CN106141452B - Self-adhesive packaging material laser die cutting device - Google Patents
Self-adhesive packaging material laser die cutting device Download PDFInfo
- Publication number
- CN106141452B CN106141452B CN201610656610.6A CN201610656610A CN106141452B CN 106141452 B CN106141452 B CN 106141452B CN 201610656610 A CN201610656610 A CN 201610656610A CN 106141452 B CN106141452 B CN 106141452B
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- Prior art keywords
- die
- silica gel
- cutting
- gel sheet
- laser
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- 239000000853 adhesive Substances 0.000 title claims abstract description 20
- 239000005022 packaging material Substances 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 84
- 239000011261 inert gas Substances 0.000 claims abstract description 54
- 238000003698 laser cutting Methods 0.000 claims abstract description 14
- 238000007599 discharging Methods 0.000 claims abstract description 9
- 239000007789 gas Substances 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 84
- 239000000741 silica gel Substances 0.000 claims description 84
- 229910002027 silica gel Inorganic materials 0.000 claims description 84
- 238000007789 sealing Methods 0.000 claims description 19
- 238000001514 detection method Methods 0.000 claims description 5
- 238000011084 recovery Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 9
- 239000001301 oxygen Substances 0.000 abstract description 9
- 229910052760 oxygen Inorganic materials 0.000 abstract description 9
- 238000001816 cooling Methods 0.000 abstract description 6
- 206010067484 Adverse reaction Diseases 0.000 abstract description 5
- 230000006838 adverse reaction Effects 0.000 abstract description 5
- 238000002955 isolation Methods 0.000 abstract description 2
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000002845 discoloration Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000000779 smoke Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000002633 protecting effect Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000002912 waste gas Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Packages (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser die-cutting device for self-adhesive packaging materials, which comprises a bracket, a laser cutting mechanism and a containing cavity, wherein the containing cavity is used for containing die-cutting materials, a light-transmitting plate is arranged on the containing cavity, the laser cutting mechanism is arranged above the light-transmitting plate, one end of the containing cavity is provided with a die-cutting material feeding hole, the other end of the containing cavity is provided with a die-cutting material discharging hole, an inert gas inlet is arranged on the die-cutting material feeding hole, an exhaust gas outlet is arranged on the die-cutting material discharging hole, and the inert gas inlet is connected with an inert gas storage mechanism through a pipeline. The invention has reasonable structural design, the die-cutting material is placed in the accommodating cavity filled with the inert gas, the inert gas is arranged around the die-cutting material, the temperature generated when the laser beam irradiates the die-cutting material is reduced by utilizing the cooling and air isolation effects of the inert gas, and adverse reaction with oxygen is avoided, so that the smooth cross section of the laser die-cutting is ensured, no oxide layer exists, and the quality of the laser die-cutting is improved.
Description
Technical Field
The invention relates to a laser die cutting device, in particular to a laser die cutting device for a self-adhesive packaging material.
Background
The laser die cutting is a continuous or intermittent cutting and indentation process by utilizing a high-energy high-density laser beam to quickly move according to a designed pattern and instantly heat a die cutting material to a gasification temperature. The laser die cutting uses high-energy laser beams to replace the traditional mechanical die cutting processing, the die cutting machine is labor-saving, fast, flexible, low in cost and very suitable for die cutting processing of self-adhesive labels and packaging materials.
However, when the self-adhesive labels and the packaging materials are subjected to laser die cutting, the laser cutting materials generate high temperature and react with oxygen in the air, so that the temperature of material die cutting slits can be increased, the high temperature leads to severe reaction and can not ensure smooth cross section, meanwhile, the high temperature can lead to burning and discoloration of printing ink on the self-adhesive labels and the packaging materials, irregular die cutting slits of film materials can be caused, the width of the die cutting slits is widened, gasified residues are attached to the die cutting edges, the edge of the paper material slit is oxidized and yellow, the width of the die cutting slits is widened, smoke is large and the like; in addition, oxidation reaction is added, so that a heat affected zone is increased, and the cutting quality is relatively poor.
The laser die cutting at present has the problems in use, the development of laser in the die cutting field of self-adhesive labels and packaging materials is restricted. Therefore, it is necessary to eliminate the adverse effects of the high temperature generated by cutting the material by the laser beam and the reaction with oxygen in the air in the laser die cutting.
Disclosure of Invention
Aiming at the defects, the invention aims to provide the laser die-cutting device for the self-adhesive packaging material, which is reasonable in structural design, the die-cutting material is placed in the accommodating cavity filled with the inert gas, the inert gas is arranged around the die-cutting material, the temperature generated when the laser beam irradiates the die-cutting material is reduced by utilizing the cooling and air isolation effects of the inert gas, and adverse reaction with oxygen is avoided, so that the smooth cross section of the laser die-cutting is ensured, no oxide layer exists, and the quality of the laser die-cutting is improved.
The technical scheme adopted by the invention for achieving the purpose is as follows:
the utility model provides a non-setting adhesive packaging material laser cross cutting device, includes support, laser cutting mechanism and holding cavity, its characterized in that, the holding cavity is used for holding cross cutting material, and is provided with the light-transmitting plate on this holding cavity, laser cutting mechanism sets up in the light-transmitting plate top, holding cavity one end is provided with cross cutting material feed inlet, and the other end is provided with cross cutting material discharge gate, is provided with the inert gas air inlet on this cross cutting material feed inlet, is provided with the waste gas vent on this cross cutting material discharge gate, and this inert gas air inlet has inert gas storage mechanism through the pipe connection.
As a further improvement of the present invention, the laser cutting mechanism is perpendicular to the light-transmitting plate.
As a further improvement of the invention, the upper end surface or the lower end surface of the accommodating cavity is a light-transmitting plate.
As a further improvement of the present invention, the light-transmitting plate is transparent glass.
As a further improvement of the invention, the die-cutting material feeding port is provided with a first silica gel sealing structure, the first silica gel sealing structure consists of a first upper silica gel sheet and a first lower silica gel sheet, and the first upper silica gel sheet and the first lower silica gel sheet are sunken into the accommodating cavity to form a Chinese character 'ji'; the thickness of the first upper silica gel sheet and the first lower silica gel sheet is 0.3-0.5mm, the lengths of the first upper silica gel sheet and the first lower silica gel sheet are larger than the length of the die cutting material feeding hole, and the sum of the widths of the first upper silica gel sheet and the first lower silica gel sheet is larger than the width of the die cutting material feeding hole.
As a further improvement of the invention, the die-cutting material discharge hole is provided with a second silica gel sealing structure, the second silica gel sealing structure consists of a second upper silica gel sheet and a second lower silica gel sheet, and the second upper silica gel sheet and the second lower silica gel sheet are sunken into the accommodating cavity to form a Chinese character 'ji'; the thicknesses of the second upper silica gel sheet and the second lower silica gel sheet are 0.1-0.2mm, the lengths of the second upper silica gel sheet and the second lower silica gel sheet are larger than the length of the die cutting material discharge hole, and the sum of the widths of the second upper silica gel sheet and the second lower silica gel sheet is equal to the width of the die cutting material discharge hole.
As a further improvement of the invention, the inert gas inlet is provided with a pressure sensor and an electronic gas valve.
As a further improvement of the invention, the accommodating cavity is provided with an inert gas detection mechanism and an inert gas recovery mechanism.
As a further improvement of the invention, a color mark sensor is arranged on the feeding hole of the die-cutting material, and the color mark sensor is arranged opposite to the front surface of the die-cutting material.
The beneficial effects of the invention are as follows: the die cutting material is placed in a closed accommodating cavity filled with inert gas, the inert gas has the cooling effect, the temperature generated when laser beams irradiate the die cutting material is reduced, adverse reaction with oxygen is avoided, the material is completely melted by means of laser energy, the poor chemical reaction generated by high temperature and oxygen of a die cutting joint of the material during laser die cutting is avoided, the temperature of a melting point area of the close material is relatively low, the burning and discoloration of printing ink are avoided, the inert gas has the cooling and protecting effects, the reaction is stable and uniform, the width of the die cutting joint is small, and the quality is high; the section is fine and smooth, the surface roughness is low, no oxide layer exists, the edge of the kerf does not yellow, and the smoke and dust are small; a silica gel sealing structure is respectively arranged at the die-cutting material feeding hole and the die-cutting material discharging hole, inert gas leakage and air doping are prevented, and sealing effect is improved.
The foregoing is a summary of the invention and is further defined by the following detailed description of the invention when read in conjunction with the accompanying drawings.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Detailed Description
In order to further describe the technical means and effects adopted by the present invention for achieving the intended purpose, the following detailed description of the specific embodiments of the present invention is given with reference to the accompanying drawings and preferred embodiments.
Referring to fig. 1, an embodiment of the present invention provides a laser die-cutting device for self-adhesive packaging materials, which includes a bracket 1, a laser cutting mechanism 2 and a receiving cavity 3, wherein the receiving cavity 3 is used for receiving a die-cutting material 10, a transparent plate 31 is disposed on the receiving cavity 3, the laser cutting mechanism 2 is disposed above the transparent plate 31, and the laser cutting mechanism 2 is disposed perpendicular to the transparent plate 31; one end of the accommodating cavity 3 is provided with a die-cutting material feeding hole 32, the other end is provided with a die-cutting material discharging hole 33, the die-cutting material feeding hole 32 is provided with an inert gas inlet 321, the die-cutting material discharging hole 33 is provided with an exhaust gas outlet, and the inert gas inlet 321 is connected with an inert gas storage mechanism 5 through a pipeline 4.
In this embodiment, the upper end surface or the lower end surface of the accommodating cavity 3 is a light-transmitting plate 31, that is, the light-transmitting plate 31 may be disposed on the upper end surface of the accommodating cavity 3 or may be disposed on the lower end surface of the accommodating cavity 3. Meanwhile, it is preferable that the light-transmitting plate 31 is transparent glass.
In order to prevent inert gas leakage in the accommodating cavity 3, the die-cutting material feeding port 32 is provided with a first silica gel sealing structure 6, the first silica gel sealing structure 6 is composed of a first upper silica gel sheet 61 and a first lower silica gel sheet 62, the first upper silica gel sheet 61 and the first lower silica gel sheet 62 are sunken into a Chinese character 'zhi' shape structure in the accommodating cavity 3, and when the die-cutting material 10 passes through the first silica gel sealing structure 6, the first upper silica gel sheet 61 and the first lower silica gel sheet 62 are tightly attached to the surface of the die-cutting material 10, so that inert gas leakage is prevented. The thicknesses of the first upper silica gel sheet 61 and the first lower silica gel sheet 62 are all 0.3-0.5mm, the lengths of the first upper silica gel sheet 61 and the first lower silica gel sheet 62 are both greater than the length of the die-cutting material feed inlet 32, and the sum of the widths of the first upper silica gel sheet 31 and the first lower silica gel sheet 32 is greater than the width of the die-cutting material feed inlet 32. Through setting up first silica gel seal structure 6 at cross cutting material feed inlet 32, improve the sealed tightness of first silica gel seal structure 6, have first upper silica gel piece 61 and first lower silica gel piece 62 of certain thickness, increase the extrusion dynamics to cross cutting material 10, realize good sealed effect, prevent that air doping from getting into the holding cavity 3 inside.
Meanwhile, the die-cutting material discharging hole 33 is provided with a second silica gel sealing structure 7, the second silica gel sealing structure 7 is composed of a second upper silica gel sheet 71 and a second lower silica gel sheet 72, the second upper silica gel sheet 71 and the second lower silica gel sheet 72 are sunken into the accommodating cavity 3 to form a character structure, and when the die-cutting material 10 passes through the second silica gel sealing structure 7, the second upper silica gel sheet 71 and the second lower silica gel sheet 72 are tightly attached to the surface of the die-cutting material 10, so that inert gas leakage is prevented. The thicknesses of the second upper silica gel sheet 71 and the second lower silica gel sheet 72 are 0.1-0.2mm, the lengths of the second upper silica gel sheet 71 and the second lower silica gel sheet 72 are larger than the length of the die-cutting material discharge hole 33, and the sum of the widths of the second upper silica gel sheet 71 and the second lower silica gel sheet 72 is equal to the width of the die-cutting material discharge hole 33. By providing the second upper and lower relatively thin silicone sheets 71, 72 at the die-cut material outlet 33, the sealing effect of the die-cut material outlet 33 is weaker, so that the waste gas can be discharged out of the accommodating cavity 3 along with the die-cut material 10.
As a further improvement of the present invention, the inert gas inlet 321 is provided with a pressure sensor and an electronic gas valve, when the inert gas pressure in the accommodating cavity 3 is greater than a set value, the pressure sensor is electrified to close the electronic gas valve; when the pressure value is smaller than the set pressure value, the pressure sensor is powered off, the electronic air valve is opened, and the inert gas enters the accommodating cavity 3 again.
As a further improvement of the invention, the accommodating cavity 3 is provided with an inert gas detection mechanism 8 and an inert gas recovery mechanism 9, when the concentration of the inert gas in the accommodating cavity 3 is smaller than a certain concentration, the inert gas detection mechanism 8 gives an instruction to the inert gas recovery mechanism 9 to start working, the inert gas in the accommodating cavity 3 is fully recovered, and meanwhile, an electronic air valve of the inert gas inlet 321 is instructed to be closed, so that the high-concentration inert gas is prevented from entering the accommodating cavity 3, and meanwhile, the feeding and receiving devices of the laser cutting mechanism 2 are instructed to stop working; when the inert gas in the accommodating cavity 3 is recovered, the inert gas detection mechanism 8 opens the electronic gas valve to enable the high-concentration pure inert gas to enter the accommodating cavity 3 when detecting that the inert gas concentration in the accommodating cavity 3 is 0, and simultaneously issues a command to the host computer to start conveying the die-cutting material 10.
Meanwhile, a color mark sensor is arranged on the die-cutting material feeding hole 32, and the color mark sensor is arranged opposite to the front surface of the die-cutting material 10.
The laser die-cutting device for the self-adhesive packaging material is suitable for laser die-cutting of self-adhesive labels and packaging materials, the die-cutting material 10 is placed in the accommodating cavity 3, inert gas is injected into the accommodating cavity 3 through the pipeline 4 during laser die-cutting, the accommodating cavity 3 is filled with the inert gas, laser beams emitted by the laser cutting mechanism 2 pass through the light-transmitting plate 31 and pass through the inert gas to irradiate the die-cutting material 10, and as the inert gas is arranged around the die-cutting material 10, the die-cutting temperature is reduced, the die-cutting material 10 is completely gasified by means of laser energy, adverse reaction with oxygen in air is avoided, and meanwhile, dust generated during laser die-cutting is taken away by an exhaust gas outlet.
The main point of the invention is that the die-cutting material is placed in a closed containing cavity filled with inert gas, the inert gas has the cooling effect, the temperature generated when laser beams irradiate the die-cutting material is reduced, adverse reaction with oxygen is avoided, the material is completely melted by means of laser energy, the poor chemical reaction generated by high temperature and oxygen of the die-cutting joint of the material during laser die-cutting is avoided, the temperature of the melting point area of the close material is relatively low, the burning and discoloration of printing ink are avoided, the cooling and protecting effects of the inert gas are added, the reaction is stable and uniform, the width of the die-cutting joint is small, and the quality is high; the section is fine and smooth, the surface roughness is low, no oxide layer exists, the edge of the kerf does not yellow, and the smoke and dust are small; and a silica gel sealing structure is respectively arranged at the die cutting material feeding hole and the die cutting material discharging hole, so that inert gas leakage is prevented, air doping is prevented, and the sealing effect is improved.
The foregoing is merely a preferred embodiment of the present invention, and the technical scope of the present invention is not limited to the above embodiments, so that other structures using the same or similar technical features as those of the above embodiments of the present invention are all within the scope of the present invention.
Claims (7)
1. The laser die-cutting device for the self-adhesive packaging material comprises a bracket, a laser cutting mechanism and a containing cavity, and is characterized in that the containing cavity is used for containing a die-cutting material, a light-transmitting plate is arranged on the containing cavity, the laser cutting mechanism is arranged above the light-transmitting plate, one end of the containing cavity is provided with a die-cutting material feeding port, the other end of the containing cavity is provided with a die-cutting material discharging port, an inert gas inlet is arranged on the die-cutting material feeding port, an exhaust gas outlet is arranged on the die-cutting material discharging port, and the inert gas inlet is connected with an inert gas storage mechanism through a pipeline; the die-cutting material feeding port is provided with a first silica gel sealing structure, the first silica gel sealing structure consists of a first upper silica gel sheet and a first lower silica gel sheet, and the first upper silica gel sheet and the first lower silica gel sheet are sunken into the accommodating cavity to form a Chinese character 'ji'; the thicknesses of the first upper silica gel sheet and the first lower silica gel sheet are 0.3-0.5mm, the lengths of the first upper silica gel sheet and the first lower silica gel sheet are larger than the length of the die cutting material feed inlet, and the sum of the widths of the first upper silica gel sheet and the first lower silica gel sheet is larger than the width of the die cutting material feed inlet; the die-cutting material discharge hole is provided with a second silica gel sealing structure, the second silica gel sealing structure consists of a second upper silica gel sheet and a second lower silica gel sheet, and the second upper silica gel sheet and the second lower silica gel sheet are sunken into the accommodating cavity to form a Chinese character 'zhu'; the thicknesses of the second upper silica gel sheet and the second lower silica gel sheet are 0.1-0.2mm, the lengths of the second upper silica gel sheet and the second lower silica gel sheet are larger than the length of the die cutting material discharge hole, and the sum of the widths of the second upper silica gel sheet and the second lower silica gel sheet is equal to the width of the die cutting material discharge hole.
2. The laser die cutting device for self-adhesive packaging materials according to claim 1, wherein the laser cutting mechanism is arranged perpendicular to the light-transmitting plate.
3. The laser die-cutting device for the self-adhesive packaging material according to claim 1, wherein the upper end surface or the lower end surface of the accommodating cavity is a light-transmitting plate.
4. The laser die cutting device for self-adhesive packaging materials according to claim 1, wherein the light-transmitting plate is transparent glass.
5. The laser die cutting device for the self-adhesive packaging material according to claim 1, wherein the inert gas inlet is provided with a pressure sensor and an electronic gas valve.
6. The laser die-cutting device for the self-adhesive packaging material according to claim 1, wherein the accommodating cavity is provided with an inert gas detection mechanism and an inert gas recovery mechanism.
7. The laser die-cutting device for the self-adhesive packaging material according to claim 1, wherein a color mark sensor is arranged on the die-cutting material feeding hole, and the color mark sensor is arranged opposite to the front surface of the die-cutting material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610656610.6A CN106141452B (en) | 2016-08-11 | 2016-08-11 | Self-adhesive packaging material laser die cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610656610.6A CN106141452B (en) | 2016-08-11 | 2016-08-11 | Self-adhesive packaging material laser die cutting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106141452A CN106141452A (en) | 2016-11-23 |
| CN106141452B true CN106141452B (en) | 2024-02-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610656610.6A Active CN106141452B (en) | 2016-08-11 | 2016-08-11 | Self-adhesive packaging material laser die cutting device |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| LU93248B1 (en) * | 2016-10-04 | 2018-04-05 | Soremartec Sa | Laser treatment of wrapping materials |
| CN107350638A (en) * | 2017-09-13 | 2017-11-17 | 广东亿鑫丰智能装备股份有限公司 | Anti-splashing laser die cutting device and method |
| CN108714746B (en) * | 2018-07-09 | 2021-03-12 | 奇鋐科技股份有限公司 | Jig structure of heat dissipation unit |
| US11033989B2 (en) | 2018-07-22 | 2021-06-15 | Asia Vital Components Co., Ltd. | Jig structure for manufacturing heat dissipation unit |
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| US4642445A (en) * | 1985-06-28 | 1987-02-10 | Westinghouse Electric Corp. | Shielding apparatus for metal processing operations |
| JP2013180938A (en) * | 2012-03-02 | 2013-09-12 | Seiko Epson Corp | Member processing method and substrate for electronic component |
| CN203265222U (en) * | 2012-11-20 | 2013-11-06 | 通快机床两合公司 | Machine for hotly dividing workpiece and fragment car for machine |
| CN205043359U (en) * | 2015-10-10 | 2016-02-24 | 中国科学院西安光学精密机械研究所 | Closed type inflating surface pressurizing and clamping device and system |
| CN206216129U (en) * | 2016-08-11 | 2017-06-06 | 东莞市金运汇研激光科技有限公司 | A kind of adhesive sticker packaging material laser die cutting device |
-
2016
- 2016-08-11 CN CN201610656610.6A patent/CN106141452B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4642445A (en) * | 1985-06-28 | 1987-02-10 | Westinghouse Electric Corp. | Shielding apparatus for metal processing operations |
| JP2013180938A (en) * | 2012-03-02 | 2013-09-12 | Seiko Epson Corp | Member processing method and substrate for electronic component |
| CN203265222U (en) * | 2012-11-20 | 2013-11-06 | 通快机床两合公司 | Machine for hotly dividing workpiece and fragment car for machine |
| CN205043359U (en) * | 2015-10-10 | 2016-02-24 | 中国科学院西安光学精密机械研究所 | Closed type inflating surface pressurizing and clamping device and system |
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| CN106141452A (en) | 2016-11-23 |
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Address after: 523000 No. 21, Dayu Road, Dayu village, Huangjiang Town, Dongguan City, Guangdong Province Applicant after: Dongguan Huiyue Technology Co.,Ltd. Address before: 523000 No. 21, Dayu Road, Dayu village, Huangjiang Town, Dongguan City, Guangdong Province Applicant before: DONGGUAN JINYUN HUIYAN LASER TECHNOLOGY CO.,LTD. |
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