CN106141902B - Grinding device - Google Patents

Grinding device Download PDF

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Publication number
CN106141902B
CN106141902B CN201610312950.7A CN201610312950A CN106141902B CN 106141902 B CN106141902 B CN 106141902B CN 201610312950 A CN201610312950 A CN 201610312950A CN 106141902 B CN106141902 B CN 106141902B
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China
Prior art keywords
slurry
grinding
chuck table
air
chip
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CN201610312950.7A
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Chinese (zh)
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CN106141902A (en
Inventor
山中聪
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Disco Corp
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Disco Corp
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

Grinding device is provided, the usage amount of slurry is reduced and efficiently recycles slurry.Grinding device (1), which has, to retain slurry (45) on the downside of chuck table (3) and recycles to the abradant surface of grinding pad (25) (25a) and provide the size circulations component (50) of slurry (45), size circulations component (50) includes the bucket portion (51) of concave shape, and slurry (45) are retained around chuck table (3)；And air supply member (55), it has the air ejiction opening (56) that air is sprayed towards the abradant surface (25a) in the slurry for retaining in bucket portion (51), therefore can retain slurry (45) and air supply member (55) in bucket portion (51) and can spray air from air ejiction opening (56) and will remain in the spray of the slurry (45) in bucket portion (51) and rise and to the abradant surface of grinding pad (25) (25a) circulation offer slurry (45).The usage amount of slurry (45) is reduced as a result, and efficiently recycles slurry (45).

Description

Grinding device
Technical field
The present invention relates to the grinding device that chip ground is directed at while the abradant surface to grinding pad provides slurry.
Background technique
Since the flexural strength of the chip when carrying out grinding to machined objects such as chips makes its thinning can reduce, so passing through The machined surface of chip is ground to improve flexural strength.As the device ground to chip, such as using can By be referred to as the chemical mechanical milling method of CMP (Chemical Mechanical Polishing: chemical mechanical grinding) come pair The grinding device that chip is ground.Grinding device is generally configured using by grinding pad in downside, by what is kept to chip Maintaining part configures the structure in upside, by chip pushing and pressing in grinding while the abradant surface to grinding pad provides slurry (lapping liquid) Mill is padded and is ground.In the dedicated unit only ground, following scheme is proposed: being for example received in back and forth by container Slurry used in grinding, and slurry is recycled using circulating pump (for example, referring to following patent documents 1).
And, it is also proposed that it can make to be ground and grind the processing unit (plant) implemented in one apparatus, the processing unit (plant) structure Become: by the chuck table kept to chip configuration in downside, grinding component and Grinding structural unit being configured into side above (for example, referring to following patent documents 2).When being ground to chip after grinding, on one side to chip provide slurry while Grinding pad is pushed against and is ground in chip.
Patent document 1: No. 3384530 bulletin of Japanese Unexamined Patent Publication
Patent document 2: No. 5406676 bulletins of Japanese Patent Publication No.
But in the grinding device as described above that can be recycled to slurry, due to being carried out when to chip Slurry constantly is provided to the abradant surface of grinding pad when grinding, so slurry is more using quantitative change, it is less economical.Also, when logical When crossing above-mentioned processing unit (plant) and being ground to chip, since the slurry that provides chip is from the chuck work kept to chip The peripheral side for making platform falls and mixes with grinding waste liquid when grinding, so the recycling of slurry is highly difficult.In order to this Slurry is recycled, and the apparatus structure not mixed with grinding waste liquid using slurry is needed, but using such structure is very Difficult.Also, due to being also difficult from the grinding waste liquid for be mixed with slurry only to recycle slurry, so the slurry that can be recycled It is discarded together with grinding waste liquid, wastes many slurries.
Summary of the invention
The present invention be it is completed in view of the above situation, its purpose is to provide a kind of grinding devices, are able to suppress slurry The usage amount of material and slurry is expeditiously recycled.
Grinding device of the invention includes chuck table, keeps to chip；Grinding structural unit, with main shaft, The grinding pad that the chip kept to the chuck table is ground is installed as to rotate by the main shaft, and the Grinding structural unit is logical The abradant surface for crossing the grinding pad grinds chip；Slurry supply member, to the abradant surface and the chuck of the grinding pad The upper surface for the chip that workbench is kept provides slurry；And grinding feeding component, it is kept with the chuck table Chip upper surface closer and farther from direction on grinding feeding is carried out to the Grinding structural unit, wherein the grinding device has Size circulations component, the size circulations component retain the slurry on the downside of the chuck table and recycle and provide to the abradant surface The slurry, the size circulations component include the bucket portion of concave shape, and it includes side wall, bottom plate and inner sidewall, the side wall is around making The grinding pad and the card at the abrasion site for the contact wafers that abradant surface and the chuck table of the grinding pad are kept Disk workbench, the bottom plate connect with the lower part of the side wall and have the opening for exposing the chuck table, the inside in center Wall erects setting at the inner peripheral of the opening；And air supply member, have among the slurry for retaining in the bucket portion The air ejiction opening that air is sprayed towards the abradant surface of the grinding pad, the air sprayed from the air ejiction opening will remain in this The pulp spraying in bucket portion rises and recycles to the abradant surface of the grinding pad and provide the slurry.
Grinding device of the invention includes slurry supply member, the chip kept to grinding pad and chuck table Slurry is provided；And size circulations component, slurry is retained on the downside of chuck table and the abradant surface of grinding pad is recycled Slurry is provided, size circulations component includes the bucket portion of recess shapes, slurry is retained around chuck table；And it is empty Gas supply member, the air that there is the abradant surface towards grinding pad to spray air in the slurry for retaining in the bucket portion spray Mouthful, therefore slurry is supplied by upper surface of the slurry supply member to the abradant surface of grinding pad and chip, even if slurry is to rotation Chuck table and grinding pad around disperse, slurry can also be remained in bucket portion.
Also, due to the pulp spraying that air supply member sprays air from air ejiction opening and will remain in bucket portion It rises, provides slurry so can recycle to the abradant surface of grinding pad.Therefore, the usage amount of slurry can be reduced, and to slurry Expeditiously recycled.
Detailed description of the invention
Fig. 1 is the perspective view for showing the structure of grinding device.
Fig. 2 is the cross-sectional view for showing the structure of Grinding structural unit, chuck table and size circulations component.
Fig. 3 is shown to be directed at chip and grinds while being recycled to grinding pad using size circulations component and providing slurry The cross-sectional view of state.
Fig. 4 is the cross-sectional view for showing the structure of variation of size circulations component.
Fig. 5 be show on one side use the variation of size circulations component to grinding pad recycle provide slurry while be directed at chip into The cross-sectional view of the state of row grinding.
Label declaration
1: grinding device；2: device pedestal；3: chuck table；3a: retaining surface；4: motor；5: rotary shaft；6: base Platform；7: column；8: Working position sensor；9: positioning region；10:Y axis direction feeds component；11: ball-screw；12: bearing portion； 13: motor；14: guide rail；15: mobile station；20: Grinding structural unit；21: main shaft；22: bracket；23: motor；24: mounting base； 25: grinding pad；25a: abradant surface；26: through hole；30: grinding feeding component；31: fixed part；32: ball-screw；33: electronic Machine；34: guide rail；35: lifter plate；40: slurry supply member；41: slurry supply pipe；42: supply mouth；43: valve；44: slurry supplies To source；45: slurry；45a: liquid storage；50: size circulations component；51: bucket portion；52: side wall；53: bottom plate；54: inner sidewall；55: empty Gas supply member；56: air ejiction opening；57: air supply source；58: valve；60: attracting source；61: valve；70: size circulations component； 71: bucket portion；72: wrinkle portion；73: bottom plate；74: inner sidewall；75: lifting cylinder；750: cylinder；751: supporting part；752: piston； 76: air supply member；77: air ejiction opening；78: valve；79: air supply source.
Specific embodiment
Grinding device 1 shown in FIG. 1 is by CMP come an example of the grinding device ground to chip.Grinding device 1 With the device pedestal 2 extended in the Y-axis direction, has on device pedestal 2 and chip keep and can rotate Chuck table 3.The upper surface of chuck table 3 is the retaining surface 3a kept to chip, attraction source (not shown) with Retaining surface 3a connection.The lower end of rotary shaft 5 and chuck table 3 links, which connect with motor 4 shown in Fig. 2. Motor 4 rotates rotary shaft 5, so as to make chuck table 3 with the rotation of defined rotation speed.
The base station 6 extended in the Y-axis direction is equipped in the inside of device pedestal 2.Being equipped on base station 6 makes chuck The Y direction that workbench 3 moves in the Y-axis direction feeds component 10.Y direction feeding component 10 includes ball-screw 11, Extend in the Y-axis direction；Bearing portion 12 can rotate the end bearing bearing of ball-screw 11；Motor 13, with The other end of ball-screw 11 connects；A pair of guide rails 14 is extended in parallel with ball-screw 11；And mobile station 15, under Side supports chuck table 3.A pair of guide rails 14 is contacted with the lower slide of mobile station 15, ball-screw 11 be formed in The nut of the central portion of mobile station 15 screws togather.Motor 13 makes the rotation of ball-screw 11 so as to make chuck table 3 and move Dynamic platform 15 moves in the Y-axis direction together.
It is erect at the X-direction rear portion of device pedestal 2 and is provided with column 7.Grinding structural unit 20 is included in the front of column 7, it is right The chip that chuck table 3 is kept is ground；And grinding feeding component 30, what is kept with chuck table 3 The upper surface of chip closer and farther from direction on grinding feeding is carried out to Grinding structural unit 20.
Grinding structural unit 20 includes main shaft 21, the axle center with Z-direction；Bracket 22, in a manner of it can rotate The shell supported around main shaft 21 is kept；Motor 23 is connect with one end of main shaft 21；And grinding pad 25, the lower end of main shaft 21 is mounted in a manner of it can assemble and disassemble by mounting base 24.The lower surface of grinding pad 25 is to chip The abradant surface 25a ground.The rotation center of main shaft 21 shown in Fig. 2 is formed with the through hole 26 axially extended.
Grinding feeding component 30 shown in FIG. 1 includes fixed part 31, is fixed on column 7；Ball-screw 32, in Z axis side It upwardly extends；Motor 33 is connect with one end of ball-screw 32；A pair of guide rails 34 is extended in parallel with ball-screw 32； And lifter plate 35, one face and Grinding structural unit 20 link.Another face sliding contact of a pair of guide rails 34 and lifter plate 35, Ball-screw 32 and the nut for the central portion for being formed in lifter plate 35 screw togather.By motor 33 drive ball-screw 32 so as to Go up and down Grinding structural unit 20 in the Z-axis direction together with lifter plate 35.
It is equipped with Working position sensor 8 near the upper surface of base station 2, that is, Y direction feeding component 10, the processing Position sensor 8 detects the processing for the chuck table 3 that can be ground by the grinding pad 25 of Grinding structural unit 20 to chip Position.The positioning region 9 that identifies is equipped in the side of mobile station 15 by Working position sensor 8.The Working position sensor 8 The position of chuck table 3 when detecting positioning region 9 is Working position.Working position, which refers to, to be maintained on chuck table 3 Chip the position that is overlapped with the middle section of the abradant surface 25a of at least grinding pad 25 of upper surface whole region.
Grinding device 1 includes slurry supply member 40, connect with Grinding structural unit 20 and to grinding pad 25 and chucking work The chip that platform 3 is kept provides slurry；And size circulations component 50, slurry is retained in the position of the lower section of chuck table 3 Expect and is recycled to the abradant surface 25a of grinding pad 25 and slurry is provided.
As shown in Fig. 2, slurry supply member 40 includes slurry supply pipe 41, it is inserted into the through hole 26 of main shaft 21； And slurry supply source 44, it is connect via valve 43 with the upper end of slurry supply pipe 41.It is formed in the lower end of slurry supply pipe 41 There is the supply mouth 42 for spraying slurry.Further, it is possible to which the slurry of supply amount as defined in being made by opening valve 43 is supplied from slurry The supply mouth 42 of pipe 41 sprays downward.
Size circulations component 50 includes the bucket portion 51 of concave shape, is centered around around chuck table 3 and retains slurry Material；And air supply member 55, air is sprayed towards the abradant surface 25a of grinding pad 25.Bucket portion 51 can be with chucking work Platform 3 moves in the Y-axis direction together, which includes: side wall 52, what is ground by Grinding structural unit 20 to chip Abrasion site is around grinding pad 25 and chuck table 3；Bottom plate 53 connect with the lower part of side wall 52 and has in centre The opening for exposing chuck table 3；And inner sidewall 54, it erects and is arranged from the inner peripheral of the opening.Abrasion site refers to The grinding in the state that upper surface of the abradant surface 25a and the chip being maintained on chuck table 3 that make grinding pad 25 contact The height and position of component 20.Side wall 52 extends to the position than the grinding pad 25 in the case that Grinding structural unit 20 is located at abrasion site High position is set, can be covered in attrition process around grinding pad 25 and chuck table 3, prevent slurry from dispersing.
Air supply member 55 includes air ejiction opening 56, connect with the underface for the bottom plate 53 for constituting bucket portion 51, shape Cheng Yu retains the bottom plate 53 of slurry；And air supply source 57, it is connect via valve 58 with air ejiction opening 56.When in bucket portion 51 In retained when opening valve 58 in the state of slurry, can make as defined in the air of flow spray and will deposit from air ejiction opening 56 The pulp spraying stayed in bucket portion 51 rises.In addition, it is 8~10mm or so that the size of air ejiction opening 56, which is such as diameter,.
It is preferred that air ejiction opening 56 is formed in and 3 close position of chuck table.As a result, to the grinding pad of rotation 25 The slurry that abradant surface 25a circulation provides is liable to stick on the chip being maintained on chuck table 3.
Attraction source 60 is connect via valve 61 with air ejiction opening 56.It closes valve 58 and opens valve 61, thus, it is possible to sky Gas blowout outlet 56 acts on the attraction in attraction source 60 and attracts the slurry remained in bucket portion 51 and slurry is discharged to outside device Portion.
Then, the action example of grinding device 1 is illustrated.Wafer W shown in Fig. 2 is an example of machined object, is ground Grinding the upper surface Wa that pad 25 is ground is surface to be polished.On the other hand, become positioned at the face of the opposite side of upper surface Wa and be attracted guarantor Hold the lower surface W b on the retaining surface 3a of chuck table 3.
After on the retaining surface 3a that wafer W is placed on chuck table 3, by attracting the attraction in source by wafer W Attracting holding is on retaining surface 3a.The motor 13 of Y direction feeding component 10 shown in FIG. 1 rotates ball-screw 11, and Move chuck table 3 in the Y-axis direction together with movable drill base 15.Also, when Working position sensor 8 detects positioning Portion 9 identifies that chuck table 3 has been positioned at Working position, and the motor 33 of grinding feeding component 30 makes ball-screw 32 Rotation, and decline Grinding structural unit 20 together with lifter plate 35.
As shown in figure 3, opening valve 43 about slurry supply member 40 and connecting slurry supply source 44 and slurry supply pipe 41 It is logical, make as defined in the slurry of supply amount flow into slurry supply pipe 41, and make slurry 45 along slurry supply pipe 41 from supply mouth 42 It sprays.As the supply amount of slurry, such as it is set as 100~200ml/min.
Grinding feeding, live spindle 21 are carried out on the direction close relative to chuck table 3 to grinding pad 25 on one side On one side so that grinding pad 25 according to the direction arrow A with such as 1000rpm rotation, and make chuck table 3 according to the direction arrow A with Such as 300rpm rotation.Also, make the upper of the abradant surface 25a of the grinding pad 25 rotated while declining and the wafer W of rotation The entire face contact of surface Wa, slides grinding pad 25 relatively with wafer W.
At this point, when the upper table for the wafer W for being provided to rotation from the slurry 45 that the ejiction opening 42 of slurry supply pipe 41 sprays The abradant surface 25a of face Wa and grinding pad 25 and enter upper surface Wa and abradant surface 25a between when, slurry 45 played chemistry make With played with grinding pad 25 mechanism synergistic effect, can the upper surface Wa to wafer W grind.In wafer W In grinding, slurry 45 is splashed on side wall 52 or is retained under the stream periphery of chuck table 3 into bucket portion 51.In bucket portion The slurry of 100~200ml is retained in 51.
After the slurry 45 of defined supply amount has flowed into slurry supply pipe 41, slurry supply member 40 closes valve 43 It closes.Then, air supply member 55 makes grinding of the air of defined flow from the ejection of air ejiction opening 56 and to grinding pad 25 25a circulation in face provides slurry 45, wherein the liquid storage 45a for the slurry that the air ejiction opening 56 is remained in bucket portion 51 is covered.It is empty The flow of gas is set to such as 50l/min.
Specifically, opening valve 58 about air supply member 55 and connecting air supply source 57 and air ejiction opening 56 It is logical, spray abradant surface 25a of the air of defined flow from air ejiction opening 56 towards grinding pad 25.The air of the ejection from The lower section of the liquid storage 45a of the slurry remained in bucket portion 51 applies pressure and sprays slurry 45, as a result, to the grinding in rotation The abradant surface 25a circulation of pad 25 provides slurry 45.
The abradant surface 25a of the grinding pad 25 of the rotation slurry 45 provided is driven because of the rotation of grinding pad 25, it is also attached Be used for the grinding to upper surface Wa on the upper surface Wa for the wafer W being held on chuck table 3.In this way in chip After the attrition process of W terminates, closes valve 58 and open valve 61 and be connected to attraction source 60 with air ejiction opening 56, attraction is deposited Slurry 45 is simultaneously discharged to outside device by the slurry 45 that stays in bucket portion 51.
In this way, size circulations component 50 possessed by grinding device 1 includes the bucket portion 51 of concave shape, in chucking work Slurry 45 is retained around platform 3；And air supply member 55, have among the slurry for retaining in bucket portion 51 towards grinding The abradant surface 25a of pad 25 sprays the air ejiction opening 56 of air, therefore from the slurry supply pipe 41 for constituting slurry supply member 40 The upper surface Wa of abradant surface 25a and wafer W to grinding pad 25 provide as defined in supply amount slurry 45, even if slurry 45 is to card It disperses around disk workbench 3 and grinding pad 25, slurry 45 can also be remained in bucket portion 51.
Since after having retained slurry 45 in bucket portion 51, air supply member 55 sprays air from air ejiction opening 56 Spray out and by the slurry 45 remained in bucket portion 51, thus can to grinding pad 25 abradant surface 25a circulation provide slurry 45.
Therefore, the usage amount of slurry 45 can be suppressed to required minimum limit, slurry 45 is expeditiously followed Ring utilizes.
Size circulations component 70 shown in Fig. 4 is the variation of size circulations component.Size circulations component 70, which has, to retain The bucket portion 71 of the recess shapes of slurry and the air supply member 76 that air is connect and sprayed with the lower side of bucket portion 71.Bucket portion 71 Include: wrinkle portion 72 can stretch in the up-down direction；Bottom plate 73 is connect and in center with the lower end in wrinkle portion 72 Locate that there is the opening for exposing chuck table 3；And inner sidewall 74, it erects and is arranged from the inner peripheral of the opening.Air supplies Air ejiction opening 77 is included in the same manner as above-mentioned air supply member 55 to component 76, is formed in bottom plate 73；And air Supply source 79 is connect via valve 78 with air ejiction opening 77.The lifting cylinder 75 for keeping wrinkle portion 72 flexible and wrinkle portion 72 connect It connects.Lifting cylinder 75 includes: cylinder 750；Supporting part 751 links with the upper end in wrinkle portion 72；And piston 752, with Supporting part 751 connects.
As shown in figure 5, providing slurry when one side recycles grinding pad 25 by size circulations component 70, pass through grinding on one side When padding 25 pairs of wafer Ws and grinding, side is mobile upward in the inside of cylinder 750 for piston 752, thus makes on supporting part 751 It rises and extends wrinkle portion 72, will be surrounded around the grinding pad 25 and chuck table 3 at abrasion site by wrinkle portion 72. By using so as needed come the structure for making wrinkle portion 72 stretch in the up-down direction, as a result, in grinding other than feelings Under condition, it can prevent wrinkle portion 72 from becoming obstacle by making wrinkle portion 72 keep out of the way lower section.Later, size circulations component 70 with Above-mentioned size circulations component 50 similarly, opens valve 78, is connected to air supply source 79 with air ejiction opening 77 and makes to provide Flow air from air ejiction opening 77 spray, by slurry 45 from bucket portion 51 spray and followed to the abradant surface 25a of grinding pad 25 Ring provides slurry 45.The usage amount of slurry 45 can be also suppressed to required minimum limit and to slurry by size circulations component 70 45 are expeditiously recycled.
Slurry supply member 40 shown in above embodiment is constituted are as follows: slurry supply pipe 41 is inserted into passing through for main shaft 21 Slurry 45 is supplied in through-hole 26 and to the upper surface Wa of grinding pad 25 and wafer W, still, such as also may be constructed are as follows: with grinding Component separates and the configuration of slurry supply member to bucket portion 51,71 is directly fed slurry in the top of bucket portion 51,71.
Also, slurry in the above-described embodiment, is provided and by grinding pad to chip from slurry supply member 40 on one side It is ground, is on one side remained in slurry in bucket portion 51, but slurry can also be provided before making grinding pad and contact wafers And the slurry of defined amount has been retained in bucket portion 51,71 and then has made grinding pad 25 and contact wafers and is supplied by air Component 55 provides air and recycles to the abradant surface 25a of grinding pad 25 and provide slurry 45.
It in grinding device 1, also may be constructed are as follows: just will whenever the wafer W to arbitrary defined number is ground The slurry discharge in bucket portion 51,71 is remained in, and retains slurry in bucket portion 51,71 again in the grinding of next wafer W. If, can be with identical whenever being ground the slurry that just replacement remains in bucket portion 51,71 to multiple defined wafer Ws Processing speed carries out expeditiously attrition process to wafer W.
Size circulations component 50,70 shown in above embodiment can also be taken other than being mounted in grinding device 1 It is loaded in the processing unit (plant) for being able to carry out grinding and grinding.In such processing unit (plant), by the way that size circulations component is arranged, from And slurry can not be made to mix with grinding fluid and only recycle to slurry, therefore do not need discarded slurry.In addition, when at this When being ground in processing unit (plant) to chip, wiper mechanism etc. is preferably first passed through in advance, bucket portion 51,71 is cleaned and will include The grinding waste liquid of grindstone dust etc. removes.

Claims (1)

1. a kind of grinding device, includes
Chuck table keeps chip；
Grinding structural unit, with main shaft, the grinding pad which grinds the chip kept to the chuck table is pacified For that can rotate, which grinds chip by the abradant surface of the grinding pad dress；
The upper surface of slurry supply member, the chip that the abradant surface and the chuck table to the grinding pad are kept provides Slurry；And
Grinding feeding component, the upper surface of the chip kept with the chuck table closer and farther from direction on to this Grinding structural unit carries out grinding feeding,
It is characterized in that,
The grinding device has a size circulations component, the size circulations component retain the slurry on the downside of the chuck table and The abradant surface is recycled, the slurry is provided,
The size circulations component includes
The bucket portion of concave shape, it includes side wall, bottom plate and inner sidewall, the side wall is around the abradant surface for making the grinding pad and is somebody's turn to do The grinding pad and the chuck table at the abrasion site for the contact wafers that chuck table is kept, the bottom plate and the side wall Lower part connection and there is the opening for exposing the chuck table in center, which erects at the inner peripheral of the opening Setting；And
There is air supply member the abradant surface towards the grinding pad to spray air among the slurry for retaining in the bucket portion Air ejiction opening,
The grinding from the air that the air ejiction opening sprays is by the pulp spraying remained in the bucket portion and to the grinding pad Face circulation provides the slurry.
CN201610312950.7A 2015-05-14 2016-05-12 Grinding device Active CN106141902B (en)

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TWI665054B (en) 2019-07-11
KR102305377B1 (en) 2021-09-24
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JP6454599B2 (en) 2019-01-16
TW201702002A (en) 2017-01-16
JP2016215284A (en) 2016-12-22

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