CN106155241A - Heat abstractor - Google Patents
Heat abstractor Download PDFInfo
- Publication number
- CN106155241A CN106155241A CN201510155915.4A CN201510155915A CN106155241A CN 106155241 A CN106155241 A CN 106155241A CN 201510155915 A CN201510155915 A CN 201510155915A CN 106155241 A CN106155241 A CN 106155241A
- Authority
- CN
- China
- Prior art keywords
- water
- heat
- cooling head
- heat abstractor
- cold type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims abstract description 71
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 57
- 239000012530 fluid Substances 0.000 claims abstract description 19
- 230000005669 field effect Effects 0.000 claims description 9
- 230000005855 radiation Effects 0.000 claims description 6
- 210000004556 brain Anatomy 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention belongs to radiator structure field, particularly relate to a kind of heat abstractor, it is intended to solve to use two set existing water-cooling heat radiating devices, when respectively two high consumption heating devices being dispelled the heat, the technical problem taken up room in troublesome poeration and structure is installed.First water-cooling head, second water-cooling head is connected between any two with cold type pipeline, first water-cooling head is sticked on the first chip, the heat that first chip produces is transferred to inside the first water-cooling head, under the first water pump drives, the low temperature heat-conducting fluid of cold type introduced the first water-cooling head and deliver to the second water-cooling head, second water-cooling head is sticked on the second chip, the heat that second chip produces is transferred to inside the second water-cooling head, under the second water pump drives, the heat-conducting fluid that the first water-cooling head flows out is introduced the second water-cooling head and delivers to cold type, heat-conducting fluid heat release in cold type is become low temperature from high temperature.Two high consumption heating devices can effectively be dispelled the heat by this heat abstractor simultaneously, easily installs, is not take up space, and consumptive material is less.
Description
Technical field
The invention belongs to radiator structure field, particularly relate to a kind of heat abstractor.
Background technology
Heat abstractor of the prior art is divided into air-cooled radiating device and water-cooling heat radiating device, and both structures are equal
Can be to the central processing unit on computer main board, the graph processing chips on computer display card or other heater members
Dispel the heat.Water-cooling heat radiating device generally includes and is sticked on heater members and for the heat of absorption heater part
The water-cooling head of amount, for heat being distributed to outside cold type and be connected between water-cooling head and cold type two
Pipeline.Relative to air-cooled radiating device, water-cooling heat radiating device has more preferable radiating effect, it is adaptable to Gao Gong
Consumption heater members, relatively costly.Under needing the occasion that two high consumption heating devices are dispelled the heat simultaneously,
When all using water-cooling heat radiating device such as computer main board and computer display card, two set water-cooling heat radiating device process ratios are installed
Cumbersome, structure compares and takes up room, and consumptive material is more, relatively costly.
Summary of the invention
It is an object of the invention to provide a kind of heat abstractor, it is intended to solve to use two sets existing water-cooling dress
Put and the skill taken up room in troublesome poeration and structure is installed when respectively two high consumption heating devices being dispelled the heat
Art problem.
The present invention is achieved in that a kind of heat abstractor, and described heat abstractor is for simultaneously to first line
Plate and the heat radiation of the second wiring board, described first line plate is provided with the first chip, on described second wiring board
Second chip is installed；Described heat abstractor includes being sticked on described first chip and having the first water inlet
With the first water-cooling head of the first outlet, be arranged on described first water-cooling head and for driving described first water
Fluid in cold head is flowed to the first water pump of described first outlet by described first water inlet, is sticked described
On second chip and there is the second water inlet and the second water-cooling head of the second outlet, be arranged on described second water
Fluid on cold head and in driving described second water-cooling head is flowed to described second by described second water inlet and goes out
Second water pump at the mouth of a river and there is the 3rd water inlet and the cold type of the 3rd outlet, described 3rd outlet with
Connect between described first water inlet and have the first pipeline, between described first outlet and described second water inlet
Connecting and have second pipe, being connected between described second outlet with described 3rd water inlet has the 3rd pipeline；Institute
State cold type, described first pipeline, described first water-cooling head, described second pipe, described second water-cooling head with
Described 3rd pipeline is formed in a closed circuit, and this closed circuit and is filled with heat-conducting fluid.
Further, described first water pump is arranged in described first water-cooling head, and described second water pump is arranged on
In described second water-cooling head.
Further, described heat abstractor also includes being arranged on described cold type and for dispelling the heat this cold type
First fan.
Further, described first line plate is computer main board, and described second wiring board is computer display card, institute
State computer display card to be arranged on described computer main board；Described first chip is central processing unit；Described computer shows
Card has the first side and deviates from the second side of described first side, and described second chip is graph processing chips, institute
State graph processing chips to be arranged on described first side of described computer display card.
Further, described first side of described computer display card being provided with field-effect transistor, described field is imitated
Answering graph processing chips described in transistor AND gate separately, described heat abstractor also includes that being arranged on described computer shows
On described first side of card and for the second fan that described field-effect transistor is dispelled the heat.
Further, described heat abstractor also includes described second side and the correspondence being arranged on described computer display card
Radiator on the position of described graph processing chips, described radiator includes being sticked on described second side
Heat sink and some fin of being arranged on the side away from described computer display card of described heat sink.
Further, described cold type is arranged on described second side of described computer display card.
Further, described first pipeline is detachably connected to described 3rd outlet and described first water inlet
Between Kou, described second pipe is detachably connected between described first outlet and described second water inlet,
Described 3rd pipeline is detachably connected between described second outlet and described 3rd water inlet.
Further, described cold type is plate-shaped, and described cold type and described second wiring board are parallel to each other distribution,
And this cold type is all vertically set on described first line plate with this second wiring board.
Or, described cold type is plate-shaped, described cold type, described first line plate and described second wiring board two
Two mutual vertical distribution.
The present invention has the technical effect that the first water-cooling head, the second water-cooling head and cold type two relative to prior art
Connecting between two and have pipeline, the first water-cooling head is sticked on the first chip, the heat transmission that the first chip produces
To the first water-cooling head, under the first water pump drives, the low temperature heat-conducting fluid of cold type is introduced the first water-cooling head
And deliver to the second water-cooling head, the second water-cooling head is sticked on the second chip, the heat transmission that the second chip produces
To the second water-cooling head, under the second water pump drives, the heat-conducting fluid that the first water-cooling head flows out is introduced second
Water-cooling head also delivers to cold type, and the heat-conducting fluid heat release in cold type is become low temperature from high temperature.This heat abstractor can be same
Time two high consumption heating devices are effectively dispelled the heat, easily install, compact conformation, be not take up space,
And consumptive material is less, cost is suitable.
Accompanying drawing explanation
Fig. 1 is that the heat abstractor that first embodiment of the invention provides is applied at first line plate and the second wiring board
On assembling schematic diagram.
Fig. 2 is the decomposing schematic representation of the heat abstractor of Fig. 1.
Fig. 3 is the decomposing schematic representation of another angle of the heat abstractor of Fig. 2, wherein cold type, the first fan,
First pipeline, second pipe, the 3rd pipeline and the first water-cooling head do not show.
Fig. 4 is that the heat abstractor that second embodiment of the invention provides is applied at first line plate and the second wiring board
On assembling schematic diagram.
Fig. 5 is the decomposing schematic representation of the heat abstractor of Fig. 4.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and reality
Execute example, the present invention is further elaborated.Only should be appreciated that specific embodiment described herein
Only in order to explain the present invention, it is not intended to limit the present invention.
Referring to Fig. 1 to Fig. 3, a kind of heat abstractor that the embodiment of the present invention provides, described heat abstractor is used
In simultaneously, first line plate 80 is dispelled the heat with the second wiring board 90, described first line plate 80 is provided with
One chip (not shown), described second wiring board 90 is provided with the second chip 91；Described heat abstractor bag
Include and be sticked on described first chip and have the first water inlet 11 and the first water-cooling head of the first outlet 12
10, the fluid on described first water-cooling head 10 and in driving described first water-cooling head 10 it is arranged on by institute
State the first water inlet 11 to flow to the first water pump (not shown) of described first outlet 12, be sticked described
On two chips 91 and there is the second water-cooling head 20 of the second water inlet 21 and the second outlet 22, be arranged on
Fluid on described second water-cooling head 20 and in driving described second water-cooling head 20 is intake by described second
Mouth 21 flows to the second water pump (not shown) of described second outlet 22 and has the 3rd water inlet 31
With the cold type 30 of the 3rd outlet 32, connect between described 3rd outlet 32 and described first water inlet 11
Being connected to the first pipeline 41, being connected between described first outlet 12 with described second water inlet 21 has the second pipe
Road 42, is connected between described second outlet 22 and described 3rd water inlet 31 and has the 3rd pipeline 43；Described
Cold type 30, described first pipeline 41, described first water-cooling head 10, described second pipe 42, described second
Water-cooling head 20 and described 3rd pipeline 43 are formed and are filled with heat conduction stream in a closed circuit, and this closed circuit
Body.
First water-cooling head the 10, second water-cooling head 20 is connected between any two with cold type 30 pipeline, the first water-cooled
10 are sticked on the first chip, and it is internal that the heat that the first chip produces is transferred to the first water-cooling head 10,
Under first water pump driving, the low temperature heat-conducting fluid of cold type 30 introduced the first water-cooling head 10 and deliver to the second water-cooled
20, the second water-cooling head 20 is sticked on the second chip 91, and the heat that the second chip 91 produces is transferred to
Second water-cooling head 20 is internal, and the heat-conducting fluid flowed out by the first water-cooling head 10 under the second water pump drives introduces
Second water-cooling head 20 also delivers to cold type 30, and the heat-conducting fluid heat release in cold type 30 is become low temperature from high temperature.Should
Two high consumption heating devices can effectively be dispelled the heat by heat abstractor simultaneously, easily installs, compact conformation,
Being not take up space, and consumptive material is less, cost is suitable.
Cold type 30 is prior art, has water inlet and outlet, and high-temperature heat-conductive fluid is entered cold by water inlet
Row 30 and dispel the heat in cold type 30 by high temperature become make low temperature, low temperature heat-conducting fluid is discharged by outlet.
Further, the first water pump is arranged in described first water-cooling head 10, and the second water pump is arranged on described
In two water-cooling heads 20.Water pump integrated installation is in water-cooling head, and compact conformation, this structure is prior art.
Further, described heat abstractor also includes being arranged on described cold type 30 and for this cold type 30
First fan 50 of heat radiation.Specifically, the first fan 50 is arranged on inner side, and cold type 30 is in outside, the
The heat of the heat in cabinet and cold type 30 is forced row to outside by one fan 50.
Further, first line plate 80 is computer main board 80, and the second wiring board 90 is computer display card 90,
Computer display card 90 is arranged on computer main board 80；First chip is central processing unit；Computer display card 90 has
First side 90a and deviate from the second side 90b of the first side 90a, described second chip 91 is graph processing chips
91, graph processing chips 91 is arranged on the first side 90a of computer display card 90.Central processing unit is computer
The main heating source of mainboard 80, graph processing chips 91 is the main heating source of computer display card 90, needs emphasis to drop
Temperature.For computer main board 80, the second wiring board 90 is computer display card 90 to first line plate 80, or first
For computer display card, the second wiring board 90 is computer main board to wiring board 80, and heat abstractor is real to desktop computer
Now dispel the heat.It is to be appreciated that first line plate 80 and the second wiring board 90 need the heating of heat radiation for other
Device, heat abstractor realizes heat radiation to other heat-producing devices.
Further, the described first side 90a of described computer display card 90 is provided with field-effect transistor 92,
With described graph processing chips 91 separately, described heat abstractor also includes peace to described field-effect transistor 92
It is contained on the described first side 90a of described computer display card 90 and for described field-effect transistor 92 is dispelled the heat
The second fan 60.Specifically, the second water-cooling head 20 is provided with installing rack 61, installing rack 61 is installed
Having the second fan 60, the heat produced by field-effect transistor 92 is arranged to outside.
Further, described heat abstractor also includes the described second side 90b being arranged on described computer display card 90
And corresponding to the radiator 70 on the position of described graph processing chips 91, described radiator 70 includes being sticked
Heat sink 71 on described second side 90b and be arranged on described heat sink 71 away from described computer display card
Some fin 72 on the side of 90.Specifically, radiator 70 and the second water-cooling head 20 use tightly simultaneously
Firmware is locked on first line plate 80.Second chip 91 can be dispelled the heat by radiator 70 further.
Further, described cold type 30 is arranged on the described second side 90b of described computer display card 90.Should
Structure is easy to the heat that on the heat that obtained by radiator 70 and first line plate 80, other heater members produce
Row is to outside, and especially when being provided with the first fan 50, radiating effect is more preferable.
Further, described first pipeline 41 is detachably connected to described 3rd outlet 32 and described the
Between one water inlet 11, described second pipe 42 is detachably connected to described first outlet 12 with described
Between second water inlet 21, described 3rd pipeline 43 is detachably connected to described second outlet 22 and institute
State between the 3rd water inlet 31.Specifically, each water inlet and outlet all use joint, sheathed on joint
Having rubber ring, each pipeline is set in corresponding joints realization and is tightly connected.Further, joint can select one
Font or L font, in order to the connection of pipeline.In the present embodiment, the first water-cooling head 10 uses L
The joint of font, the second water-cooling head 20 all uses the joint of yi word pattern with water row 30.
Further, described cold type 30 is plate-shaped, and described cold type 30 is the most flat with described second wiring board 90
Row is distributed, and this cold type 30 is all vertically set on described first line plate 80 with this second wiring board 90.
Specifically, cold type 30 and the second wiring board 90 separately, the first chip be arranged on first line plate 80 and
Between cold type 30 and the second wiring board 90.When first line plate 80 for computer main board 80 second line
When road plate 90 is computer display card 90, the interface position of computer display card 90 is staggered with cold type 30.It is being provided with
During the first fan 50, the first fan 50 is allowed to force row to outside the heat in cabinet.In the present embodiment,
Two the first fans 50 are installed on cold type 30.Or, the on-demand quantity that first fan 50 is set.
Refer to Fig. 4, Fig. 5, the heat abstractor that second embodiment of the invention provides, provide with first embodiment
Heat abstractor roughly the same, described cold type 30 is plate-shaped, unlike first embodiment: described cold type
30, described first line plate 80 is mutually perpendicular to distribution two-by-two with described second wiring board 90.Specifically, cold
Row 30, first line plate the 80, second wiring board 90 are mutually perpendicular to, two-by-two substantially in the three of a cuboid
Individual adjacent surface is distributed.When first line plate 80, for computer main board 80, the second wiring board 90 is computer display card
When 90, the interface position of computer display card 90 is concordant with cold type 30, it is simple to cold type 30 dispels the heat, and is being provided with
During one fan 50, the first fan 50 is allowed to force row to outside the heat in cabinet.In the present embodiment,
One the first fan 50 is installed on cold type 30.Or, the on-demand quantity that first fan 50 is set.Above
Two schemes is selected one to be applicable to different cabinets, allows heat abstractor have adaptability.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all at this
Any amendment, equivalent and the improvement etc. made within bright spirit and principle, should be included in the present invention
Protection domain within.
Claims (10)
1. a heat abstractor, it is characterised in that: described heat abstractor is for simultaneously to first line plate and the
Two wiring board heat radiations, described first line plate are provided with the first chip, described second wiring board are provided with
Second chip；Described heat abstractor includes being sticked on described first chip and having the first water inlet and first
First water-cooling head of outlet, it is arranged on described first water-cooling head and in driving described first water-cooling head
Fluid flowed to the first water pump of described first outlet by described first water inlet, be sticked at described second core
On sheet and there is the second water inlet and the second water-cooling head of the second outlet, be arranged on described second water-cooling head
And the fluid in driving described second water-cooling head is flowed to described second outlet by described second water inlet
Second water pump and there is the 3rd water inlet and the cold type of the 3rd outlet, described 3rd outlet and described the
Connecting between one water inlet and have the first pipeline, being connected between described first outlet with described second water inlet has
Second pipe, is connected between described second outlet with described 3rd water inlet and has the 3rd pipeline；Described cold type,
Described first pipeline, described first water-cooling head, described second pipe, described second water-cooling head and the described 3rd
Pipeline is formed in a closed circuit, and this closed circuit and is filled with heat-conducting fluid.
2. heat abstractor as claimed in claim 1, it is characterised in that: described first water pump is arranged on described
In first water-cooling head, described second water pump is arranged in described second water-cooling head.
3. heat abstractor as claimed in claim 1, it is characterised in that: described heat abstractor also includes installing
On described cold type and for the first fan that this cold type is dispelled the heat.
4. the heat abstractor as described in any one of claims 1 to 3, it is characterised in that: described first line
Plate is computer main board, and described second wiring board is computer display card, and described computer display card is arranged on described computer master
On plate；Described first chip is central processing unit；Described computer display card has the first side and deviates from described first
Second side of side, described second chip is graph processing chips, and described graph processing chips is arranged on described electricity
On described first side of brain video card.
5. heat abstractor as claimed in claim 4, it is characterised in that: described the first of described computer display card
Field-effect transistor, described field-effect transistor and described graph processing chips are installed separately on side, institute
State heat abstractor also to include being arranged on described first side of described computer display card and for brilliant to described field effect
Second fan of body pipe heat radiation.
6. heat abstractor as claimed in claim 4, it is characterised in that: described heat abstractor also includes installing
Radiator on described second side of described computer display card and the position corresponding to described graph processing chips,
Described radiator include the heat sink being sticked on described second side and be arranged on described heat sink away from described
Some fin on the side of computer display card.
7. heat abstractor as claimed in claim 4, it is characterised in that: described cold type is arranged on described computer
On described second side of video card.
8. the heat abstractor as described in any one of claims 1 to 3, it is characterised in that: described first pipeline
Being detachably connected between described 3rd outlet and described first water inlet, described second pipe is detachable
Be connected between described first outlet and described second water inlet, described 3rd pipeline is detachably connected
Between described second outlet and described 3rd water inlet.
9. the heat abstractor as described in any one of claims 1 to 3, it is characterised in that: described cold type is plate
Shape, described cold type and described second wiring board are parallel to each other distribution, and this cold type is the most vertical with this second wiring board
Directly it is arranged on described first line plate.
10. the heat abstractor as described in any one of claims 1 to 3, it is characterised in that: described cold type in
Tabular, described cold type, described first line plate are mutually perpendicular to distribution two-by-two with described second wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510155915.4A CN106155241A (en) | 2015-04-03 | 2015-04-03 | Heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510155915.4A CN106155241A (en) | 2015-04-03 | 2015-04-03 | Heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106155241A true CN106155241A (en) | 2016-11-23 |
Family
ID=57338500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510155915.4A Pending CN106155241A (en) | 2015-04-03 | 2015-04-03 | Heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106155241A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107396599A (en) * | 2017-07-14 | 2017-11-24 | 华南理工大学 | A kind of heat abstractor and thermal management algorithm of movable cabinet level server system |
| CN109819626A (en) * | 2017-11-22 | 2019-05-28 | 微星科技股份有限公司 | Radiator and cooling system |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1797276A (en) * | 2004-12-24 | 2006-07-05 | 富准精密工业(深圳)有限公司 | Liquid cooling type heat sink |
| CN2833699Y (en) * | 2005-06-08 | 2006-11-01 | 讯凯国际股份有限公司 | Modified water-cooled radiator structure |
| TWM324810U (en) * | 2007-06-05 | 2008-01-01 | Gigazone Int Co Ltd | Water-cooled circulating heat dissipation device of computer motherboard |
| CN201084094Y (en) * | 2007-07-06 | 2008-07-09 | 曜嘉科技股份有限公司 | Computer mainframe board water cooled circulating heat radiating device |
| CN101295681A (en) * | 2007-04-26 | 2008-10-29 | 美商旭扬热传股份有限公司 | Water-cooling radiating module device of display card |
| CN201984415U (en) * | 2010-12-21 | 2011-09-21 | 深圳市万景华科技有限公司 | Cross-flow radiator and video card with same |
| CN202433827U (en) * | 2012-01-17 | 2012-09-12 | 项云 | Integral water-cooled radiator |
| CN202453800U (en) * | 2012-02-29 | 2012-09-26 | 万哲 | Computer case with external radiator |
| CN202649911U (en) * | 2012-06-26 | 2013-01-02 | 保锐科技股份有限公司 | Water-cooled radiating device special for display card |
| CN202720557U (en) * | 2012-06-25 | 2013-02-06 | 北京视博云科技有限公司 | Heat dissipation system |
| CN203376678U (en) * | 2013-05-02 | 2014-01-01 | 山东科技大学 | A built-in water cooling heat sink for a notebook computer |
| CN203386140U (en) * | 2013-08-06 | 2014-01-08 | 深圳市万景华科技有限公司 | CPU radiator of case |
| CN103699191A (en) * | 2012-09-28 | 2014-04-02 | 四川奥格科技有限公司 | Semiconductor water-cooling central processing unit (CPU) radiator |
| CN104102308A (en) * | 2014-07-23 | 2014-10-15 | 叶斌 | Water-cooling computer base |
| CN204557352U (en) * | 2015-04-03 | 2015-08-12 | 深圳市万景华科技有限公司 | Heat abstractor |
-
2015
- 2015-04-03 CN CN201510155915.4A patent/CN106155241A/en active Pending
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1797276A (en) * | 2004-12-24 | 2006-07-05 | 富准精密工业(深圳)有限公司 | Liquid cooling type heat sink |
| CN2833699Y (en) * | 2005-06-08 | 2006-11-01 | 讯凯国际股份有限公司 | Modified water-cooled radiator structure |
| CN101295681A (en) * | 2007-04-26 | 2008-10-29 | 美商旭扬热传股份有限公司 | Water-cooling radiating module device of display card |
| TWM324810U (en) * | 2007-06-05 | 2008-01-01 | Gigazone Int Co Ltd | Water-cooled circulating heat dissipation device of computer motherboard |
| CN201084094Y (en) * | 2007-07-06 | 2008-07-09 | 曜嘉科技股份有限公司 | Computer mainframe board water cooled circulating heat radiating device |
| CN201984415U (en) * | 2010-12-21 | 2011-09-21 | 深圳市万景华科技有限公司 | Cross-flow radiator and video card with same |
| CN202433827U (en) * | 2012-01-17 | 2012-09-12 | 项云 | Integral water-cooled radiator |
| CN202453800U (en) * | 2012-02-29 | 2012-09-26 | 万哲 | Computer case with external radiator |
| CN202720557U (en) * | 2012-06-25 | 2013-02-06 | 北京视博云科技有限公司 | Heat dissipation system |
| CN202649911U (en) * | 2012-06-26 | 2013-01-02 | 保锐科技股份有限公司 | Water-cooled radiating device special for display card |
| CN103699191A (en) * | 2012-09-28 | 2014-04-02 | 四川奥格科技有限公司 | Semiconductor water-cooling central processing unit (CPU) radiator |
| CN203376678U (en) * | 2013-05-02 | 2014-01-01 | 山东科技大学 | A built-in water cooling heat sink for a notebook computer |
| CN203386140U (en) * | 2013-08-06 | 2014-01-08 | 深圳市万景华科技有限公司 | CPU radiator of case |
| CN104102308A (en) * | 2014-07-23 | 2014-10-15 | 叶斌 | Water-cooling computer base |
| CN204557352U (en) * | 2015-04-03 | 2015-08-12 | 深圳市万景华科技有限公司 | Heat abstractor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107396599A (en) * | 2017-07-14 | 2017-11-24 | 华南理工大学 | A kind of heat abstractor and thermal management algorithm of movable cabinet level server system |
| CN109819626A (en) * | 2017-11-22 | 2019-05-28 | 微星科技股份有限公司 | Radiator and cooling system |
| CN109819626B (en) * | 2017-11-22 | 2023-03-28 | 微星科技股份有限公司 | Radiator and cooling system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104054407B (en) | Cooling system for server | |
| CN102159058A (en) | Liquid-cooled radiation structure | |
| US6945315B1 (en) | Heatsink with active liquid base | |
| CN206039415U (en) | Heat radiation structure of computer main part | |
| TW201543989A (en) | Electronic system and docking thereof | |
| TWM574708U (en) | Electronic device with water cooling function and water cooling module and water cooling row | |
| CN110060967A (en) | A kind of two-sided cooling radiator | |
| TWM539760U (en) | Integrated liquid cooling system | |
| CN104423504A (en) | Server | |
| CN204650415U (en) | Heat abstractor | |
| CN106155241A (en) | Heat abstractor | |
| CN204557352U (en) | Heat abstractor | |
| TWM277983U (en) | Improved water-cooling heat dissipating structure | |
| CN107124853A (en) | Liquid cooling apparatus and its electronic equipment of application | |
| TWI744363B (en) | Cold plate assembly for electrical cabinet | |
| CN209787684U (en) | Liquid cooling device for cooling electronic equipment and electronic equipment | |
| CN2932931Y (en) | Liquid-cooled radiator that radiates heat with casing | |
| CN202433827U (en) | Integral water-cooled radiator | |
| CN204557363U (en) | A kind of magnetism servo-electric motor water-cooling of casing heat radiation | |
| US10303229B2 (en) | Water-cooling heat dissipation module | |
| CN207166932U (en) | Liquid cooling apparatus and its electronic equipment of application | |
| CN206788697U (en) | A kind of high-efficient heat-dissipating computer motherboard | |
| CN205987664U (en) | Heat dissipation device | |
| CN205782061U (en) | A kind of LED module efficient radiating apparatus | |
| CN205665634U (en) | Liquid cooling's rack -mounted server |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161123 |