CN106132090A - 一种pcb中导电图形整平的方法 - Google Patents
一种pcb中导电图形整平的方法 Download PDFInfo
- Publication number
- CN106132090A CN106132090A CN201610512969.6A CN201610512969A CN106132090A CN 106132090 A CN106132090 A CN 106132090A CN 201610512969 A CN201610512969 A CN 201610512969A CN 106132090 A CN106132090 A CN 106132090A
- Authority
- CN
- China
- Prior art keywords
- pcb
- pcb substrate
- copper
- conductive pattern
- carries out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 21
- 239000000919 ceramic Substances 0.000 claims abstract description 13
- 239000002002 slurry Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 12
- 238000010586 diagram Methods 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000011889 copper foil Substances 0.000 claims description 9
- 238000005286 illumination Methods 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 5
- 241000143437 Aciculosporium take Species 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000012774 insulation material Substances 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 abstract description 11
- 238000003466 welding Methods 0.000 abstract description 3
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 2
- 208000003351 Melanosis Diseases 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610512969.6A CN106132090B (zh) | 2016-06-30 | 2016-06-30 | 一种pcb中导电图形整平的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610512969.6A CN106132090B (zh) | 2016-06-30 | 2016-06-30 | 一种pcb中导电图形整平的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106132090A true CN106132090A (zh) | 2016-11-16 |
CN106132090B CN106132090B (zh) | 2019-03-22 |
Family
ID=57468988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610512969.6A Active CN106132090B (zh) | 2016-06-30 | 2016-06-30 | 一种pcb中导电图形整平的方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106132090B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111328205A (zh) * | 2020-03-18 | 2020-06-23 | 四川英创力电子科技股份有限公司 | 一种平面厚铜pcb的加工工艺 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002344142A (ja) * | 2001-05-15 | 2002-11-29 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
JP2004087656A (ja) * | 2002-08-26 | 2004-03-18 | Victor Co Of Japan Ltd | プリント配線板の製造方法 |
CN101716744A (zh) * | 2009-11-12 | 2010-06-02 | 梅州博敏电子有限公司 | 无环盲孔高密度互连印制线路板板面整平的方法 |
CN101772269A (zh) * | 2009-12-23 | 2010-07-07 | 深南电路有限公司 | Pcb加工方法 |
CN102244987A (zh) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | 高厚径比背板树脂塞孔方法 |
CN103781291A (zh) * | 2014-02-25 | 2014-05-07 | 昆山苏杭电路板有限公司 | 印制板树脂塞孔工艺 |
CN105430939A (zh) * | 2015-10-30 | 2016-03-23 | 江苏博敏电子有限公司 | 一种印制电路板埋孔树脂塞孔方法 |
-
2016
- 2016-06-30 CN CN201610512969.6A patent/CN106132090B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002344142A (ja) * | 2001-05-15 | 2002-11-29 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
JP2004087656A (ja) * | 2002-08-26 | 2004-03-18 | Victor Co Of Japan Ltd | プリント配線板の製造方法 |
CN101716744A (zh) * | 2009-11-12 | 2010-06-02 | 梅州博敏电子有限公司 | 无环盲孔高密度互连印制线路板板面整平的方法 |
CN101772269A (zh) * | 2009-12-23 | 2010-07-07 | 深南电路有限公司 | Pcb加工方法 |
CN102244987A (zh) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | 高厚径比背板树脂塞孔方法 |
CN103781291A (zh) * | 2014-02-25 | 2014-05-07 | 昆山苏杭电路板有限公司 | 印制板树脂塞孔工艺 |
CN105430939A (zh) * | 2015-10-30 | 2016-03-23 | 江苏博敏电子有限公司 | 一种印制电路板埋孔树脂塞孔方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111328205A (zh) * | 2020-03-18 | 2020-06-23 | 四川英创力电子科技股份有限公司 | 一种平面厚铜pcb的加工工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN106132090B (zh) | 2019-03-22 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A method of conducting pattern leveling in PCB Effective date of registration: 20210525 Granted publication date: 20190322 Pledgee: Guangde sub branch of Postal Savings Bank of China Ltd. Pledgor: GUANGDE BAODA PRECISION PCB Co.,Ltd. Registration number: Y2021980003931 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220527 Granted publication date: 20190322 Pledgee: Guangde sub branch of Postal Savings Bank of China Ltd. Pledgor: GUANGDE BAODA PRECISION PCB Co.,Ltd. Registration number: Y2021980003931 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A method of leveling conductive pattern in PCB Effective date of registration: 20220527 Granted publication date: 20190322 Pledgee: Guangde sub branch of Postal Savings Bank of China Ltd. Pledgor: GUANGDE BAODA PRECISION PCB Co.,Ltd. Registration number: Y2022990000287 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230718 Granted publication date: 20190322 Pledgee: Guangde sub branch of Postal Savings Bank of China Ltd. Pledgor: GUANGDE BAODA PRECISION PCB Co.,Ltd. Registration number: Y2022990000287 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Method for Leveling Conductive Patterns in PCB Effective date of registration: 20230725 Granted publication date: 20190322 Pledgee: Anhui Guangde Rural Commercial Bank Co.,Ltd. Pledgor: GUANGDE BAODA PRECISION PCB Co.,Ltd. Registration number: Y2023980049445 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20190322 Pledgee: Anhui Guangde Rural Commercial Bank Co.,Ltd. Pledgor: GUANGDE BAODA PRECISION PCB Co.,Ltd. Registration number: Y2023980049445 |