CN106104767B - 半导体晶片加工用胶带和半导体晶片的加工方法 - Google Patents

半导体晶片加工用胶带和半导体晶片的加工方法 Download PDF

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Publication number
CN106104767B
CN106104767B CN201580015094.2A CN201580015094A CN106104767B CN 106104767 B CN106104767 B CN 106104767B CN 201580015094 A CN201580015094 A CN 201580015094A CN 106104767 B CN106104767 B CN 106104767B
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China
Prior art keywords
semiconductor wafer
adhesive tape
thickness
wafer processing
adhesive
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Active
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CN201580015094.2A
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English (en)
Chinese (zh)
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CN106104767A (zh
Inventor
冈祥文
内山具朗
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Publication of CN106104767A publication Critical patent/CN106104767A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
CN201580015094.2A 2014-03-24 2015-03-20 半导体晶片加工用胶带和半导体晶片的加工方法 Active CN106104767B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-061011 2014-03-24
JP2014061011A JP5697061B1 (ja) 2014-03-24 2014-03-24 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法
PCT/JP2015/058601 WO2015146856A1 (ja) 2014-03-24 2015-03-20 半導体ウェハ加工用粘着テープおよび半導体ウェハの加工方法

Publications (2)

Publication Number Publication Date
CN106104767A CN106104767A (zh) 2016-11-09
CN106104767B true CN106104767B (zh) 2018-05-01

Family

ID=52837010

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580015094.2A Active CN106104767B (zh) 2014-03-24 2015-03-20 半导体晶片加工用胶带和半导体晶片的加工方法

Country Status (5)

Country Link
JP (1) JP5697061B1 (ko)
KR (1) KR101766174B1 (ko)
CN (1) CN106104767B (ko)
TW (1) TWI590361B (ko)
WO (1) WO2015146856A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170122185A (ko) * 2015-11-09 2017-11-03 후루카와 덴키 고교 가부시키가이샤 반도체 칩의 제조방법 및 이것에 이용하는 마스크 일체형 표면 보호 테이프
ES2930455T3 (es) * 2015-11-09 2022-12-13 Furukawa Electric Co Ltd Cinta de protección de superficie con máscara integrada
SG11201808291YA (en) * 2016-03-30 2018-10-30 Lintec Corp Semiconductor processing sheet
JP2018184551A (ja) * 2017-04-26 2018-11-22 日東電工株式会社 粘着シート
JP7042667B2 (ja) * 2018-03-28 2022-03-28 古河電気工業株式会社 半導体チップの製造方法
CN114080406A (zh) * 2019-07-31 2022-02-22 大阪有机化学工业株式会社 固化性树脂组合物、以及弹性体及片材

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3773358B2 (ja) * 1998-07-01 2006-05-10 三井化学株式会社 半導体ウエハの裏面研削用粘着フィルム及びそれを用いる半導体ウエハの裏面研削方法
JP3383227B2 (ja) * 1998-11-06 2003-03-04 リンテック株式会社 半導体ウエハの裏面研削方法
US6794751B2 (en) * 2001-06-29 2004-09-21 Intel Corporation Multi-purpose planarizing/back-grind/pre-underfill arrangements for bumped wafers and dies
JP2011054940A (ja) * 2009-08-07 2011-03-17 Nitto Denko Corp 半導体ウェハ保持保護用粘着シート及び半導体ウェハの裏面研削方法
JP5705447B2 (ja) * 2010-03-31 2015-04-22 古河電気工業株式会社 表面保護用粘着テープ
JP5638439B2 (ja) * 2011-03-31 2014-12-10 リンテック株式会社 粘着剤および粘着シート
US20130001283A1 (en) * 2011-06-29 2013-01-03 Steven Friderich Flexible Multi-Panel Sterilization Assembly
JP5951216B2 (ja) * 2011-10-13 2016-07-13 リンテック株式会社 粘着シートおよびその使用方法
JP2013091731A (ja) * 2011-10-26 2013-05-16 Denki Kagaku Kogyo Kk 粘着テープ、及び粘着テープ巻取体とその製造方法
JP6220495B2 (ja) * 2012-03-01 2017-10-25 三菱ケミカル株式会社 画像表示装置用透明両面粘着シート及びこれを用いた画像表示装置
JP5100902B1 (ja) * 2012-03-23 2012-12-19 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
JP6035325B2 (ja) * 2012-03-23 2016-11-30 リンテック株式会社 ワーク加工用シート基材およびワーク加工用シート
JP6393449B2 (ja) 2012-03-27 2018-09-19 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
JP5117629B1 (ja) * 2012-06-28 2013-01-16 古河電気工業株式会社 ウェハ加工用粘着テープ
JP5993255B2 (ja) * 2012-09-11 2016-09-14 三菱樹脂株式会社 アクリル系樹脂フィルム及びダイシング用粘着シート
JP5480415B1 (ja) * 2012-10-11 2014-04-23 古河電気工業株式会社 半導体ウェハ加工用粘着テープ

Also Published As

Publication number Publication date
TWI590361B (zh) 2017-07-01
TW201539630A (zh) 2015-10-16
WO2015146856A1 (ja) 2015-10-01
KR101766174B1 (ko) 2017-08-07
KR20160125524A (ko) 2016-10-31
JP5697061B1 (ja) 2015-04-08
JP2015185692A (ja) 2015-10-22
CN106104767A (zh) 2016-11-09

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