CN106180468A - Heat pipe method for embedding - Google Patents
Heat pipe method for embedding Download PDFInfo
- Publication number
- CN106180468A CN106180468A CN201610673860.0A CN201610673860A CN106180468A CN 106180468 A CN106180468 A CN 106180468A CN 201610673860 A CN201610673860 A CN 201610673860A CN 106180468 A CN106180468 A CN 106180468A
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- embedding
- embedding groove
- groove
- drift
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
- B21D53/06—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of metal tubes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D39/00—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of heat pipe method for embedding, including step: offer embedding groove on workpiece, the A/F of embedding groove is less than the cell body width of opening adjoiner；Heat pipe is embedded in embedding groove；The top of heat pipe is carried out riveting punching press of rising for the first time, the bottom of the bottom of heat pipe with embedding groove is compressed；The top of heat pipe carries out second time rise riveting punching press, the sidewall of the both sides of heat pipe with embedding groove is compressed；The top of heat pipe carries out third time rise riveting punching press, the top of heat pipe is flattened and the rivet clasp that risen by heat pipe is scheduled in embedding groove；The 3rd drift that riveting punching press of rising for the third time uses is provided with platform part.When above-mentioned heat pipe method for embedding makes heat pipe inlay, can be scheduled on workpiece by the cold method the inlayed rivet clasp that rises, heat pipe is in close contact with embedding groove, thus improves work efficiency, reduces processing cost, strengthens linking steady character and promotes heat-conducting effect.
Description
Technical field
The present invention relates to radiating element manufacturing technology field, particularly relate to a kind of heat pipe method for embedding.
Background technology
Heat dissipation problem is that most of equipment needs to solve.One of them settling mode is to inlay heat pipe on workpiece,
The most relatively common way is, offers embedding groove, then by heat pipe (based on cost, hardness and rate of heat dissipation on workpiece
Considering etc. factor, current copper heat pipe is relatively conventional) it is embedded in this embedding groove.
Traditional heat pipe method for embedding is: offer embedding groove on workpiece, is coated with glue, then will lead in embedding groove
Heat pipe is embedded in this embedding groove, waits that the glue solidifies.After the glue solidifies, carry out welding in the opening edge of embedding groove and add
Work, welds together the edge of heat pipe with embedding groove.The shortcoming of this mode is:
1, needing glue bonding and welding processing, secondary operations makes technological process complicate, and processing cost burden increases
Reduce with work efficiency.
2, heat pipe and the linking steady character of embedding groove and glue, the zone of action size of solder, material are relevant, and it combines
Steadiness is relatively low.
3, add glue and solder between heat pipe and embedding groove, cause the heat-conducting effect between heat pipe and workpiece to drop
Low.
Summary of the invention
Based on this, it is provided that a kind of raising work efficiency, the processing cost that reduces, enhancing linking steady character and lifting heat-conducting effect
Heat pipe method for embedding.
A kind of heat pipe method for embedding, including step:
Offering embedding groove on workpiece, the A/F of embedding groove is less than the cell body width of opening adjoiner；
Being embedded in embedding groove by heat pipe, now the top of heat pipe has an original curvature；
Thering is provided one first drift, carry out rising for the first time riveting punching press to the top of heat pipe, by the bottom of heat pipe with inlay
The bottom of groove compresses；The bottom of this first drift is provided with the first arc groove, and this first arc groove has first curvature, and this is years old
One curvature is less than the original curvature on the top of described heat pipe；
One second drift is provided, the top of heat pipe is carried out second time and rises riveting punching press, by the both sides of heat pipe with inlay
The sidewall of groove compresses；This second drift is provided with the second arc groove, and this second arc groove has torsion, this torsion
First curvature less than the first arc groove；The degree of depth of the second arc groove is less than the degree of depth of the first arc groove；
One the 3rd drift is provided, the top of heat pipe is carried out third time and rises riveting punching press, the top of heat pipe is flattened also
And the rivet clasp that risen by heat pipe is scheduled in embedding groove；The bottom of the 3rd drift downwardly extends and is provided with platform part.
Above-mentioned heat pipe method for embedding, first, improves the shape of embedding groove so that it is A/F is adjacent less than opening
Connect the cell body width at place.Then, riveting of rising by the heat pipe being embedded into embedding groove is processed, including three phases, first stage
Punching press makes heat pipe predeformation, its objective is that the bottom ensureing heat pipe is in close contact with the bottom of embedding groove；Second stage
Punching press makes heat pipe be again deformed, and its objective is that the both sides ensureing heat pipe are in close contact with the side of embedding groove；3rd rank
Section punching press makes heat pipe deform once again, its objective is to flatten the top of heat pipe, simultaneously further such that heat pipe and edge
Caulking groove is in close contact further, completes riveting processing of rising so that heat pipe is firmly riveted in embedding groove.Due to opening of embedding groove
Mouth width is less than the cell body width of opening adjoiner, and heat pipe is difficult to come off from embedding groove after riveting of rising.By said method,
When heat pipe is inlayed, can be scheduled on workpiece by the cold method the inlayed rivet clasp that rises, heat pipe is in close contact with embedding groove,
Thus improve work efficiency, reduce processing cost, strengthen linking steady character and promote heat-conducting effect.
Wherein in an embodiment, platform part is provided with boss, and the shape of boss is mated with the opening shape of embedding groove,
The end face of boss is plane.The top of heat pipe, while being flattened by heat pipe, is pressed in embedding groove by boss further.
Wherein in an embodiment, the cross section of embedding groove includes being positioned at the open area on top and being positioned at the cell body of bottom
Region；The bottom of open area connects with the top of channel area；The width of the bottom of open area is less than the top of channel area
The width in portion.
Wherein in an embodiment, open area is rectangle.
Wherein in an embodiment, channel area is the circular arc more than 180 °.
Wherein in an embodiment, before heat pipe is embedded in embedding groove, further comprises the steps of: and embedding groove is carried out
Cleaning is to remove the impurity that degreases.
Accompanying drawing explanation
Fig. 1 is the flow chart of the heat pipe method for embedding of an embodiment of the present invention；
Fig. 2 is the schematic cross-section of the workpiece in the heat pipe method for embedding shown in Fig. 1；
Fig. 3 is the schematic diagram of riveting punching press of rising the first time in the heat pipe method for embedding shown in Fig. 1；
Fig. 4 is that the second time in the heat pipe method for embedding shown in Fig. 1 rises the schematic diagram of riveting punching press；
Fig. 5 is that the third time in the heat pipe method for embedding shown in Fig. 1 rises the schematic diagram of riveting punching press；
In accompanying drawing, the implication of each label is:
10-workpiece, 11-embedding groove, 12-open area, 13-channel area；
20-heat pipe；
30-the first drift；
40-the second drift；
50-the 3rd drift, 51-boss.
Detailed description of the invention
By inventive feature, technological means and the specific purposes reached, function can be further appreciated that, resolve this
Bright advantage and spirit, be further understood the detailed description of the present invention with detailed description of the invention by below in conjunction with accompanying drawing.
As it is shown in figure 1, be the flow chart of the heat pipe method for embedding of an embodiment of the present invention.
A kind of heat pipe method for embedding, including step:
S10: as in figure 2 it is shown, offer embedding groove 11 on workpiece 10, the A/F of embedding groove 11 is less than opening adjoiner
Cell body width.In the present embodiment, cross section (referring to the face that the length direction of the vertical embedding groove 11 is intercepted) bag of embedding groove 11
Include the open area 12 being positioned at top and the channel area 13 being positioned at bottom.The bottom of open area 12 and the top of channel area 13
Portion connects.The width of the bottom of open area 12 is less than the width at the top of channel area 13.Specifically, this open area 12 is
Rectangle, and channel area 13 is the circular arc more than 180 °.
S20: being embedded in embedding groove 11 by heat pipe 20, the top of this heat pipe 20 has an original curvature.Now lead
The top of heat pipe 20 is also exposed to outside embedding groove 11.
S30: as shown in Figure 3, it is provided that one first drift 30, carries out riveting punching press of rising for the first time to the top of heat pipe 20, will
The bottom of heat pipe 20 compresses with the bottom of embedding groove 11.The bottom of the first drift 30 is provided with the first arc groove, this first arc
Connected in star has first curvature, and this first curvature is less than the original curvature on the top of heat pipe.First drift 30 arranges the degree of depth relatively
The first big arc groove, its objective is: if first time rises, during riveting punching press, the deformation quantity of heat pipe 20 is excessive, heat pipe 20 and edge
The contact of caulking groove 11 may be uneven, and the both sides of heat pipe 20 may be expressed into outside embedding groove 11.
S40: as shown in Figure 4, it is provided that one second drift 40, carries out second time and rises riveting punching press the top of heat pipe 20, will
The both sides of heat pipe 20 compress with the sidewall of embedding groove 11.This second drift 40 is provided with the second arc groove, and this second arc is recessed
Groove has torsion, and this torsion is less than the first curvature of the first arc groove.The degree of depth of the second arc groove is less than the
The degree of depth of one arc groove.Second drift 40 arranges the second arc groove that the degree of depth is less, its objective is: increase heat pipe 20
Punching press amplitude on thickness direction, force the sidewall deformation towards embedding groove 11 of the both sides of heat pipe 20 and with embedding groove 11
Sidewall fits tightly.Such as, the radius of curvature (curvature with radius of curvature be reciprocal relation) of the first arc groove be 9.0mm～
11.0mm, the degree of depth is 5.5mm～6.0mm；The radius of curvature of the second arc groove is: 15.0mm～16.0mm, and the degree of depth is:
0.1mm～0.5mm.The shape of the heat pipe that the first arc groove and the curvature of the second arc groove and the degree of depth are processed with reality has
Close, the present embodiment and accompanying drawing simply list some of which practical range and schematic diagram thereof, is not to above-mentioned physics
The restriction of the parameter value of amount.
S50: as shown in Figure 5, it is provided that one the 3rd drift 50, carries out third time and rises riveting punching press the top of heat pipe 20, will
The top of heat pipe 20 flattens and the rivet clasp that risen by heat pipe 20 is scheduled in embedding groove 11.The bottom of the 3rd drift 50 downwardly extends
It is provided with platform part.3rd drift 50 arranges platform part, its objective is: is flattened on the top of heat pipe 20, and forces heat pipe
20 are in close contact further with embedding groove 11.Meanwhile, in the present embodiment, platform part is provided with boss 51, the shape of boss 51
Mating with the opening shape of embedding groove 11, the end face of boss 51 is plane.Boss 51, while being flattened by heat pipe 20, enters one
The top of heat pipe 20 is pressed in embedding groove 11 by step.
Above-mentioned heat pipe method for embedding, first, improves the shape of embedding groove 11 so that it is A/F is less than opening
The cell body width of adjoiner.Then, riveting of rising by the heat pipe 20 being embedded into embedding groove 11 is processed, including three phases, the
The punching press of one stage makes heat pipe 20 predeformation, its objective is to ensure that the bottom of heat pipe 20 closely connects with the bottom of embedding groove 11
Touch.Second stage punching press makes heat pipe 20 be again deformed, and its objective is the side of both sides and the embedding groove 11 ensureing heat pipe 20
Face is in close contact.Phase III punching press makes heat pipe 20 deform once again, its objective is to flatten, simultaneously the top of heat pipe 20
Further such that heat pipe 20 is in close contact further with embedding groove 11, complete riveting processing of rising so that heat pipe 20 firmly riveting
It is connected in embedding groove 11.A/F due to embedding groove 11 is less than the cell body width of opening adjoiner, and heat pipe 20 is in riveting of rising
After be difficult to come off from embedding groove 11.Pass through said method so that when heat pipe 20 is inlayed, can be risen by the cold method inlayed
Rivet clasp is scheduled on workpiece 10, and heat pipe 20 is in close contact with embedding groove 11, thus improves work efficiency, reduces processing cost, increases
Strong linking steady character and lifting heat-conducting effect.
In his embodiment, before step S20, it is also possible to include step: be cleaned degreasing to embedding groove
Impurity.And step can also be included after step S50: the workpiece complete to riveting of rising and heat pipe carry out thermal conductivity test.
Each technical characteristic of above example can combine arbitrarily, for making description succinct, not to above-described embodiment
In all possible combination of each technical characteristic be all described, but, as long as there is not lance in the combination of these technical characteristics
Shield, is all considered to be the scope that this specification is recorded.
Above example only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, but can not
Therefore it is construed as limiting the scope of the patent.It should be pointed out that, for the person of ordinary skill of the art,
On the premise of present inventive concept, it is also possible to make some deformation and improvement, these broadly fall into protection scope of the present invention.
Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (6)
1. a heat pipe method for embedding, it is characterised in that include step:
Offering embedding groove on workpiece, the A/F of described embedding groove is less than the cell body width of described opening adjoiner；
Being embedded into by heat pipe in described embedding groove, the top of the most described heat pipe has an original curvature；
Thering is provided one first drift, carry out rising for the first time riveting punching press to the top of described heat pipe, by the bottom of described heat pipe with
The bottom of described embedding groove compresses；The bottom of described first drift is provided with the first arc groove, and this first arc groove has
One curvature, described first curvature is less than the original curvature on the top of described heat pipe；
One second drift is provided, the top of described heat pipe is carried out second time and rises riveting punching press, by the both sides of described heat pipe with
The sidewall of described embedding groove compresses；The bottom of described second drift is provided with the second arc groove；Described second arc groove has
Torsion, described torsion is less than the first curvature of described first arc groove, and the degree of depth of described second arc groove is little
The degree of depth in described first arc groove；
One the 3rd drift is provided, the top of described heat pipe is carried out third time and rises riveting punching press, the top of described heat pipe is pressed
Flat and the rivet clasp that risen by described heat pipe is scheduled in described embedding groove；The bottom of described 3rd drift has downwardly extended platform part.
Heat pipe method for embedding the most according to claim 1, it is characterised in that described platform part is provided with boss, described
The shape of boss is mated with the opening shape of described embedding groove, and the end face of described boss is plane.
Heat pipe method for embedding the most according to claim 1, it is characterised in that the cross section of described embedding groove includes being positioned at top
The open area of end and the channel area being positioned at bottom；The bottom of described open area connects with the top of described channel area；
The width of the bottom of described open area is less than the width at the top of described channel area.
Heat pipe method for embedding the most according to claim 3, it is characterised in that described open area is rectangle.
Heat pipe method for embedding the most according to claim 3, it is characterised in that described channel area is the circle more than 180 °
Arc.
Heat pipe method for embedding the most according to claim 1, it is characterised in that described heat pipe is embedded into described in inlay
Before in groove, further comprise the steps of:
Described embedding groove is cleaned the impurity that degreases.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610673860.0A CN106180468B (en) | 2016-08-16 | 2016-08-16 | Heat conducting pipe method for embedding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610673860.0A CN106180468B (en) | 2016-08-16 | 2016-08-16 | Heat conducting pipe method for embedding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106180468A true CN106180468A (en) | 2016-12-07 |
| CN106180468B CN106180468B (en) | 2019-01-08 |
Family
ID=57521577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610673860.0A Expired - Fee Related CN106180468B (en) | 2016-08-16 | 2016-08-16 | Heat conducting pipe method for embedding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106180468B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110026494A (en) * | 2019-03-20 | 2019-07-19 | 东莞市毅帆五金模具有限公司 | Multistage presses heat pipe method and its pressure heat pipe equipment |
| CN115488246A (en) * | 2022-08-10 | 2022-12-20 | 祥博传热科技股份有限公司 | Seamless high-heat-conductivity forming process for heat pipe of radiator |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6802366B1 (en) * | 2002-10-31 | 2004-10-12 | Advanced Energy Industries, Inc. | Swage method for cooling pipes |
| JP2007218439A (en) * | 2006-02-14 | 2007-08-30 | Sumitomo Light Metal Ind Ltd | Fixing method of heat pipe |
| CN101115369A (en) * | 2006-07-26 | 2008-01-30 | 讯凯国际股份有限公司 | Method for manufacturing heat conducting module |
| US20090266522A1 (en) * | 2008-04-28 | 2009-10-29 | Kuo-Len Lin | Method of flatting evaporating section of heat pipe embedded in heat dissipation device and heat dissipation device with heat pipe |
| CN101716635A (en) * | 2008-10-09 | 2010-06-02 | 鈤新科技股份有限公司 | Planarization preparation method for embedding heat pipe evaporation section in heat conduction seat |
| CN101925285A (en) * | 2009-06-17 | 2010-12-22 | 奇鋐科技股份有限公司 | Cooling plate structure and manufacturing method thereof |
| CN102149265A (en) * | 2010-02-04 | 2011-08-10 | 陈世明 | Method for tightly fitting heat pipe with heat sink |
-
2016
- 2016-08-16 CN CN201610673860.0A patent/CN106180468B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6802366B1 (en) * | 2002-10-31 | 2004-10-12 | Advanced Energy Industries, Inc. | Swage method for cooling pipes |
| JP2007218439A (en) * | 2006-02-14 | 2007-08-30 | Sumitomo Light Metal Ind Ltd | Fixing method of heat pipe |
| CN101115369A (en) * | 2006-07-26 | 2008-01-30 | 讯凯国际股份有限公司 | Method for manufacturing heat conducting module |
| US20090266522A1 (en) * | 2008-04-28 | 2009-10-29 | Kuo-Len Lin | Method of flatting evaporating section of heat pipe embedded in heat dissipation device and heat dissipation device with heat pipe |
| CN101716635A (en) * | 2008-10-09 | 2010-06-02 | 鈤新科技股份有限公司 | Planarization preparation method for embedding heat pipe evaporation section in heat conduction seat |
| CN101925285A (en) * | 2009-06-17 | 2010-12-22 | 奇鋐科技股份有限公司 | Cooling plate structure and manufacturing method thereof |
| CN102149265A (en) * | 2010-02-04 | 2011-08-10 | 陈世明 | Method for tightly fitting heat pipe with heat sink |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110026494A (en) * | 2019-03-20 | 2019-07-19 | 东莞市毅帆五金模具有限公司 | Multistage presses heat pipe method and its pressure heat pipe equipment |
| CN110026494B (en) * | 2019-03-20 | 2024-01-19 | 东莞市毅帆五金模具有限公司 | Multi-stage heat pipe pressing method and heat pipe pressing equipment thereof |
| CN115488246A (en) * | 2022-08-10 | 2022-12-20 | 祥博传热科技股份有限公司 | Seamless high-heat-conductivity forming process for heat pipe of radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106180468B (en) | 2019-01-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5707735B2 (en) | Electric wire with terminal fitting and method of manufacturing electric wire with terminal fitting | |
| CN106180468A (en) | Heat pipe method for embedding | |
| MY181313A (en) | Metallic sintered bonding body and die bonding method | |
| US10035221B2 (en) | Metal bonded product and method for producing metal bonded product | |
| CN102211247A (en) | Ultrasonic weld pad for welding battery cell tabs | |
| CN110064836B (en) | Joined structure and joining method | |
| CN105762537A (en) | Elastic sheet | |
| JP6935784B2 (en) | How to manufacture a secondary battery | |
| CN201681943U (en) | Automobile rectifying bridge diode | |
| KR101767351B1 (en) | Aluminum electric wire connection structure | |
| US10707147B2 (en) | Clip for semiconductor package | |
| CN106783762A (en) | The diode encapsulating structure and manufacture method of a kind of vertical parallel way of dual chip | |
| JP6201963B2 (en) | Terminal parts | |
| CN106180371B (en) | The crude green body processing method of mobile device middle frame structure | |
| JP6975917B2 (en) | Joint structure | |
| CN108364905A (en) | Welding tool setup and the method for welding microwave chip | |
| CN204289763U (en) | For electric cooking appliance binding post and there is the electric cooking appliance of this binding post | |
| JP2007201122A (en) | Solid electrolytic capacitor and its manufacturing method | |
| JP6519440B2 (en) | Method of manufacturing terminal-equipped electric wire, and crimping jig | |
| CN110311280A (en) | A kind of reactor connecting terminal compression bonding apparatus | |
| EP2339621A2 (en) | Method for flattening a heat dissipating tube and device for performing the same | |
| CN102548342A (en) | Radiator and manufacturing method thereof | |
| CN208336164U (en) | Device for integrated antenna package welding | |
| CN205583163U (en) | Spring piece | |
| CN204464267U (en) | Semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190108 Termination date: 20210816 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |