CN106102327B - A kind of adhering method of glue film - Google Patents
A kind of adhering method of glue film Download PDFInfo
- Publication number
- CN106102327B CN106102327B CN201610664310.2A CN201610664310A CN106102327B CN 106102327 B CN106102327 B CN 106102327B CN 201610664310 A CN201610664310 A CN 201610664310A CN 106102327 B CN106102327 B CN 106102327B
- Authority
- CN
- China
- Prior art keywords
- glue film
- location
- pedestal
- printed board
- top board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
A kind of adhering method of glue film of the present invention belongs to circuit assembly technical field.The present invention is a kind of method of rapid link glue film, by using special glue film adhesive tool, can play quickly positioning and reducing bonding number between glue film and heat sink, printed board.Glue film adhesive tool is made of top board (1), pedestal (2) origin reference location pin (3) anti-deviation positioning pin (4) location hole (5).The present invention can significantly improve the accuracy of glue film bonding and reduce the bonding period.
Description
Technical field
A kind of adhering method of glue film of the present invention, belongs to circuit assembly technical field.
Background technique
Printed board has a use in my each project of institute, either fly control series or inertial navigation series again or other
The product of field series, almost the product of each series has printed board.And I the function printed board of 90% project all need
Cold plate is bonded to play the role of heat dissipation, the heat dissipation quality of one piece of printed board directly influences a cabinet even whole system
Operation quality, printed board at present bonding be broadly divided into the hot sticky two parts of cold bonding, traditional adhering method complex procedures, consistency
Difference, error are big.When especially encountering the more and small printed board of via devices in printed board, it is very easy to the general when be bonded cold plate
Cold plate shelters from pad and cannot find in time, thus waste time delay Task Progress and cause subsequent handling can not normally into
Row.
Summary of the invention
The purpose of the present invention is to propose to a kind of adhering methods of new glue film, are being bonded to solve present high-volume printed board
The complex procedures occurred in the process, consistency is poor, and error is big, the phenomenon that.During being glued so that the printed board of guarantee afterwards is hot and cold
Quickly, accurately, the task of light complete cost procedure.
The technical scheme adopted by the invention is as follows: a kind of adhering method of glue film, which is characterized in that the realization step of this method
It is as follows:
1, the cold and hot viscous tooling of glue film is designed, the cold and hot viscous tooling of glue film is rectangular steel plates structure, is divided into upper layer and lower layer, upper layer is
The top board 1 of rectangle, lower layer are the pedestal 2 of rectangle；Top board 1 and the shape of pedestal 2 match；
2, the four corners of top board 1 have a location hole 5 respectively；
3, anti-deviation positioning pin 4 origin reference location pin 3 and 4 at is respectively equipped at 4 on pedestal 2；Origin reference location pin 3 is distinguished at 4
It is corresponding that the reserved locking bar hole location position of hole location, glue film is reserved with printed board locking bar；At 4 anti-deviation positioning pin 4 respectively with
5 position of location hole of 1 four corners of top board is corresponding, and can be used cooperatively；
4, the locking bar of printed board is reserved hole location to be inserted in origin reference location pin 3, then the locking bar hole location that glue film is reserved
It is inserted in origin reference location pin 3, finally heat sink locking bar hole location is inserted in origin reference location pin 3；
5, it is combined the quadrangle of acetone injection printed board with glue film, printed board for pasting fixed heat sink with syringe
Part；
6, the location hole 5 of 1 four corners of top board is inserted in the anti-deviation positioning pin 4 of 2 four corners of pedestal；
7, by the top board 1 combined and the cold and hot viscous tooling of 2 glue film of pedestal be put into vulcanizer carry out it is hot sticky.
The present invention has the advantage that and the utility model has the advantages that the present invention is to the hot and cold viscous process of heat sink in printed board assembly
A significant innovation, due to traditional adhering method complex procedures, consistency is poor, and error is big.Especially encounter in printed board
When the more and small printed board of via devices, be very easy to cold plate is sheltered from pad when being bonded cold plate to find in time,
Delay Task Progress to waste time, and causes subsequent handling that can not be normally carried out.Compared to traditional hot and cold viscous bonding side
Method, the present invention have quick, accurate, light advantage.After being bonded using this method, have the advantage that
1, first that glue film and printed board is fixed by origin reference location pin (3)；Quick, accurate, hole location is positioned to just without offset.
Glue film is directly contacted with printed board, very clear to whether pad blocks, and can remove specialized staff inspection link from.
3, heat sink cold bonding step shorten to 4 work steps by 5 work steps, and the movement for injecting acetone is shorten to 1 time by 2 times.
4, assembly time was shorten to 3 minutes by original 10 minutes.
5, this tooling only weighs 6 kilograms, and only top board need to be put into pedestal, and time-consuming is only 2 seconds, between pedestal and top board
Design have anti-deviation positioning pin, can solve machine in uphill process vibration displacement to glue film and printed board weld tabs hole location
Caused by deviate, both hands are easily sent into machine.
Detailed description of the invention
Fig. 1 top board structural schematic diagram
Fig. 2 lower bottom base schematic diagram
Wherein top board (1) is pedestal (2), origin reference location pin (3), anti-deviation positioning pin (4), location hole (5).
Specific embodiment
A kind of adhering method of glue film, which is characterized in that steps are as follows for the realization of this method:
1, the cold and hot viscous tooling of glue film is designed, the cold and hot viscous tooling of glue film is rectangular steel plates structure, is divided into upper layer and lower layer, upper layer is
The top board 1 of rectangle, lower layer are the pedestal 2 of rectangle；Top board 1 and the shape of pedestal 2 match；
2, the four corners of top board 1 have a location hole 5 respectively；
3, anti-deviation positioning pin 4 origin reference location pin 3 and 4 at is respectively equipped at 4 on pedestal 2；Origin reference location pin 3 is distinguished at 4
It is corresponding that the reserved locking bar hole location position of hole location, glue film is reserved with printed board locking bar；At 4 anti-deviation positioning pin 4 respectively with
5 position of location hole of 1 four corners of top board is corresponding, and can be used cooperatively；
4, the locking bar of printed board is reserved hole location to be inserted in origin reference location pin 3, then the locking bar hole location that glue film is reserved
It is inserted in origin reference location pin 3, finally heat sink locking bar hole location is inserted in origin reference location pin 3；
5, it is combined the quadrangle of acetone injection printed board with glue film, printed board for pasting fixed heat sink with syringe
Part；
6, the location hole 5 of 1 four corners of top board is inserted in the anti-deviation positioning pin 4 of 2 four corners of pedestal；
7, by the top board 1 combined and the cold and hot viscous tooling of 2 glue film of pedestal be put into vulcanizer carry out it is hot sticky.
It elaborates with reference to the accompanying drawings of the specification to the present invention.
Step 1: preparing printed board, glue film, heat sink, hot and cold viscous tooling.
Step 2: printed board being put on tooling base (2), is inserted in the locking bar hole reserved in printed board on pedestal (2)
Four origin reference location pins (3) on.
Step 3: glue film being placed in printed board, four benchmark on pedestal (2) are inserted in the locking bar hole for keeping glue film reserved
On positioning pin (3).And check whether glue film shelters from pad.
Step 4: heat sink being placed in printed board and glue film and forms sub-assembly.Make the locking bar hole reserved on heat sink set
Enter on four origin reference location pins (3) on pedestal (2).
Step 5: with syringe by the quadrangle of acetone injection printed board, for pasting fixed heat sink and glue film, printed board
Sub-assembly.
Step 6: top board (1) is covered on the pedestal (2) of the heat sink that fixes and glue film, printed board sub-assembly.
It is inserted in four location holes (5) on top board (1) quadrangle in four anti-deviation positioning pins (4) on pedestal (2) quadrangle.
Step 7: it is hot sticky that the top board combined (1) and the cold and hot viscous tooling of pedestal (2) glue film being put into vulcanizer progress.
Claims (1)
1. a kind of adhering method of glue film, the bonding applied to the heat sink in printed board, which is characterized in that the realization of this method
Steps are as follows:
(1) the cold and hot viscous tooling of glue film is designed, the cold and hot viscous tooling of glue film is rectangular steel plates structure, is divided into upper layer and lower layer, upper layer is square
The top board (1) of shape, lower layer are the pedestal (2) of rectangle；Top board (1) and the shape of pedestal (2) match；
(2) four corners of top board (1) have a location hole (5) respectively；
(3) anti-deviation positioning pin (4) origin reference location pin (3) and 4 at is respectively equipped at 4 on pedestal (2)；Origin reference location pin (3) at 4
It is corresponding that the reserved locking bar hole location position of hole location, glue film is reserved with printed board locking bar respectively；Anti-deviation positioning pin (4) at 4
It is corresponding with location hole (5) position of top board (1) four corners respectively, and can be used cooperatively；
(4) locking bar of printed board is reserved hole location to be inserted in origin reference location pin (3), then the locking bar hole location set that glue film is reserved
Enter in origin reference location pin (3), finally heat sink locking bar hole location is inserted in origin reference location pin (3)；
(5) with syringe by the quadrangle of acetone injection printed board, for pasting fixed heat sink and glue film, printed board sub-assembly；
(6) location hole (5) of top board (1) four corners is inserted in the anti-deviation positioning pin (4) of pedestal (2) four corners；
(7) by the top board combined (1) and the cold and hot viscous tooling of pedestal (2) glue film be put into vulcanizer carry out it is hot sticky.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610664310.2A CN106102327B (en) | 2016-08-12 | 2016-08-12 | A kind of adhering method of glue film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610664310.2A CN106102327B (en) | 2016-08-12 | 2016-08-12 | A kind of adhering method of glue film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106102327A CN106102327A (en) | 2016-11-09 |
| CN106102327B true CN106102327B (en) | 2019-01-01 |
Family
ID=57457374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610664310.2A Active CN106102327B (en) | 2016-08-12 | 2016-08-12 | A kind of adhering method of glue film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106102327B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114891449B (en) * | 2022-04-25 | 2024-02-02 | 歌尔股份有限公司 | Laser adhesive film bonding process method and intelligent watch |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020152609A1 (en) * | 1999-02-23 | 2002-10-24 | Samsung Electro-Mechanics Co., Ltd. | Method and device for coupling PCB sheet |
| CN100341391C (en) * | 2001-04-18 | 2007-10-03 | 日东电工株式会社 | Method for mounting electronic part on flexible printed wiring board and adhesive sheet for fixing flexible printed wiring board |
| CN201894000U (en) * | 2010-12-07 | 2011-07-06 | 深圳市精诚达电路有限公司 | Reinforcement fitting device of circuit board |
| CN203523160U (en) * | 2013-11-06 | 2014-04-02 | 博敏电子股份有限公司 | Combined flexible printed circuit board assistant material gluing fixture |
| CN204046923U (en) * | 2014-08-19 | 2014-12-24 | 常州安泰诺特种印制板有限公司 | Heat radiation pcb board |
| CN204859778U (en) * | 2015-07-02 | 2015-12-09 | 上达电子(深圳)有限公司 | Paste and cover membrane tool |
-
2016
- 2016-08-12 CN CN201610664310.2A patent/CN106102327B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020152609A1 (en) * | 1999-02-23 | 2002-10-24 | Samsung Electro-Mechanics Co., Ltd. | Method and device for coupling PCB sheet |
| CN100341391C (en) * | 2001-04-18 | 2007-10-03 | 日东电工株式会社 | Method for mounting electronic part on flexible printed wiring board and adhesive sheet for fixing flexible printed wiring board |
| CN201894000U (en) * | 2010-12-07 | 2011-07-06 | 深圳市精诚达电路有限公司 | Reinforcement fitting device of circuit board |
| CN203523160U (en) * | 2013-11-06 | 2014-04-02 | 博敏电子股份有限公司 | Combined flexible printed circuit board assistant material gluing fixture |
| CN204046923U (en) * | 2014-08-19 | 2014-12-24 | 常州安泰诺特种印制板有限公司 | Heat radiation pcb board |
| CN204859778U (en) * | 2015-07-02 | 2015-12-09 | 上达电子(深圳)有限公司 | Paste and cover membrane tool |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106102327A (en) | 2016-11-09 |
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