CN106129088B - A kind of display panel and preparation method, display device - Google Patents
A kind of display panel and preparation method, display device Download PDFInfo
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- CN106129088B CN106129088B CN201610581600.0A CN201610581600A CN106129088B CN 106129088 B CN106129088 B CN 106129088B CN 201610581600 A CN201610581600 A CN 201610581600A CN 106129088 B CN106129088 B CN 106129088B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
This application provides a kind of display panel and preparation methods, display device, to reduce thermal deformation of the flexible base board under high-temperature technology, to improve the yield of flexible product, and then the cost of flexible product is reduced, a kind of display panel provided by the present application includes at least one layer of flexible compound film and display layer stacked gradually；Wherein, the flexible compound film includes：Heat-sink shell and the main flexible membrane being layered on the heat-sink shell.
Description
Technical field
This application involves field of display technology, more particularly to a kind of display panel and preparation method, display device.
Background technique
Organic EL display panel (Organic Electroluminesence Display, OLED) is relative to liquid crystal
Display screen (Liquid Crystal Display, LCD) has self-luminous, frivolous, wide viewing angle, high brightness, high contrast, low
The advantages that driving voltage and quick response, it is considered to be next-generation display technology.
Wherein flexible OLED display answers wearable device due to the characteristics such as its low-power consumption, flexible, durable
With that will bring far-reaching influence, the following flexible OLED display will be widely applied with the continuous infiltration of personal intelligent terminal.
It is general using in hard transparent substrate 1 at present in the manufacturing process of the display panel of flexible OLED display
Make flexible membrane 2, then again on flexible membrane 2 make display layer 3 (including on flexible membrane 2 formed thin film transistor backplane layer
(TFT-BP layers) 31, organic luminous layer 32, thin-film encapsulation layer 33), as shown in FIG. 1, FIG. 1 is before the removing made in the prior art
Flexible OLED display panel structural schematic diagram, then remove hard transparent substrate 1, form flexible OLED display panel, such as
Shown in Fig. 2, Fig. 2 is the structural schematic diagram of the flexible OLED display panel after the removing made in the prior art.Using the production
Technique makes flexible OLED display panel, during removing hard transparent substrate, is mainly carried out using laser to flexible membrane
Irradiation, so that the flexible membrane Surface absorption integrating laser carbonization contacted with hard transparent substrate, destroys Adhesion Interface between the two, but
The heat generated in flexible membrane and the separation process of hard transparent substrate makes flexible membrane be easy to happen thermal deformation, leads to flexible product
It is too low in mould group process section yield, it is higher so as to cause production cost.
Other are needed to equally exist soft using the flexible product of flexible membrane and the production of hard transparent substrate separating technology
Property film and the separation process of hard transparent substrate in the heat that generates make flexible membrane be easy to happen thermal deformation, cause flexible product good
Rate is too low, so as to cause the higher problem of production cost.
Summary of the invention
The embodiment of the present application provides a kind of display panel and preparation method, display device, exists to reduce flexible base board
Thermal deformation under high-temperature technology to improve the yield of flexible product, and then reduces the cost of flexible product.
A kind of display panel provided by the embodiments of the present application includes at least one layer of flexible compound film stacked gradually and display
Layer；Wherein, the flexible compound film includes：Heat-sink shell and the main flexible membrane being layered on the heat-sink shell.
Display panel provided by the embodiments of the present application, including at least one layer of flexible compound film stacked gradually and display layer；
Wherein, flexible compound film includes：Heat-sink shell and the main flexible membrane being layered on heat-sink shell, due in main flexible membrane far from display layer
Side be provided with heat-sink shell, which can be absorbed the heat generated during removing hard transparent substrate and is not easy
Deformation occurs, therefore, it is possible to reduce thermal deformation of the flexible base board under high-temperature technology, so as to improve the good of flexible product
Rate, and then reduce the cost of flexible product.
Preferably, the heat-sink shell is the heat-sink shell of half network；Wherein, half network is each grid institute
Position be non-hollow out structure.
Due to the heat-sink shell that heat-sink shell is half network, stress shape of the heat-sink shell under high-temperature technology can be reduced in this way
Become, and since the contact surface of heat-sink shell and main flexible membrane is curved surface, Planar Contraction can be reduced in this way.
Preferably, the heat-sink shell with a thickness of 3000 angstroms~5000 angstroms.
Preferably, the material of the heat-sink shell is inorganic siliceous material.
Preferably, the material of the heat-sink shell is silicon nitride.
Preferably, the display layer includes thin film transistor backplane layer, organic luminous layer and the thin-film package stacked gradually
Layer.
The embodiment of the present application also provides a kind of display devices, including above-mentioned display panel provided by the embodiments of the present application.
Since display device provided by the embodiments of the present application uses above-mentioned display panel, and above-mentioned display panel packet
Include at least one layer of flexible compound film and display layer stacked gradually；Wherein, flexible compound film includes：Heat-sink shell and it is layered in heat absorption
Due to being provided with heat-sink shell far from the side of display layer in main flexible membrane, which can be absorbed is shelling main flexible membrane on layer
The heat that is generated during from hard transparent substrate and be not easy that deformation occurs, therefore, it is possible to reduce flexible base board is in high temperature work
Thermal deformation under skill so as to improve the yield of flexible product, and then reduces the cost of flexible product.
The embodiment of the present application also provides a kind of preparation method of display panel, this method includes：
Auxiliary flexible film is formed in hard transparent substrate；
At least one layer of flexible compound film is formed on the auxiliary flexible film；Wherein, the flexible compound film includes：Heat absorption
Layer and the main flexible membrane being layered on heat-sink shell；
Display layer is formed on the flexible compound film；
Separate the hard transparent substrate and the auxiliary flexible film.
It include at least one layer of flexible compound film and display layer stacked gradually using display panel prepared by this method；Its
In, flexible compound film includes：Heat-sink shell and the main flexible membrane being layered on heat-sink shell, due in main flexible membrane far from display layer
Side is provided with heat-sink shell, which can be absorbed the heat generated during removing hard transparent substrate and be not easy to send out
Raw deformation, therefore, it is possible to reduce thermal deformation of the flexible base board under high-temperature technology, so as to improve the yield of flexible product,
And then reduce the cost of flexible product.
Preferably, the formation heat-sink shell includes：
Deposition heat absorption layer film；
It passes sequentially through grid pattern chemical industry skill for the heat absorption layer film and etches partially technique and form half network
Heat-sink shell；Wherein, half network is the structure that the position where each grid is non-hollow out.
The heat-sink shell for using this method to be formed can reduce heat-sink shell in high temperature work for the heat-sink shell of half network in this way
Stress deformation under skill, and since the contact surface of heat-sink shell and main flexible membrane is curved surface, Planar Contraction can be reduced in this way.
Preferably, formed the auxiliary flexible film with a thickness of 200 angstroms~500 angstroms.
Preferably, the thickness of the main flexible membrane formed is at least the 10 of the thickness of the auxiliary flexible film formed
Times.
Preferably, described form display layer on the flexible compound film, including：It is formed on the flexible compound film thin
Film transistor backsheet layer, organic luminous layer and thin-film encapsulation layer.
Preferably, the separation hard transparent substrate and the auxiliary flexible film, including：
The auxiliary flexible film is irradiated using laser, so that the auxiliary flexible film is carbonized；
Auxiliary flexible film after separating the hard transparent substrate and the carbonization.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the flexible OLED display panel before the removing made in the prior art；
Fig. 2 is the structural schematic diagram of the flexible OLED display panel after the removing made in the prior art；
Fig. 3 is a kind of structural schematic diagram of display panel provided by the embodiments of the present application；
Fig. 4 is the top view of heat-sink shell in display panel provided by the embodiments of the present application；
Fig. 5 is a kind of flow diagram of the preparation method of display panel provided by the embodiments of the present application；
Fig. 6 (a)~6 (g) is the preparation process flow schematic diagram of display panel provided by the embodiments of the present application.
Specific embodiment
The embodiment of the present application provides a kind of display panel and preparation method, display device, exists to reduce flexible base board
Thermal deformation under high-temperature technology to improve the yield of flexible product, and then reduces the cost of flexible product.
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on
Embodiment in the application, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall in the protection scope of this application.
It should be noted that the thickness of each layer and shape do not reflect actual proportions in illustrations, purpose is only illustrated
Illustrate teachings herein.
Referring to Fig. 3, a kind of display panel provided by the embodiments of the present application includes at least one layer of flexible compound stacked gradually
Film 4 (one layer of flexible compound film is merely illustrated in Fig. 3) and display layer 3；Wherein, the flexible compound film 4 includes：41 He of heat-sink shell
The main flexible membrane 42 being layered on the heat-sink shell.
Due to being provided with heat-sink shell 41 far from the side of display layer 3 in main flexible membrane 42, which be can be absorbed
The heat that generates during removing hard transparent substrate 1 and be not easy that deformation occurs, therefore, it is possible to reduce flexible base board is in high temperature
Thermal deformation under technique so as to improve the yield of flexible product, and then reduces the cost of flexible product.
Wherein, the material of heat-sink shell 41 is high temperature resistant and is not susceptible to the material of deformation, such as inorganic siliceous material, inorganic
Material can be silicon nitride (SiNx), silica, silicon oxynitride etc., preferably, the material of heat-sink shell 41 is silicon nitride.
Main flexible membrane 42 can be polyether sulfone (PES), polyacrylate (PAR), polyetherimide (PEI), poly- naphthalene diformazan
Sour glycol ester (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl (polyallylate),
Polyimide resin (Polymide, PI), polycarbonate (PC), Triafol T (TAC), cellulose acetate propionate (CAP)
Or the organic hyaline membrane of insulation that one of acrylate (acryl) or their combination are constituted.
Preferably, as shown in Figure 3, Figure 4, heat-sink shell 41 is the heat-sink shell of half network；Wherein, half network
It is the structure of non-hollow out for the position where each grid 411.
Wherein, the shape of grid 411 can be rectangle, rectangular, prismatic, circle etc., can be set as needed, and the application is real
It applies example and is not limited thereof.
Due to the heat-sink shell 41 that heat-sink shell 41 is half network, heat-sink shell 41 can be reduced in this way under high-temperature technology
Stress deformation, and since the contact surface of heat-sink shell 41 and main flexible membrane 42 is curved surface, Planar Contraction can be reduced in this way.
Certainly, heat-sink shell 41 or the heat-sink shell of planar structure, the embodiment of the present application are simultaneously not limited thereof.
Preferably, as shown in figure 3, the thickness h of heat-sink shell 41 is 3000 angstroms~5000 angstroms.
Preferably, as shown in figure 3, display layer 3 includes thin film transistor backplane layer 31, the organic luminous layer 32 stacked gradually
With thin-film encapsulation layer 33.Certain display layer 3 can also be made of other film layers, and it is aobvious that the embodiment of the present application is not limited to flexible OLED
Show that panel, other flexible products are also suitable.
Based on the same inventive concept, the embodiment of the present application also provides a kind of preparation methods of display panel, such as Fig. 5 institute
Show, this method comprises the following steps：
S101, auxiliary flexible film is formed in hard transparent substrate；
Wherein, hard transparent substrate can be substrate of glass, quartz substrate, crystal base bottom etc..
S102, at least one layer of flexible compound film is formed on auxiliary flexible film；Wherein, flexible compound film includes：Heat-sink shell
With the main flexible membrane being layered on heat-sink shell；
Wherein, the material of heat-sink shell is high temperature resistant and is not susceptible to the material of deformation, such as inorganic siliceous material, inorganic to contain
Silicon materials can be silicon nitride, silica, silicon oxynitride etc., and the thickness of heat-sink shell can be 3000 angstroms~5000 angstroms.
S103, display layer is formed on flexible compound film；
S104, separation hard transparent substrate and auxiliary flexible film.
Wherein, auxiliary flexible film and main flexible membrane can be polyether sulfone (PES), polyacrylate (PAR), polyetherimide
(PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl
(polyallylate), polyimide resin (PI), polycarbonate (PC), Triafol T (TAC), cellulose acetate propionate
(CAP) or the organic hyaline membrane of insulation that constitutes of one of acrylate (acryl) or their combination.
Can be identical it should be pointed out that forming the material of auxiliary flexible film and forming the material of main flexible membrane, it can also be with
It is different.
Preferably, formation heat-sink shell includes in step S102：
Deposition heat absorption layer film；
Grid pattern chemical industry skill is passed sequentially through for heat absorption layer film and etches partially the heat absorption that technique forms half network
Layer；Wherein, half network is the structure that the position where each grid is non-hollow out.
Wherein, grid pattern chemical industry skill, which refers to, forms lattice by techniques such as resist coating, exposure, developments.
Etch partially technique and refer to that the object that will not be etched is etched to perforation, but retain certain thickness (generally retain 5%~
60%), that is, it is etched to non-hollow out.
The thickness of the auxiliary flexible film formed in step S101 can bePreferably, what is formed is auxiliary
Help flexible membrane with a thickness of
Preferably, the thickness of the main flexible membrane formed is at least 10 times of the thickness of the auxiliary flexible film formed.
Preferably, display layer is formed on flexible compound film in step S103, including：Film is formed on flexible compound film
Transistor backsheet layer, organic luminous layer and thin-film encapsulation layer.
Preferably, hard transparent substrate and auxiliary flexible film are separated in step S104, including：
Auxiliary flexible film is irradiated using laser, so that auxiliary flexible film is carbonized；
Auxiliary flexible film after separating hard transparent substrate and carbonization.
Below to make heat-sink shell using silicon nitride material, auxiliary flexible film and master are made using polyimide resin (PI)
For flexible membrane, the preparation process stream of display panel provided by the embodiments of the present application is illustrated in conjunction with attached drawing 6 (a)~6 (g)
Journey.
Step 1: referring to Fig. 6 (a), one layer of PI liquid is applied in hard transparent substrate 01, and the is formed after baking-curing
One PI film 02, as auxiliary flexible film；
Wherein, the first PI film 02 with a thickness ofThe temperature of baking-curing PI liquid is T0.
Step 2: utilizing plasma enhanced chemical vapor deposition (Plasma Enhanced referring to Fig. 6 (b)
Chemical Vapor Deposition, PECVD) in the surface of the first PI film 02 one layer of silicon nitride (SiNx) film layer 03 of deposition；
Wherein, the thickness of silicon nitride film layer 03 can beThe temperature of deposited silicon nitride film layer 03
For T1.
Step 3: referring to Fig. 6 (c), it, can be by grid pattern chemical industry skill (for example, applying photoetching for silicon nitride film layer 03
The techniques such as glue, exposure, development) formed network mask 04；
Step 4: for silicon nitride film layer 03, performed etching using mask 04 by etching partially technique referring to Fig. 6 (d),
And mask 04 is removed after etching, the silicon nitride film layer 05 of half network is formed, as heat-sink shell；
Wherein, half network is the structure that the position at each 06 place of grid is non-hollow out；The depth of etching for example may be used
Think the 75% of 03 height of silicon nitride film layer.
Step 5: one layer of PI liquid is applied on the silicon nitride film layer 05 of half network referring to Fig. 6 (e), it is solid through overbaking
The 2nd PI film 07 is formed after change, as main flexible membrane；
Wherein, the thickness of the 2nd PI film 07 is at least 10 times of the thickness of the first PI film 02；The temperature of baking-curing PI liquid
Degree is T2.
It should be noted that the silicon nitride film layer 05 of half network and the 2nd PI film 07 constitute flexible compound film, if needing
Layer flexible composite membrane is made, can continue to make flexible compound film on the 2nd PI film 07, make subsequent each flexible compound
The step of film, is similar to making step (i.e. the step 2 to step 5) of above-mentioned flexible compound film, and difference is above-mentioned flexible compound
The making step of film is to carry out on auxiliary flexible film, and the making step of subsequent each flexible compound film is soft in current master
It is carried out on property film, details are not described herein for the identical step of the two.
Step 6: forming thin film transistor backplane layer 08,09 and of organic luminous layer on the 2nd PI film 07 referring to Fig. 6 (f)
Thin-film encapsulation layer 010；
Wherein, form thin film transistor backplane layer 08, organic luminous layer 09 and thin-film encapsulation layer 010 is all existing skill
Art, therefore details are not described herein.
It should be noted that the relationship used in flexible compound film production technique between temperature T0, T1, T2 is：T0≥
T1 >=T2, the display layer made on the basis of this flexible compound film (including thin film transistor backplane layer, organic luminous layer and film
Encapsulated layer) used in temperature condition not above T2, in other words, used temperature during making display panel
Degree be gradually successively decrease or it is constant.
Step 7: the side from hard transparent substrate 01 far from the first PI film 02, carries out the first PI film 02 using laser
Irradiation, so that the first PI film 02 is carbonized, the first PI film after separation hard transparent substrate 01 and carbonization obtains display panel, such as
Shown in Fig. 6 (g).
Based on the same inventive concept, the embodiment of the present application also provides a kind of display devices, including the embodiment of the present application to mention
The above-mentioned display panel supplied.
In conclusion display panel includes at least one layer stacked gradually in technical solution provided by the embodiments of the present application
Flexible compound film and display layer；Wherein, flexible compound film includes：Heat-sink shell and the main flexible membrane being layered on heat-sink shell, due to
The side of display layer is provided with heat-sink shell in main flexible membrane, which can be absorbed the mistake in removing hard transparent substrate
The heat that is generated in journey and be not easy that deformation occurs, therefore, it is possible to reduce thermal deformation of the flexible base board under high-temperature technology, so as to
To improve the yield of flexible product, and then reduce the cost of flexible product.
Obviously, those skilled in the art can carry out various modification and variations without departing from the essence of the application to the application
Mind and range.In this way, if these modifications and variations of the application belong to the range of the claim of this application and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (11)
1. a kind of display panel, which is characterized in that including at least one layer of flexible compound film stacked gradually and display layer；Wherein,
The flexible compound film includes：Heat-sink shell and the main flexible membrane being layered on the heat-sink shell；
The heat-sink shell is the heat-sink shell of half network；Wherein, half network is that the position where each grid is
The structure of non-hollow out.
2. display panel according to claim 1, which is characterized in that the heat-sink shell with a thickness of 3000 angstroms~5000
Angstrom.
3. display panel according to claim 2, which is characterized in that the material of the heat-sink shell is inorganic siliceous material.
4. display panel according to claim 3, which is characterized in that the material of the heat-sink shell is silicon nitride.
5. display panel according to claim 1, which is characterized in that the display layer includes the film crystal stacked gradually
Pipe backsheet layer, organic luminous layer and thin-film encapsulation layer.
6. a kind of display device, which is characterized in that including display panel described in any claim of Claims 1 to 5.
7. a kind of preparation method of display panel, which is characterized in that this method includes：
Auxiliary flexible film is formed in hard transparent substrate；
At least one layer of flexible compound film is formed on the auxiliary flexible film；Wherein, the flexible compound film includes：Heat-sink shell and
The main flexible membrane being layered on heat-sink shell；
Display layer is formed on the flexible compound film；
Separate the hard transparent substrate and the auxiliary flexible film；
The formation heat-sink shell includes：
Deposition heat absorption layer film；
Grid pattern chemical industry skill is passed sequentially through for the heat absorption layer film and etches partially the heat absorption that technique forms half network
Layer；Wherein, half network is the structure that the position where each grid is non-hollow out.
8. the method according to the description of claim 7 is characterized in that formed the auxiliary flexible film with a thickness of 200 angstroms~
500 angstroms.
9. according to the method described in claim 8, it is characterized in that, what the thickness of the main flexible membrane formed was at least formed
10 times of the thickness of the auxiliary flexible film.
10. being wrapped the method according to the description of claim 7 is characterized in that described form display layer on the flexible compound film
It includes：Thin film transistor backplane layer, organic luminous layer and thin-film encapsulation layer are formed on the flexible compound film.
11. the method according to the description of claim 7 is characterized in that the separation hard transparent substrate and the auxiliary
Flexible membrane, including：
The auxiliary flexible film is irradiated using laser, so that the auxiliary flexible film is carbonized；
Auxiliary flexible film after separating the hard transparent substrate and the carbonization.
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| CN109031841B (en) * | 2017-06-09 | 2022-01-25 | 元太科技工业股份有限公司 | Flexible laminated structure and display |
| CN107283075B (en) * | 2017-08-02 | 2019-01-15 | 武汉华星光电半导体显示技术有限公司 | Improve the method for chamfered area defect in laser cutting parameter |
| JP2019090879A (en) * | 2017-11-13 | 2019-06-13 | 株式会社Ｊｏｌｅｄ | Display device and method for manufacturing display device |
| CN107968109A (en) * | 2017-11-21 | 2018-04-27 | 武汉华星光电半导体显示技术有限公司 | Flexible OLED display panel and preparation method thereof, display device |
| CN108963101B (en) * | 2017-11-30 | 2022-08-26 | 广东聚华印刷显示技术有限公司 | Release layer for manufacturing flexible display device and composite substrate |
| CN108962937B (en) * | 2017-12-21 | 2021-07-30 | 广东聚华印刷显示技术有限公司 | Flexible display device and preparation method thereof |
| CN108847450A (en) * | 2018-06-12 | 2018-11-20 | 武汉华星光电半导体显示技术有限公司 | A kind of substrate of Organic Light Emitting Diode and preparation method thereof |
| CN109461379A (en) * | 2018-09-28 | 2019-03-12 | 昆山国显光电有限公司 | Display panel and display device |
| WO2020162864A1 (en) * | 2019-02-04 | 2020-08-13 | Hewlett-Packard Development Company, L.P. | Electronic display devices |
| CN111628110A (en) | 2020-06-24 | 2020-09-04 | 京东方科技集团股份有限公司 | Display module and display device |
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| TWI589042B (en) * | 2010-01-20 | 2017-06-21 | 半導體能源研究所股份有限公司 | Light-emitting device, flexible light-emitting device, electronic device, lighting apparatus, and method of manufacturing light-emitting device and flexible-light emitting device |
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