CN106084750A - 一种应用于led植物生长灯芯片封装的增透有机硅改性聚氨酯胶 - Google Patents
一种应用于led植物生长灯芯片封装的增透有机硅改性聚氨酯胶 Download PDFInfo
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Abstract
本发明公开了一种应用于LED植物生长灯芯片封装的增透有机硅改性聚氨酯胶，这种封装胶中加入了纳米氧化铈、纳米氟化钙等纳米材料，有效的改善了胶层的光学性能，获得具有增透效果的膜层，提高了芯片的出光效率，光强度更高，加入的异丙醇铝还能提高胶料的导热性能，最终获得了一种具有良好封装效果的树脂胶，极大地提高了灯具对植物的有效照射率，高效的促进了植物的生长，且使用简单，使用时直接将其涂覆在芯片或者荧光粉层上固化即可。
Description
技术领域
本发明涉及LED封装胶技术领域，尤其涉及一种应用于LED植物生长灯芯片封装的增透有机硅改性聚氨酯胶。
背景技术
植物生长过程中光照是一个至关重要的因素，在种植过程中，因为自然条件的变化，尤其是在晚秋和冬季，植物的光照明显不足，此时室内补充照明就显得尤为重要了。LED光源是近年来崛起的在农业领域较为理想的人工光源，较之传统光源，LED光源节能环保，光谱纯净，贴合植物生长的波长范围，拥有巨大的市场需求量。
LED植物生长灯多是由若干均匀分布的单灯组合而成，其中单灯是由若干个发光芯片封装而成，生产过程一般为固晶、焊线、灌封、切割、测试、包装这几个流程，其中灌封胶的性能将直接影响到芯片的出光效率和使用寿命，目前LED植物灯在应用过程中存在的问题主要是发光效率低，光分散度高，而大功率的芯片封装又存在散热性差、使用寿命短等问题。
发明内容
本发明目的就是为了弥补已有技术的缺陷，提供一种应用于LED植物生长灯芯片封装的增透有机硅改性聚氨酯胶。
本发明是通过以下技术方案实现的：
一种应用于LED植物生长灯芯片封装的增透有机硅改性聚氨酯胶，所述的增透有机硅改性聚氨酯胶由以下重量份的原料制得：聚丙二醇50-60、羟基硅油20-30、甲苯-2，4-二异氰酸酯12-18、二月桂酸二丁基锡0.1-0.2、纳米氧化铈0.1-0.2、纳米氟化钙2-3、硅烷偶联剂0.1-0.2、异丙醇铝0.5-1、丁基缩水甘油醚5-10。
所述的增透有机硅改性聚氨酯胶由以下步骤制得：
（1）将纳米氧化铈、纳米氟化钙与硅烷偶联剂混合研磨分散20-30min备用；
（2）将异丙醇铝投入丁基缩水甘油醚中，密闭超声搅拌混合3-5h，制成透明溶胶，随后投入步骤（1）制备的物料，继续超声分散2-3h，所得物料备用；
（3）将聚丙二醇与羟基硅油混合，在110℃条件下真空脱水处理，完全脱除水分后冷却至50-60℃，滴加甲苯-2，4-二异氰酸酯，边滴加边搅拌，滴加完毕后恒温反应3-5h，反应结束后滴加二月桂酸二丁基锡，升温至60-70℃，反应1-2h，过滤出料，得有机硅改性聚氨酯乳液备用；
（4）将步骤（1）、步骤（2）制得的物料依次加入步骤（3）制得的有机硅改性聚氨酯乳液中，搅拌混合均匀后物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其固化后即完成封装。
本发明利用有机硅改性聚氨酯胶对植物生长灯中的芯片进行封装，这种封装胶中加入了纳米氧化铈、纳米氟化钙等纳米材料，有效的改善了胶层的光学性能，获得具有增透效果的膜层，提高了芯片的出光效率，光强度更高，加入的异丙醇铝还能提高胶料的导热性能，最终获得了一种具有良好封装效果的树脂胶，极大地提高了灯具对植物的有效照射率，高效的促进了植物的生长，且使用简单，使用时直接将其涂覆在芯片或者荧光粉层上固化即可。
具体实施方式
该实施例的增透有机硅改性聚氨酯胶由以下重量份的原料制得：聚丙二醇50、羟基硅油20、甲苯-2，4-二异氰酸酯12、二月桂酸二丁基锡0.1、纳米氧化铈0.1、纳米氟化钙2、硅烷偶联剂0.1、异丙醇铝0.5、丁基缩水甘油醚5。
该增透有机硅改性聚氨酯胶由以下步骤制得：
（1）将纳米氧化铈、纳米氟化钙与硅烷偶联剂混合研磨分散20min备用；
（2）将异丙醇铝投入丁基缩水甘油醚中，密闭超声搅拌混合3h，制成透明溶胶，随后投入步骤（1）制备的物料，继续超声分散2h，所得物料备用；
（3）将聚丙二醇与羟基硅油混合，在110℃条件下真空脱水处理，完全脱除水分后冷却至50℃，滴加甲苯-2，4-二异氰酸酯，边滴加边搅拌，滴加完毕后恒温反应3h，反应结束后滴加二月桂酸二丁基锡，升温至60℃，反应1h，过滤出料，得有机硅改性聚氨酯乳液备用；
（4）将步骤（1）、步骤（2）制得的物料依次加入步骤（3）制得的有机硅改性聚氨酯乳液中，搅拌混合均匀后物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其固化后即完成封装。
产品性能测试结果如下：
拉伸强度：52.6MPa；吸水率%（25℃）：0.64；折射率：1.522；透光率：83.6%。
Claims (2)
1.一种应用于LED植物生长灯芯片封装的增透有机硅改性聚氨酯胶，其特征在于，所述的增透有机硅改性聚氨酯胶由以下重量份的原料制得：聚丙二醇50-60、羟基硅油20-30、甲苯-2，4-二异氰酸酯12-18、二月桂酸二丁基锡0.1-0.2、纳米氧化铈0.1-0.2、纳米氟化钙2-3、硅烷偶联剂0.1-0.2、异丙醇铝0.5-1、丁基缩水甘油醚5-10。
2.如权利要求1所述的一种应用于LED植物生长灯芯片封装的增透有机硅改性聚氨酯胶，其特征在于，所述的增透有机硅改性聚氨酯胶由以下步骤制得：
（1）将纳米氧化铈、纳米氟化钙与硅烷偶联剂混合研磨分散20-30min备用；
（2）将异丙醇铝投入丁基缩水甘油醚中，密闭超声搅拌混合3-5h，制成透明溶胶，随后投入步骤（1）制备的物料，继续超声分散2-3h，所得物料备用；
（3）将聚丙二醇与羟基硅油混合，在110℃条件下真空脱水处理，完全脱除水分后冷却至50-60℃，滴加甲苯-2，4-二异氰酸酯，边滴加边搅拌，滴加完毕后恒温反应3-5h，反应结束后滴加二月桂酸二丁基锡，升温至60-70℃，反应1-2h，过滤出料，得有机硅改性聚氨酯乳液备用；
（4）将步骤（1）、步骤（2）制得的物料依次加入步骤（3）制得的有机硅改性聚氨酯乳液中，搅拌混合均匀后物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其固化后即完成封装。
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| CN1674315A (zh) * | 2004-03-26 | 2005-09-28 | 株式会社小糸制作所 | 光源组件和车辆用前照灯 |
| CN105623586A (zh) * | 2015-12-29 | 2016-06-01 | 安徽安大华泰新材料有限公司 | 一种耐热耐候性聚氨酯灌封胶的制备方法 |
| CN105669967A (zh) * | 2016-04-20 | 2016-06-15 | 中国工程物理研究院化工材料研究所 | 聚醚高分子刷杂化的纳米无机材料及其制备方法 |
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| CN1674315A (zh) * | 2004-03-26 | 2005-09-28 | 株式会社小糸制作所 | 光源组件和车辆用前照灯 |
| CN105623586A (zh) * | 2015-12-29 | 2016-06-01 | 安徽安大华泰新材料有限公司 | 一种耐热耐候性聚氨酯灌封胶的制备方法 |
| CN105669967A (zh) * | 2016-04-20 | 2016-06-15 | 中国工程物理研究院化工材料研究所 | 聚醚高分子刷杂化的纳米无机材料及其制备方法 |
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| 韩英: "铈基纳米氧化物改性有机硅封装胶的研究", 《中国优秀硕士学位论文全文数据库 工程科技I辑》 * |
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