CN106142754A - A kind of high-frequency circuit base material of resin combination and manufacture thereof - Google Patents

A kind of high-frequency circuit base material of resin combination and manufacture thereof Download PDF

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Publication number
CN106142754A
CN106142754A CN201610527162.XA CN201610527162A CN106142754A CN 106142754 A CN106142754 A CN 106142754A CN 201610527162 A CN201610527162 A CN 201610527162A CN 106142754 A CN106142754 A CN 106142754A
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CN
China
Prior art keywords
copper foil
base material
frequency circuit
circuit base
ceramic packing
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Pending
Application number
CN201610527162.XA
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Chinese (zh)
Inventor
向昊
刘晓峰
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Wuhan Lian Heng Electronic Materials Co Ltd
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Wuhan Lian Heng Electronic Materials Co Ltd
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Priority to CN201610527162.XA priority Critical patent/CN106142754A/en
Publication of CN106142754A publication Critical patent/CN106142754A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C09D127/16—Homopolymers or copolymers of vinylidene fluoride
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C09D127/18—Homopolymers or copolymers of tetrafluoroethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/12—Mixture of at least two particles made of different materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/04—Time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08J2327/16—Homopolymers or copolymers of vinylidene fluoride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08J2327/18—Homopolymers or copolymers of tetrafluoroethylene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
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Abstract

The high frequency plate of the resin combination described in patent of the present invention and manufacture thereof, its committed step includes: the mixing of (one) fluorine resin；(2) ceramic packing of several different proportion particle diameter species patterns utilizes solvent to be pre-mixed；(3) mixing of fluorine resin and filler；(4) preparation of complex media piece；(5) preparation of the Copper Foil after the coated sintering of fluororesin and compounding ceramic packing；(6) lamination of high-frequency copper-clad plate.Above-mentioned steps is utilized to obtain a kind of fluororesin composition producing high-frequency circuit base material and a kind of high-frequency copper-clad plate employing said composition production.

Description

A kind of high-frequency circuit base material of resin combination and manufacture thereof
Technical field
The composition that the present invention relates to be formed after a kind of fluorine resin mixes with ceramic packing is in particular with this group A kind of high-frequency circuit base material prepared by compound.
Background technology
Polytetrafluoroethylene (PTFE) (PTFE) from 1945 by E.I.Du Pont Company exploitation commercialization since, the excellent reason possessing due to it Changing performance, having numerous special purposes in all trades and professions, wherein a big class is used for manufacturing high-frequency copper-clad plate, and terminal is used for communication The copper-clad plate of antenna, power amplifier, especially its high-k is used for military use, such as radar.On the market for same dielectric The product of the high-frequency circuit base material of constant (Dk) is a lot, for each concrete company, each of which concrete dielectric constant (Dk) product type of high-frequency circuit base material also several, the mainly processing type in later stage and other application performance parameters meet Different use requires, use in some base materials glass cloth and do not use glass cloth, has plenty of dry-press process complex media Piece, have utilizes wet to be molded complex media piece, and technique is varied.Constantly carry so using more excellent technique to meet High performance requirement seems very urgent, United States Patent (USP) 6417459/2002 invention a kind of PTFE/ glass cloth dipstick and Copper Foil Between place PFA film method because PFA has more preferable mobility and cohesive than PTFE, improve Copper Foil dipstick Peel strength, but this technology also exists inconsistency and PFA film easy mobility when lamination of internal structure, and affect sheet material Thickness evenness.The present invention is aiming at general product and carries out technologic improvement, improves the uniformity of base material, reduces gas The impact on dielectric loss for the bubble, controls thickness and the dimensional stability of base material more accurately.
Content of the invention
The present invention is directed to the weak point that the said goods exists, a kind of good resin combination of uniformity is provided, utilizes A kind of material material content consistent properties stably more excellent high-frequency circuit base material that this resin combination is made.
The implementation method of the present invention is as follows:
(1), fluorine-containing resin emulsion, compounding ceramic packing, special Copper Foil are prepared；
(2), the mixing of fluorine-containing resin emulsion；
(3) mixing of ceramic packing, is compounded；
(4), the fluororesin composition of the mixed cost invention of fluorine-containing resin emulsion and compounding ceramic packing；
(5), fluorine-containing resin emulsion and compounding ceramic packing be prepared by mixing into complex media piece；
(6), fluorine-containing resin emulsion and the mixing of compounding ceramic packing is coated in the upper drying of Copper Foil one side, baking, sintering Become stand-by Copper Foil
(7) by the Copper Foil for preparing with complex media piece according to Copper Foil+complex media piece+Copper Foil, copper foil tape fluorine resin Composition both faces towards complex media piece, is laminated into the high-frequency circuit base material of the present invention.
The wherein mixing of step (two) one or more fluorine resins requires at normal temperatures, stirring at low speed, not breakdown of emulsion.
Wherein step (three) one or more ceramic packings and certain solvent fully presoak, and then utilize special equipment at a high speed Mixing, static 24 hours not stratified does not settles.
Wherein step (four) fluorine resin mixture mixes in the mixing apparatus of given pace with ceramic packing mixture Uniformly become the composition of the present invention, not stratified do not settle not breakdown of emulsion.
Wherein the composition in step (four) is dried, bakees, is molded by step (five).First stage temperature controls at 90- Between 120 DEG C, second stage and molding stage temperature control between 180-220 DEG C,
Wherein resin combination is coated uniformly on the use face of Copper Foil by step (six), through drying, bakeing, sintering rank Section, first stage temperature controls between 90-120 DEG C, and second stage temperature controls between 180-220 DEG C, and the phase III burns Knot phase temperature controls between 300-350 DEG C.
The material that wherein step (five) and step (six) are prepared by step (seven) is folded according to Copper Foil+complex media piece+Copper Foil Closing, copper foil surface is coated with resin and the one side of compounding ceramic packing both faces towards complex media piece.Then at 400 DEG C, 12MPa presses Keep 1.5 hours under power, prepare the high-frequency circuit base material that the present invention describes.
Detailed description of the invention
The process of the copper-clad plate of the fluororesin composition of the present invention and manufacture thereof is as follows:
(1), fluorine-containing resin emulsion, compounding ceramic packing, special Copper Foil are prepared；
(2), the mixing of fluorine-containing resin emulsion；
(3) mixing of ceramic packing, is compounded；
(4), the fluororesin composition of the mixed cost invention of fluorine-containing resin emulsion and compounding ceramic packing；
(5), fluorine-containing resin emulsion and compounding ceramic packing be prepared by mixing into complex media piece；
(6), fluorine-containing resin emulsion and the mixing of compounding ceramic packing is coated in the upper drying of Copper Foil one side, baking, sintering Become stand-by Copper Foil
(7) by the Copper Foil for preparing with complex media piece according to Copper Foil+complex media piece+Copper Foil, copper foil tape fluorine resin Composition both faces towards complex media piece, is laminated into the high-frequency circuit base material of the present invention.
The wherein mixing of step (two) one or more fluorine resins requires at 25 DEG C, stirring at low speed, not breakdown of emulsion.
Wherein step (three) one or more ceramic packings and the abundant pre-soaking of certain solvent more than 24 hours, then utilize Special equipment mixed at high speed is uniform, and static 24 hours not stratified does not settles.
Wherein step (four) fluorine resin mixture mixes in the mixing apparatus of given pace with ceramic packing mixture Uniformly become the composition of the present invention, not stratified do not settle not breakdown of emulsion.Therein it is crucial that do not produce centrifugal effect, and cause various Different-grain diameter becomes Assembled distribution.Using water-cooled sleeve in mixed process, utilizing cold water to cool down, temperature may not exceed 30 DEG C.
Wherein the composition in step (four) is dried, bakees, is molded by step (five).First stage temperature controls at 90- Between 120 DEG C, second stage and molding stage temperature control between 180-220 DEG C, keep vacuum, the complex media piece of preparation Material smooth surface, does not has bubble.
Wherein resin combination is coated uniformly on the use face of Copper Foil by step (six), through drying, bakeing, sintering rank Section, first stage temperature controls between 90-120 DEG C, and second stage temperature controls between 180-220 DEG C, and the phase III burns Knot phase temperature controls between 300-350 DEG C.Vacuum is kept during it
The material that wherein step (five) and step (six) are prepared by step (seven) is folded according to Copper Foil+complex media piece+Copper Foil Closing, copper foil surface is coated with resin and the one side of compounding ceramic packing both faces towards complex media piece.Then at 400 DEG C, 12MPa presses Keep 1.5 hours under power, prepare the high-frequency circuit base material that the present invention describes.
Below in conjunction with specific embodiment, the present invention is described in further detail:
First selecting the fluorine resin mixture of a kind of applicable coating, described fluorine resin includes perfluoroethylene-propylene breast Liquid, polyfluorinated ethylene alkyl vinyl ether emulsion or tetrafluoroethene and the copolymer of ethene, in Polyvinylidene, polytrifluorochloroethylene Any combination of one or more.
A kind of compounding fill composition of reselection, compounding fill composition includes aluminum oxide, silica, nitridation The composition of one or more in boron, silicon nitride, titanium dioxide, strontium titanates, barium titanate.
Above two mixture combines according to certain ratio, prepares stand-by complex media piece and fluorine resin and pottery The Copper Foil of porcelain filling composition coating.
Embodiment one: the fluorine resin of the present invention and the composition of compounding ceramic packing and high-frequency circuit base material method thereof are such as Under:
(1) fluorine resin and compounding ceramic packing composition are prepared；Ratio is specific
(2) above-mentioned composition is utilized to prepare thickness 0.90mm, the complex media piece of dielectric constant 6.15
(3) Copper Foil after utilizing above-mentioned composition and Copper Foil to prepare the sintering containing above-mentioned composition coating of 0.05mm, The wherein thickness 0.035mm of Copper Foil, Copper Foil gross thickness 0.05mm after the sintering of above-mentioned composition coating；
(4) utilize the Copper Foil after the sintering that above-mentioned composition coats and complex media piece, according to Copper Foil+complex media piece+ Copper Foil overlaps, and copper foil surface is coated with resin and the one side of compounding ceramic packing both faces towards complex media piece.Then at 400 DEG C, Keep 1.5 hours under 12MPa pressure, prepare the sample of the high-frequency circuit base material embodiment one that the present invention describes.
Comparative example one: for composition and the high-frequency electrical roadbed thereof of the fluorine resin and compounding ceramic packing that contrast the present invention Material method is as follows:
(1) fluorine resin and compounding ceramic packing composition are prepared；Ratio is specific
(2) above-mentioned composition is utilized to prepare thickness 0.93mm, the complex media piece of dielectric constant 6.15
(3) utilizing above-mentioned composition to prepare complex media piece, according to Copper Foil+complex media piece+Copper Foil overlapping, Copper Foil is thick Change face both faces towards complex media piece.Then at 400 DEG C, keep 1.5 hours under 12MPa pressure, prepare the height that the present invention describes The sample of frequency circuit base material comparative example one.
The following is the resin combination of the present invention and the detection of prepared plate property compare:
Test event Embodiment one Comparative example one
Thickness (mm) 1.00mm 0.98mm
Dk(5GHz) 6.17 6.05
Df(5GHz) 0.0019 0.0023
PS(N/mm) 2.5 1.9
It can be seen that use the composition of the present invention and the dielectric constant of high frequency circuit materials and Jie from the above-mentioned table of comparisons Electrical loss is more stable, and closer to design load, and peel strength is high, is preferably suitable for the circuit board processing in later stage.
The method of the present invention is described by embodiment, but is not construed as limiting the method for the present invention, with reference to the present invention The description of method, other changes to the disclosed embodiments, as the professional person of this area is readily apparent that, such Change also should belong to the scope that the claims in the present invention limit.

Claims (10)

1. a high-frequency circuit base material for resin combination and manufacture thereof, its feature comprises the following steps:
(1), fluorine-containing resin emulsion, compounding ceramic packing, special Copper Foil are prepared；
(2), the mixing of fluorine-containing resin emulsion；
(3) mixing of ceramic packing, is compounded；
(4), the fluororesin composition of the mixed cost invention of fluorine-containing resin emulsion and compounding ceramic packing；
(5), fluorine-containing resin emulsion and compounding ceramic packing be prepared by mixing into complex media piece；
(6), the mixing of fluorine-containing resin emulsion and compounding ceramic packing is coated in the upper drying of Copper Foil one side, bakees, sinters into and treat Copper Foil；
(7) Copper Foil preparing and complex media piece are combined according to Copper Foil+complex media piece+Copper Foil, copper foil tape fluorine resin Thing both faces towards complex media piece, is laminated into the high-frequency circuit base material of the present invention.
2. the high-frequency circuit base material according to claim 1 resin combination and manufacture thereof, the fluorine resin described in step (), bag Include the copolymer of perfluoroethylene-propylene emulsion, polyfluorinated ethylene alkyl vinyl ether emulsion or tetrafluoroethene and ethene, gather inclined second Any combination of one or more in alkene, polytrifluorochloroethylene.
3. the high-frequency circuit base material according to claim 1 resin combination and manufacture thereof, the ceramic packing described in step (), bag Include sintered ceramic packing to include in aluminum oxide, silica, boron nitride, silicon nitride, titanium dioxide, strontium titanates, barium titanate The composition of one or more.
4. the high-frequency circuit base material according to claim 1 resin combination and manufacture thereof, the mixed process described in step (three), mixed Conjunction reaches fully to infiltrate, and ceramic packing can within dispersed 24 hours, not settle in a solvent, not stratified.
5. the high-frequency circuit base material according to claim 1 resin combination and manufacture thereof, the mixed process described in step (four), contain Fluororesin mixes abundant not breakdown of emulsion with condiment, and ceramic packing can not sink for dispersed 24 hours in fluoro-containing composition kind Fall, not stratified.
6. the high-frequency circuit base material according to claim 1 resin combination and manufacture thereof, the complex media piece described in step (four), Make use of the fluororesin composition of the present invention through drying, baking, compression molding three phases.
7. the high-frequency circuit base material according to claim 1 resin combination and manufacture thereof, the fluoro-resin emulsion described in step (four) It is coated in the upper drying of Copper Foil one side after mixing with the composition of compounding ceramic packing, bakee, sinter stand-by Copper Foil into.
8. the high-frequency circuit base material according to claim 6 and 7 resin combination and manufacture thereof, described drying, baking, sintering, Molding stage, first stage temperature controls between 90-120 DEG C, and second stage and molding stage temperature control at 180-220 DEG C Between, phase III sintering phase temperature controls between 300-350 DEG C.
9. the high-frequency circuit base material according to claim 6 resin combination and manufacture thereof, described baking molding stage is all true Complete under Altitude.
10. the high-frequency circuit base material according to claim 1 resin combination and manufacture thereof, the high frequency of the preparation described in step (seven) Circuit substrate, according to Copper Foil+complex media piece+Copper Foil overlapping, copper foil surface is coated with resin and the one side of compounding ceramic packing Both face towards complex media piece.Then at 400 DEG C, keep 1.5 hours under 12MPa pressure, prepare the high-frequency electrical that the present invention describes Roadbed material.
CN201610527162.XA 2016-07-06 2016-07-06 A kind of high-frequency circuit base material of resin combination and manufacture thereof Pending CN106142754A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106590452A (en) * 2016-11-25 2017-04-26 常州中英科技股份有限公司 Adhesive sheet for copper-clad laminate
CN107379678A (en) * 2017-06-29 2017-11-24 安徽升鸿电子有限公司 High frequency flexibility coat copper plate is made using vacuum hotpressing mode
CN111775527A (en) * 2020-07-09 2020-10-16 瑞声科技（南京）有限公司 Preparation method of composite medium copper-clad plate and printed circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106590452A (en) * 2016-11-25 2017-04-26 常州中英科技股份有限公司 Adhesive sheet for copper-clad laminate
CN107379678A (en) * 2017-06-29 2017-11-24 安徽升鸿电子有限公司 High frequency flexibility coat copper plate is made using vacuum hotpressing mode
CN111775527A (en) * 2020-07-09 2020-10-16 瑞声科技（南京）有限公司 Preparation method of composite medium copper-clad plate and printed circuit board

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Application publication date: 20161123