CN106146848B - A kind of siliceous epoxy acid imide matrix resin of 14BDAPB types and preparation method thereof - Google Patents
A kind of siliceous epoxy acid imide matrix resin of 14BDAPB types and preparation method thereof Download PDFInfo
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- CN106146848B CN106146848B CN201610614094.0A CN201610614094A CN106146848B CN 106146848 B CN106146848 B CN 106146848B CN 201610614094 A CN201610614094 A CN 201610614094A CN 106146848 B CN106146848 B CN 106146848B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/125—Unsaturated polyimide precursors the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain
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Abstract
The present invention relates to siliceous epoxy acid imide matrix resins of a kind of 14BDAPB types and preparation method thereof, the matrix resin is by 1,4 bis- (2,4 diamino phenoxy) benzene 14BDAPB, epoxy resin, 3 aminopropyltrialkoxysilanes, imide oligomer object and curing agent composition.Preparation method includes the following steps:(1) imide oligomer object is prepared;(2) bis- (2, the 4 diamino phenoxy) benzene of Isosorbide-5-Nitrae, epoxy resin are put into reaction kettle, after being stirred reaction, imide oligomer object is added and continues to be stirred to react, 3 aminopropyltrialkoxysilanes are then added and are stirred to react, curing agent is added to be uniformly mixed, you can.The bonding between the base materials such as the metals such as steel, copper, aluminium and ceramics, glass, polymer matrix composites and the preparation of glass fibre, aramid fiber, carbon fibre reinforced composite are the composite can be widely applied to, there is good industrialization prospect.
Description
Technical field
The invention belongs to macromolecule matrix resin and its preparation field, more particularly to a kind of siliceous epoxy acyl of 14BDAPB types
Imine matrix resin and preparation method thereof.
Background technology
It is well known that epoxy resin has many excellent performances:(1) good adhesive property:Adhesive strength is high, bonding
Wide, (such as glass, ceramics, resin base are multiple for it and many metals (such as iron, steel, copper, aluminium, metal alloy) or nonmetallic materials
Condensation material, timber, plastics etc.) adhesive strength it is very high, some, which is even more than, is glued the intensity of material itself, therefore can be used for
It is one of main component of structural adhesive in many stress members;(2) good processing performance:Formulaion of epoxy resin
Flexibility, processing technology and product properties diversity be the most outstanding in high molecular material;(3) good stability
Energy:The solidification of epoxy resin does not generate low-molecular material mainly by the ring opening polyaddition of epoxy group in solidification process,
Its cure shrinkage is one of kind minimum in thermosetting resin, generally 1%-2%, if selecting filler appropriate that can make
Shrinking percentage is down to 0.2% or so;Epoxy main chains after solidification are ehter bond, phenyl ring, three-dimensional crosslinking structure, therefore with excellent
Resistance to acid and alkali.
Therefore, epoxy resin is widely used in the every field of national economy:Either high-technology field is still
Its trace can be seen in field of general technology, either defence and military or civilian industry or even daily life.
Currently, there is also some problems for epoxy-resin systems, if heat resistance is relatively low, much not as good as heteroaromatic Type of Collective object
It is (such as polyimides, polybenzimidazoles, polybenzoxazole, polyphenyl based quinoxaline, polybenzothiozole).
Polyimides is developed in the sixties, and most common one is by pyromellitic acid anhydride and aromatic diamine system
.Contain multiple aromatic heterocycle structural unit in polyimide molecule, therefore polyimide resin is that have extremely superior heat resistance
A kind of high molecular material of property.Conventional polyimide structures, heat decomposition temperature also have generally at 500 DEG C or more
There is obdurability.Therefore, it is also frequently utilized for thermosetting resin, such as the heat-resisting toughening of epoxy resin, bimaleimide resin changes
Property agent.
Chinese invention patent CN103146330A discloses a kind of 2,2- bis- [4- (2,4- diamino phenoxies) phenyl] six
Fluoro-propane type high temperature resistant epoxy adhesive and preparation method thereof is 1 by mass ratio:The component A and B component of 1-2 forms, wherein A
Component is copolymer made of being reacted with epoxy resin by bis- [4- (2,4- diamino phenoxies) phenyl] hexafluoropropane of 2,2-;B
Component is by bis- [4- (2,4- diamino phenoxies) phenyl] hexafluoropropane of 2,2- and aromatic dicarboxylic anhydride in highly polar non-matter
Solid content made of being reacted in sub- organic solvent and toluene is the homogeneous phase transparent solution of 15%-30%.Preparation method includes:Room temperature
Under, by A, B component in mass ratio 1:1-2 is uniformly mixed.
It is resistance to that Chinese invention patent CN103131369A discloses a kind of bis- (2,4- diamino phenoxies) diphenyl sulphone (DPS) types of 4,4'-
High-temp epoxy adhesive and preparation method thereof is 1 by mass ratio:The component A and B component of 1-2 form, wherein component A be by 4,
Copolymer made of 4 '-bis- (2,4- diamino phenoxies) diphenyl sulphone (DPS)s are reacted with epoxy resin;B component is by 4,4 '-bis- (2,4-
Diamino phenoxy) diphenyl sulphone (DPS) is solid made of being reacted in highly polar aprotic organic solvent and toluene with aromatic dicarboxylic anhydride
Content is the homogeneous phase transparent solution of 15%-30%.Preparation method includes:At room temperature, by A, B component in mass ratio 1:1-2 is stirred
It is uniformly mixed.
Chinese invention patent CN103146331A discloses a kind of resistance to height of bis- (2,4- diamino phenoxies) biphenyl types of 4,4'-
Temperature epoxy adhesive and preparation method thereof is 1 by mass ratio:The component A and B component of 1-2 forms, and wherein component A is by 4,4 '-
Copolymer made of bis- (2,4- diamino phenoxies) biphenyl are reacted with epoxy resin;B component is by 4,4 '-bis- (2,4- diaminos
Phenoxyl) solid content made of biphenyl is reacted with aromatic dicarboxylic anhydride in highly polar aprotic organic solvent and toluene is
The homogeneous phase transparent solution of 15%-30%.Preparation method includes:At room temperature, by A, B component in mass ratio 1:1-2 is stirred
It is even.
Yan Rui, Yu Xinhai et al.【The preparation of novel epoxy adhesive and performance study, insulating materials, 2012,45 (2):
12-14,18】A kind of neo-epoxy resin adhesive and preparation method thereof is disclosed, and systematic research has been carried out to its performance.
Seas Yu Xin et al.【The preparation of organosilicon epoxy system adhesive and performance study, insulating materials, 2012,45 (2):
1-3,11】A kind of adhesive composition of organic siliconresin modified epoxy is disclosed, and its performance is studied, simultaneously
The superior adhesive of comprehensive performance is obtained.
Chinese invention patent CN102220102A has been applied in seas Yu Xin et al., discloses a kind of high-temperature-resistant adhesive and its system
Preparation Method.
Chinese invention patent CN102260480A discloses a kind of high-temperature-resistant modified epoxy resin adhesive and its preparation side
Method.
Chinese invention patent CN102181251A discloses a kind of epoxyn that unsaturated polyimides are modified
And preparation method thereof.
Chinese invention patent CN102031082A discloses a kind of benzimidazole diamine curing type epoxy adhesive and its system
Preparation Method.
Chinese invention patent CN101649174A discloses a kind of high temperature resistant one-component solvent-free epoxy adhesive and its system
Preparation Method.
Chinese invention patent CN101544879A discloses a kind of preparation method of high strength solventless epoxy adhesive.
Wu Min et al.【The development of novel high-strength one-component epoxy resin adhesive, bonding, 2009,30 (9):54-57】
A kind of epoxy binder in monocomponent in is disclosed, excellent combination property especially has very high tensile shear strength.
Chen Hongjiang et al.【The cure kinetics research of neo-epoxy resin adhesive system, bonding, 2009,30 (8):43-
45】A kind of epoxyn system is disclosed, and its cure kinetics is studied.
Perhaps plum virtue et al.【The cure kinetics research of polyimide-epoxy resin adhesive, chemistry and bonding, 2011,33
(2):17-20】A kind of polyimide-epoxy resin adhesive is disclosed, and cure kinetics research has been carried out to it.
Chinese invention patent CN101148656A discloses a kind of preparation method of heat-resistant solvent-free epoxy adhesive,
It is characterized mainly in that:TGDDM epoxy resin, toughener, hydrogenated bisphenol A, curing agent, accelerating agent are uniformly mixed, and resistance to height has been made
Warm non-solvent epoxy adhesive.But its high temperature resistance still has larger limitation, fails to meet under many hot environments
Practical application.
Chinese invention patent CN101397486A discloses a kind of preparation side of bi-component solvent-free epoxy resin adhesive
Method is primarily characterized in that:It includes component A and B component, and wherein component A contains novolac epoxy resin, alicyclic type epoxy resin
And nbr carboxyl terminal;B component is bis- (2,4- diamino phenoxies) the benzene aromatic polyvalent amine hardeners of 1,3-.Alicyclic ring type ring
The additive amount of oxygen resin and nbr carboxyl terminal is respectively the 20-35% and 12% (mass percent) of novolac epoxy resin.
The additive amount of bis- (2,4- diamino phenoxies) the benzene aromatic polyvalent amine hardeners of 1,3- is the 15-20% of novolac epoxy resin
(mass percent), gained adhesive system good manufacturability.But its heat resistance is ideal not enough.
Chinese invention patent CN1927908A discloses a kind of preparation method of phenolic hydroxyl group containing polyimide powder, due to
The presence of phenolic hydroxyl group, polyimide powder can form covalent bond with epoxy reaction, sub- so as to improve thermoplasticity polyamides
The compatibility of polyimide resin and epoxy resin, and so that epoxy-resin systems is reached good toughening effect.Yu Xinhai etc.
People【Development [J] of high-temperature resistant single-component epoxy adhesive is bonded, 2008,29 (12):16-19】Disclose a kind of high temperature resistant list
The preparation method of component epoxy adhesive, is primarily characterized in that:With maleic anhydride (MA) for end-capping reagent, with bis- (the 3- ammonia of 2,2-
Base -4- hydroxy phenyls) hexafluoropropane (BAHPFP), bis- [4- (4- amino-benzene oxygens) phenyl] propane (BAPOPP) of 2,2-, 2,2-
Bis- [4- (3,4- di carboxyl phenyloxies) phenyl] propane dianhydrides (BPADA) are that main Material synthesis has obtained phenolic hydroxy group polyetherimide
Polyimide resin (HPEI);With synthesized obtained HPEI for resistant, toughened dose, with N, N, N', N'- four glycidyl groups -4,4'-
Diaminodiphenylmethane (TGDDM), hydrogenated bisphenol A epoxy resin (HBPAE), latent curing agent etc., preparation have obtained synthesis
The high-temperature resistant single-component epoxy adhesive haveing excellent performance.
Invention content
Technical problem to be solved by the invention is to provide a kind of siliceous epoxy acid imide matrix resin of 14BDAPB types and its
Preparation method, preparation process of the present invention is simple, environmental-friendly, excellent combination property, can be widely applied to the metals such as steel, copper, aluminium
And the bonding between the base materials such as ceramics, glass, polymer matrix composites and glass fibre, aramid fiber, fibre reinforced
The preparation of composite material has good industrialization prospect.
A kind of siliceous epoxy acid imide matrix resin of 14BDAPB types of the present invention is 1-5 by mass ratio:100:2-8:1-
5:Bis- (2,4- diamino phenoxies) the benzene 14BDAPB of 1,4-, epoxy resin, 3- aminopropyltrialkoxysilanes, the acyl of 30-50 is sub-
Amine oligomer and curing agent composition;Wherein, it is 2 that imide oligomer object, which is by molar ratio,:1:2 bis- (the 3- amino-4-hydroxies of 2,2-
Phenyl) hexafluoropropane, bis- [4- (3,4- di carboxyl phenyloxies) phenyl] propane dianhydrides of 2,2- and maleic anhydride reaction and obtain.
The 3- aminopropyltrialkoxysilanes are selected from 3- aminopropyl trimethoxysilanes, 3- aminopropyl triethoxysilanes
One or both of mixture.
The epoxy resin is selected from E-51 epoxy resin, E-44 epoxy resin, ES216 epoxy resin, ECC202 asphalt mixtures modified by epoxy resin
Fat, CE793 epoxy resin, glycidyl amine type epoxy resin, diglycidyl ether type epoxy resin, alicyclic type epoxy resin, phenol
One or more of aldehyde type epoxy resin, glycidyl ester type epoxy resin.
The glycidyl amine type epoxy resin is selected from N, N, N ', N '-four glycidyl groups -4,4 '-diamino hexichol first
Alkane epoxy resin, N, N, N ', N '-four glycidyl groups -3,3 '-dimethyl -4,4 '-diaminodiphenylmethane epoxy resin, N,
N, N ', N '-four glycidyl groups -3,3 '-diethyl -4,4 '-diaminodiphenylmethane epoxy resin, N, N, N ', N '-four shrinks
The chloro- 4,4 '-diaminodiphenylmethane epoxy resin of glyceryl -3,3 '-two, N, N, N ', N '-four glycidyl groups -4,4 '-diamino
Yl diphenyl ether epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-diaminodiphenylsulfone epoxy resin, N, N, N ', N ' -
Four glycidyl group -3,4 '-diaminodiphenyl ether epoxy resin, N, N, N ', N '-four glycidyl groups -3,3 '-diamino hexichol
Sulfone epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-benzidine epoxy resin, N, N, N ', N '-four shrinks sweet
Oil base p-phenylenediamine epoxy resin, N, N, N ', N '-four glycidyl group m-phenylene diamine (MPD)s epoxy resin, N, N, N ', N '-four shrinks
Bis- (4- amino-benzene oxygens) the benzene epoxy resin of glyceryl -1,4-, N, N, N ', bis- (the 3- aminobenzenes of N '-four glycidyl groups -1,4-
Oxygroup) benzene epoxy resin, N, N, N ', bis- (4- amino-benzene oxygens) the benzene epoxy resin of N '-four glycidyl groups -1,3-, N, N, N ',
Bis- (3- amino-benzene oxygens) the benzene epoxy resin of N '-four glycidyl groups -1,3-, N, N, N ', N '-four glycidyl groups -1,4- is double
(2- trifluoromethyl-4-aminophenoxyls) benzene epoxy resin, N, N, N ', bis- (the 2- trifluoromethyls-of N '-four glycidyl groups -1,3-
4- amino-benzene oxygens) benzene epoxy resin, N, N, N ', N ', O- five glycidyls -4,4 '-diamino -4 "-hydroxyl triphenylmenthane
Epoxy resin, N, N, N ', bis- [4- (4- amino-benzene oxygens) phenyl] the propane epoxy resin of N '-four glycidyl groups -2,2-, N, N,
Bis- [4- (4- amino-benzene oxygens) phenyl] the hexafluoropropane epoxy resin of N ', N '-four glycidyl group -2,2-, N, N, N ', N '-four
Bis- [4- (3- amino-benzene oxygens) phenyl] the propane epoxy resin of glycidyl -2,2-, N, N, N ', four glycidyl group -2 N ' -,
Bis- [4- (2- trifluoromethyl-4-aminophenoxyls) phenyl] the propane epoxy resin of 2-, N, N, N ', N '-four glycidyl groups -2,2-
Bis- [4- (3- amino-benzene oxygens) phenyl] hexafluoropropane epoxy resin, N, N, N ', the bis- [4- (2- of N '-four glycidyl groups -2,2-
Trifluoromethyl-4-aminophenoxyl) phenyl] hexafluoropropane epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4-
Amino-benzene oxygen) diphenyl ether epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- trifluoromethyl -4- aminobenzenes
Oxygroup) diphenyl ether epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4- amino-benzene oxygens) diphenyl sulphone (DPS) asphalt mixtures modified by epoxy resin
Fat, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyls) diphenyl sulphone (DPS) epoxy resin, N, N,
Bis- (4- amino-benzene oxygens) the diphenyl sulfide epoxy resin of N ', N '-four glycidyl group -4,4 ' -, N, N, N ',-four glycidols of N '
Bis- (2- trifluoromethyl-4-aminophenoxyls) the diphenyl sulfide epoxy resin of base -4,4 ' -, N, N, N ', four glycidyl group -4 N ' -,
4 '-bis- (4- amino-benzene oxygens) diphenyl-methane epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- fluoroforms
Base -4- amino-benzene oxygens) diphenyl-methane epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4- amino-benzene oxygens)
Benzophenone epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyls) hexichol
Ketone epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4- amino-benzene oxygens) biphenyl epoxy resin, N, N, N ',
N '-four glycidyl groups -4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyls) biphenyl epoxy resin, N, N, N ', N ', O, O ' -
Bis- (3- amino-4-hydroxylphenyls) the hexafluoropropane epoxy resin of six glycidyl -2,2-, N, N, O-triglycidyl group is to ammonia
Base phenol epoxy resin, N, one or more of N, O-triglycidyl meta-aminophenol epoxy resin.
The diglycidyl ether type epoxy resin is selected from 1,3- diglycidyls resorcinol, 1,4- diglycidyls
Bis- (4- glycidyl phenyls) hexafluoropropane of hydroquinone, 4,4 '-diglycidyl bisphenol Ss, 2,2-, 2,2- are bis-, and (4- contracts
Water glycerine butylcyclohexyl) propane, Bisphenol F diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, bisphenol-A 2-glycidyl
One or more of ether, fatty alcohol polyglycidyl ether.
The alicyclic type epoxy resin is selected from sour -3 ', the 4 '-epoxycyclohexyethylSiOi methyl esters of 3,4- epoxycyclohexyethylSiOis, 3,4- epoxies
One or more of sour -3 ', 4 '-epoxy groups-the 6 '-methyl cyclohexane methyl esters of base -6- methyl cyclohexanes, Dipentenedioxide.
The phenol aldehyde type epoxy resin is selected from phenol-formaldehyde phenolic resin type epoxy resin, o-cresol-formaldehyde novolac tree
Epoxy-type epoxy resin, resorcinol-formaldehyde phenolic resin type epoxy resin, m-cresol-formaldehyde phenolic resin type epoxy resin,
Catechol-formaldehyde phenolic resin type epoxy resin, bisphenol A-formaldehyde phenolic resin type epoxy resin, bisphenol S-formaldehyde novolac tree
Epoxy-type epoxy resin, bisphenol AF-formaldehyde phenolic resin type epoxy resin, '-biphenyl diphenol-formaldehyde phenolic resin type epoxy resin, neighbour
One or more of phenylphenol-formaldehyde phenolic resin type epoxy resin, naphthols-formaldehyde phenolic resin type epoxy resin.
The glycidyl ester type epoxy resin is selected from terephthalic acid diglycidyl ester epoxy resin, M-phthalic acid
2-glycidyl ester epoxy resin, o-phthalic acid diglycidyl ester epoxy resin, interior methine tetrahydrophthalic acid two
Ethylene oxidic ester epoxy resin, 4,5- 7-oxa-bicyclo[4.1.0-1,2- dicarboxylic acid diglycidyl esters epoxy resin, two octanoic acid two of adjacent benzene
One or more of polyglycidyl epoxy resin.
The curing agent is selected from hexahydrophthalic anhydride, K-12 curing agent, tetrahydrophthalic anhydride, methyl tetrahydro phthalic anhydride, dodecenyl succinate
Acid anhydrides, methyl hexahydrophthalic anhydride, tung oil acid anhydride, with 80 acid anhydrides made of dicyclopentadiene and maleic acid anhydride reactant, with terpene two
Acid anhydrides made of alkene and maleic acid anhydride reactant, with liquid acid anhydrides, N, N- made of turpentine oil and maleic acid anhydride reactant
Dimethylaniline, N, N- dimethyl open-chain crown ether, N, N- dimethyl benzylamines, 2-ethyl-4-methylimidazole, imidazoles, 2,4,6-
One or more of three (dimethylamino methyl) phenol, 1,8- diazas-bicyclic [5.4.0] hendecene -7.
A kind of preparation method of the siliceous epoxy acid imide matrix resin of 14BDAPB types of the present invention, includes the following steps:
(1) by bis- (3- amino-4-hydroxylphenyls) hexafluoropropane of 2,2-, o-cresol, bis- [4- (the 3,4- dicarboxyl benzene of 2,2-
Oxygroup) phenyl] propane dianhydride and maleic anhydride be put into reaction kettle, be passed through nitrogen, stir, be heated to 80 DEG C, be added dropwise different
Quinoline is heated to 100 DEG C -110 DEG C, after being stirred to react 5-12 hours, is cooled to 60 DEG C, reactant is poured into and fills precipitating agent
In precipitating kettle, solids is precipitated in high-speed stirred, and filtering, 80 DEG C are dried in vacuo 10 hours, obtain imide oligomer object;
(2) bis- (2, the 4- diamino phenoxy) benzene (14BDAPB) of Isosorbide-5-Nitrae-, epoxy resin are put into reaction kettle, in 80 DEG C-
After 100 DEG C are stirred reaction 0.5-1 hours, imide oligomer object is added and continues to be stirred to react 1-2 hours, 3- ammonia is then added
Propyl trialkoxy silane is stirred to react 5-15 minutes, is cooled to room temperature, is added curing agent, is uniformly mixed.
The mass ratio of isoquinolin and bis- (3- amino-4-hydroxylphenyls) hexafluoropropane of 2,2- described in step (1) is 1-
4:20。
Precipitating agent described in step (1) is selected from methanol, ethyl alcohol, propyl alcohol, isopropanol, ethylene glycol, glycol monoethyl ether, second
One or more of glycol dimethyl ether, ethylene glycol monoethyl ether, ethylene glycol diethyl ether, acetone, butanone;Wherein, precipitating agent and 2,
The mass ratio of bis- (3- amino-4-hydroxylphenyls) hexafluoropropane of 2- is 20-40:1.
The mass ratio of o-cresol and bis- (3- amino-4-hydroxylphenyls) hexafluoropropane of 2,2- described in step (1) is 10-
20:1。
Advantageous effect
(1) viscosity controllability of the present invention is good, can be adjusted in broader range, preparation process is simple, environmental-friendly, comprehensive
Conjunction is had excellent performance, and can be widely applied between the base materials such as the metals such as steel, copper, aluminium and ceramics, glass, polymer matrix composites
Bonding and the preparation of glass fibre, aramid fiber, carbon fibre reinforced composite, have good industrialization prospect;
(2) present invention can complete preparation process in common apparatus, be advantageously implemented industrialized production.
Specific implementation mode
Present invention will be further explained below with reference to specific examples.It should be understood that these embodiments are merely to illustrate the present invention
Rather than it limits the scope of the invention.In addition, it should also be understood that, after reading the content taught by the present invention, people in the art
Member can make various changes or modifications the present invention, and such equivalent forms equally fall within the application the appended claims and limited
Range.
Embodiment 1
By bis- (3- amino-4-hydroxylphenyls) hexafluoropropane (BAHPFP, 366g/mol) of 73.2 grams of (0.2 mole) 2,2-,
Bis- [4- (3, the 4- di carboxyl phenyloxy) phenyl] propane dianhydrides of 735.0 grams of o-cresols, 52.0 grams of (0.1 mole) 2,2- (BPADA,
It 520g/mol) is put into reaction kettle with 19.6 grams of (0.2 mole) maleic anhydrides (MA, 98g/mol), is passed through nitrogen, stirred, heating
80 DEG C are warming up to, 3.8 grams of isoquinolin are added dropwise, is heated to 100 DEG C, after being stirred to react 5 hours, is cooled to 60 DEG C, reactant is fallen
In the precipitating kettle for entering to fill 1500 grams of methanol, solids is precipitated in high-speed stirred, and filtering, 80 DEG C are dried in vacuo 10 hours, obtain
308.3 grams of imide oligomer object (theoretical yields:314.0 grams), yield 98.2% is denoted as BBMO-1.
Embodiment 2
By bis- (3- amino-4-hydroxylphenyls) hexafluoropropane (BAHPFP, 366g/mol) of 73.2 grams of (0.2 mole) 2,2-,
Bis- [4- (3, the 4- di carboxyl phenyloxy) phenyl] propane dianhydrides of 1460 grams of o-cresols, 52.0 grams of (0.1 mole) 2,2- (BPADA,
It 520g/mol) is put into reaction kettle with 19.6 grams of (0.2 mole) maleic anhydrides (MA, 98g/mol), is passed through nitrogen, stirred, heating
80 DEG C are warming up to, 14.0 grams of isoquinolin are added dropwise, is heated to 110 DEG C, after being stirred to react 12 hours, 60 DEG C is cooled to, by reactant
It pours into the precipitating kettle for filling 2000 grams of ethyl alcohol and 920 grams of glycol monoethyl ethers, high-speed stirred, solids is precipitated, filter, 80 DEG C
Vacuum drying 10 hours, obtains 313.4 grams of imide oligomer object (theoretical yields:314.0 grams), yield 99.8% is denoted as BBMO-
2。
Embodiment 3
By bis- (2,4- diamino phenoxies) benzene (14BDAPB) of 1.0 grams of 1,4-, 30.0 grams of 1,3- diglycidyl isophthalic
Diphenol, 30.0 grams of CE793 epoxy resin and 40.0 grams of N, N, N ', bis- [4- (the 4- aminobenzene oxygen of N '-four glycidyl groups -2,2-
Base) phenyl] propane epoxy resin is put into reaction kettle, after 100 DEG C are stirred reaction 0.5 hour, 2.0 grams of BBMO-1 are added
Imide oligomer object continues to be stirred to react 1 hour, and 3.0 grams of 3- aminopropyl trimethoxysilanes are then added and are stirred to react 5 minutes,
It is cooled to room temperature, adds 8.0 grams of 1,8- diazas-bicyclic [5.4.0] hendecene -7 and 42.0 grams of tung oil acid anhydrides, be stirred
Uniformly, the siliceous epoxy acid imide matrix resin of 156.0 grams of 14BDAPB types is obtained, M-1 is denoted as.
Embodiment 4
By bis- (2,4- diamino phenoxies) benzene (14BDAPB) of 3.0 grams of 1,4-, 10.0 grams of M-phthalic acid 2-glycidyls
Ester epoxy resin, 30.0 grams of ES216 epoxy resin, 30.0 grams of N, N, N ', bis- [4- (the 4- amino of N '-four glycidyl groups -2,2-
Phenoxy group) phenyl] propane epoxy resin and 30.0 grams of N, N, N ', N '-four glycidyl groups -4,4 '-diaminodiphenylmethane ring
Oxygen resin is put into reaction kettle, and after 80 DEG C are stirred reaction 1 hour, the acyl of 2.0 grams of BBMO-1 and 3.0 gram of BBMO-2 is added
Imide oligomer continues to be stirred to react 2 hours, and 4.0 grams of 3- aminopropyl trimethoxysilanes and 4.0 grams of 3- aminopropyls are then added
Triethoxysilane is stirred to react 5 minutes, is cooled to room temperature, and 20.0 grams of 2-ethyl-4-methylimidazoles and 10.0 gram 2 are added,
4,6- tri- (dimethylamino methyl) phenol, are uniformly mixed, and obtain the siliceous epoxy acid imide matrix of 146.0 grams of 14BDAPB types
Resin is denoted as M-2.
Embodiment 5
By bis- (2,4- diamino phenoxies) benzene (14BDAPB) of 5.0 grams of 1,4-, 20.0 grams of o-cresols-formaldehyde novolac tree
Epoxy-type epoxy resin, 20.0 grams of hydrogenated bisphenol A diglycidyl ethers, 20.0 grams of 4,5- 7-oxa-bicyclo[4.1.0-1,2- dioctyl phthalate two contract
Water glycerine ester epoxy resin and 40.0 grams of N, N, N ', N '-four glycidyl groups -4,4 '-diaminodiphenylmethane epoxy resin is put
Enter in reaction kettle, after 80 DEG C are stirred reaction 1 hour, the imide oligomer object that 3.0 grams of BBMO-2 are added continues stirring instead
It answers 2 hours, 2.0 grams of 3- aminopropyl trimethoxysilanes is then added and are stirred to react 15 minutes, is cooled to room temperature, adds 25.0
Gram 2-ethyl-4-methylimidazole and 20.0 grams of methyl tetrahydro phthalic anhydrides, are uniformly mixed, it is siliceous to obtain 155.0 grams of 14BDAPB types
Epoxy acid imide matrix resin, is denoted as M-3.
Embodiment 6
Take the siliceous epoxy acid imide matrix resin of the 14BDAPB types of suitable 3~embodiment of embodiment 5 respectively, i.e. M-1~
M-3, and be uniformly applied to respectively in standard stainless steel test piece, it overlaps, clamps, be put into convection oven and cured:From room
Temperature is started to warm up to 80 DEG C, after being kept for 2 hours, is continuously heating to 120 DEG C, after being kept for 1 hour, is continuously heating to 150 DEG C, is kept
After 0.5 hour, cooled to room temperature.Using electronic tensile machine, room temperature (25 DEG C) and high temperature (180 DEG C) item are carried out to it respectively
Tensile shear strength test under part, the results are shown in Table 1.
Take the siliceous epoxy acid imide matrix resin of the 14BDAPB types of suitable 3~embodiment of embodiment 5 respectively, i.e. M-1~
M-3, and be uniformly applied to respectively in plate glass test piece, it overlaps, clamps, be put into convection oven and cured:From room temperature
It starts to warm up to 80 DEG C, after being kept for 2 hours, is continuously heating to 120 DEG C, after being kept for 1 hour, be continuously heating to 150 DEG C, keep
After 0.5 hour, cooled to room temperature.Using electronic tensile machine, room temperature (25 DEG C) and high temperature (180 DEG C) item are carried out to it respectively
Tensile shear strength test under part, the results are shown in Table 1.
Take the siliceous epoxy acid imide matrix resin of the 14BDAPB types of suitable 3~embodiment of embodiment 5 respectively, i.e. M-1~
M-3, and be equably impregnated with respectively on glass cloth, it is overlapped and is clamped with standard stainless steel test piece, be put into convection oven and consolidated
Change:It is started to warm up from room temperature to 80 DEG C, after being kept for 2 hours, is continuously heating to 120 DEG C, after being kept for 1 hour, is continuously heating to 150
DEG C, after being kept for 0.5 hour, cooled to room temperature.Using electronic tensile machine, room temperature (25 DEG C) and high temperature are carried out to it respectively
Tensile shear strength test under the conditions of (180 DEG C), the results are shown in Table 1.
1 tensile shear strength of table, unit:MPa
Claims (10)
1. a kind of siliceous epoxy acid imide matrix resin of 14BDAPB types, it is characterised in that:It is 1-5 by mass ratio:100:2-8:1-
5:Bis- (2,4- diamino phenoxies) the benzene 14BDAPB of 1,4-, epoxy resin, 3- aminopropyltrialkoxysilanes, the acyl of 30-50 is sub-
Amine oligomer and curing agent composition;Wherein, it is 2 that imide oligomer object, which is by molar ratio,:1:2 bis- (the 3- amino-4-hydroxies of 2,2-
Phenyl) hexafluoropropane, bis- [4- (3,4- di carboxyl phenyloxies) phenyl] propane dianhydrides of 2,2- and maleic anhydride reaction and obtain.
2. the siliceous epoxy acid imide matrix resin of a kind of 14BDAPB types according to claim 1, it is characterised in that:It is described
The one kind or two of 3- aminopropyltrialkoxysilanes in 3- aminopropyl trimethoxysilanes, 3- aminopropyl triethoxysilanes
The mixture of kind.
3. the siliceous epoxy acid imide matrix resin of a kind of 14BDAPB types according to claim 1, it is characterised in that:It is described
Epoxy resin is selected from E-51 epoxy resin, E-44 epoxy resin, ES216 epoxy resin, ECC202 epoxy resin, CE793 epoxies
Resin, glycidyl amine type epoxy resin, diglycidyl ether type epoxy resin, alicyclic type epoxy resin, phenol aldehyde type epoxy resin,
One or more of glycidyl ester type epoxy resin.
4. the siliceous epoxy acid imide matrix resin of a kind of 14BDAPB types according to claim 3, it is characterised in that:It is described
Glycidyl amine type epoxy resin is selected from N, N, N ', N '-four glycidyl groups -4,4 '-diaminodiphenylmethane epoxy resin, N,
N, N ', N '-four glycidyl groups -3,3 '-dimethyl -4,4 '-diaminodiphenylmethane epoxy resin, N, N, N ', N '-four shrinks
Glyceryl -3,3 '-diethyl -4,4 '-diaminodiphenylmethane epoxy resin, N, N, N ', N '-four glycidyl groups -3,3 '-two
Chloro- 4,4 '-diaminodiphenylmethane epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-diaminodiphenyl ether asphalt mixtures modified by epoxy resin
Fat, N, N, N ', N '-four glycidyl groups -4,4 '-diaminodiphenylsulfone epoxy resin, N, N, N ', four glycidyl group -3 N ' -,
4 '-diaminodiphenyl ether epoxy resin, N, N, N ', N '-four glycidyl groups -3,3 '-diaminodiphenylsulfone epoxy resin, N, N,
N ', N '-four glycidyl group -4,4 '-benzidine epoxy resin, N, N, N ', N '-four glycidyl group p-phenylenediamine epoxies
Resin, N, N, N ', N '-four glycidyl group m-phenylene diamine (MPD)s epoxy resin, N, N, N ', the bis- (4- of N '-four glycidyl groups -1,4-
Amino-benzene oxygen) benzene epoxy resin, N, N, N ', bis- (3- amino-benzene oxygens) the benzene epoxy resin of N '-four glycidyl groups -1,4-,
N, N, N ', bis- (4- amino-benzene oxygens) the benzene epoxy resin of N '-four glycidyl groups -1,3-, N, N, N ', N '-four glycidyl groups -
Bis- (3- amino-benzene oxygens) the benzene epoxy resin of 1,3-, N, N, N ', the bis- (2- trifluoromethyl -4- ammonia of N '-four glycidyl groups -1,4-
Phenoxyl) benzene epoxy resin, N, N, N ', bis- (2- trifluoromethyl-4-aminophenoxyls) benzene of N '-four glycidyl groups -1,3-
Epoxy resin, N, N, N ', N ', O- five glycidyls -4,4 '-diamino -4 "-hydroxyl triphenylmenthane epoxy resin, N, N, N ',
Bis- [4- (4- amino-benzene oxygens) phenyl] the propane epoxy resin of N '-four glycidyl groups -2,2-, N, N, N ',-four glycidols of N '
Bis- [4- (4- amino-benzene oxygens) phenyl] the hexafluoropropane epoxy resin of base -2,2-, N, N, N ', N '-four glycidyl groups -2,2- is double
[4- (3- amino-benzene oxygens) phenyl] propane epoxy resin, N, N, N ', bis- [4- (the 2- fluoroforms of N '-four glycidyl groups -2,2-
Base -4- amino-benzene oxygens) phenyl] propane epoxy resin, N, N, N ', bis- [4- (the 3- aminobenzene oxygen of N '-four glycidyl groups -2,2-
Base) phenyl] hexafluoropropane epoxy resin, N, N, N ', the bis- [4- (2- trifluoromethyl -4- aminobenzenes of N '-four glycidyl groups -2,2-
Oxygroup) phenyl] hexafluoropropane epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4- amino-benzene oxygens) diphenyl ether
Epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyls) diphenyl ether asphalt mixtures modified by epoxy resin
Fat, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4- amino-benzene oxygens) diphenyl sulphone (DPS) epoxy resin, N, N, N ', N '-four contracts
Water glyceryl -4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyls) diphenyl sulphone (DPS) epoxy resin, N, N, N ',-four glycidols of N '
Bis- (4- amino-benzene oxygens) the diphenyl sulfide epoxy resin of base -4,4 ' -, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- tri-
Methyl fluoride -4- amino-benzene oxygens) diphenyl sulfide epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4- aminobenzenes
Oxygroup) diphenyl-methane epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyls)
Diphenyl-methane epoxy resin, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (4- amino-benzene oxygens) benzophenone asphalt mixtures modified by epoxy resin
Fat, N, N, N ', N '-four glycidyl groups -4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyls) benzophenone epoxy resin, N,
N, N ', N '-four glycidyl groups -4,4 '-bis- (4- amino-benzene oxygens) biphenyl epoxy resin, N, N, N ',-four glycidols of N '
Bis- (2- trifluoromethyl-4-aminophenoxyls) biphenyl epoxy resins of base -4,4 ' -, N, N, N ', N ', O, O '-six glycidyl -
Bis- (3- amino-4-hydroxylphenyls) the hexafluoropropane epoxy resin of 2,2-, N, N, O-triglycidyl group para-aminophenol asphalt mixtures modified by epoxy resin
Fat, N, one or more of N, O-triglycidyl meta-aminophenol epoxy resin.
5. the siliceous epoxy acid imide matrix resin of a kind of 14BDAPB types according to claim 3, it is characterised in that:It is described
Diglycidyl ether type epoxy resin is selected from 1,3- resorcinol diglycidyl ethers, 1,4- resorcinol diglycidyl ethers, 4,4 '-bis-
Bis- (the 4- glycidyl ethers phenyl) hexafluoropropane of phenol S diglycidyl ethers, 2,2-, bis- (the 4- glycidyl ether hexamethylenes of 2,2-
Base) propane, Bisphenol F diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, bisphenol A diglycidyl ether, fatty alcohol more contract
One or more of water glycerin ether.
6. the siliceous epoxy acid imide matrix resin of a kind of 14BDAPB types according to claim 3, it is characterised in that:It is described
Alicyclic type epoxy resin is selected from sour -3 ', the 4 '-epoxycyclohexyethylSiOi methyl esters of 3,4- epoxycyclohexyethylSiOis, 3,4- epoxy group -6- methyl cyclohexanes
One or more of sour -3 ', 4 '-epoxy groups -6 '-methyl cyclohexane methyl esters, Dipentenedioxide.
7. the siliceous epoxy acid imide matrix resin of a kind of 14BDAPB types according to claim 3, it is characterised in that:It is described
Phenol aldehyde type epoxy resin is selected from phenol-formaldehyde phenolic resin type epoxy resin, o-cresol-formaldehyde phenolic resin type asphalt mixtures modified by epoxy resin
Fat, resorcinol-formaldehyde phenolic resin type epoxy resin, m-cresol-formaldehyde phenolic resin type epoxy resin, catechol-
Formaldehyde phenolic resin type epoxy resin, bisphenol A-formaldehyde phenolic resin type epoxy resin, bisphenol S-formaldehyde phenolic resin type ring oxygen
Resin, bisphenol AF-formaldehyde phenolic resin type epoxy resin, '-biphenyl diphenol-formaldehyde phenolic resin type epoxy resin, adjacent phenyl benzene
One or more of phenol-formaldehyde phenolic resin type epoxy resin, naphthols-formaldehyde phenolic resin type epoxy resin.
8. the siliceous epoxy acid imide matrix resin of a kind of 14BDAPB types according to claim 3, it is characterised in that:It is described
Glycidyl ester type epoxy resin is selected from terephthalic acid diglycidyl ester epoxy resin, Diglycidyl M-phthalate
Epoxy resin, o-phthalic acid diglycidyl ester epoxy resin, interior methine tetrahydrophthalic acid 2-glycidyl ester ring
Oxygen resin, 4,5- 7-oxa-bicyclo[4.1.0-1,2- dicarboxylic acid diglycidyl esters epoxy resin, two sad diglycidyl ether epoxy of adjacent benzene
One or more of resin.
9. the siliceous epoxy acid imide matrix resin of a kind of 14BDAPB types according to claim 1, it is characterised in that:It is described
Curing agent is selected from hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl tetrahydro phthalic anhydride, dodecenylsuccinic anhydride, methyl hexahydrophthalic anhydride, eleostearic acid
Acid anhydride is formed with 80 acid anhydrides made of dicyclopentadiene and maleic acid anhydride reactant, with limonene and maleic acid anhydride reactant
Acid anhydrides, with liquid acid anhydrides, N made of turpentine oil and maleic acid anhydride reactant, accelerine, N, N- dimethyl is to first
Base aniline, N, N- dimethyl benzylamines, 2-ethyl-4-methylimidazole, imidazoles, 2,4,6- tri- (dimethylamino methyl) phenol, 1,8-
One or more of bicyclic [5.4.0] hendecene -7 of diaza -.
10. a kind of preparation method of the siliceous epoxy acid imide matrix resin of 14BDAPB types as described in claim 1, including such as
Lower step:
(1) by bis- (3- amino-4-hydroxylphenyls) hexafluoropropane of 2,2-, o-cresol, the bis- [4- (3,4- di carboxyl phenyloxies) of 2,2-
Phenyl] propane dianhydride and maleic anhydride be put into reaction kettle, be passed through nitrogen, stir, be heated to 80 DEG C, isoquinolin is added dropwise,
100 DEG C -110 DEG C are heated to, after being stirred to react 5-12 hours, 60 DEG C is cooled to, reactant is poured into the precipitating for filling precipitating agent
In kettle, solids is precipitated in stirring, filters, and vacuum drying obtains imide oligomer object;
(2) bis- (2,4- diamino phenoxy) the benzene 14BDAPB of Isosorbide-5-Nitrae -, epoxy resin are put into reaction kettle, in 80 DEG C -100 DEG C
After being stirred reaction 0.5-1 hours, imide oligomer object is added and continues to be stirred to react 1-2 hours, 3- aminopropyls are then added
Trialkoxy silane is stirred to react 5-15 minutes, is cooled to room temperature, is added curing agent, is uniformly mixed.
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