CN106154759B - A kind of lithographic equipment and method of the fluctuating of recoverable material - Google Patents
A kind of lithographic equipment and method of the fluctuating of recoverable material Download PDFInfo
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- CN106154759B CN106154759B CN201510175996.4A CN201510175996A CN106154759B CN 106154759 B CN106154759 B CN 106154759B CN 201510175996 A CN201510175996 A CN 201510175996A CN 106154759 B CN106154759 B CN 106154759B
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Abstract
The present invention discloses a kind of lithographic equipment that recoverable material rises and falls, which is characterized in that including：Lighting system, for providing a lithographic beam；Mask platform, for carrying mask；The vertical sensor of mask platform, the vertical position for detecting and controlling a mask platform；Mask focusing and leveling system, the face shape for measuring mask；Work stage is moved for bearing substrate, compensates the low order amount of mask and real estate shape；Substrate focusing and leveling system, the face shape for measuring substrate；The vertical sensor of work stage, the vertical position for detecting and controlling a work stage；Objective lens array, two row object lens being made of multiple single object lens, single object lens include upper movable eyeglass and lower moveable eyeglass, the upper movable eyeglass and lower moveable eyeglass have the function of vertical adjustment, upper movable eyeglass is for compensating mask partial face shape high-order amount, and lower moveable eyeglass is for compensating substrate partial face shape high-order amount；Between two row object lens, mask focusing and leveling system is located at the surface of substrate focusing and leveling system for mask focusing and leveling system and substrate focusing and leveling system.
Description
Technical field
The present invention relates to the photoetching dresses that a kind of integrated circuit equipment manufacturing field more particularly to a kind of recoverable material rise and fall
It sets and method.
Background technology
Material rises and falls, including mask aligner mask version is caused by face shape and substrate surface are uneven caused by gravity deformation
Face shape.Wherein, real estate shape can be divided into integral face shape and partial face shape.Integral face shape describes upper surface of base plate overall variation
Trend corresponds to the low order amount in real estate shape；Partial face shape describes in exposure field subrange, upper surface of base plate
Irregular height rises and falls, and corresponds to the high-order amount in real estate shape.
Mask gravity deformation can cause curvature of the image, and image planes is caused to deviate nominal position.Real estate shape can cause to expose
Field upper surface and exposure focal plane are misaligned, and defocus occurs.Two kinds of face shapes can have an adverse effect to actual exposure effect.Nikon
In house journal CN1379286A, CN101375372A, CN102346378A, by adjusting the vertical height of each camera lens of objective lens array
Curvature of the image caused by compensating mask gravity deformation.Above method main purpose is that do not have for correction mask version gravity deformation
There is the influence for considering mask gravity deformation and large-size substrate face shape to exposure effect.
Invention content
In order to overcome defect existing in the prior art, the present invention provide a kind of lithographic equipment that recoverable material rises and falls and
Method.
In order to achieve the above-mentioned object of the invention, the present invention discloses a kind of lithographic equipment that recoverable material rises and falls, and feature exists
In, including：Lighting system, for providing a lithographic beam；Mask platform, for carrying mask；The vertical sensor of mask platform, is used for
Detect and control the vertical position of a mask platform；Mask focusing and leveling system, the face shape for measuring mask；Work stage is used for
Bearing substrate moves, and compensates the low order amount of mask and real estate shape；Substrate focusing and leveling system, the face shape for measuring substrate；
The vertical sensor of work stage, the vertical position for detecting and controlling a work stage；Objective lens array is made of multiple single object lens
Two row object lens, single object lens include upper movable eyeglass and lower moveable eyeglass, the upper movable eyeglass and lower moveable eyeglass
Has the function of vertical adjustment, upper movable eyeglass is for compensating mask partial face shape high-order amount, and lower moveable eyeglass is for compensating
Substrate partial face shape high-order amount；Mask focusing and leveling system and substrate focusing and leveling system are between two row object lens, mask tune
Burnt leveling system is located at the surface of substrate focusing and leveling system.
Further, the movement locus of upper movable eyeglass, lower moveable eyeglass and work stage is that Legendre is multinomial
Formula or other orthogonal polynomial tracks.
Present invention simultaneously discloses a kind of methods measured and correct material fluctuating, include the following steps：Step 1: mask platform
Vertical sensor control mask platform height and inclination are constant, and mask focusing and leveling sensor is used to measure mask plane shape；Step 2:
The vertical sensor control Workpiece stage vertical position of work stage is constant, and real estate shape is measured using substrate focusing and leveling sensor；Step
Rapid three, it is based on mask plane shape compensation model, mask plane shape is split as low order amount and high-order amount part, is compensated mask plane shape
Work stage adjustment amount and top object lens adjustment amount；Step 4: being based on real estate shape compensation model, real estate shape is split as low
Rank is measured and high-order amount part, is compensated the work stage adjustment amount and lower section object lens adjustment amount of real estate shape；Step 5: to compensation
The work stage adjustment amount of mask plane shape and the work stage adjustment amount of compensation real estate shape merge, and are fitted to obtain work stage fortune
Dynamic rail mark；According to top object lens adjustment amount and lower section object lens adjustment amount, be fitted with obtain upper movable eyeglass and under can
The movement locus of index glass piece；Step 6: adjustment top object lens, lower section object lens and work stage hybrid compensation mask and real estate shape.
Further, described to be fitted to using Legendre fitting of a polynomials or other way of fitting.
Compared with prior art, the present invention is by the way of work stage and object lens movable lens Joint regulation, by mask
Version gravity deformation and real estate shape carry out fractionation compensation.It is movable by adjusting camera lens top half in real time during scan exposure
Mechanism compensates mask plane shape high-order amount；By adjusting camera lens lower half portion movable agency in real time, real estate shape high-order amount is compensated；
By adjusting work stage in real time, the low order amount in mask plane shape and real estate shape is compensated.Splice by using 6 small field of view object lens
Composition makes light field public, and the time for exposure is reduced with this, reduces manufacture difficulty and cost.The present invention improves TFT photo-etching machine exposals point
The system performance index such as resolution and yield.
Description of the drawings
It can be obtained further by detailed description of the invention below and institute's accompanying drawings about the advantages and spirit of the present invention
Solution.
Fig. 1 is the structural schematic diagram for the lithographic equipment that recoverable material provided by the present invention rises and falls；
Fig. 2 is one of movable lens adjustment principle schematic；
Fig. 3 is the two of movable lens adjustment principle schematic；
Fig. 4 is mask platform vertical position schematic diagram；
Fig. 5 is facula measurement value schematic diagram；
Fig. 6 is plane fitting schematic diagram；
Fig. 7 is the flow chart for the photolithography method that recoverable material provided by the present invention rises and falls.
Specific implementation mode
The specific embodiment that the invention will now be described in detail with reference to the accompanying drawings.
In view of the deficiencies in the prior art, in order to compensate adverse effect of two kinds of face shapes to exposure effect respectively, this
The a set of lithographic equipment of Technical Design, by adjusting work stage and object lens or more two parts movable lens in real time, correction is covered
Masterplate gravity deformation and real estate shape make exposure field upper surface in exposure process be overlapped with exposure focal plane.
In the present invention, by the way of work stage and object lens movable lens Joint regulation, by mask gravity deformation and base
Plate face shape carries out fractionation compensation.During scan exposure, by adjusting camera lens top half movable agency in real time, mask plane is compensated
Shape high-order amount；By adjusting camera lens lower half portion movable agency in real time, real estate shape high-order amount is compensated；By adjusting workpiece in real time
Platform compensates the low order amount in mask plane shape and real estate shape.
For current large-sized substrate, in order to ensure that yield, the technical program pass through 6 using splicing camera lens method
Small field of view object lens splicing one big visual field of rectangle of composition.
Below with reference to attached drawing 1-7, lithographic equipment and side that recoverable material that the present invention will be described in detail is provided rises and falls
The realization method of method.
Fig. 1 schematically illustrates according to one embodiment of present invention 1 lithographic equipment.According to an embodiment of the invention, it carries
For a kind of lithographic equipment comprising：Lighting system 1, mask 2, mask platform 3, the vertical sensor 4 of mask platform, mask focusing are adjusted
Flat system 5, substrate focusing and leveling system 6, objective lens array 7, substrate 8, work stage 9, the vertical sensor of work stage, actuator 10.
In addition to this, which further includes：Mask focusing and leveling systematic survey hot spot 11, substrate focusing and leveling systematic survey hot spot
12。
Each subsystem function and correlation are：During offline Mapping (measurement of face row), mask focusing and leveling system
5 and substrate focusing and leveling system 6 measure 8 upper surface face shape of 2 lower surface of mask and substrate respectively.During scan exposure, illumination
System 1 emits illuminating bundle, is irradiated on mask 2, is imaged onto on real estate 8 by objective lens array 7, the vertical sensor of mask platform
4 control 3 catenary motions of mask platform, mask focusing and leveling system 5 measure mask plane shape, and the vertical sensor 10 of work stage controls workpiece
Platform 9 carries 8 catenary motion of substrate, and substrate focusing and leveling system 6 carries out substrate surface shape measurement.
Compared with prior art, objective lens array 7 of the invention is made of a plurality of lenses, and visual field is by a plurality of lenses group
At camera lens uses catadioptric principle.Wherein each camera lens includes upper part movable lens and lower part movable lens, two parts
For Independent adjustable complete machine structure.Splicing view field is made of totally two row object lens (objective lens array 7), 6 Ge Dan objective angular fields.Mask focusing is adjusted
Between two row object lens 7, substrate focusing and leveling system 6 is located at mask focusing and leveling for flat system 5 and substrate focusing and leveling system 6
Immediately below system 5.
The present invention is split as low order amount and high-order by upper part movable lens and lower part movable lens, by mask plane shape
Amount, work stage adjustment amount compensate mask plane shape low order amount, and part movable lens compensate mask partial face shape high-order on each object lens
It measures, movable lens joint in part adjusts compensation mask plane shape in work stage and object lens.Real estate shape is split as low order amount and height
Rank is measured, and work stage adjustment amount compensates real estate shape low order amount, and each object lens lower part movable lens compensation substrate partial face shape is high
Rank is measured, and work stage and object lens lower part movable lens joint adjust compensation real estate shape.
Movable lens adjustment can be realized by the following two kinds mode：
Mode one：Vertical adjustment lens 21 realize vertical adjustment object lens focal plane 22, as shown in Figure 2.
Mode two：Horizontal direction adjusts movable lens group eyeglass 21, realizes vertical adjustment object lens focal plane 22, as shown in Figure 3.
Fig. 4 is mask platform vertical position schematic diagram.As shown in figure 4, the vertical sensor 4 of mask platform measures 3 height of mask platform,
Mask focusing and leveling 5 measures mask plane shape 2 and mask datum plate label height.
The present invention also provides a kind of methods that measurement material rises and falls, and include the following steps：
The first step, mask platform vertical sensor control mask platform vertical position, are covered using mask focusing and leveling systematic survey
Die face shape；
The vertical sensor of second step, work stage controls Workpiece stage vertical position, uses substrate focusing and leveling systematic survey base
Plate face shape；
Third step is based on mask plane shape compensation model, and mask plane shape is split as part on work stage adjustment amount and object lens
Adjustment amount；
4th step is based on real estate shape compensation model, and real estate shape is split as work stage adjustment amount and object lens lower part
Adjustment amount；
5th step uses Legendre fitting of a polynomials to each section adjustment amount, calculates Legendre multinomial coefficients
(C0, C1, C2, C3, C4) is handed down to work stage and object lens top and the bottom movable lens, controls work stage during scan exposure
With object lens top and the bottom movable lens movement locus.
Based on mask plane shape compensation model, mask plane shape is split as part adjustment amount on work stage adjustment amount and object lens and is had
Body is as follows：
As shown in figure 4, the vertical sensor 4 of mask platform measures mask platform height, mask focusing and leveling system 5 measures mask plane
Shape and mask datum plate label height.
Mask plane shape compensation model calculates work stage adjustment amount
Mask plane shape is opposite mask platform benchmark plate face shape, shown in calculation formula such as formula (1)：
Δzreticle(xi,yi)=((zFLS_spot-zENC(xi,yi))-(Zplate+Rxplate*yi-Ryplate*xi) ………
(1)
Above formula respectively measures physical meaning：
1) zENC (x, y) is the reading of the vertical sensor of mask platform during measuring mask plane shape；
2) Zplate, Rxplate, Ryplate, the height and tilting value of datum plate；
3) zFLS_spot is the measurement height value of each hot spot of mask focusing and leveling system；
4)ΔzreticleIt is poor with respect to the face shape of mask platform datum plate for mask plane shape；
5) xi, yi are each measurement point horizontal position on mask.
After mask plane shape is corresponded to image planes, corresponding x, y, z expression formulas are：
Above formula respectively measures physical meaning：
1) x, y are the measurement point position after being transformed into image planes；
2)xws, ywsFor exposure field center；
3)ΔzDifference for mask plane shape with respect to mask platform datum plate；
4)xreticle_i, yreticle_iFor mask coordinates system measurement point horizontal position；
5) M is lens ratio.
Using static visual field sliding average, x is calculated to the fitting face setting value along a series of y locations of exposure center.
Each fitting face setting value Z (y), Rx (y), Ry (y) utilize all point Linears in current Slit (static visual field)
Fitting obtains：
zi=axi+byi+c ……………………(3)
Wherein, xi, yi, zi are represented after mask mapping measurement points go to image planes, all in Slit at each y location
Mask mapping measurement points.
As shown in fig. 6, in Slit sliding processes, (after going to image planes, formula (2) is seen with mask mapping measurement points in Slit
Plane fitting is done, fitting face setting value Z (y), Rx (y), Ry (y) are obtained.
Fitting face height and inclination expression formula are：
It is as follows that physical meaning is respectively measured in above formula：
z_sreticle(y)、Rx_sreticle(y)、Ry_sreticle(y)：It is y each to compensate only for mask plane shape
Set the vertical setting value of corresponding static visual field work stage；
Y is that the position to scanning, y belong to [y along ystart,yend],ystartIt is to start exposure position, yendIt is to terminate exposure
Position.
Part adjustment amount on object lens is calculated to specifically include：
Each physical quantity meaning of above formula is as follows：
1) zij is all mask mapping measured values under i-th of camera lens；
2)For the average value of the z of j point under i-th of camera lens.
Each physical quantity meaning of above formula is as follows：
1) dzi is the adjustment amount of single camera lens；
2) z_si (y) is the height value that face is fitted in entire static visual field of i-th of optical center.
z_si(y)=a*xi+b*yi+c ……………………(7)
Each physical quantity meaning of above formula is as follows：
1) a, b, c are the floor coefficient that six facula measurement values of mask focusing and leveling 5 are fitted at different y locations；
2) xi, yi are each optical center position.
It is specific as follows to calculate work stage adjustment amount for real estate shape compensation model：
As shown in figure 5, the height that each hot spot original measurement value is transformed under optical axis is：
zspot_FLS(x, y)=zspot_raw+RyBF*xspot-RxBF*yspot ……………………(8)
It is as follows that above formula respectively measures physical meaning：
1)xspot、yspotFor the horizontal position of hot spot；
2)zspot_rawFor the original measurement value of each hot spot；
3)zspot_FLSFor the transformed height value of each hot spot；
4)RxBF、RyBFFor the tilting value of optimum exposure focal plane.
The corresponding vertical measurement value sensor of work stage of each facula measurement point is：
z_sspot_IFM(x, y)=z_s-Ry_s*xspot+Rx_s*yspot……………………(9)
It is as follows that above formula respectively measures physical meaning：
1)xspot、yspotFor the horizontal position of hot spot；
2) z_s, Rx_s, Ry_s are height and the inclination of current work stage, and value is equal to the survey of the vertical sensor of work stage
Magnitude；
3)z_sspot_IFMCorresponding work stage vertical measurement value sensor when for each facula measurement position under optical axis.
Real estate shape expression formula is：
zwafer_map(x, y)=z_sspot_IFM(x,y)+Z_BF-zspot_FLS(x,y) ……………………(10)
It is as follows that above formula respectively measures physical meaning：
1)zspot_FLSFor the transformed height value of each hot spot；
2)z_sspot_IFMCorresponding work stage vertical measurement value sensor when for each facula measurement position under optical axis；
3)Z_BFFor the height value of optimum exposure focal plane；
4)zwafer_mapFor original real estate shape.
Using static visual field sliding average, x is calculated to the fitting face setting value along a series of y locations of exposure center.
Each fitting face setting value Z (y), Rx (y), Ry (y) utilize all point Linears in current Slit (static visual field)
Fitting obtains：
zi=axi+byi+c ……………………(11)
Wherein, xi,yi,ziRepresent real estate shape mapping measurement points all in Slit at each y location.
As shown in fig. 6, in Slit sliding processes, plane fitting is done with real estate shape mapping measurement points in Slit, is obtained
Fitting face setting value Z (y), Rx (y), Ry (y).
Fitting face height and inclination expression formula are：
It is as follows that physical meaning is respectively measured in above formula：
z_splate(y)、Rx_splate(y)、Ry_splate(y)：To compensate only for real estate shape, each y location corresponds to static state and regards
The field vertical setting value of work stage；
Y is that the position to scanning, y belong to [y along ystart,yend],ystartIt is to start exposure position, yendIt is to terminate exposure
Position.Calculate object lens lower part adjustment amount
Each physical quantity meaning of above formula is as follows：
1)zijFor all substrate mapping measured values under i-th of camera lens；
2)For the average value of the z of j point under i-th of camera lens.
Each physical quantity meaning of above formula is as follows：
1)dziFor the adjustment amount of single camera lens；
2)z_si(y) it is the height value that face is fitted in entire static visual field of i-th of optical center.
z_si(y)=a*xi+b*yi+c ……………………(15)
Each physical quantity meaning of above formula is as follows：
1) a, b, c are the plane system that six facula measurement values of substrate focusing and leveling system 6 are fitted at different y locations
Number；
2)xi, yiFor each optical center position.
Legendre fitting of a polynomials
Work stage adjustment amount fitting of a polynomial
Compensate mask plane shape, work stage adjustment amount z_sreticle(y)、Rx_sreticle(y)、Ry_sreticle(y)；
Compensate real estate shape, work stage adjustment amount z_splate(y)、Rx_splate(y)、Ry_splate(y)；
When to compensation mask plane shape, work stage adjustment amount does Legendre fitting of a polynomials, can obtain formula (16) Legendre
Multinomial：
When to compensation real estate shape, work stage adjustment amount does Legendre fitting of a polynomials, can obtain formula (17) Legendre
Multinomial：
Final work stage adjustment amount Legendre multinomials are shown in formula (18)：
Single object lens adjustment amount fitting of a polynomial
Single object lens adjustment amount dzi(y), corresponding Legendre multinomials are as follows：
Fig. 7 is the flow chart for the photolithography method that recoverable material provided by the present invention rises and falls.Wherein 701 to 714 be base
In real estate shape compensation model, real estate shape is split as to the detailed process of work stage adjustment amount and object lens lower part adjustment amount.
801 to 814 be to be based on mask plane shape compensation model, and mask plane shape is split as partial adjustment on work stage adjustment amount and object lens
Amount.Legendre fitting of a polynomials are used to each section adjustment amount, calculate Legendre multinomial coefficients (C0, C1, C2, C3,
C4), it is handed down to work stage and object lens top and the bottom movable lens, controls work stage and object lens top and the bottom during scan exposure
Movable lens movement locus.The calculation of specific each adjustment amount is as described above.
The preferred embodiment of the only present invention described in this specification, above example are only to illustrate the present invention
Technical solution rather than limitation of the present invention.All those skilled in the art pass through logic analysis, reasoning under this invention's idea
Or the limited available technical solution of experiment, it all should be within the scope of the present invention.
Claims (4)
1. the lithographic equipment that a kind of recoverable material rises and falls, which is characterized in that including：
Lighting system, for providing a lithographic beam；
Mask platform, for carrying mask；
The vertical sensor of mask platform, the vertical position for detecting and controlling the mask platform；
Mask focusing and leveling system, the face shape for measuring mask；
Work stage is moved for bearing substrate, compensates the low order amount of mask and real estate shape；
Substrate focusing and leveling system, the face shape for measuring substrate；
The vertical sensor of work stage, the vertical position for detecting and controlling the work stage；
Objective lens array, two row object lens being made of multiple single object lens, single object lens include upper movable eyeglass and lower moveable eyeglass,
The upper movable eyeglass and lower moveable eyeglass have the function of vertical adjustment, and upper movable eyeglass is for compensating mask partial face
Shape high-order amount, lower moveable eyeglass is for compensating substrate partial face shape high-order amount；
Between two row object lens, mask focusing and leveling system is located at base for mask focusing and leveling system and substrate focusing and leveling system
The surface of plate focusing and leveling system.
2. the lithographic equipment that recoverable material as described in claim 1 rises and falls, it is characterised in that upper movable eyeglass down can
Index glass piece and the movement locus of work stage are Legendre multinomials or other orthogonal polynomial tracks.
3. a kind of being applied to the measurement of lithographic equipment and the method for correcting material fluctuating described in claim 1, include the following steps：
Step 1: the vertical sensor control mask platform height of mask platform and inclination are constant, surveyed using mask focusing and leveling sensor
Measure mask plane shape；
Step 2: the vertical sensor control Workpiece stage vertical position of work stage is constant, measured using substrate focusing and leveling sensor
Real estate shape；
Step 3: being based on mask plane shape compensation model, mask plane shape is split as low order amount and high-order amount part, is compensated and covers
The work stage adjustment amount and upper movable eyeglass adjustment amount of die face shape；Step 4: real estate shape compensation model is based on, by real estate
Shape is split as low order amount and high-order amount part, is compensated work stage adjustment amount and the adjustment of lower moveable eyeglass of real estate shape
Amount；
Step 5: merging to compensating the work stage adjustment amount of mask plane shape and the work stage adjustment amount of compensation real estate shape, carry out
Fitting is to obtain work stage movement locus；According to upper movable eyeglass adjustment amount and lower moveable eyeglass adjustment amount, it is fitted
To obtain the movement locus of upper movable eyeglass and lower moveable eyeglass；
Step 6: adjustment upper movable eyeglass, lower moveable eyeglass and work stage hybrid compensation mask and real estate shape.
4. the method as claimed in claim 3 measured and correct material fluctuating, which is characterized in that described to be fitted to use
Legendre fitting of a polynomials or other way of fitting.
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| CN107966880B (en) * | 2017-03-15 | 2019-01-11 | 上海微电子装备（集团）股份有限公司 | A kind of vertical control method for litho machine |
| CN107966881B (en) | 2017-03-15 | 2018-11-23 | 上海微电子装备（集团）股份有限公司 | Lithographic equipment and method |
| CN109426094B (en) * | 2017-08-31 | 2020-05-01 | 上海微电子装备（集团）股份有限公司 | Exposure method, measurement method, and exposure apparatus |
| JP7198731B2 (en) * | 2019-07-19 | 2023-01-04 | レーザーテック株式会社 | Imaging device and focus adjustment method |
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| CN1952785A (en) * | 2005-05-16 | 2007-04-25 | 台湾积体电路制造股份有限公司 | Immersion lithography apparatus and method |
| CN101142534A (en) * | 2005-03-15 | 2008-03-12 | 富士胶片株式会社 | Exposure apparatus and exposure method |
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| KR101279666B1 (en) * | 2005-01-26 | 2013-06-27 | 칼 짜이스 에스엠테 게엠베하 | Optical assembly |
| JP4911558B2 (en) * | 2005-06-29 | 2012-04-04 | 株式会社小松製作所 | Narrow band laser equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101142534A (en) * | 2005-03-15 | 2008-03-12 | 富士胶片株式会社 | Exposure apparatus and exposure method |
| CN1952785A (en) * | 2005-05-16 | 2007-04-25 | 台湾积体电路制造股份有限公司 | Immersion lithography apparatus and method |
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Address after: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Applicant after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Applicant before: Shanghai Micro Electronics Equipment Co., Ltd. |
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