CN106158788A - Liquid cooling heat radiator and electronic equipment - Google Patents
Liquid cooling heat radiator and electronic equipment Download PDFInfo
- Publication number
- CN106158788A CN106158788A CN201510208583.1A CN201510208583A CN106158788A CN 106158788 A CN106158788 A CN 106158788A CN 201510208583 A CN201510208583 A CN 201510208583A CN 106158788 A CN106158788 A CN 106158788A
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- substrate
- liquid
- heat radiator
- liquid cooling
- cooling medium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention proposes a kind of liquid cooling heat radiator, including the substrate for heat radiation, radiating surface it is provided with on substrate, substrate is provided with cooling medium entrance, cooling medium outlet and liquid cold runner, cooling medium entrance is connected by liquid cold runner with cooling medium outlet, and the radiating surface of substrate is provided with heat exchange fin.The liquid cooling heat radiator that the present invention proposes, its substrate can carry out heat exchange by the air of heat exchange fin Yu surrounding, it is possible to reaches more preferable radiating effect.
Description
Technical field
The present invention relates to technical field of electronic equipment, particularly relate to a kind of liquid cooling heat radiator and electronic equipment.
Background technology
In electronic equipment, communication apparatus, due to the continuous increase of chip power-consumption, traditional air-cooled technology is
Through being difficult to be fully solved the heat dissipation problem of big power dissipating chip (chip as above in power consumption 150W), liquid is cold to be dissipated
Hot scheme is the most gradually taken seriously.Liquid cooling heat radiator in current conventional electronic equipment, communication apparatus is logical
Often net quantity of heat is taken away by liquid in liquid cooling base internal flow, the liquid cooling base appearance not contacted with chip
Face is flat surface, and its radiating effect is poor.
Summary of the invention
The present invention provides a kind of liquid cooling heat radiator and electronic equipment, and main purpose is by heat exchange fin strong
Change substrate and surrounding air heat exchange, to reach more preferable radiating effect.
For achieving the above object, the present invention provides a kind of liquid cooling heat radiator, including the substrate for heat radiation,
Be provided with radiating surface on described substrate, described substrate be provided with cooling medium entrance, cooling medium outlet and
Liquid cold runner, described cooling medium entrance is connected by described liquid cold runner with the outlet of described cooling medium,
It is provided with heat exchange fin on described radiating surface.
Preferably, described liquid cold runner is metallic conduit, is provided with accommodating described metal tube in described substrate
The holding channel in road.
Preferably, described substrate is upper substrate and infrabasal plate welding formation, described upper substrate and described lower base
It is correspondingly arranged on upper groove and low groove, described upper groove and described low groove on the solder side of plate respectively to enclose
Close and form liquid cold runner.
Preferably, described radiating fin welds or one-body molded with described substrate.
Preferably, described radiating fin welds or one-body molded with described infrabasal plate.
Preferably, described substrate and described heat exchange fin are made by metal heat-conducting material.
Preferably, described liquid cooling heat radiator includes the multiple described substrate being arranged in series, base described in upper level
The cooling medium of plate exports the cooling medium entrance with substrate described in next stage by being connected pipeline communication.
The present invention also proposes a kind of electronic equipment, including above-mentioned liquid cooling heat radiator.
Liquid cooling heat radiator and electronic equipment that the present invention proposes arrange radiating fin by the outer surface at substrate
Sheet, realizes the heat exchange of substrate and surrounding air by radiating fin, so that substrate plays bigger dissipating
Heat effect, simultaneously when substrate heat-sinking capability deficiency, it is also possible to dispelled the heat by surrounding air assisting base plate.
Accompanying drawing explanation
Fig. 1 is the structural representation of liquid cooling heat radiator preferred embodiment of the present invention；
Fig. 2 is the cooling system schematic diagram of liquid cooling heat radiator preferred embodiment of the present invention.
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, do referring to the drawings further
Explanation.
Detailed description of the invention
Below in conjunction with the accompanying drawings and specific embodiment is described further with regard to technical scheme, it should
Understanding, specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
The present invention provides a kind of liquid cooling heat radiator.
With reference to shown in Fig. 1, Fig. 1 is the structural representation of liquid cooling heat radiator preferred embodiment of the present invention,
In the present embodiment, this liquid cooling heat radiator 11 includes the substrate 20 for heat radiation, substrate 20 is provided with scattered
Hot side, substrate 20 is provided with cooling medium entrance 22, cooling medium outlet 23 and liquid cold runner 24, cold
But medium inlet 22 is connected by liquid cold runner 25 with cooling medium outlet 23, the radiating surface of substrate 20
On be provided with heat exchange fin 21, such as Fig. 2, in this embodiment, heat exchange fin 21 be preferably shaped to flap-type
Fin, but the heat exchange fin shape of the present invention is not limited to this, it is also possible to it is aciculiform fin, cylindrical wing
Other shapes such as sheet or Special-shaped fin.
The liquid cooling heat radiator 11 proposed in the present embodiment uses increases heat exchange fin 21 at substrate 20 outer surface,
Thus carry out more preferable heat exchange with the air of surrounding, the situation of ambient air temperature it is less than in substrate 20 temperature
Under, substrate 20 absorbs the heat of surrounding air by heat exchange fin 21 so that ambient air temperature drops
Low, in the case of the substrate 20 projecting temperature of temperature, surrounding air can also pass through heat exchange fin 21
Assisting base plate 20 dispels the heat, thus reaches more preferable heat transfer effect.
Further, in this embodiment, the structure of substrate 20 is preferably upper substrate 25 and infrabasal plate 26
It is welded, the solder side of upper substrate 25 and infrabasal plate 26 is correspondingly arranged on upper groove and low groove,
Upper groove and low groove enclose formation liquid cold runner 24, and now, heat exchange fin 21 is attached to upper substrate 24
Upper surface, as in figure 2 it is shown, this embodiment using the upper surface of upper substrate 24 as radiating surface, but not
It is confined to this, it is also possible to further by other sides or the side etc. of infrabasal plate 25 of upper substrate 24
As radiating surface, this kind of structure is prone to process and cost-effective；Substrate 20 can also be further arranged to one
The plate that block is complete, offers holding channel wherein, is pressed in holding channel metallic conduit as liquid cold flow
Road, in other embodiments, the concrete structure of liquid cold runner 24 can also be other forms.
Further, the radiating fin 21 in the present embodiment is preferably make one-body molded with upper substrate 24,
Other embodiments can also select the fixing connected modes such as welding, crimping, when substrate 20 be one piece complete
Plate time, substrate 20 can with heat exchange fin 21 can one-body molded can also welding fabrication, substrate 20
Can be that the metal heat-conducting materials such as copper, aluminum, rustless steel or various metals material are mixed with heat exchange fin 21
The alloy closed is connected by modes such as welding, crimping, it is also possible to be graphite flake or heat conduction film etc.
Other Heat Conduction Materials are connected by the mode such as bonding, to realize the great heat radiation effect of liquid cooling heat radiator.
Specifically, as in figure 2 it is shown, be the cooling system signal of liquid cooling heat radiator preferred embodiment of the present invention
Figure, when using liquid cooling heat radiator 11, liquid low-temperature receiver 10 cooling medium flowed out is entered by cooling medium
Mouth 22 enters substrates 20, in the internal flow of the liquid cold runner 24 within substrate 20, passes through cooling medium
With the heat exchange of substrate 20, the heat produced during being used by electronic product 13 etc. is taken away, and is passed through cold
But media outlet 23 flows out substrate 20, returns at liquid low-temperature receiver 10, after liquid cold source cool-down, then carries
To substrate 20, form circulation, dispel the heat for electronic product 13 etc..
Further, liquid cooling heat radiator includes multiple substrate 20 being arranged in series, logical between multiple substrates 20
Crossing connection pipeline to connect, connecting pipeline can be the metal tube such as copper pipe, aluminum pipe, it is also possible to be non-metallic pipe,
The cooling medium outlet 23 of upper level substrate 20 passes through connecting tube with the cooling medium entrance of next stage substrate
Road connects, and a liquid cooling heat radiator can be multiple chip or other electronic equipment heat exchange.
These are only the preferred embodiments of the present invention, not thereby limit the scope of the claims of the present invention, every
Utilize equivalent structure or equivalence flow process conversion that description of the invention and accompanying drawing content made, or directly or
Connect and be used in other relevant technical fields, be the most in like manner included in the scope of patent protection of the present invention.
Claims (8)
1. a liquid cooling heat radiator, it is characterised in that include the substrate for heat radiation, described substrate sets
Being equipped with radiating surface, described substrate is provided with cooling medium entrance, cooling medium outlet and liquid cold runner, institute
State cooling medium entrance to be connected by described liquid cold runner, on described radiating surface with the outlet of described cooling medium
It is provided with heat exchange fin.
Liquid cooling heat radiator the most according to claim 1, it is characterised in that described liquid cold runner is gold
Metal conduit, is provided with the holding channel of accommodating described metallic conduit in described substrate.
Liquid cooling heat radiator the most according to claim 1, it is characterised in that described substrate is upper substrate
Formed with infrabasal plate welding, the solder side of described upper substrate and described infrabasal plate is correspondingly arranged on respectively
Groove and low groove, described upper groove and described low groove enclose formation liquid cold runner.
Liquid cooling heat radiator the most according to claim 2, it is characterised in that described radiating fin and institute
State substrate to weld or one-body molded.
Liquid cooling heat radiator the most according to claim 3, it is characterised in that described radiating fin and institute
State infrabasal plate to weld or one-body molded.
6. according to the liquid cooling heat radiator according to any one of claim 1-5, it is characterised in that described substrate
Make by metal heat-conducting material with described heat exchange fin.
Liquid cooling heat radiator the most according to claim 1, it is characterised in that described liquid cooling heat radiator bag
Include the multiple described substrate being arranged in series, described in the cooling medium outlet of substrate described in upper level and next stage
The cooling medium entrance of substrate is by connecting pipeline communication.
8. an electronic equipment, it is characterised in that include that the liquid according to any one of claim 1-7 is cold
Radiator.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510208583.1A CN106158788A (en) | 2015-04-28 | 2015-04-28 | Liquid cooling heat radiator and electronic equipment |
| PCT/CN2015/099167 WO2016173286A1 (en) | 2015-04-28 | 2015-12-28 | Liquid cooling radiator and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510208583.1A CN106158788A (en) | 2015-04-28 | 2015-04-28 | Liquid cooling heat radiator and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106158788A true CN106158788A (en) | 2016-11-23 |
Family
ID=57198920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510208583.1A Pending CN106158788A (en) | 2015-04-28 | 2015-04-28 | Liquid cooling heat radiator and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106158788A (en) |
| WO (1) | WO2016173286A1 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107591379A (en) * | 2017-07-24 | 2018-01-16 | 广东美的暖通设备有限公司 | The heat abstractor and transducer air conditioning of transducer air conditioning drive module chip |
| CN107611103A (en) * | 2017-07-24 | 2018-01-19 | 广东美的暖通设备有限公司 | The heat abstractor and transducer air conditioning of transducer air conditioning drive module chip |
| CN108161002A (en) * | 2017-12-11 | 2018-06-15 | 北京工业大学 | Fin cooling system, cooling fins and its increasing material manufacturing method |
| CN109152314A (en) * | 2018-10-30 | 2019-01-04 | 珠海格力电器股份有限公司 | Heat dissipation device, control heat dissipation assembly and washing machine |
| CN109429466A (en) * | 2017-08-21 | 2019-03-05 | 大石祖耀 | A kind of radiator for charging unit |
| CN110015003A (en) * | 2017-08-21 | 2019-07-16 | 徐煜 | A kind of charging unit |
| CN110610912A (en) * | 2019-10-15 | 2019-12-24 | 安徽祥博传热科技有限公司 | Liquid cooling heat dissipation device for copper aluminum pipe and machining method thereof |
| CN111384006A (en) * | 2018-12-29 | 2020-07-07 | 中兴通讯股份有限公司 | Heat radiation structure |
| CN112328021A (en) * | 2020-11-06 | 2021-02-05 | 浪潮电子信息产业股份有限公司 | Server and internal exposure heat dissipation structure thereof |
| CN115440688A (en) * | 2022-09-15 | 2022-12-06 | 北京市燃气集团有限责任公司 | Intelligent gas meter ESAM chip issuing machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108882499A (en) * | 2017-05-09 | 2018-11-23 | 罗伯特·博世有限公司 | Motherboard, power electronic device and equipment including it |
| CN112466827A (en) * | 2020-12-04 | 2021-03-09 | 西安中车永电捷通电气有限公司 | Cooling device, control equipment and rail train |
| CN113240572B (en) * | 2021-06-18 | 2022-12-23 | 潍坊科技学院 | Photoelectric image processing device based on big data and implementation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6926070B2 (en) * | 2002-03-22 | 2005-08-09 | Intel Corporation | System and method for providing cooling systems with heat exchangers |
| CN201163626Y (en) * | 2008-01-11 | 2008-12-10 | 林于纮 | Chip fast-cooling device |
| CN201590985U (en) * | 2010-01-25 | 2010-09-22 | 中兴通讯股份有限公司 | Liquid cooling plate |
| CN202083049U (en) * | 2011-06-13 | 2011-12-21 | Tcl空调器(中山)有限公司 | Air conditioner and heat radiation device thereof |
| CN203120357U (en) * | 2013-01-14 | 2013-08-07 | 中兴通讯股份有限公司 | Liquid cooling heat dissipation cabinet |
| CN203814108U (en) * | 2013-12-19 | 2014-09-03 | 上海西门子医疗器械有限公司 | Liquid cooling apparatus, liquid cooling assembly, and medical facility |
-
2015
- 2015-04-28 CN CN201510208583.1A patent/CN106158788A/en active Pending
- 2015-12-28 WO PCT/CN2015/099167 patent/WO2016173286A1/en active Application Filing
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107591379A (en) * | 2017-07-24 | 2018-01-16 | 广东美的暖通设备有限公司 | The heat abstractor and transducer air conditioning of transducer air conditioning drive module chip |
| CN107611103A (en) * | 2017-07-24 | 2018-01-19 | 广东美的暖通设备有限公司 | The heat abstractor and transducer air conditioning of transducer air conditioning drive module chip |
| CN109429466A (en) * | 2017-08-21 | 2019-03-05 | 大石祖耀 | A kind of radiator for charging unit |
| CN110015003A (en) * | 2017-08-21 | 2019-07-16 | 徐煜 | A kind of charging unit |
| CN109429466B (en) * | 2017-08-21 | 2020-10-16 | 大石祖耀 | Heat dissipation device for charging device |
| CN108161002A (en) * | 2017-12-11 | 2018-06-15 | 北京工业大学 | Fin cooling system, cooling fins and its increasing material manufacturing method |
| CN109152314A (en) * | 2018-10-30 | 2019-01-04 | 珠海格力电器股份有限公司 | Heat dissipation device, control heat dissipation assembly and washing machine |
| CN109152314B (en) * | 2018-10-30 | 2024-07-02 | 珠海格力电器股份有限公司 | Heat abstractor, control radiating component and washing machine |
| CN111384006A (en) * | 2018-12-29 | 2020-07-07 | 中兴通讯股份有限公司 | Heat radiation structure |
| CN110610912A (en) * | 2019-10-15 | 2019-12-24 | 安徽祥博传热科技有限公司 | Liquid cooling heat dissipation device for copper aluminum pipe and machining method thereof |
| CN112328021A (en) * | 2020-11-06 | 2021-02-05 | 浪潮电子信息产业股份有限公司 | Server and internal exposure heat dissipation structure thereof |
| CN115440688A (en) * | 2022-09-15 | 2022-12-06 | 北京市燃气集团有限责任公司 | Intelligent gas meter ESAM chip issuing machine |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016173286A1 (en) | 2016-11-03 |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161123 |
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| WD01 | Invention patent application deemed withdrawn after publication |