of thermal dispersant coatings of the present invention is verified further by tests below:
Take 8 pieces of aluminium bases to mark respectively, plate 1, plate 2, plate 3, plate 4, plate 5, plate 6, plate 7, plate 8；Wherein plate 1 is not coated with heat-radiation coating Layer, plate 2-8 surface is coated with the thermal dispersant coatings in embodiment of the present invention 1-7 the most successively, after solidification detects its performance；By plate 1 to plate 8 is positioned in heating plate, be sequentially adjusted in temperature 50 C, 80 DEG C, 100 DEG C, 150 DEG C, 200 DEG C, 250 DEG C, 300 DEG C, every time After homoiothermic, balancing and within 60 minutes, be further continued for being heated to next temperature, utilize temperature measurer record temperature, result is as shown in table 1, room temperature 25 ℃。
Table 1
Initial temperature DEG C 50 80 100 150 200 250 300
After plate 1 balances 60 minutes 38 65 78 121 155 198 243
After plate 2 balances 60 minutes 26 50 58 83 110 160 201
After plate 3 balances 60 minutes 22 48 56 80 105 149 190
After plate 4 balances 60 minutes 23 45 55 81 103 148 188
After plate 5 balances 60 minutes 20 41 48 76 98 130 175
After plate 6 balances 60 minutes 21 42 49 77 99 132 176
After plate 7 balances 60 minutes 23 49 52 80 100 135 185
After plate 8 balances 60 minutes 24 47 54 81 103 141 188
Can clearly show that from table 1 the aluminium base temperature scribbling thermal dispersant coatings of the present invention is all far below being not coated with thermal dispersant coatings Aluminium base, illustrate that thermal dispersant coatings of the present invention has good radiating effect.
Thermal dispersant coatings of the present invention combination, reasonable mixture ratio, good heat dissipation effect；Dispel the heat in thermal dispersant coatings formula of the present invention filler Composition and ratio is reasonable, the area of dissipation of the effective film layer adding formation, so that the radiating effect of thermal dispersant coatings of the present invention It is obviously improved.
The ultimate principle of the present invention and principal character and advantages of the present invention have more than been shown and described.The skill of the industry The art personnel simply explanation it should be appreciated that the present invention is not restricted to the described embodiments, described in above-described embodiment and description The principle of the present invention, without departing from the spirit and scope of the present invention, the present invention also has various changes and modifications, these Changes and improvements both fall within scope of the claimed invention.Claimed scope by appending claims and Its equivalent defines.

Claims (5)

1. a heat radiation device of high-power LED, including installation base plate (7), it is characterised in that: described installation base plate (7) table Mounting seat is offered in face, and described mounting seat internal engagement installs light source chip (8), and described light source chip (8) is provided above graphite cake (11), described graphite cake (11) is fixing with capillary tube absorber plate (12) to be connected, described installation base plate (7) and lampshade (1) inside Support in bottom surface is fixing to be connected, and described lampshade (1) inner tip installs motor (2) additional, and the axle head of described motor (2) installs turbine flabellum additional (3), heat radiation grid (5) is uniformly installed in described lampshade (1) side upper end, and lampshade (1) surface of described heat radiation grid (5) lower section is left If heat dissipating grid (6), described heat radiation grid (5) and capillary tube absorber plate (12) are all by conduit and coolant circulation unit (4) Connecting, described coolant circulation unit (4) and motor (2) are all connected with controller by wire, described heat radiation grid (5) outward Wall is provided with thermal dispersant coatings.
A kind of heat radiation device of high-power LED the most according to claim 1, it is characterised in that: described capillary tube absorbs heat Plate (12) surface reload temperature sensor (10), described temperature sensor (10) is connected with controller by wire.
A kind of heat radiation device of high-power LED the most according to claim 1, it is characterised in that: described light source chip (8) And fill silicone grease (9) between graphite cake (11).
A kind of heat radiation device of high-power LED the most according to claim 1, it is characterised in that: described heat radiation grid (5) High-temperature conduit and low temperature water pipe are offered in inside, and described high-temperature conduit is connected by N-shaped capillary channel with low temperature water pipe.
A kind of heat radiation device of high-power LED the most according to claim 1, it is characterised in that: described thermal dispersant coatings, press Weight portion includes following components:
。
CN201610633871.6A 2016-08-03 2016-08-03 A kind of heat radiation device of high-power LED Pending CN106195661A (en)

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CN107706259A (en) * 2017-10-12 2018-02-16 绍兴文理学院 A kind of solar energy backboard water radiating device
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