CN106182468B

CN106182468B - Method for forming vertical crack in brittle material substrate and method for breaking substrate

Info

Publication number: CN106182468B
Application number: CN201610332891.XA
Authority: CN
Inventors: 岩坪佑磨; 曾山浩
Original assignee: Mitsuboshi Diamond Industrial Co Ltd
Current assignee: Mitsuboshi Diamond Industrial Co Ltd
Priority date: 2015-05-29
Filing date: 2016-05-18
Publication date: 2020-06-23
Anticipated expiration: 2036-05-18
Also published as: KR20160140385A; CN106182468A; TW201703961A; JP2016221822A; TWI695768B; JP6589381B2

Abstract

The invention provides a method for forming a vertical crack in a brittle material substrate and a substrate breaking method, which can form the vertical crack on the brittle material substrate with high reliability. The method for forming the vertical crack on the brittle material substrate comprises the following steps: a groove line forming step of forming a groove line on one main surface, the groove line being a linear groove portion; and an auxiliary line forming step of forming an auxiliary line intersecting the groove line by pressure-rolling a scribing wheel, wherein the scribing wheel has a uniform blade edge on an outer peripheral portion, the groove line is formed in a state of maintaining a crack-free state right below the groove line in the groove line forming step, and the auxiliary line is formed in a state of inclining the scribing wheel from a forming advancing direction of the auxiliary line at a predetermined inclination angle in a horizontal plane, thereby generating propagation of a vertical crack from the groove line with an intersection point of the two lines as a starting point.

Description

Method for forming vertical crack in brittle material substrate and method for breaking substrate

Technical Field

The present invention relates to a method for breaking a brittle material substrate, and more particularly, to a method for forming a vertical crack when breaking a brittle material substrate.

Background

A manufacturing process of a flat panel display panel, a solar cell panel, or the like generally includes a step of breaking a substrate (mother substrate) made of a brittle material such as a glass substrate, a ceramic substrate, or a semiconductor substrate. For the related art breaking, a method of forming a scribe line on a substrate surface using a scribing tool such as a diamond cutter or a cutter wheel and propagating a crack (vertical crack) from the scribe line in a thickness direction of the substrate is widely used. When the scribe line is formed, the vertical crack may completely propagate in the thickness direction to break the substrate, but the vertical crack may locally propagate in the thickness direction. In the latter case, after the scribe line is formed, stress application called a breaking process is performed. The substrate is broken along the scribe lines by completely propagating the vertical crack in the thickness direction through the breaking step.

As a method for propagating a vertical crack by forming a scribe line as described above, there are known: a method of forming a linear machining mark, also called an auxiliary line, which becomes a starting point (trigger) when a vertical crack propagates (see, for example, patent document 1).

Prior art documents

Patent document

Patent document 1: japanese patent laid-open publication No. 2015-74145

Disclosure of Invention

Technical problem to be solved by the invention

For example, the method using the auxiliary line as disclosed in patent document 1 has an advantage that a force (impact) applied to the substrate by a scribing tool such as a cutter wheel or a diamond cutter can be reduced when forming the scribing line for breaking, as compared with the method not using the auxiliary line. For example, even in a system in which a weak force (load) such that a vertical crack is not easily propagated is applied to form a scribe line, the vertical crack can be ideally propagated from the scribe line by using the auxiliary line as a trigger.

However, although a high yield (reliable breaking) is required for breaking a brittle material substrate, particularly in a manufacturing process of mass production, the technique disclosed in patent document 1 does not necessarily ensure that a vertical crack reliably propagates starting from an auxiliary line.

The present invention has been made in view of the above-described problems, and an object thereof is to provide a method capable of forming a vertical crack in a brittle material substrate at a predetermined breaking position with high reliability.

Means for solving the technical problem

In order to solve the above-described technical problem, a method for forming a vertical crack in a brittle material substrate according to a first aspect of the present invention is a method for forming a vertical crack at a breaking position when breaking the brittle material substrate in a thickness direction, including: a groove line forming step of forming a groove line on one main surface of the brittle material substrate, the groove line being a linear groove portion; and an auxiliary line forming step of forming an auxiliary line by pressure-rolling a scribing wheel on the one main surface, the scribing wheel having a uniform cutting edge at an outer peripheral portion, the auxiliary line being a processing mark intersecting the groove line, wherein the groove line forming step forms the groove line so as to maintain a crack-free state directly below the groove line, and wherein the auxiliary line forming step forms the auxiliary line in a state where the scribing wheel is inclined from a forming advancing direction of the auxiliary line at a predetermined inclination angle in a horizontal plane, and causes a vertical crack to propagate from the groove line in a thickness direction of the brittle material substrate, with an intersection of the groove line and the auxiliary line as a starting point.

A second aspect of the present invention is the method for forming a median crack in a brittle material substrate according to the first aspect, wherein in the auxiliary line forming step, a deviation set (a deviation) of the auxiliary crack from the auxiliary line toward the inside of the brittle material substrate is generated in a region on one side of the auxiliary line in accordance with the formation of the auxiliary line, and forming positions of the groove line and the auxiliary line are defined such that the region in which the auxiliary crack deviates set (a deviation) is positioned on one side of a predetermined propagation direction of the median crack on the groove line.

A third aspect of the present invention is the method for forming a median crack in a brittle material substrate according to the second aspect, wherein the auxiliary line is formed so as to intersect the groove line in a vicinity of a side opposite to a direction in which the median crack propagates on the groove line.

A fourth aspect of the present invention is the method for forming a vertical crack in a brittle material substrate according to the second or third aspect, wherein in the auxiliary line forming step, a forward direction of the scribing wheel is inclined in a horizontal plane from a forming forward direction of the auxiliary line toward a direction of a predetermined propagation direction of the vertical crack on the groove line.

A fifth aspect of the present invention is the method for forming a vertical crack in a brittle material substrate according to any one of the first to fourth aspects, wherein the tilt angle is 1.0 ° or more and 5.0 ° or less.

A sixth aspect of the present invention is the method for forming a vertical crack in a brittle material substrate according to the fifth aspect, wherein the tilt angle is 2.5 ° or more and 5.0 ° or less.

A seventh aspect of the present invention is the method for forming a vertical crack in a brittle material substrate according to any one of the first to sixth aspects, wherein the auxiliary line is formed after the groove line is formed.

A breaking method of a brittle material substrate according to an eighth aspect of the present invention is a method for breaking the brittle material substrate in a thickness direction, characterized by comprising: a median crack forming step of forming the median crack in the brittle material substrate according to any one of the first to seventh aspects; and a breaking step of breaking the brittle material substrate along the vertical crack.

Effects of the invention

According to the first to eighth aspects, the vertical crack can be reliably propagated at the predetermined breaking position of the brittle material substrate, and therefore the brittle material substrate can be reliably broken at the breaking position.

Drawings

Fig. 1 is a schematic configuration diagram of a scribing apparatus 100.

Fig. 2 is a schematic view of the posture of the scribing wheel 51 in the scribing apparatus 100.

Fig. 3 is a plan view of the brittle material substrate W illustrating a state after the slot line TL is formed.

Fig. 4 (a) and (b) are schematic diagrams showing a schematic configuration of the diamond nicking tool 150 for forming the groove line TL.

Fig. 5 is a zx partial cross-sectional view of a vertical cross-section including the slot line TL.

Fig. 6 is a plan view illustrating the brittle material substrate W in the case where the auxiliary line AL is formed.

Fig. 7 is a plan view of the brittle material substrate W illustrating a state in which the vertical crack VC propagates with the formation of the auxiliary line AL.

Fig. 8 is a plan view of the brittle material substrate W illustrating a case where the vertical crack VC propagates with the formation of the auxiliary line AL.

Fig. 9 is a zx partial cross-sectional view of a vertical cross-section including a groove line TL and a vertical crack VC.

Fig. 10 (a) and (b) are schematic diagrams showing the vicinity of the auxiliary line AL when the vertical crack VC is formed.

Fig. 11 (a) and (b) show imaging examples of the brittle material substrate W on which the auxiliary line AL is formed.

Fig. 12 (a) to (c) are partial enlarged images of the auxiliary lines AL formed at different inclination angles θ.

Fig. 13 is a graph in which VC establishment rates with respect to loads applied when forming the auxiliary lines AL are plotted for different inclination angles θ in example 1.

Fig. 14 is a graph in which VC establishment rates with respect to loads applied when forming the auxiliary lines AL are plotted for different inclination angles θ in example 2.

Detailed Description

< scribing device >

Fig. 1 is a diagram schematically showing the configuration of a scribing apparatus 100 used in the embodiment of the present invention. Generally, the scribing apparatus 100 is used when breaking a brittle material substrate W such as a glass substrate, a ceramic substrate, or a semiconductor substrate at a predetermined breaking position in the thickness direction DT to reduce the size thereof, but in the present embodiment, the scribing apparatus 100 is mainly used for forming an auxiliary line AL (see fig. 6 and the like) which is formed in order to propagate a vertical crack at the breaking position on the side of one main surface SF1 of the brittle material substrate W. In the present embodiment, the auxiliary line AL is a machining mark that is formed on the main surface SF1 so as to intersect with a groove line TL (see fig. 3 and the like) formed at a cut position on the main surface SF1 side and that serves as a starting point (trigger) when a vertical crack is propagated directly below the groove line TL. The groove line TL is a fine linear groove portion (concave portion) immediately below which a vertical crack is formed. The auxiliary line AL and the slot line TL will be described in detail later.

The scribing apparatus 100 mainly includes a table 1 on which a brittle material substrate W is placed, and a scribing head 2 for holding a scribing tool 50.

The scribing apparatus 100 includes one or both of a table moving mechanism and a scribing head moving mechanism, not shown, and by providing these mechanisms, the scribing head 2 can be moved relative to the table 1 in a horizontal plane while holding the scribing tool 50 in the scribing apparatus 100. For convenience of explanation, it is assumed that the scribing head 2 moves relative to the table 1 in the scribing direction DP shown in fig. 1 during the scribing operation.

The scribing tool 50 is a tool for scribing the brittle material substrate W. The scribing tool 50 has a scribing wheel (cutter wheel) 51, a pin 52, and a holder 53.

The scribing wheel 51 has a disk shape (bead shape) and a uniform cutting edge PF along the outer periphery thereof, and the cutting edge PF has a substantially triangular shape (including a ridge line and a pair of inclined surfaces sandwiching the ridge line) in a cross-sectional view. The scribing wheel 51 typically has a diameter of around several mm. The pin 52 is inserted vertically into the position of the axial center AX of the scribing wheel 51. The holder 53 is held by the scribing head 2, and supports the pin 52 inserted into the scribing wheel 51 so that the scribing wheel 51 can rotate around the axial center AX. That is, the holder 53 pivotally supports the scribing wheel 51 integrally formed with the pin 52 so as to be rotatable about the axial center AX. More specifically, the holder 53 horizontally supports the pin 52 such that a surface formed by the cutting edge PF (outer peripheral portion) of the scribing wheel 51 extends in the vertical direction.

The tip PF is formed of a hard material such as cemented carbide, sintered diamond, polycrystalline diamond, or single crystal diamond. From the viewpoint of reducing the surface roughness of the ridge line and the inclined surface described above, the entire scribing wheel 51 may be made of single crystal diamond.

In the scribing apparatus 100 having the above-described configuration, the scribing head 2 holding the scribing tool 50 is moved in the scribing direction DP while the scribing wheel 51 is pressed against one main surface (hereinafter, also referred to as an upper surface) SF1 of the brittle material substrate W which is horizontally placed and fixed on the table 1 with the other main surface SF2 as a placing surface. Then, the scribing wheel 51 in a state of being pressed against the brittle material substrate W rolls around the shaft center AX in the direction indicated by the arrow RT in a state where the cutting edge PF enters the brittle material substrate W a little. As a result, plastic deformation in the moving direction of the scribing wheel 51 occurs on the upper surface SF1 of the brittle material substrate W in accordance with the pressure rolling of the scribing wheel 51. In the present embodiment, the pressing and rolling operation of the scribing wheel 51 in which the plastic deformation occurs is referred to as a scribing operation of the scribing wheel 51. The load applied to the brittle material substrate by the scribing wheel 51 when the scribing wheel 51 is pressed against the upper surface SF1 can be adjusted by a load adjusting mechanism, not shown, provided in the scribing head 2.

Fig. 2 is a view showing the posture (inclination) of the scribing wheel 51 in the scribing apparatus 100. In the present embodiment, the angle θ at which the scribing wheel 51 is inclined clockwise in the horizontal plane with respect to the scribing direction DP in a state where the scribing wheel 51 is held by the scribing head 2 with the scribing direction DP as the reference direction is defined as the inclination angle of the scribing wheel 51. The inclination angle θ is also an angle formed by the extending direction D1 of the orthogonal axis between the vertical plane formed by the cutting edge PF (ridge line) of the scribing wheel 51 and the horizontal plane and the scribing direction DP.

In the present embodiment, the auxiliary line AL is formed when one brittle material substrate W is cut as described above, but the inclination angle θ when the auxiliary line AL is formed is intentionally set to a value larger than 0 °. That is, the auxiliary line AL is formed in a state where the scribing wheel 51 is intentionally inclined from the scribing direction DP in the horizontal plane. Note that, in this embodiment, since the inclination angle θ is defined, the auxiliary line AL is formed to have a unique shape, which will be described in detail later.

Specifically, the scribing apparatus 100 in which the inclination angle θ is set in the range of 1.0 ° to 5.0 ° is used when forming the auxiliary line AL. Preferably, the inclination angle θ is set in the range of 2.5 ° to 5.0 °.

The scribing wheel 51 may be inclined by inclining the scribing head 2, by changing the angle of installation of the scribing tool 50 on the scribing head 2, or by other means.

< procedure for Forming vertical crack >

Next, a procedure for forming a vertical crack at a breaking position by the auxiliary line AL in the present embodiment will be described. Fig. 3 to 9 are views showing the formation of the vertical crack in stages. In the following description, a case will be described as an example where a plurality of breaking positions (break lines) parallel to a pair of opposite sides are set in advance in a rectangular brittle material substrate W. In each drawing, right-hand xyz coordinates are shown, in which the forming direction of the auxiliary line AL is the positive x-axis direction, the forming direction of the groove line TL is the positive y-axis direction, and the vertical upward direction is the positive z-axis direction.

First, the slot line TL is formed. Fig. 3 is a plan view (xy plan view) of the brittle material substrate W illustrating a state after the slot line TL is formed. Fig. 4 is a diagram schematically showing the configuration of the scribing tool 150 for forming the slot line TL. Fig. 5 is a zx partial cross-sectional view of a vertical cross-section including the slot line TL. The position of the slot line TL shown in fig. 3 corresponds to a breaking position when the brittle material substrate W is viewed from the top SF1 side of the top surface of the brittle material substrate W in plan view.

In the present embodiment, the scribing tool 150 including the diamond nicker 151 is used to form the groove line TL. The diamond chisel 151 is formed into a truncated pyramid shape as shown in fig. 4, for example, and includes a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD 1. In more detail, as shown in fig. 4 (b), the plurality of faces include a side face SD2 (second face) and a side face SD3 (third face). The top surface SD1, the side surfaces SD2 and SD3 face in different directions from each other and are adjacent to each other. In the diamond chisel 151, a cutting edge PF2 is formed by a ridge PS formed by side surfaces SD2 and SD3 and a vertex PP formed by three surfaces, i.e., a top surface SD1 and side surfaces SD2 and SD 3. As shown in fig. 4 (a), the diamond chisel 151 is held so that a tip side top surface SD1 of the long shank 152 having a rod shape (columnar shape) is at the lowermost end.

When the scribing tool 150 is used, as shown in fig. 4 (a), the diamond chisel 151 is brought into contact with the upper surface SF1 of the brittle material substrate W in a state where the axial direction AX2 of the long shank 152 is inclined by a predetermined angle from the vertical direction toward the front side (positive y-axis direction) in the moving direction DA, in other words, in a posture where the top surface SD1 is directed toward the rear side (negative y-axis direction) in the moving direction DA. Then, while maintaining this contact state, the scribing tool 150 is moved forward in the moving direction DA, and the cutting edge PF2 of the diamond point cutter 151 is slid. Thereby, plastic deformation along the moving direction DA of the diamond nicking tool 151 is generated. In the present embodiment, the sliding operation of the diamond scribe 151 in which the plastic deformation occurs is also referred to as a scribing operation of the diamond scribe 151.

As shown in fig. 3 and 5, the groove line TL is a fine linear groove portion formed in the upper surface SF1 of the brittle material substrate W so as to extend in the y-axis direction. In a state where the posture of the scribing tool 150 is symmetrical with respect to the moving direction DA, the diamond chisel 151 is slid to generate plastic deformation in the upper surface SF1 of the brittle material substrate W, and as a result, the groove line TL is formed. At this time, as schematically shown in fig. 5, the slot line TL is formed substantially in a slot portion having a line-symmetric shape in a cross section perpendicular to the extending direction thereof.

As shown in fig. 3, at a predetermined breaking position on the upper surface SF1 of the brittle material substrate W, a groove line TL is formed from the start point T1 to the end point T2 in the positive y-axis direction indicated by an arrow AR 1. In the following description, a range of the slot line TL relatively closer to the start point T1 is referred to as an upstream side, and a range relatively closer to the end point T2 is referred to as a downstream side.

Note that, in fig. 3, the start point T1 and the end point T2 of the groove line TL are provided at positions slightly separated from the end portions of the brittle material substrate W, but this is not essential, and either one or both of them may be appropriately positioned at the end portions of the brittle material substrate W depending on the type of the brittle material substrate W to be cut, the use of the single piece after cutting, and the like. However, the mode in which the starting point T1 is provided at the end portion of the brittle material substrate W increases the impact applied to the cutting edge PF2 of the scribing tool 150, compared to the mode in which the starting point T1 is slightly apart from the end portion as illustrated in fig. 3, and therefore attention must be paid in consideration of the life of the cutting edge PF2 and the occurrence of an unexpected vertical crack.

The groove lines TL at the respective plurality of cut-off positions may be formed sequentially by the scribing tool 150 in a not-shown processing apparatus including one scribing tool 150, or may be formed simultaneously and in parallel by using a plurality of processing apparatuses for forming the groove lines TL.

When forming the score line TL, the load applied by the scribing tool 150 (which corresponds to the force with which the scribing tool 150 is pressed into the upper surface SF1 of the brittle material substrate W from vertically above) is set to such a degree that the score line TL can be reliably formed without causing propagation of a vertical crack from the score line TL in the thickness direction DT of the brittle material substrate W (fig. 5).

In other words, the slot line TL is formed so that the brittle material substrate W is continuously connected in the direction intersecting the slot line TL (i.e., in a crack-free state) directly below the slot line TL. When the slot line TL is formed in accordance with this, an internal stress remains as a result of plastic deformation in the vicinity of the slot line TL of the brittle material substrate W (within a range of approximately 5 μm to 10 μm from the slot line TL).

For example, the formation of the slot line TL is realized by setting the load applied by the scribing tool 150 to a value smaller than that when a scribe line accompanied by propagation of a vertical crack is formed by the same scribing tool 150.

In the crack-free state, even if the slot line TL is formed, the propagation of the vertical crack from the slot line TL does not occur, and therefore, even if a bending moment acts on the brittle material substrate W, the breakage along the slot line TL is less likely to occur than when the vertical crack is formed.

After the groove line TL is formed, the auxiliary line AL is formed by the scribing apparatus 100 including the scribing tool 50 whose inclination angle θ is set in the range of 1.0 ° to 5.0 ° (preferably in the range of 2.5 ° to 5.0 °). Fig. 6 is a plan view of the brittle material substrate W illustrating a state when the auxiliary line AL is formed. Fig. 7 and 8 are plan views of the brittle material substrate W illustrating a case where the vertical crack VC propagates with the formation of the auxiliary line AL. Fig. 9 is a zx partial cross-sectional view of a vertical cross-section including a groove line TL and a vertical crack VC.

In the present embodiment, as shown in fig. 6, the auxiliary line AL is a processing mark formed by plastically deforming the upper surface SF1 of the brittle material substrate W in the range from the starting point a1 to the end point a2 in the positive x-axis direction (orthogonal to the groove line TL) indicated by the arrow AR2 in the vicinity of the downstream side of the groove line TL.

More specifically, the auxiliary line AL is formed so that the forming direction of the auxiliary line AL indicated by the arrow AR2 coincides with the scribing direction DP (positive x-axis direction). Therefore, the auxiliary line AL is formed in a state of being inclined toward the upstream side of the position where the auxiliary line AL is formed in the forward direction of the scribing wheel 51, that is, toward the negative y-axis direction side.

At this time, the scribing head 2 is moved in the scribing direction DP while the scribing wheel 51 is pressed against the upper surface SF1 of the brittle material substrate W, and the scribing wheel 51 rolls. However, since the inclination angle θ is not 0 °, the forces received by the pair of inclined surfaces constituting the cutting edge PF are not the same. Specifically, the scribing wheel 51 is moved in the scribing direction DP in a state where the inclined surface facing the positive y-axis direction receives a larger resistance from the brittle material substrate W than the inclined surface facing the negative y-axis direction. As a result, the auxiliary line AL is formed as a machining mark having a wider width as the inclination angle θ is larger (see fig. 12), and the cross-sectional shape thereof is asymmetrical. Since the formation of the auxiliary line AL is not intended to propagate the vertical crack immediately below the same line as the formation of the score line TL, the load applied by the scribing wheel 51 may be set to a value smaller than that in the case of forming a scribe line accompanied by propagation of the vertical crack by the same scribing wheel 51.

If the auxiliary line AL is formed under the condition that the load applied by the scribing wheel 51 is equal to or greater than the predetermined threshold value, the propagation of the vertical crack VC from the groove line TL in the thickness direction DT of the brittle material substrate W as shown in fig. 9 occurs in order from the position of the intersection point C with each groove line TL in the predetermined propagation direction of the vertical crack VC (the upstream side of the groove line TL in fig. 7) as shown by an arrow AR3 in fig. 7 every time the auxiliary line AL intersects the groove line TL.

Eventually, as shown in fig. 8, the propagation of the vertical crack VC from the slot line TL is generated at all the disconnection positions. That is, when the auxiliary line AL is formed (triggered by the auxiliary line AL), the vertical crack VC extending from the groove line TL is formed at each breaking position of the brittle material substrate W in the crack-free state, although the groove line TL has been formed up to now.

This is because, when the groove line TL is formed using the scribing tool 150 including the diamond scribe tool 151, the vertical crack VC to be generated right below the groove line TL has a property of propagating toward the side where the top surface SD1 exists. That is, the vertical crack VC generated in the vicinity of the auxiliary line AL has a property of propagating in a specific direction. In the present embodiment in which the groove line TL is formed such that the top surface SD1 of the diamond scribe is disposed on the upstream side of the groove line TL, the vertical crack VC is unlikely to propagate in the reverse direction although it propagates toward the upstream side of the groove line TL after the auxiliary line AL is formed.

The brittle material substrate W on which the vertical crack VC is formed at the breaking position in this manner is supplied to a predetermined breaking device not shown. In the breaking apparatus, a bending moment is applied to the brittle material substrate W by a so-called three-point bending or four-point bending method, and a breaking step of propagating the vertical crack VC to the lower surface SF2 of the brittle material substrate W is performed. Through this breaking step, the brittle material substrate W is broken at the breaking position.

In the case of the above-described procedure, the formation of the groove line TL at the breaking position is not accompanied by the propagation of the vertical crack VC, and therefore, there is an advantage that the load applied to the scribing tool 50 can be reduced as compared with the case where the breaking position is scribed so as to form the vertical crack simultaneously with the formation of the scribe line in the related art. This advantage helps to extend the life of the scribing tool 50 for breaking in the breaking position.

< details of vertical crack propagation >

Fig. 10 is a schematic diagram showing a situation in the vicinity of the auxiliary line AL when the vertical crack VC is formed by forming the auxiliary line AL after the groove line TL is formed. Fig. 11 is an image of a brittle material substrate W on which an auxiliary line AL is formed.

As shown in fig. 10 a, when the auxiliary line AL is formed in the positive x-axis direction (direction perpendicular to the y-axis) as the scribing direction DP, numerous cracks starting from the auxiliary line AL, that is, auxiliary cracks AC, are randomly generated in the side region on the negative y-axis direction side (lower side in the drawing of the auxiliary line AL in fig. 10) of the auxiliary line AL in the brittle material substrate W at the entire formation position. This is also confirmed in fig. 11 (b) in which a cross section of the brittle material substrate W is observed, for example. Note that, in fig. 11 (a) in which the upper surface SF1 is observed, in addition to the auxiliary line AL being able to be confirmed, in the lower region RE of the auxiliary line AL surrounded by the closed curve, a small number of auxiliary cracks AC continuing in a linear shape inside the brittle material substrate W are penetrated.

More specifically, the auxiliary crack AC appears to propagate in the (+ x, -y, -z) direction from substantially any position of the auxiliary line AL. In brief, when top SF1 is viewed in plan, it is offset in the negative y-axis direction of auxiliary line AL within a range of approximately several tens of μm from auxiliary line AL. However, since the formation of the auxiliary cracks AC is a phenomenon that occurs randomly, the auxiliary cracks AC are generated in other ranges although the ratio is small, and this point is not shown in fig. 10.

Since the partial set of the auxiliary cracks AC is generated in the entire auxiliary line AL, the auxiliary cracks AC are generated with a high probability also in the vicinity of the intersection of the auxiliary line AL and the groove line TL. As described above, since the internal stress remains in the vicinity of the slot line TL, when the auxiliary line AL is formed such that the auxiliary crack AC is formed on the side of the vertical crack VC in the predetermined propagation direction, the release of the residual internal stress in the vicinity of the slot line TL occurs when the auxiliary crack AC reaches the region where the residual internal stress exists. As a result, as shown by an arrow AR4 in fig. 10 b, the vertical crack VC propagates from the slot line TL in a predetermined propagation direction of the vertical crack VC (in the present embodiment, on the upstream side of the slot line TL). This is the detail of the propagation of the vertical crack VC according to the method of the present embodiment described above.

In the method according to the present embodiment, as described above, the auxiliary line AL is formed by the scribing wheel 51 intentionally inclined at the inclination angle θ of 1.0 ° to 5.0 ° (preferably, 2.5 ° to 5.0 °), so that a large number of auxiliary cracks AC are unevenly gathered on the side of the scribing wheel 51 inclined forward in the advancing direction, and the formation positions of the auxiliary line AL and the groove line TL are set so that the breaking position extends on the side where the auxiliary cracks AC are formed. Thereby, the reliability of propagation of the vertical crack VC from the slot line TL at the disconnection position is improved. That is, the method of forming the auxiliary line AL by the scribing wheel 51 intentionally inclined in the present embodiment has an effect of restricting the propagation portion of the vertical crack VC and improving the reliability of the propagation. That is, when the brittle material substrate W is cut, the inclination direction of the scribing wheel 51, the formation position of the auxiliary line AL, and the formation position of the groove line TL are determined according to the cutting position, and thus the vertical crack VC can be reliably propagated at the cutting position.

When θ is less than 1.0 °, the auxiliary crack AC is not concentrated, and the reliability of crack propagation is lowered, which is not preferable. Further, the larger the inclination angle θ is, the more difficult the scribing wheel 51 rolls when forming the auxiliary line AL tends to be.

As described above, according to the present embodiment, when the brittle material substrate is to be cut at a predetermined cut position, the groove line is formed at the formation position corresponding to the cut position under the condition that the vertical crack does not occur right below, and the auxiliary line is formed so that the auxiliary crack is biased in the predetermined propagation direction of the vertical crack VC, that is, on the upstream side of the groove line by using the scribing wheel which is intentionally inclined in the horizontal plane, whereby the vertical crack can be propagated at the cut position with high reliability. Since the vertical crack is reliably formed, the brittle material substrate can be reliably cut at the cut position in the cutting step which is a subsequent step. In this case, the load applied to the scribing wheel when forming the groove line and the auxiliary line can be set to a value smaller than that when performing the scribing operation accompanied by propagation of the vertical crack.

< example 1 >

The formation of the groove line TL and the auxiliary line AL according to the procedure shown in the above embodiment was performed a plurality of times while changing the formation conditions of the auxiliary line AL, and the occurrence of propagation of the vertical crack VC was evaluated. As the brittle material substrate W, a glass substrate having a thickness of 0.2mm was used.

Specifically, the inclination angle θ is changed to three levels of 0 °, 1.2 °, and 2.0 °, and the load applied to the scribing wheel 51 is changed to seven levels of 0.4N, 0.8N, 1.1N, 1.5N, 1.9N, 2.3N, and 2.6N, so that the auxiliary line AL is formed under 21 conditions in total. The moving speed of the scribing head 2 was set to 100 mm/sec. The scribing wheel 51 used was a wheel having a diameter of 2.0mm, a thickness of 0.65mm, a diameter of 0.8mm of the insertion hole of the pin 52, and a tip angle of 100 °. Fig. 12 is a partially enlarged image of the auxiliary lines AL formed at the respective inclination angles θ with the load applied to the scribing wheel 51 set to 1N.

Then, the load applied to the scribing tool 150 is fixed, and 100 groove lines TL are formed in accordance with various forming conditions of the auxiliary line AL.

Fig. 13 is a graph in which the propagation occurrence rate of the vertical crack VC from the total 100 groove lines TL (hereinafter referred to as VC establishment rate) is plotted with respect to the load applied when the auxiliary line AL is formed for each of the 3 kinds of inclination angles θ.

As shown in fig. 13, when the inclination angle θ is 0 °, only the VC establishment rate of about 60% at the maximum (when the load is 1.5N) is obtained, whereas when the inclination angle θ is 1.2 °, the VC establishment rate of 95% or more is obtained when the load applied to the scribing wheel 51 is 1.9N or more, and when the inclination angle θ is 2.0 °, the VC establishment rate of 100% is obtained by setting the load applied to the scribing wheel 51 to 1.5N or more.

These results indicate that the vertical crack VC can be substantially reliably propagated from the groove line TL if a load of at least 1.9N is applied to the scribing wheel 51 when the inclination angle θ is 1.2 °, and can be reliably propagated from the groove line TL if a load of at least 1.5N is applied to the scribing wheel 51 when the inclination angle θ is 2.0 °.

Further, if the scribing wheel 51 is operated under the same condition to perform the scribing operation and propagate the vertical crack together with the formation of the scribe line, it is necessary to apply a load of at least about 3N to 4N, and therefore, the result of the present embodiment also shows that the auxiliary line AL can be formed by applying a load smaller than the load applied to the scribing wheel 51 when the scribing operation accompanied by the vertical crack propagation is performed. Further, since the groove line TL can be formed by applying a load equal to or smaller than that applied when the auxiliary line AL is formed, it can be said that the method according to the above embodiment can realize vertical crack propagation by applying a load lower than that applied when the vertical crack is propagated by the scribing operation directly.

< example 2 >

In order to examine the relationship between the inclination direction of the scribing wheel 51 and the vertical crack VC, the VC establishment rate when the inclination angle θ was set to-1.2 ° was evaluated. The conditions other than the inclination angle θ were the same as in example 1. Note that, for example, when the inclination angle θ is negative as described with reference to fig. 2, it corresponds to a case where the scribing wheel 51 is inclined so that the extending direction D1 of the orthogonal axis between the vertical plane formed by the cutting edge PF (outer peripheral portion) of the scribing wheel 51 and the horizontal plane is directed to the opposite side with respect to the scribing direction DP shown in fig. 2, and when the inclination angle θ is negative as described with reference to fig. 3, it corresponds to a case where the advancing direction of the scribing wheel 51 is inclined forward toward the downstream side of the formation position of the auxiliary line AL, that is, toward the y-axis side.

Fig. 14 is a graph in which VC establishment rates are plotted with respect to the load applied when forming the auxiliary line AL, for each of the case where the inclination angle θ is-1.2 ° and the case of 1.2 ° shown in example 1.

As shown in fig. 14, when the inclination angle θ is-1.2 °, the VC establishment rate becomes higher as the load applied by the scribing wheel 51 becomes larger, but even when 2.6N is reached, the VC is still at about 70%. This result is inferior to that obtained in example 1 when the inclination angle θ is 1.2 ° which is 95% or more VC establishment ratio if the load applied by the scribing wheel 51 is at least 1.9N.

The correlation results show that by making the inclination direction of the scribing wheel 51 at the time of forming the auxiliary line AL the one side in the predetermined propagation direction of the vertical crack, the vertical crack VC can be propagated from the groove line TL more reliably even if a load smaller than that at the time of inclination to the opposite side is applied.

< modification example >

Although the auxiliary line AL is formed after the slot line TL is formed in the above embodiment, the order of forming the slot line TL and the auxiliary line AL may be reversed.

In the above embodiment, the slot line TL and the auxiliary line AL are orthogonal to each other on the upper surface SF1 of the brittle material substrate W, but this is not essential, and the slot line TL and the auxiliary line AL may intersect obliquely as long as it is possible to ideally realize the propagation of the vertical crack from the slot line TL in accordance with the formation of the auxiliary line AL.

Further, in the above embodiment, the groove line TL is formed by the scribing tool 150 by sliding the diamond cutter 151 in a state where the axial direction AX2 of the long shank 152 is inclined forward in the moving direction DA, that is, in a posture where the ceiling surface SD1 is directed rearward in the moving direction DA, but instead of the above-described embodiment, the groove line TL may be formed by sliding the diamond cutter 151 in a state where the axial direction AX2 of the long shank 152 is inclined rearward in the moving direction DA, that is, in a posture where the ceiling surface SD1 is directed forward in the moving direction DA.

Further, in the above embodiment, the groove line TL is formed using the diamond cutter 151, but instead of the above embodiment, a method of forming the groove line TL by pressure-rolling the scribing wheel 51 of the scribing apparatus 100 may be adopted. This can be achieved, for example, by: that is, the scribe device 100 for forming the slot line TL whose inclination angle θ is fixedly set at 0 ° and the scribe device 100 for forming the auxiliary line AL whose inclination angle θ is fixedly set in the range of 1.0 ° to 5.0 ° (preferably, in the range of 2.5 ° to 5.0 °) are separately prepared in advance, and the slot line TL and the auxiliary line AL are formed by these devices, respectively. Alternatively, one scribing apparatus 100 may be provided with the scribing tool 50 for forming the slot line TL and the scribing tool 50 for forming the auxiliary line AL. Alternatively, the scribing apparatus 100 may be further provided with a tilt angle varying means, not shown, so that the predetermined tilt angle θ is set when the auxiliary line AL is formed. However, the inclination angle θ is not limited to 0 ° when the slot line TL is formed.

However, in the case of the latter two modes, unlike the above-described embodiment, the direction of propagation of the vertical crack is the downstream side of the slot line TL. Therefore, in these embodiments, the auxiliary line AL is formed in the vicinity of the upstream side of the slot line TL in a state where the scribing wheel 51 is inclined at the negative inclination angle θ as in the above-described embodiment 2. More specifically, the auxiliary line AL may be formed in a state where the front of the scribing wheel 51 in the advancing direction is inclined toward the downstream side of the position where the auxiliary line AL is formed, that is, the positive y-axis direction side.

In this case, the auxiliary line AL is formed so that the auxiliary crack AC is biased toward the downstream side of the groove line TL in the direction of propagation of the vertical crack VC, as in the above-described embodiment, whereby the vertical crack ideally propagates from the groove line TL in the direction of propagation of the vertical crack VC. As a result, the vertical crack VC can be reliably propagated at the break position where the slot line TL is formed.

Description of the symbols

1: working table

2: marking head

50. 150: marking tool

51: scribing wheel

52: pin

53: support frame

100: marking device

151: diamond nicking tool

152: long handle

A1: starting point (of auxiliary line AL)

A2: end point (of auxiliary line AL)

AC: auxiliary crack

AL: auxiliary line

AX: center of axis

C: intersection point (of the slot line TL and the auxiliary line AL)

DP: direction of marking

PF: tip (of scribing wheel 51)

SF 1: one principal surface (upper surface) (of the brittle material substrate W)

SF 2: the other principal surface (lower surface) (of the brittle material substrate W)

T1: starting point (of slot line TL)

T2: (of the slot line TL) end point

TL: slot line

VC: vertical crack

W: brittle material substrate

Claims

1. A method for forming a vertical crack in a brittle material substrate, the method being used for forming the vertical crack at a breaking position when the brittle material substrate is broken in a thickness direction, the method comprising:

a groove line forming step of forming a groove line on one main surface of the brittle material substrate, the groove line being a linear groove portion; and

an auxiliary line forming step of forming an auxiliary line by rolling a scribing wheel having a uniform blade edge on an outer peripheral portion, the auxiliary line being a processing mark intersecting the groove line, on the one main surface by pressure contact,

in the slot line forming step, the slot line is formed so as to maintain a crack-free state directly below the slot line,

in the auxiliary line forming step, the auxiliary line is formed in a state where the scribing wheel is inclined from a forming advancing direction of the auxiliary line at a predetermined inclination angle in a horizontal plane,

and propagating a vertical crack from the groove line in a thickness direction of the brittle material substrate, starting from an intersection of the groove line and the auxiliary line.

2. The method according to claim 1, wherein the brittle material substrate is formed by a method comprising the steps of,

in the auxiliary line forming step, a partial set of auxiliary cracks is generated in one side region of the auxiliary line from the auxiliary line toward the inside of the brittle material substrate as the auxiliary line is formed,

and defining the formation positions of the groove line and the auxiliary line so that the region of the auxiliary crack segregation is located on one side of the groove line in the predetermined propagation direction of the vertical crack.

3. The method of forming a vertical crack in a brittle material substrate as claimed in claim 2, characterized in that,

the auxiliary line is formed so as to intersect the groove line in the vicinity of a side opposite to a predetermined propagation direction of the vertical crack on the groove line.

4. The method for forming a vertical crack in a brittle material substrate as claimed in claim 2 or 3, characterized in that,

in the auxiliary line forming step, the advancing direction front side of the scribing wheel is inclined in the horizontal plane from the forming advancing direction of the auxiliary line toward the predetermined propagation direction side of the vertical crack on the groove line.

5. The method according to claim 1, wherein the brittle material substrate is formed by a method comprising the steps of,

the inclination angle is 1.0-5.0 deg.

6. The method according to claim 5, wherein the step of forming the vertical crack in the brittle material substrate,

the inclination angle is 2.5-5.0 deg.

7. The method according to claim 1, wherein the brittle material substrate is formed by a method comprising the steps of,

the auxiliary line is formed after the groove line is formed.

8. A method of breaking a brittle material substrate for breaking the brittle material substrate in a thickness direction, comprising:

a vertical crack forming step of forming the vertical crack on the brittle material substrate by the method for forming a vertical crack in a brittle material substrate according to any one of claims 1 to 7; and

and a breaking step of breaking the brittle material substrate along the vertical crack.