CN106134013B - 插座组件、插头组件和连接器*** - Google Patents

插座组件、插头组件和连接器*** Download PDF

Info

Publication number
CN106134013B
CN106134013B CN201580014642.XA CN201580014642A CN106134013B CN 106134013 B CN106134013 B CN 106134013B CN 201580014642 A CN201580014642 A CN 201580014642A CN 106134013 B CN106134013 B CN 106134013B
Authority
CN
China
Prior art keywords
port
plug
card slot
midfeather
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580014642.XA
Other languages
English (en)
Other versions
CN106134013A (zh
Inventor
肯特·E·雷尼尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Molex LLC
Original Assignee
Molex LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex LLC filed Critical Molex LLC
Priority to CN201710174054.3A priority Critical patent/CN106936034B/zh
Publication of CN106134013A publication Critical patent/CN106134013A/zh
Application granted granted Critical
Publication of CN106134013B publication Critical patent/CN106134013B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
    • H01R25/006—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits the coupling part being secured to apparatus or structure, e.g. duplex wall receptacle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/717—Structural association with built-in electrical component with built-in light source
    • H01R13/7172—Conduits for light transmission
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1078—Leads having locally deformed portion, e.g. for retention

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

本发明提供插座组件、插头组件和连接器***，其中一插座包括可以0.6mm(或更大)的间距设置在一卡槽中的多个端子。一施压元件可设置在所述卡槽中，以接合一对接的板卡。所述插座能设置成允许空气从一前面向一后面流动，空气通过一中间壁。一插头组件可设置成包括一导热本体且设置成产生一些热量。所述本体可包括具有多个冷却槽的一表面。所述多个冷却槽允许空气流过所述插头组件，从而所述插头组件能被直接冷却。

Description

插座组件、插头组件和连接器***
相关申请
本申请主张于2014年3月27日提交的美国临时专利申请号US61/971366的优先权，该申请通过援引其整体合并于本文。
技术领域
本申请涉及连接器领域，更具体而言涉及适用于支持日益增长的密度需求的连接器。
背景技术
习知有多种输入/输出(IO)连接器。一些常见类型的连接器包括SFP式连接器、QSFP式连接器以及CXP式连接器。往往使用这些连接器的一种用途是机架安装式交换机(rack mounted switch)，从而可以给其它设备提供许多连接点(connection)且能支持高带宽的要求。这些连接器尽管是适用的(useful)，但是往往构造成将多个端子以一0.8或0.75mm的间距设置于一卡槽上。各卡槽能使多个端子设置于该卡槽的两侧。因此，设置多个端子的间距往往限制成排设置的端子的数量且由此限制能由一1U机架***(rack system)支持的带宽。尽管已知有多种具有小间距的IO连接器，但是在一插头连接器中使用一板卡(paddle card)的常规的IO连接器(例如SFP、QSFP、CXP式连接器)采用0.75mm或更大的间距，以适应***卡槽中的板卡的固有公差(inherent tolerance)(因为板卡典型地采用一PCB结构形成)。板卡是可取的，除了板卡会潜在地有助改善公差累积之外，它能支持使***工作的电路，特别是针对主动式铜缆(active copper)和光纤基的插头组件。
已确定的是，当试图提供具有0.65mm或更小间距的端子的卡槽时，如果采用常规的构造技术，那么用于形成一板卡的电路板的公差会变成问题。有助解决这个问题的一个方法是在一罩体中使用一施压元件(biasing element)，该施压元件有助朝向一端口(port)的一侧对插头连接器施压。然而，某些人群会赏识一连接器***的进一步改进。
另外，现有的***往往难以冷却，特别是如果多个***以一堆叠结构设置。由此，某些人群会赏识会有助解决热管理问题的一连接器***。
发明内容
提供了一种连接器，所述连接器使多个端子以一0.6mm-0.65mm(例如在0.59与0.66mm之间)的间距设置于一卡槽内。一施压元件设置于所述卡槽的一端，以提供充分的公差控制。所述连接器能构造成支持有源线缆组件和光学模块(例如可以产生热负荷的模块)，且在一实施例中，所述连接器能支持产生2W功率的模块。为了在一堆叠结构中提供冷却，空气流被引导穿入所述连接器、流过所述模块并从所述连接器的后面(back)流出，从而当空气流动通过所述***时所述模块能被直接冷却。
附图说明
本申请通过举例示出但不受限于附图，在附图中类似的附图标记表示类似的部件，而且在附图中：
图1示出一插座组件对接一插头组件的一实施例的一立体图。
图2示出图1中所示的实施例的一立体图，其中一个插头组件处于脱离对接的状态。
图3示出图1中所示的实施例的另一立体图，其中一个插头组件被省略。
图4示出图3所示的实施例的一部分分解立体图。
图5示出图3所示的实施例的一前视图。
图6示出沿图2的线6-6剖开的一侧视图。
图7示出图6所示的实施例的一立体图。
图8示出图7所示的实施例的一简化的立体图。
图9示出图8所示的实施例的一部分分解立体图。
图10示出图9所示的实施例的另一立体图。
图11示出图8所示的实施例的另一立体图。
图12示出图2所示的实施例的一放大立体图。
图13示出沿图2的线13-13剖开的一立体图。
图14示出沿图2的线14-14剖开的一立体图。
图15示出沿图2的线15-15剖开的一立体图。
图16A示出一插座组件的另一实施例的一立体图。
图16B示出图16A所示的实施例的一放大立体图。
图17A示出沿图16A的线17-17剖开的一立体图。
图17B示出图17A所示的实施例的一前视图。
图18示出沿图2的线18-18剖开的一立体图。
图19示出图18所示的实施例的一简化前视图。
图20示出一插座组件的一实施例的一部分立体图。
图21示出图20所示的实施例的另一立体图。
图22示出图20所示的实施例的另一立体图。
具体实施方式
下面具体的说明描述多个示范性实施例且不意欲限制到明确公开的组合。因此，除非另有说明，本文所公开的各种特征可以组合在一起而形成出于简明目的而未示出的多个另外组合。此外，所描述的特征可以单独使用，也可以与其他描述的多个特征的子集组合使用，以提供适于相应应用的功能。因此，除非另有说明，所描述的实施例不意欲是限制。
参照附图，一插座组件10安装在一电路板5上。所述插座组件10包括一罩体30以及多个端口12，所述多个端口12构造成收容插头组件90。
如已知的，一插头组件90可包括连接于一本体92的一线缆93且所示出的实施例包括一扣持件91，扣持件91设置成允许一扣持***可脱离地接合插座组件10。一插头组件90的替代实施例可包括不使一线缆与其连接的一本体(诸如针对能***插头组件中的光学连接器提供的实施例)。本体92保护能使多个垫以一0.65或0.60mm的间距设置的一板卡95，且板卡95是插头组件90与插座组件10之间的连接界面的一部分。所示出的本体92包括一表面94，表面94包括多个冷却槽96，所述多个冷却槽96延伸于将***端口12中的所述本体92的大部分长度，且在一实施例中所述多个冷却槽96沿上表面94延伸到超过突部60的前端60a的一端92a。当插头组件90***端口12中时，所述多个冷却槽96允许空气流动穿过端口12，且与现有设计相比显著提高了冷却效率，因为空气流能直接冷却插头组件90。
插座组件10包括一顶壁31a、两个侧壁31b以及一后壁31c。一底壁31d也能设置成提高屏蔽性能。一基座50设置于所述罩体30内并支撑一薄片体阵列40。基座50包括一突部60且一卡槽62设置于突部60。卡槽62包括一施压元件68，施压元件68构造成接合板卡95并朝向卡槽62的一侧对板卡95施压。这使得控制板卡95与所述卡槽62面对面并消除一定范围内的与板卡95上的多个垫的位置与设置在卡槽62内的多个接触部的位置关联的公差。可由绝缘树脂制成的基座50还包括另外冷却的空气通道52，且具有扣持在基座50上并有助将薄片体阵列40固定就位的一后支撑部54。
如已知的，薄片体阵列40包括多个薄片体41，且各薄片体41支撑多个端子，各端子具有一尾部42以及一接触部44。所述多个接触部44设置在卡槽62内且典型地布置成一些接触部44设置在卡槽62相反的两侧。为了提高性能，短肋部67将形成一差分对45的信号端子隔开，而长肋部65设置在信号端子与相应的接地端子之间。因为所述多个接触部44以一单排按一恒定间距设置，所以短肋部67提供了信号端子之间的电隔离和保护，而与信号端子相关的介电常数相比，长肋部65增加了信号端子与接地端子之间的介电常数(dielectriccontact)，以提供差分对之间的优选的耦合(例如，尽管所述多个端子为一恒定间距，但是与对称连接相比，差分耦合能够承载更多的能量)。换言之，肋部65、67形成有助保护接触部44的沟槽且信号端子与形成在卡槽62中的凹部69对齐，凹部69有助降低信号端子的接触部44附近的介电常数。
所述罩体30包括能为罩体30的其它部分提供结构支撑的一前部32，且前部32可包括从底壁31d延伸的肩部38，能够支撑设置于所述端口12内的EMI垫片32a以助使EMI辐射最小化。光导管(light pipe)29(因为它们通常是透光的，所以它们在图中示出为透明的)可被设置且典型地将设置为将光从所述支撑电路板5朝向前面11a引导，前面11a通常在所述两个端口12之间。
为了有助限定端口12，设置一中央支撑件21。中央支撑件21由受两个侧壁31b支撑且形成有一顶壁21a和一底壁21b以分别用于限定一端口12的底部或一端口12的顶部。一中央通道26由中央支撑件21限定。顶壁21a和底壁21b均具有凹槽23，以进一步允许空气流进入端口12。一插件15可设置于中央支撑件21。插件15包括具有多个前开孔16a的一前壁16，所述多个前开孔16a允许空气流动穿过前壁16，且插件15进一步允许采用多个光导管29来照亮相应的区域的多个指示器。
所述插座组件10还包括一中间壁70，中间壁70具有由多个中间开孔72a形成的中间阵列72，且还包括设置在上部的端口12处的多个开孔72b且包括设置在下部的端口12处的开孔72c。开孔72a、72b、72c允许空气流过中间壁70，同时依然提供所需的EMI保护。中间壁70具有多个切缺部(cutout)73，所述多个切缺部73允许所述多个光导管29延伸通过中间壁70。由此，所示出的设计允许采用多个光导管29同时依然提供改进的冷却能力。
多个后开孔34a允许空气流动通过后壁31c。基座50设计成在基座50的侧面存在有足够的空间，从而空气能从中间壁70流动到后壁31c。由此，如能够认识到的，插座组件10设置成允许大量的空气从前面11a流动到后面11b(或以相反的方向)。具体地，如果空气从前面11a流动到后面11b，那么插件15设置成允许空气流动通过前壁16，空气流动通过中央通道26、然后流动通过中间壁70、流动通过基座50以及最后从后壁31c流出。
如能够认识到的，一卡槽62在所示出的实施例中公开为以0.6mm或0.65mm的间距设置多个端子。为了提供必要的公差，一施压元件68设置于所述卡槽62内，且施压元件68有助确保所述板卡95的一侧的位置为已知的(一侧被压靠在所述卡槽的一侧上)。这减少了公差累积，从而一0.6mm间距的连接器对于采用一常规的板卡为基础的连接器而言是可行的。与现有设计相比，这在对整个插头连接器施压上提供了进一步的改进，因为已确定的是，板卡95在插头连接器90内的位置的公差累积存在可能(potential)。然而，所描述的实施例消除了公差累积的形成，因为板卡95的缘部95a变成一基准点(datum)。如果板卡95的缘部95a用于使设置于板卡95的多个垫97对准，那么所述公差能被进一步得到改善。另外，用于形成板卡的标准构造技术会导致公差累积，这会妨碍0.6mm间距的端子以可靠的方式工作。
应注意的是，如果多个端子以更大的间距(诸如0.7mm或更大)设置，那么所述施压元件68可以省略。所述连接器的设计在小型封装中依然能够提供所需的冷却性能，且不管端子间距的大小如何，冷却用特征均能结合到连接器中。
在任何情况下，所述插头组件90无需设置多个冷却槽96。例如，如果插头组件90是一被动(passive)部件，那么它几乎没有对冷却的需求，所以所述多个冷却槽可以忽略。
本文给出的申请以其优选实施例及示范性实施例说明了各个特征。本领域技术人员在阅读本申请后将作出落入随附权利要求的范围和精神内的许多其它的实施例、修改、以及变形。

Claims (13)

1.一种插座组件，包括：
一罩体，包括一前面、一后面、一第一端口、一第二端口以及位于所述第一端口与所述第二端口之间的一中央通道；和
一基座，设置于所述罩体内，所述基座具有与所述第一端口对准的一第一卡槽以及与所述第二端口对准的一第二卡槽；
其中，所述中央通道由一中央支撑件限定，所述中央支撑件形成有一顶壁和一底壁，所述顶壁和所述底壁分别用于限定所述第一端口的底部和所述第二端口的顶部，所述罩体和所述基座设置成允许空气从所述前面流到所述后面，空气通过所述中央通道。
2.如权利要求1所述的插座组件，其中，所述第一卡槽包括以0.6mm和0.65mm之间的一间距设置的多个端子，所述第一卡槽包括位于一侧的一施压元件。
3.如权利要求1所述的插座组件，其中，所述基座支撑多个光导管。
4.如权利要求1所述的插座组件，还包括一中间壁，所述中间壁具有允许空气流动通过所述中间壁的多个开孔。
5.一种插头组件，包括：
一基座，包括一顶表面以及一底表面，所述基座由一导热材料制成；以及
一板卡，设置于所述基座内，所述板卡朝向所述插头组件的一前端延伸；
其中，所述顶表面和所述底表面的其中之一具有沿所述插头组件的长度延伸的多个凹槽，所述基座包括能够***一端口的部分，并且所述多个凹槽沿着该部分延伸。
6.如权利要求5所述的插头组件，其中，所述板卡具有以一0.6mm的间距设置的多个接触垫，所述多个接触垫与所述板卡的一侧对准。
7.一种连接器***，包括：
一插座组件，具有限定一端口的一罩体以及设置在所述罩体内的一基座，所述罩体具有一后壁，且所述基座具有与所述端口对准的一卡槽，所述卡槽具有多个端子，使所述多个端子的接触部设置于所述卡槽内，所述多个接触部成排设置且以0.59mm到0.66mm之间的一间距设置，所述卡槽具有设置在所述卡槽的一第一侧的一施压元件；
一插头组件，设置于所述端口内，所述插头组件包括一本体以及一板卡，所述板卡具有与所述多个接触部接合的多个垫，所述板卡具有被压靠到所述卡槽的一第二侧的一缘部，所述第一侧与所述第二侧相对，所述插头组件包括在所述本体上的一第一表面，且所述第一表面包括多个冷却槽，所述多个冷却槽延伸于将***所述端口中的所述本体的大部分长度，从而使得所述多个冷却槽设置成在所述插头组件设置在所述端口中时允许空气流动通过所述端口。
8.如权利要求7所述的连接器***，其中，所述插座组件为一堆叠连接器，且所述端口为一第一端口，所述插座组件还包括竖向设置在所述第一端口之上的一第二端口，所述基座还支撑与所述第二端口对准的一第二卡槽，所述第二卡槽具有位于所述第二卡槽的一第一侧的一施压元件。
9.如权利要求8所述的连接器***，其中，所述插座组件包括一前面、一后面以及位于所述前面和所述后面之间的一中间壁，所述中间壁具有允许空气穿过所述中间壁的多个开孔，所述插座组件还包括一中央通道，所述中央通道设置成允许空气从所述前面流动到所述中间壁。
10.如权利要求9所述的连接器***，其中，所述插座组件包括一插件，所述插件设置于所述前面处的所述中央通道中，且所述插件包括允许空气流动穿过所述插件进入到所述中央通道中的多个开孔。
11.如权利要求10所述的连接器***，其中，所述基座与所述罩体间隔开，从而空气能在所述基座与所述罩体之间的一空间中从所述中间壁流动到所述后壁。
12.如权利要求11所述的连接器***，其中，所述中间壁的多个开孔与所述第一端口及所述第二端口对准，且所述中间壁的多个开孔设置成允许空气流动穿过所述第一端口及所述第二端口以流动通过所述中间壁的多个开孔。
13.如权利要求7所述的连接器***，其中，所述多个垫与所述板卡的所述缘部对准。
CN201580014642.XA 2014-03-27 2015-03-26 插座组件、插头组件和连接器*** Active CN106134013B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710174054.3A CN106936034B (zh) 2014-03-27 2015-03-26 插头连接器和连接器***

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461971366P 2014-03-27 2014-03-27
US61/971,366 2014-03-27
PCT/US2015/022705 WO2015148786A1 (en) 2014-03-27 2015-03-26 Thermally efficient connector system

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201710174054.3A Division CN106936034B (zh) 2014-03-27 2015-03-26 插头连接器和连接器***

Publications (2)

Publication Number Publication Date
CN106134013A CN106134013A (zh) 2016-11-16
CN106134013B true CN106134013B (zh) 2019-05-07

Family

ID=54196389

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201710174054.3A Active CN106936034B (zh) 2014-03-27 2015-03-26 插头连接器和连接器***
CN201580014642.XA Active CN106134013B (zh) 2014-03-27 2015-03-26 插座组件、插头组件和连接器***

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201710174054.3A Active CN106936034B (zh) 2014-03-27 2015-03-26 插头连接器和连接器***

Country Status (6)

Country Link
US (3) US9960553B2 (zh)
EP (1) EP3123572B1 (zh)
JP (1) JP6479840B2 (zh)
CN (2) CN106936034B (zh)
TW (2) TWI675513B (zh)
WO (1) WO2015148786A1 (zh)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6479840B2 (ja) 2014-03-27 2019-03-06 モレックス エルエルシー 熱効率の良いコネクタシステム
CN110531473A (zh) * 2015-09-10 2019-12-03 申泰公司 具有高热消散模块的机架安装式设备和具有增加的冷却的收发器插座
US10164362B2 (en) 2015-12-31 2018-12-25 Foxconn Interconnect Technology Limited Plug connecetor with a metallic enclosure having heat sink member thereon
US9825408B2 (en) * 2016-03-14 2017-11-21 Te Connectivity Corporation Connector module assembly having a gasket plate
US9666997B1 (en) * 2016-03-14 2017-05-30 Te Connectivity Corporation Gasket plate for a receptacle assembly of a communication system
US11309655B2 (en) 2016-05-16 2022-04-19 Molex, Llc High density receptacle
EP3327869B1 (de) * 2016-11-23 2019-01-09 MD Elektronik GmbH Elektrischer steckverbinder für ein mehradriges elektrisches kabel
CN107046206B (zh) * 2017-01-23 2021-07-20 富士康(昆山)电脑接插件有限公司 电连接器
FR3063838A1 (fr) 2017-03-10 2018-09-14 Radiall Ensemble de connexion d'une fiche a une embase de panneau de boitier d'equipement electronique, integrant un moyen de regulation thermique, fiche et embase associees
MY192137A (en) * 2017-06-07 2022-07-29 Samtec Inc Transceiver assembly array with fixed heatsink and floating transceivers
WO2018231822A1 (en) * 2017-06-13 2018-12-20 Molex, Llc High density receptacle
US10644472B2 (en) * 2017-06-28 2020-05-05 Mellanox Technologies, Ltd. Cable adapter
US10381761B2 (en) * 2017-07-21 2019-08-13 Quanta Computer Inc. Add-on processing unit with I/O connectors
US20190068768A1 (en) * 2017-08-31 2019-02-28 Rohan Garg Privacy protection system
US11101610B2 (en) * 2017-10-11 2021-08-24 Guangdong Gopod Group Holding Co., Ltd. Connector converter
KR20230173753A (ko) * 2017-11-21 2023-12-27 몰렉스 엘엘씨 키이-결합식 입력/출력 커넥터
CN109980400B (zh) * 2017-12-28 2021-07-23 泰科电子(上海)有限公司 连接器
CN111630726B (zh) * 2018-01-09 2022-08-02 莫列斯有限公司 高密度插座
US10705309B2 (en) 2018-06-06 2020-07-07 Mellanox Technologies, Ltd. RF EMI reducing fiber cable assembly
US10506737B1 (en) * 2018-12-17 2019-12-10 Te Connectivity Corporation Airflow fairings for circuit card assemblies of a communication system
CN111416239A (zh) * 2019-01-08 2020-07-14 泰科电子(上海)有限公司 导框、电器设备和隔离组件
US10741954B1 (en) 2019-03-17 2020-08-11 Mellanox Technologies, Ltd. Multi-form-factor connector
US10873161B2 (en) * 2019-05-06 2020-12-22 Te Connectivity Corporation Receptacle assembly having cabled receptacle connector
DE102019111749A1 (de) 2019-05-07 2020-11-12 Te Connectivity Germany Gmbh Elektrischer Steckverbinder sowie elektrische Steckverbindung
US11169330B2 (en) 2019-10-24 2021-11-09 Mellanox Technologies Tlv Ltd. Wavelength-splitting optical cable
US11011861B1 (en) * 2019-10-25 2021-05-18 TE Connectivity Services Gmbh Stacked receptacle connector assembly
CN111883962A (zh) 2020-07-03 2020-11-03 东莞立讯技术有限公司 电连接器组件以及电连接器组合件
EP4214081A1 (en) 2020-09-18 2023-07-26 Nubis Communications, Inc. Data processing systems including optical communication modules
US11327257B1 (en) * 2020-10-22 2022-05-10 Mellanox Technologies, Ltd. Networking communication adapter
US11650385B2 (en) * 2021-02-03 2023-05-16 Cisco Technology, Inc. Optical module cages mounted for optimal density and cooling
US11855381B2 (en) * 2022-02-16 2023-12-26 Hewlett Packard Enterprise Development Lp Chassis having an insertion key assembly for a pluggable module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101924304A (zh) * 2009-02-17 2010-12-22 泰科电子公司 具有电磁密封元件的连接器组件
CN102148435A (zh) * 2009-09-08 2011-08-10 泰科电子公司 模块连接器***
CN102570152A (zh) * 2010-10-25 2012-07-11 莫列斯公司 连接器组件

Family Cites Families (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5767999A (en) * 1996-05-02 1998-06-16 Vixel Corporation Hot-pluggable/interchangeable circuit module and universal guide system having a standard form factor
JPH10189178A (ja) 1996-12-26 1998-07-21 Dai Ichi Denshi Kogyo Kk 電気コネクタ
US6062893A (en) * 1998-06-04 2000-05-16 Molex Incorporated Adapter frame for an electrical connector
US6585534B2 (en) * 1998-08-20 2003-07-01 Intel Corporation Retention mechanism for an electrical assembly
US6178096B1 (en) * 1998-11-25 2001-01-23 The Whitaker Corporation Shielding cover having parts held together by latch members
US7013088B1 (en) * 1999-05-26 2006-03-14 Jds Uniphase Corporation Method and apparatus for parallel optical interconnection of fiber optic transmitters, receivers and transceivers
US6431765B1 (en) * 1999-06-11 2002-08-13 Cisco Technology Inc. Distributed network repeater module and method
JP2001118629A (ja) * 1999-10-18 2001-04-27 Jst Mfg Co Ltd コネクタ及びコネクタに装着された電子モジュールの冷却方法
GB2373374B (en) * 2001-03-15 2004-03-17 Agilent Technologies Inc Novel fiber optic transceiver module
US7314318B2 (en) * 2001-03-15 2008-01-01 International Business Machines Corporation Compact optical transceivers including thermal distributing and electromagnetic shielding systems and methods thereof
TW514327U (en) * 2001-06-06 2002-12-11 Hon Hai Prec Ind Co Ltd Photoelectric signal converter
US6600865B2 (en) * 2001-06-21 2003-07-29 Hon Hai Precision Ind. Co., Ltd. Stacked GBIC guide rail assembly
TW582559U (en) * 2001-10-17 2004-04-01 Hon Hai Prec Ind Co Ltd Optical transceiver
DE60200142T2 (de) * 2002-03-05 2004-07-08 Agilent Technologies Inc., A Delaware Corp., Palo Alto Opto-elektronisches Modul mit elektromagnetischer Abschirmung
WO2003077377A1 (en) * 2002-03-06 2003-09-18 Tyco Electronics Corporation Receptacle assembly having shielded interface with pluggable electronic module
US7371965B2 (en) * 2002-05-09 2008-05-13 Finisar Corporation Modular cage with heat sink for use with pluggable module
US6870746B2 (en) * 2002-11-06 2005-03-22 Agilent Technologies, Inc. Electronic module
US6975510B1 (en) * 2003-05-09 2005-12-13 Linux Networx Ventilated housing for electronic components
CN201243428Y (zh) * 2003-06-27 2009-05-20 莫莱克斯公司 接纳电子模块的适配器框架和框架及附着到电路板的框架
GB2405264B (en) * 2003-08-20 2007-02-28 Agilent Technologies Inc Pluggable optical subassembly
US7070446B2 (en) * 2003-08-27 2006-07-04 Tyco Electronics Corporation Stacked SFP connector and cage assembly
US7023703B2 (en) * 2003-10-20 2006-04-04 Molex Incorporated Module retention latch assembly
JP4026605B2 (ja) * 2004-03-01 2007-12-26 松下電工株式会社 電線接続用コネクタの製造方法
JP2005316475A (ja) * 2004-04-29 2005-11-10 Sumitomo Electric Ind Ltd 光トランシーバ
US7357673B2 (en) * 2004-06-30 2008-04-15 Molex Incorporated Shielded cage assembly for electrical connectors
US7281862B2 (en) * 2005-03-31 2007-10-16 Intel Corporation Optical device latching mechanism
TWI276857B (en) * 2005-06-10 2007-03-21 Delta Electronics Inc A connecting module for communication
JP4517998B2 (ja) * 2005-10-07 2010-08-04 パナソニック電工株式会社 メモリカード用ソケット
CN101313440A (zh) * 2005-11-15 2008-11-26 松下电工株式会社 用于小型记录介质的连接器
JP4730092B2 (ja) * 2005-12-28 2011-07-20 日立電線株式会社 ラッチ機構及びラッチ機構付き電子モジュール
WO2008070873A2 (en) * 2006-12-07 2008-06-12 Finisar Corporation Electromagnetic radiation containment and heat management in an electronic module
US7484987B2 (en) * 2006-12-19 2009-02-03 Finisar Corporation Latch assembly for an optoelectronic module
US7646615B2 (en) * 2006-12-19 2010-01-12 Finisar Corporation Electromagnetic inferference shield for an optoelectronic module
US7543995B2 (en) * 2006-12-19 2009-06-09 Finisar Corporation Optical subassembly connector block for an optoelectronic module
US7547149B2 (en) * 2006-12-19 2009-06-16 Finisar Corporation Optical connector latch assembly for an optoelectronic module
US7845975B2 (en) * 2007-01-30 2010-12-07 Pulse Engineering, Inc. Low-profile connector assembly and methods
US7597573B2 (en) 2007-02-26 2009-10-06 Tyco Electronics Corporation Low profile high current power connector with cooling slots
US7764504B2 (en) * 2007-05-16 2010-07-27 Tyco Electronics Corporation Heat transfer system for a receptacle assembly
US7914317B2 (en) * 2007-08-24 2011-03-29 Methode Electronics, Inc. Reverse cam release mechanism
JP4915342B2 (ja) * 2007-12-21 2012-04-11 住友電気工業株式会社 光トランシーバの放熱装置
US8684765B2 (en) 2008-10-31 2014-04-01 Tyco Electronics Corporation Connector assembly including a light pipe assembly
WO2010068671A1 (en) * 2008-12-12 2010-06-17 Molex Incorporated Resonance modifying connector
WO2010104847A1 (en) * 2009-03-10 2010-09-16 Molex Incorporated Connector assembly with improved cooling capability
US8535787B1 (en) * 2009-06-29 2013-09-17 Juniper Networks, Inc. Heat sinks having a thermal interface for cooling electronic devices
US8035973B2 (en) * 2009-08-31 2011-10-11 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Cage having a heat sink device secured thereto in a floating arrangement that ensures that continuous contact is maintained between the heat sink device and a parallel optical communications device secured to the cage
US8534930B1 (en) * 2009-09-24 2013-09-17 Juniper Networks, Inc. Circuit boards defining openings for cooling electronic devices
CN102906947B (zh) 2009-11-13 2016-04-13 安费诺有限公司 高性能、小形状因数的带有常规模式电抗控制的连接器
JP5418187B2 (ja) 2009-12-02 2014-02-19 ソニー株式会社 接触操作判定装置、接触操作判定方法およびプログラム
US8345426B2 (en) * 2010-08-16 2013-01-01 Tyco Electronics Corporation Guide system for a card module
CN102403602B (zh) * 2010-09-13 2014-05-14 凡甲电子(苏州)有限公司 插座电源连接器、插头电源连接器及其组件
US8038466B1 (en) 2010-09-13 2011-10-18 Alltop Electronics (Suzhou) Co., Ltd Power receptacle with enlarged heat dissipation path formed on mating face and power connector assembly thereof
US8277252B2 (en) * 2010-10-01 2012-10-02 Tyco Electronics Corporation Electrical connector assembly
US8545268B2 (en) * 2010-10-01 2013-10-01 Tyco Electronics Corporation Electrical connector assembly
US8545267B2 (en) * 2010-10-01 2013-10-01 Tyco Electronics Corporation Electrical connector assembly
CN102544796B (zh) * 2010-12-28 2014-06-18 凡甲电子(苏州)有限公司 卡缘连接器及其组件
JP5083426B2 (ja) * 2011-03-14 2012-11-28 オムロン株式会社 端子およびこれを用いたコネクタ
US9419403B2 (en) * 2011-07-01 2016-08-16 Samtec, Inc. Transceiver system
US9052483B2 (en) 2011-09-27 2015-06-09 Finisar Corporation Communication module assembly with heat sink and methods of manufacture
US20130157499A1 (en) * 2011-12-20 2013-06-20 International Business Machines Corporation Active electrical connection with self-engaging, self-releasing heat-sink
US8613632B1 (en) * 2012-06-20 2013-12-24 Tyco Electronics Corporation Electrical connector assembly having thermal vents
US8834205B2 (en) * 2012-07-19 2014-09-16 Tyco Electronics Corporation Pluggable module system
US9882297B2 (en) * 2013-04-24 2018-01-30 Molex, Llc Connector system with thermal surface
US9518785B2 (en) * 2013-07-24 2016-12-13 Tyco Electronics Corporation Receptacle assembly for receiving a pluggable module
JP6479840B2 (ja) * 2014-03-27 2019-03-06 モレックス エルエルシー 熱効率の良いコネクタシステム
US9391407B1 (en) * 2015-06-12 2016-07-12 Tyco Electronics Corporation Electrical connector assembly having stepped surface

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101924304A (zh) * 2009-02-17 2010-12-22 泰科电子公司 具有电磁密封元件的连接器组件
CN102148435A (zh) * 2009-09-08 2011-08-10 泰科电子公司 模块连接器***
CN102570152A (zh) * 2010-10-25 2012-07-11 莫列斯公司 连接器组件

Also Published As

Publication number Publication date
US9960553B2 (en) 2018-05-01
TW201607160A (zh) 2016-02-16
US10797451B2 (en) 2020-10-06
JP6479840B2 (ja) 2019-03-06
EP3123572A1 (en) 2017-02-01
WO2015148786A1 (en) 2015-10-01
CN106936034B (zh) 2019-06-07
US10374372B2 (en) 2019-08-06
CN106936034A (zh) 2017-07-07
US20180248324A1 (en) 2018-08-30
US20190356093A1 (en) 2019-11-21
US20170005446A1 (en) 2017-01-05
CN106134013A (zh) 2016-11-16
JP2017510031A (ja) 2017-04-06
EP3123572B1 (en) 2022-07-20
TW201740626A (zh) 2017-11-16
TWI584533B (zh) 2017-05-21
EP3123572A4 (en) 2017-12-20
TWI675513B (zh) 2019-10-21

Similar Documents

Publication Publication Date Title
CN106134013B (zh) 插座组件、插头组件和连接器***
US10039208B2 (en) Method for cooling a connector system
US10249983B2 (en) Connector with integrated heat sink
US10367283B2 (en) Connector with thermal management
US8184442B2 (en) Case of an electronic device
JP2018509729A (ja) 空気流を伴うコネクタシステム
US9727127B2 (en) Network device
US9933555B2 (en) Receptacle assembly having a light pipe assembly
US9716347B2 (en) Connector with a vent wall with openings sized to block electromagnetic interference
US8325488B2 (en) Card module and module connector assembly

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant