CN106189056A - The aldehyde resin composition that a kind of high bonding strength is poly- - Google Patents
The aldehyde resin composition that a kind of high bonding strength is poly- Download PDFInfo
- Publication number
- CN106189056A CN106189056A CN201610718218.XA CN201610718218A CN106189056A CN 106189056 A CN106189056 A CN 106189056A CN 201610718218 A CN201610718218 A CN 201610718218A CN 106189056 A CN106189056 A CN 106189056A
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- weight portion
- bonding strength
- resin composition
- poly
- high bonding
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/08—Polymer mixtures characterised by other features containing additives to improve the compatibility between two polymers
Abstract
The present invention relates to the aldehyde resin composition that a kind of high bonding strength is poly-.The aldehyde resin composition that the high bonding strength that the present invention provides is poly-, component including following weight portion: acetal resin 80 120 weight portion, polystyrene resin 30 65 weight portion, mica powder 20 70 weight portion, melamine phosphate 10 50 weight portion, melamine cyanurate 15-30 weight portion, toughener 10 30 weight portion, double thioether 10 35 weight portion；Wherein polystyrene resin comprises 0.1 2wt% active isocyanate；Inventor's early stage has carried out the screening experiment of substantial amounts of component and consumption, it is found surprisingly that, acetal resin adds containing the polystyrene resin of specified quantitative active isocyanate, mica powder and melamine cyanurate, the generation of carbide can be suppressed in preparation process, the compatibility between polystyrene resin and acetal resin in polyoxymethylene composite resin composition can be improved, the aldehyde resin composition that the high bonding strength being prepared gathers has high impact strength, there is at weld bond intensity and the extension property of excellence, also there is high-mouldability.
Description
Technical field
The invention belongs to new material and environmental protection and energy saving technical field, particularly relate to the formaldehyde resin that a kind of high bonding strength is poly-
Compositions.
Background technology
Acetal resin have excellent mechanical properties, creep resistance, fatigue resistance and wearability POM-H Acetal homopolymer or
Copolymer is widely used in Electrical and Electronic parts, or is applied to various character, including mechanical schemes
Field.But, the impact resistance of acetal resin is poor, thus its utilization is partly limited.
Summary of the invention
In view of the problem existing for prior art, the present invention provides the aldehyde resin composition that a kind of high bonding strength is poly-,
The generation of carbide can be suppressed in preparation process, and improve the compatibility between resin used, there is high impact strength, molten
There is at wiring intensity and the extension property of excellence, also there is high-mouldability.
The technical scheme is that
The invention provides the aldehyde resin composition that a kind of high bonding strength is poly-, including the component of following weight portion: poly-
Formaldehyde resin 80-120 weight portion, polystyrene resin 30-65 weight portion, mica powder 20-70 weight portion, melamine phosphate
10-50 weight portion, melamine cyanurate 15-30 weight portion, toughener 10-30 weight portion, double thioether 10-35 weight portion；Its
Middle polystyrene resin comprises 0.1-2wt% active isocyanate.
The invention has the beneficial effects as follows: inventor's early stage has carried out the screening experiment of substantial amounts of component and consumption, unexpected
Discovery, add containing the polystyrene resin of specified quantitative active isocyanate, mica powder, phosphoric acid trimerization in acetal resin
Cyanamide and melamine cyanurate and double thioether, and it is optionally added the compound containing maleic anhydride, polyformaldehyde can be improved and be combined
The compatibility between polystyrene resin and acetal resin in resin combination；Therefore carbide can be suppressed in preparation process
Generation, and improve the compatibility between resin used, so have prepare the aldehyde resin composition that high bonding strength gathers
High impact strength, has intensity and the extension property of excellence at weld bond, also has high-mouldability.
On the basis of technique scheme, the present invention can also do following improvement.
Further, acetal resin 90 weight portion, polystyrene resin 45 weight portion, mica powder 50 weight portion, phosphoric acid
Tripolycyanamide 35 weight portion, melamine cyanurate 20 weight portion, toughener 20 weight portion, double thioether 25 weight portion；Wherein gather
Styrene resin comprises 1.2wt% active isocyanate.
Further, the average particulate diameter of described mica powder is 2-60 micron.
Such scheme is used to provide the benefit that: to improve environment protecting further, simultaneously facilitate mixing.
Further, described acetal resin relative density is 1.40-1.45g/cm3, and fusing point is 170-180 DEG C, melt
Viscosity be 0.3-3 degree of crystallinity be 65-85%, mean molecule quantity is 10000-200000.
Further, described toughener is MMB methyl methacrylate butadiene styrene copolymer.
Further, also include in described polystyrene resin that 0.01-5% contains the compound of maleic anhydride.
Such scheme is used to provide the benefit that: carbon can be suppressed in preparation process by adding the compound of maleic anhydride
The generation of compound, can increase the compatibility between polystyrene resin and acetal resin, improves high bonding strength further and gathers
The shock strength of aldehyde resin composition, extension property and high-mouldability.
Detailed description of the invention
Principle and feature to the present invention are described below, and example is served only for explaining the present invention, is not intended to limit
Determine the scope of the present invention.
The invention provides the aldehyde resin composition that a kind of high bonding strength is poly-, including the component of following weight portion: poly-
Formaldehyde resin 80-120 weight portion, polystyrene resin 30-65 weight portion, mica powder 20-70 weight portion, melamine phosphate
10-50 weight portion, melamine cyanurate 15-30 weight portion, toughener 10-30 weight portion, double thioether 10-35 weight portion；Its
Middle polystyrene resin comprises 0.1-2wt% active isocyanate.
Inventor's early stage has carried out the screening experiment of substantial amounts of component and consumption, is found surprisingly that, inventor's early stage is entered
Go the screening experiment of substantial amounts of component and consumption, be found surprisingly that, add in acetal resin containing specified quantitative activity
The polystyrene resin of isocyanates, mica powder, melamine phosphate and melamine cyanurate, and be optionally added containing maleic acid
The compound of acid anhydride, that can improve in polyoxymethylene composite resin composition between polystyrene resin and acetal resin is compatible
Property；Therefore can suppress the generation of carbide in preparation process, and improve the compatibility between resin used, so at preparation height
The aldehyde resin composition that bonding strength gathers has high impact strength, has intensity and the extension property of excellence at weld bond,
Also there is high-mouldability.
It is introduced below by specific embodiment.
Embodiment 1
The aldehyde resin composition that a kind of high bonding strength is poly-, including the component of following weight portion: acetal resin 80 weight
Amount part, polystyrene resin 30 weight portion, mica powder 20 weight portion, melamine phosphate 10 weight portion, melamine cyanurate
15 weight portions, toughener 10 weight portion, double thioether 20 weight portion；Wherein polystyrene resin comprises 0.1-2wt% activity isocyanide
Acid esters；The average particulate diameter of described mica powder is 2 microns, and described acetal resin relative density is 1.40-1.45g/
Cm3, fusing point is 170-180 DEG C, melt viscosity be 0.3-3 degree of crystallinity be 65-85%, mean molecule quantity is 10000-200000,
Also include in described polystyrene resin that 0.01-5% contains the compound of maleic anhydride；Preferably, described toughener is methyl-prop
E pioic acid methyl ester butadiene styrene terpolymer.
Embodiment 2
The aldehyde resin composition that a kind of high bonding strength is poly-, acetal resin 90 weight portion, polystyrene resin 45 weight
Amount part, mica powder 50 weight portion, melamine phosphate 35 weight portion, melamine cyanurate 20 weight portion, toughener 20 weight
Part, double thioether 25 weight portion；Wherein polystyrene resin comprises 1.2wt% active isocyanate.
Embodiment 3
The aldehyde resin composition that a kind of high bonding strength is poly-, including the component of following weight portion: acetal resin 120
Weight portion, polystyrene resin 65 weight portion, mica powder 70 weight portion, melamine phosphate 10-50 weight portion, cyanuric acid trimerization
Cyanamide 30 weight portion, toughener 30 weight portion, double thioether 35 weight portion；Wherein polystyrene resin comprises 2wt% activity isocyanide
Acid esters.
Comparative example 1
Acetal resin equivalent is used to replace polystyrene resin, simultaneously the mica powder in removing embodiment 1, remaining group
Divide with content with all identical with embodiment.
Comparative example 2
Acetal resin equivalent is used to replace polystyrene resin, simultaneously the mica powder in removing embodiment 1, tricresyl phosphate
Poly cyanamid and double thioether, remaining component and content are with all identical with embodiment.
Comparative example 3
Acetal resin equivalent is used to replace polystyrene resin, simultaneously the mica powder in removing embodiment 1 and cyanogen urine
Acid tripolycyanamide, remaining component with content with all identical with embodiment.
Measure of merit
Measure the poly-aldehyde resin composition of high bonding strength prepared by above-described embodiment and comparative example and comparative example respectively
In compositions in physical characteristic.
Test result is as shown in table 1.
Table 1
According to the data in table 1 it can be seen that the poly-formaldehyde resin of the high bonding strength that provides of technical scheme
Compositions has high impact strength, has intensity and the extension property of excellence, also have high-mouldability at weld bond.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all spirit in the present invention and
Within principle, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (6)
1. the aldehyde resin composition that a high bonding strength is poly-, it is characterised in that include the component of following weight portion: polyformaldehyde
Resin 80-120 weight portion, polystyrene resin 30-65 weight portion, mica powder 20-70 weight portion, melamine phosphate 10-50
Weight portion, melamine cyanurate 15-30 weight portion, toughener 10-30 weight portion, double thioether 10-35 weight portion；Wherein gather
Styrene resin comprises 0.1-2wt% active isocyanate.
The aldehyde resin composition that high bonding strength the most according to claim 1 is poly-, it is characterised in that acetal resin 90
Weight portion, polystyrene resin 45 weight portion, mica powder 50 weight portion, melamine phosphate 35 weight portion, cyanuric acid melamine
Amine 20 weight portion, toughener 20 weight portion, double thioether 25 weight portion；Wherein polystyrene resin comprises 1.2wt% activity isocyanide
Acid esters.
The aldehyde resin composition that high bonding strength the most according to claim 1 is poly-, it is characterised in that described mica powder
Average particulate diameter is 2-60 micron.
The aldehyde resin composition that high bonding strength the most according to claim 1 is poly-, it is characterised in that described polyformaldehyde tree
Fat relative density is 1.40-1.45g/cm3, and fusing point is 170-180 DEG C, melt viscosity be 0.3-3 degree of crystallinity be 65-85%, flat
Average molecular weight is 10000-200000.
The aldehyde resin composition that high bonding strength the most according to claim 1 is poly-, it is characterised in that described toughener is
MMB methyl methacrylate butadiene styrene copolymer.
The aldehyde resin composition that high bonding strength the most according to claim 1 is poly-, it is characterised in that described polystyrene
Also include in resin that 0.01-5% contains the compound of maleic anhydride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610718218.XA CN106189056A (en) | 2016-08-24 | 2016-08-24 | The aldehyde resin composition that a kind of high bonding strength is poly- |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610718218.XA CN106189056A (en) | 2016-08-24 | 2016-08-24 | The aldehyde resin composition that a kind of high bonding strength is poly- |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106189056A true CN106189056A (en) | 2016-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610718218.XA Pending CN106189056A (en) | 2016-08-24 | 2016-08-24 | The aldehyde resin composition that a kind of high bonding strength is poly- |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116376209A (en) * | 2023-04-28 | 2023-07-04 | 金发科技股份有限公司 | HIPS/POM alloy material and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1589295A (en) * | 2001-11-21 | 2005-03-02 | 韩国工程塑料有限公司 | Polyoxymethylene composite resin composition and articles prepared therefrom |
| CN1995130A (en) * | 2006-12-28 | 2007-07-11 | 深圳市科聚新材料有限公司 | Halogen-free environment-friendly flame-proof polyoxymethylene resin and its preparation method |
| CN104130544A (en) * | 2014-08-10 | 2014-11-05 | 韩巧 | Flame-retardant car ceiling material and preparation method thereof |
| CN104788839A (en) * | 2015-04-17 | 2015-07-22 | 柳州蔚园塑料彩印包装有限责任公司 | High abrasion-resistant engineering plastic |
-
2016
- 2016-08-24 CN CN201610718218.XA patent/CN106189056A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1589295A (en) * | 2001-11-21 | 2005-03-02 | 韩国工程塑料有限公司 | Polyoxymethylene composite resin composition and articles prepared therefrom |
| CN1995130A (en) * | 2006-12-28 | 2007-07-11 | 深圳市科聚新材料有限公司 | Halogen-free environment-friendly flame-proof polyoxymethylene resin and its preparation method |
| CN104130544A (en) * | 2014-08-10 | 2014-11-05 | 韩巧 | Flame-retardant car ceiling material and preparation method thereof |
| CN104788839A (en) * | 2015-04-17 | 2015-07-22 | 柳州蔚园塑料彩印包装有限责任公司 | High abrasion-resistant engineering plastic |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116376209A (en) * | 2023-04-28 | 2023-07-04 | 金发科技股份有限公司 | HIPS/POM alloy material and preparation method and application thereof |
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| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161207 |
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| RJ01 | Rejection of invention patent application after publication |