CN106149039B - electroplating device - Google Patents
electroplating device Download PDFInfo
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- CN106149039B CN106149039B CN201510161517.3A CN201510161517A CN106149039B CN 106149039 B CN106149039 B CN 106149039B CN 201510161517 A CN201510161517 A CN 201510161517A CN 106149039 B CN106149039 B CN 106149039B
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- power supply
- supply unit
- conductor
- anode
- plated
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Abstract
The present invention discloses a kind of electroplating device, including main power source supply, multiple movable hanging frame groups and first anode electric-conductor.Multiple movable hanging frame groups are driving multiple plated body continuous movings, each movable hanging frame group includes hanger and is electrically connected with the shunting power supply unit of main power source supply, hanger includes contact site and to clamp the clamping part of plated body, wherein shunt power supply unit and clamping part is connected with negative electrode, and contact site is connected with anode；First anode electric-conductor is electrically connected with multiple plated materials, and each movable hanging frame group keeps being electrically connected with and moving along first anode electric-conductor by contact site with first anode electric-conductor.Plurality of plated body is assigned to identical cathode current by each shunting power supply unit, and multiple plated materials share the anode of each shunting power supply unit by first anode electric-conductor.
Description
Technical field
The present invention relates to a kind of electroplating device, particularly a kind of plating that independent cathode current is provided each plated body
Equipment.
Background technology
Conductive path in the manufacturing process of printed circuit board (PCB), it is necessary between electroplating process formation substrate, then enter
Row sequent surface processing, so that printed circuit board (PCB) is molded.As shown in figure 1, the fixed plating of general printed circuit board (PCB) is set
Standby 80, it is the both sides that the plated material B for connecting the anode of power supply unit 81 is arranged on to electroplating bath 82 in design, and will connection
The plated body A of the negative electrode of power supply unit 81 is inserted between the both sides plated material B in electroplating bath 82, makes plated body A keep fixing
State；Afterwards by the electric current output state of control power supply unit 81 so that the metal ion from plated material B can deposit
On plated body A.
And the basic setup of the power supply unit 81 for this fixed electroplating device 80, it is to fix all plated body A
The conducting copper 83 of negative electrode has been connected in same branch, and all plated material B are fixed on same branch and are connected to same anode
Conducting copper 84, then by the control electric current power output of power supply unit 81 to perform electroplating process.
Another continuous-moving type electroplating device 90, as shown in Figures 2 and 3, set in design with foregoing fixed plating
Standby similar, difference is being that can connect plated body A relative to plated material B in electroplating bath 92 in continuous-moving type electroplating device 90
Continuous movement.Each clamping plated body A moving member 93 can slide by sliding part 931 along conducting copper 94, and moving member 93
It is electrically connected with the negative electrode of power supply unit 91 so that plated body A and all band negative electrode electricity of conducting copper 94.Multiple plated material B are then
Different zones are divided into, the different anodes of power supply unit 91 are electrically connected in each region.
And for this continuous-moving type electroplating device 90 power supply unit 91 setting, be by all plated body A by
Conducting copper 94, which connects identical negative electrode, simultaneously makes it in electroplating bath 92 along a direction continuous moving, and by all plated material B
It is fixed but connect different anodes, then by the control electric current power output of power supply unit 91 to perform electroplating process.
Regardless of whether foregoing any control mode, all plated bodies are all to share identical negative electrode, so work as plated body sheet
When body electric conductivity is variant, different plated bodies can mutually rob electricity and cause to be influenceed on plated body by electric unequal between plated body
The uniformity of coating film thickness.
The content of the invention
The main object of the present invention is to provide a kind of electroplating device for providing each material to be plated independent cathode current,
To solve the shortcomings that electroplating device of known common cathode electric current easily produces thickness of coating inequality to plated body.
To reach above-mentioned purpose, electroplating device is led including main power source supply, multiple movable hanging frame groups and the first anode
Electric part.To drive multiple plated body continuous movings, each movable hanging frame group includes hanger and with reference to hanger multiple movable hanging frame groups
Shunting power supply unit, hanger includes contact site and to clamp the clamping part of plated body, and it is electrical to shunt power supply unit
Connect main power source supply；Wherein shunt power supply unit and clamping part is connected with negative electrode, and contact site is connected with anode.First sun
Pole electric-conductor is electrically connected with multiple plated materials, wherein each movable hanging frame group keeps electricity by contact site and first anode electric-conductor
Property connect and moved along first anode electric-conductor.Plurality of plated body supplies by each shunting power supply of multiple movable hanging frame groups
Device is answered to be assigned to identical cathode current, and multiple plated materials share each shunting power supply unit by first anode electric-conductor
Anode.
Further include an at least second plate electric-conductor, an at least second plate electric-conductor to set multiple plated materials,
And each plated material is electrically connected with first anode electric-conductor by an at least second plate electric-conductor.
Shunting power supply unit includes controlled in wireless module, to receive wireless control signal to control power supply to export.
Electroplating device further includes conductive component, and main power source supply is electrically connected to each shunting power supply by conductive component and supplied
Device is answered, dc source is transmitted to each shunting power supply unit through conductive component.
Each shunting power supply unit further includes sliding part, and sliding part is formed with conductive component and is slidably connected.
Contact site is an at least slide assemblies.
The output voltage of main power source supply is more than the output voltage of each shunting power supply unit.
Thereby design, each plated body can individually be controlled by independent shunting power supply unit so that each plated body
With identical cathode current, the plating film uniformity of plated body is improved.
Brief description of the drawings
Fig. 1 is the sectional view of known fixed electroplating device.
Fig. 2 is the sectional view of known continous way electroplating device.
Fig. 3 is the top view of known continous way electroplating device.
Fig. 4 is composition schematic diagram of the main power source supply with multiple movable hanging frame groups of electroplating device.
Fig. 5 is the sectional view of electroplating device.
Fig. 6 is the top view of electroplating device.
Symbol description：
Electroplating device 1
Main power source supply 10
Movable hanging frame group 20
Hanger 21
Contact site 211
Clamping part 212
Shunt power supply unit 22
Controlled in wireless module 221
Negative electrode 222
Anode 223
Sliding part 224
First anode electric-conductor 30
Second plate electric-conductor 40
Electroplating bath 50
Conductive component 60
Plated body A
Plated material B
Direction initialization L
(known techniques)
Fixed electroplating device 80
Power supply unit 81
Electroplating bath 82
Conducting copper 83
Conducting copper 84
Continuous-moving type electroplating device 90
Power supply unit 91
Electroplating bath 92
Moving member 93
Sliding part 931
Conducting copper 94
Plated body A
Plated material B
Direction initialization L
Embodiment
For the above and other objects, features and advantages of the application can be become apparent, it is cited below particularly go out the present invention
Specific embodiment, and coordinate institute's accompanying drawings, it is described in detail below.
Fig. 4 is please refer to below.As shown in figure 4, electroplating device 1 includes main power source supply 10 and multiple movable hanging frame groups
20.Main power source supply 10 exports dc source to multiple movable hanging frames AC power is converted into dc source
Group 20 is for subsequent applications.Multiple sequentials of movable hanging frame group 20, and being capable of driven device (such as motor etc., not shown)
Drive with along a direction initialization L continuous moving.
Each movable hanging frame group 20 includes hanger 21 and shunting power supply unit 22, and shunts power supply unit 22 and be incorporated into extension
Frame 21.Main power source supply 10 is electrically connected with the shunting power supply unit 22 of each movable hanging frame group 20, with by each shunting power supply
Supply 22 obtains less output current.In one embodiment of this invention, main power source supply 10 can will be high-tension
AC power is converted into the dc source of low voltage, then through output distribution to each shunting power supply unit 22, so that each shunting
Power supply unit 22 obtains less output dc source, but the design of foregoing dc source is not limited with the present embodiment.
It is noted that the quantity of movable hanging frame group 20 increases and decreases depending on plating demand and instrument size；And work as movable hanging frame
When the quantity of group 20 is more, also can optionally increase the quantity of main power source supply 10 in the setting of electroplating device 1, with response to
Out-put supply is distributed to the shunting power supply unit 22 of multiple movable hanging frame groups 20.
In the present embodiment, shunting power supply unit 22 includes controlled in wireless module 221.Controlled in wireless module 221 to
Receive from the external world wireless control signal, and according to the wireless control signal with control power supply itself export.Wireless controlled herein
Molding group 221 can use bluetooth module, infrared ray module, Wi-Fi modules, 3G/4G network communications module or other tool wireless communications
The controlled in wireless module of number transfer function.Therefore, user, just can be in distal end by remote control, mobile phone, computer equal controller
The power supply output of the shunting power supply unit 22 of each movable hanging frame group 20 is controlled, reaches the effect controlled immediately, and increase operation
Convenience.
Below please also refer to Fig. 5 and Fig. 6.As shown in Figures 5 and 6, electroplating device 1 further includes first anode electric-conductor
30, and first anode electric-conductor 30 is electrically connected with multiple plated material B.The hanger 21 of each movable hanging frame group 20 includes contact site
211 and clamping part 212.Contact site 211 enables hanger 21 along the to keep being electrically connected with first anode electric-conductor 30
One anode conducting part 30 moves.In the present embodiment, first anode electric-conductor 30 is to use an anode copper bar, contact site 211
It is to use an at least slide assemblies, such as roller group etc., is slideably combined with anode copper bar by slide assemblies so that hanger
21 not only can relatively stablize by contact site 211 and smoothly be moved along first anode electric-conductor 30, and and can ensures contact site 211
Design with the electric connection of first anode electric-conductor 30, but contact site 211 is not limited.
Clamping part 212 is clamping plated body A so that when movable hanging frame group 20 moves, plated body A can be driven to move in the lump
It is dynamic.In the present embodiment, clamping part 212 is to use an at least clamping piece, such as metal clip etc., is pressed from both sides by manually or electrically mode
Hold or release plated body A.
The shunting power supply unit 22 of each movable hanging frame group 20 includes negative electrode 222 and anode 223.Wherein shunt power supply supply
The negative electrode 222 of device 22 is electrically connected with clamping part 212, and the anode 223 for shunting power supply unit 22 connects contact site 211.Thereby,
Shunt the plated body A clamped by the energy output cathode electric current to clamping part 212 of negative electrode 222 of power supply unit 22 so that plated body A
Band negative electrode electric charge；And the anode 223 for shunting power supply unit 22 is then electrically connected to first anode electric-conductor by contact site 211
30 so that plated material B band anode electric charges.
In one embodiment of this invention, electroplating device 1 further includes an at least second plate electric-conductor 40, to as
Electric connection medium between one anode conducting part 30 and multiple plated material B.A that is, at least second plate electric-conductor
40 can be to set multiple plated material B, and each plated material B can be also electrically connected with by an at least second plate electric-conductor 40
First anode electric-conductor 30.An at least second plate electric-conductor 40 is to use two anode copper bars herein, is separately positioned on plating
The both sides of groove 50, and every anode copper bar is for setting multiple plated material B.It is noted that an at least second plate is conductive
The setting quantity and pattern of part 40 are not limited.
Thereby, respectively the negative electrode 222 of shunting power supply unit 22 can press from both sides corresponding to independent output cathode electric current to clamping part 212
The plated body A held, that is to say, that each plated body A can correspond to an independent shunting power supply unit 22；And respectively shunt
The anode 223 of power supply unit 22 is then electrically connected to first anode electric-conductor 30 by contact site 211, forms each anode 223
Effect in parallel, so that anode 223 forms common anode loop.
As shown in Figures 5 and 6, in the present embodiment, electroplating device 1 further includes conductive component 60.This conductive component 60 is
As the conductive media between main power source supply 10 and the shunting power supply unit 22 of each movable hanging frame group 20, in order to each shifting
Dynamic hanger group 20 remains to keep being electrically connected with main power source supply 10 when moving relative to main power source supply 10.Main power source supplies
Device 10 is answered to be electrically connected to each shunting power supply unit 22 by conductive component 60, to exported main power source supply 10
Dc source is transmitted to each shunting power supply unit 22 through conductive component 60.
In design, conductive component 60 includes two conducting coppers, connects the anode DC ends of main power source supply 10 respectively
Son and negative electrode RTN terminals；And respectively shunt power supply unit 22 and further include sliding part 224, sliding part 224 can with the collar, snap fit or
Other conductive slide constructions etc. form with two conducting coppers be slidably connected respectively so that each movable hanging frame group 20 exists
Still it can be kept being electrically connected with main power source supply 10 in moving process, but the present invention is not limited.
When actually performing electroplating process, electroplating device 1 can drive multiple movable hanging frame groups 20 conductive along the first anode
Part 30 is towards direction initialization L continuous movings；Now each multiple plated body A clamped by each movable hanging frame group 20 can be driven, and in
Continuous moving between multiple plated material B of the both sides of electroplating bath 50.Certainly, respectively shunting power supply unit 22 also can be by each mobile extension
Frame group 20 drive and with continuous moving.Exported by the power supply of each shunting power supply unit 22, each plated material B can turn into sun
Pole, and each plated body A can turn into negative electrode.
Because each movable hanging frame group 20 has independent shunting power supply unit 22 so that each plated body A can be by right
Power supply unit 22 should be shunted individually to control, identical and stable cathode current can be assigned to, will not because of plated body A it
Between may conductive difference and cause by electric unequal；And multiple plated material B are then common by first anode electric-conductor 30
With the anode of each shunting power supply unit 22, same anode loop is formed.
Thereby, because the cathode current assigned by each plated body A is identical, when performing and electroplating it can be kept to plate tunic
Thick uniformity, the shortcomings that being greatly improved known electroplating device.User can also electroplate by remote control immediately monitoring and set
Standby state, to ensure the yield of electroplating process and effect.
To sum up institute is old, and no matter the present invention shows its totally different feature in known techniques with regard to purpose, means and effect.Only
It should be noted that above-mentioned many embodiments are illustrated only for the purposes of explanation, the interest field that the present invention is advocated certainly should
To be defined described in claims, rather than it is only limitted to above-described embodiment.
Claims (7)
- A kind of 1. electroplating device, multiple plated bodies are plated into plated material, it is characterised in that the electroplating device includes：One main power source supply；Multiple movable hanging frame groups, to drive the plurality of plated body continuous moving, respectively the movable hanging frame group includes a hanger and knot A shunting power supply unit of the hanger is closed, the hanger includes a contact site and to clamp a clamping part of the plated body, and The shunting power supply unit is electrically connected with the main power source supply；Wherein the shunting power supply unit connects the clamping with a negative electrode Portion, and the shunting power supply unit connects the contact site with an anode；AndOne first anode electric-conductor, is electrically connected with multiple plated materials；Wherein respectively the movable hanging frame group by the contact site and is somebody's turn to do First anode electric-conductor keeps being electrically connected with and moving along the first anode electric-conductor；Wherein the plurality of plated body is assigned to identical negative electrode by respectively shunting power supply unit of the plurality of movable hanging frame group Electric current, and the plurality of plated material shares the anode of the respectively shunting power supply unit by the first anode electric-conductor.
- 2. electroplating device as claimed in claim 1, it is characterised in that further include an at least second plate electric-conductor, this is at least One second plate electric-conductor is to set the plurality of plated material, and respectively the plated material is conductive by an at least second plate Part is electrically connected with the first anode electric-conductor.
- 3. electroplating device as claimed in claim 1, it is characterised in that wherein the shunting power supply unit includes a controlled in wireless Module, to receive a wireless control signal to control power supply to export.
- 4. electroplating device as claimed in claim 1, it is characterised in that further include a conductive component, the main power source supply by The respectively shunting power supply unit is electrically connected to by the conductive component, to by dc source through the conductive component transmit to respectively should Shunt power supply unit.
- 5. electroplating device as claimed in claim 4, it is characterised in that wherein respectively the shunting power supply unit further includes slip Portion, the sliding part are formed with the conductive component and are slidably connected.
- 6. electroplating device as claimed in claim 1, it is characterised in that wherein the contact site is an at least slide assemblies.
- 7. electroplating device as claimed in claim 1, it is characterised in that wherein the output voltage of the main power source supply is more than each The output voltage of the shunting power supply unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510161517.3A CN106149039B (en) | 2015-04-08 | 2015-04-08 | electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510161517.3A CN106149039B (en) | 2015-04-08 | 2015-04-08 | electroplating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106149039A CN106149039A (en) | 2016-11-23 |
| CN106149039B true CN106149039B (en) | 2017-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510161517.3A Active CN106149039B (en) | 2015-04-08 | 2015-04-08 | electroplating device |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107119308A (en) * | 2017-06-16 | 2017-09-01 | 俊杰机械(深圳)有限公司 | A kind of electroplating device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5494561A (en) * | 1993-01-22 | 1996-02-27 | Societe Anonyme Dite Regie Nationale Des Usines Renault | Apparatus for surface treatment by cataphoresis of metal parts, particularly of motor vehicle bodies |
| JP2006037134A (en) * | 2004-07-23 | 2006-02-09 | Chuo Seisakusho Ltd | Current control method for continuous plating device of carrier system |
| CN101423969A (en) * | 2007-11-01 | 2009-05-06 | Almexpe株式会社 | Continuous plating apparatus |
| KR20100115955A (en) * | 2009-04-21 | 2010-10-29 | 주식회사 티케이씨 | Serial plating system machine rectifeer an electrode plate system |
| CN103031588A (en) * | 2011-09-29 | 2013-04-10 | Almexpe株式会社 | Serial plating system |
| CN204714932U (en) * | 2015-04-08 | 2015-10-21 | 亚硕企业股份有限公司 | electroplating device |
-
2015
- 2015-04-08 CN CN201510161517.3A patent/CN106149039B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5494561A (en) * | 1993-01-22 | 1996-02-27 | Societe Anonyme Dite Regie Nationale Des Usines Renault | Apparatus for surface treatment by cataphoresis of metal parts, particularly of motor vehicle bodies |
| JP2006037134A (en) * | 2004-07-23 | 2006-02-09 | Chuo Seisakusho Ltd | Current control method for continuous plating device of carrier system |
| CN101423969A (en) * | 2007-11-01 | 2009-05-06 | Almexpe株式会社 | Continuous plating apparatus |
| KR20100115955A (en) * | 2009-04-21 | 2010-10-29 | 주식회사 티케이씨 | Serial plating system machine rectifeer an electrode plate system |
| CN103031588A (en) * | 2011-09-29 | 2013-04-10 | Almexpe株式会社 | Serial plating system |
| CN204714932U (en) * | 2015-04-08 | 2015-10-21 | 亚硕企业股份有限公司 | electroplating device |
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| Publication number | Publication date |
|---|---|
| CN106149039A (en) | 2016-11-23 |
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