CN106084750A - 一种应用于led植物生长灯芯片封装的增透有机硅改性聚氨酯胶 - Google Patents
一种应用于led植物生长灯芯片封装的增透有机硅改性聚氨酯胶 Download PDFInfo
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Abstract
本发明公开了一种应用于LED植物生长灯芯片封装的增透有机硅改性聚氨酯胶,这种封装胶中加入了纳米氧化铈、纳米氟化钙等纳米材料,有效的改善了胶层的光学性能,获得具有增透效果的膜层,提高了芯片的出光效率,光强度更高,加入的异丙醇铝还能提高胶料的导热性能,最终获得了一种具有良好封装效果的树脂胶,极大地提高了灯具对植物的有效照射率,高效的促进了植物的生长,且使用简单,使用时直接将其涂覆在芯片或者荧光粉层上固化即可。
Description
技术领域
本发明涉及LED封装胶技术领域,尤其涉及一种应用于LED植物生长灯芯片封装的增透有机硅改性聚氨酯胶。
背景技术
植物生长过程中光照是一个至关重要的因素,在种植过程中,因为自然条件的变化,尤其是在晚秋和冬季,植物的光照明显不足,此时室内补充照明就显得尤为重要了。LED光源是近年来崛起的在农业领域较为理想的人工光源,较之传统光源,LED光源节能环保,光谱纯净,贴合植物生长的波长范围,拥有巨大的市场需求量。
LED植物生长灯多是由若干均匀分布的单灯组合而成,其中单灯是由若干个发光芯片封装而成,生产过程一般为固晶、焊线、灌封、切割、测试、包装这几个流程,其中灌封胶的性能将直接影响到芯片的出光效率和使用寿命,目前LED植物灯在应用过程中存在的问题主要是发光效率低,光分散度高,而大功率的芯片封装又存在散热性差、使用寿命短等问题。
发明内容
本发明目的就是为了弥补已有技术的缺陷,提供一种应用于LED植物生长灯芯片封装的增透有机硅改性聚氨酯胶。
本发明是通过以下技术方案实现的:
一种应用于LED植物生长灯芯片封装的增透有机硅改性聚氨酯胶,所述的增透有机硅改性聚氨酯胶由以下重量份的原料制得:聚丙二醇50-60、羟基硅油20-30、甲苯-2,4-二异氰酸酯12-18、二月桂酸二丁基锡0.1-0.2、纳米氧化铈0.1-0.2、纳米氟化钙2-3、硅烷偶联剂0.1-0.2、异丙醇铝0.5-1、丁基缩水甘油醚5-10。
所述的增透有机硅改性聚氨酯胶由以下步骤制得:
(1)将纳米氧化铈、纳米氟化钙与硅烷偶联剂混合研磨分散20-30min备用;
(2)将异丙醇铝投入丁基缩水甘油醚中,密闭超声搅拌混合3-5h,制成透明溶胶,随后投入步骤(1)制备的物料,继续超声分散2-3h,所得物料备用;
(3)将聚丙二醇与羟基硅油混合,在110℃条件下真空脱水处理,完全脱除水分后冷却至50-60℃,滴加甲苯-2,4-二异氰酸酯,边滴加边搅拌,滴加完毕后恒温反应3-5h,反应结束后滴加二月桂酸二丁基锡,升温至60-70℃,反应1-2h,过滤出料,得有机硅改性聚氨酯乳液备用;
(4)将步骤(1)、步骤(2)制得的物料依次加入步骤(3)制得的有机硅改性聚氨酯乳液中,搅拌混合均匀后物料经过滤、真空脱泡后涂覆于芯片或荧光层上,待其固化后即完成封装。
本发明利用有机硅改性聚氨酯胶对植物生长灯中的芯片进行封装,这种封装胶中加入了纳米氧化铈、纳米氟化钙等纳米材料,有效的改善了胶层的光学性能,获得具有增透效果的膜层,提高了芯片的出光效率,光强度更高,加入的异丙醇铝还能提高胶料的导热性能,最终获得了一种具有良好封装效果的树脂胶,极大地提高了灯具对植物的有效照射率,高效的促进了植物的生长,且使用简单,使用时直接将其涂覆在芯片或者荧光粉层上固化即可。
具体实施方式
该实施例的增透有机硅改性聚氨酯胶由以下重量份的原料制得:聚丙二醇50、羟基硅油20、甲苯-2,4-二异氰酸酯12、二月桂酸二丁基锡0.1、纳米氧化铈0.1、纳米氟化钙2、硅烷偶联剂0.1、异丙醇铝0.5、丁基缩水甘油醚5。
该增透有机硅改性聚氨酯胶由以下步骤制得:
(1)将纳米氧化铈、纳米氟化钙与硅烷偶联剂混合研磨分散20min备用;
(2)将异丙醇铝投入丁基缩水甘油醚中,密闭超声搅拌混合3h,制成透明溶胶,随后投入步骤(1)制备的物料,继续超声分散2h,所得物料备用;
(3)将聚丙二醇与羟基硅油混合,在110℃条件下真空脱水处理,完全脱除水分后冷却至50℃,滴加甲苯-2,4-二异氰酸酯,边滴加边搅拌,滴加完毕后恒温反应3h,反应结束后滴加二月桂酸二丁基锡,升温至60℃,反应1h,过滤出料,得有机硅改性聚氨酯乳液备用;
(4)将步骤(1)、步骤(2)制得的物料依次加入步骤(3)制得的有机硅改性聚氨酯乳液中,搅拌混合均匀后物料经过滤、真空脱泡后涂覆于芯片或荧光层上,待其固化后即完成封装。
产品性能测试结果如下:
拉伸强度:52.6MPa;吸水率%(25℃):0.64;折射率:1.522;透光率:83.6%。
Claims (2)
1.一种应用于LED植物生长灯芯片封装的增透有机硅改性聚氨酯胶,其特征在于,所述的增透有机硅改性聚氨酯胶由以下重量份的原料制得:聚丙二醇50-60、羟基硅油20-30、甲苯-2,4-二异氰酸酯12-18、二月桂酸二丁基锡0.1-0.2、纳米氧化铈0.1-0.2、纳米氟化钙2-3、硅烷偶联剂0.1-0.2、异丙醇铝0.5-1、丁基缩水甘油醚5-10。
2.如权利要求1所述的一种应用于LED植物生长灯芯片封装的增透有机硅改性聚氨酯胶,其特征在于,所述的增透有机硅改性聚氨酯胶由以下步骤制得:
(1)将纳米氧化铈、纳米氟化钙与硅烷偶联剂混合研磨分散20-30min备用;
(2)将异丙醇铝投入丁基缩水甘油醚中,密闭超声搅拌混合3-5h,制成透明溶胶,随后投入步骤(1)制备的物料,继续超声分散2-3h,所得物料备用;
(3)将聚丙二醇与羟基硅油混合,在110℃条件下真空脱水处理,完全脱除水分后冷却至50-60℃,滴加甲苯-2,4-二异氰酸酯,边滴加边搅拌,滴加完毕后恒温反应3-5h,反应结束后滴加二月桂酸二丁基锡,升温至60-70℃,反应1-2h,过滤出料,得有机硅改性聚氨酯乳液备用;
(4)将步骤(1)、步骤(2)制得的物料依次加入步骤(3)制得的有机硅改性聚氨酯乳液中,搅拌混合均匀后物料经过滤、真空脱泡后涂覆于芯片或荧光层上,待其固化后即完成封装。
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CN105669967A (zh) * | 2016-04-20 | 2016-06-15 | 中国工程物理研究院化工材料研究所 | 聚醚高分子刷杂化的纳米无机材料及其制备方法 |
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CN105669967A (zh) * | 2016-04-20 | 2016-06-15 | 中国工程物理研究院化工材料研究所 | 聚醚高分子刷杂化的纳米无机材料及其制备方法 |
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