CN106079627B - A kind of preparation method of demixing plate - Google Patents
A kind of preparation method of demixing plate Download PDFInfo
- Publication number
- CN106079627B CN106079627B CN201610416571.2A CN201610416571A CN106079627B CN 106079627 B CN106079627 B CN 106079627B CN 201610416571 A CN201610416571 A CN 201610416571A CN 106079627 B CN106079627 B CN 106079627B
- Authority
- CN
- China
- Prior art keywords
- layer
- internal layer
- line
- copper
- pure glue
- Prior art date
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Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000004642 Polyimide Substances 0.000 claims abstract description 16
- 229920001721 polyimide Polymers 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
- B32B2038/045—Slitting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/05—5 or more layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of preparation method of demixing plate, demixing plate includes internal layer and outer layer, and outer layer is arranged on the upper and lower surface of internal layer, and outer layer includes layers of copper and polyimide layer, hole is provided with internal layer；Internal layer includes pure glue-line and without copper hardboard substrate layer, and pure glue-line is arranged on the upper and lower surface of no copper hardboard substrate layer；Preparation method using above demixing plate includes：Overlapped successively by pure glue-line, without copper hardboard substrate layer and pure glue-line, internal layer is firmly combined together to form by pure glue-line, without copper hardboard substrate layer and pure glue-line by way of pressing；Internal layer is drilled by power auger and is punched into windowing figure；In the upper and lower surface stack unification outer layer for the internal layer being punched, the polyimide layer fitting internal layer of outer layer is set, and this five layer material is bonded together by false patch mode；This five layer material is firmly bonded by fast press and is finally formed by curing an entirety.By the above-mentioned means, former pressure transmission mode can be changed to existing fast pressure mode by the present invention, to realize improved efficiency and cost savings.
Description
Technical field
The present invention relates to demixing plate field, more particularly to a kind of preparation method of demixing plate.
Background technology
Existing demixing plate includes internal layer and outer layer, and outer layer is arranged on the upper and lower surface of internal layer, and outer layer includes layers of copper and gathered
Imide layer, layers of copper and polyimide layer are superimposed together, and polyimide layer is set close to internal layer；Internal layer includes layer of prepreg
With pure glue-line, layer of prepreg is arranged on the upper and lower surface of internal layer, hole is provided with internal layer.The pressure transmission mode of existing demixing plate is
Pressing stage by stage, pressure, time, the temperature in each stage are different, and the time is longer, and caused cost also compared with
It is high.
The content of the invention
The present invention solves the technical problem of a kind of preparation method of demixing plate is provided, the thickness of internal layer can ensured
By changing the folded structure of internal layer on the premise of degree and hardness, so as to which former pressure transmission mode is changed into existing fast pressure mode, with reality
Existing improved efficiency and cost savings, its is simple in construction, easy to operate.
In order to solve the above technical problems, one aspect of the present invention is：A kind of making side of demixing plate is provided
Method, demixing plate include internal layer and outer layer, and the outer layer is arranged on the upper and lower surface of the internal layer, and the outer layer includes layers of copper and gathered
Imide layer, layers of copper and polyimide layer are superimposed together, and polyimide layer is bonded the internal layer and set, and are provided with the internal layer
Hole, the internal layer include pure glue-line and without copper hardboard substrate layers, and pure glue-line is arranged on the upper and lower surface of no copper hardboard substrate layer；
Preparation method using above demixing plate includes：
（1）Overlapped successively by pure glue-line, without copper hardboard substrate layer and pure glue-line, by pure glue-line, nothing by way of pressing
Copper hardboard substrate layer and pure glue-line are firmly combined together to form internal layer；
（2）Internal layer is drilled by power auger and is punched into windowing figure；
（3）In the upper and lower surface stack unification outer layer for the internal layer being punched, the polyimide layer fitting internal layer of outer layer is set
Put, and this five layer material is bonded together by false patch mode；
（4）This five layer material is firmly bonded by fast press and is finally formed by curing an entirety.
Preferably, the windowing figure is rectangular.
Preferably, the false patch mode is to be brought into close contact mode.
The beneficial effects of the invention are as follows：The present invention can be on the premise of the thickness of internal layer and hardness be ensured by change
The folded structure of layer, so as to which former pressure transmission mode is changed into existing fast pressure mode, to realize improved efficiency and cost savings.
Brief description of the drawings
Fig. 1 is a kind of circuit theory schematic diagram of the preferred embodiment of preparation method one of demixing plate of the present invention.
Embodiment
Presently preferred embodiments of the present invention is described in detail below in conjunction with the accompanying drawings, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, apparent is clearly defined so as to be made to protection scope of the present invention.
Referring to Fig. 1, the embodiment of the present invention includes：
A kind of preparation method of demixing plate, demixing plate include internal layer and outer layer, and the outer layer is arranged on the upper of the internal layer
Lower two sides, the outer layer include layers of copper and polyimide layer, and layers of copper and polyimide layer are superimposed together, polyimide layer fitting
The internal layer is set, and hole is provided with the internal layer, and the internal layer includes pure glue-line and without copper hardboard substrate layer（Without copper hardboard base material
Layer is also referred to as optical port layer）, pure glue-line is arranged on the upper and lower surface of no copper hardboard substrate layer.
Preparation method using above demixing plate includes：
（1）Overlapped successively by pure glue-line, without copper hardboard substrate layer and pure glue-line, by pure glue-line, nothing by way of pressing
Copper hardboard substrate layer and pure glue-line are firmly combined together to form internal layer；
（2）Internal layer is drilled by power auger and is punched into windowing figure, windowing figure is rectangular；
（3）In the upper and lower surface stack unification outer layer for the internal layer being punched, the polyimide layer fitting internal layer of outer layer is set
Put, and this five layer material is bonded together by being brought into close contact mode；
（4）This five layer material is firmly bonded by fast press and is finally formed by curing an entirety.
The present invention aims at layering type FPC plate designs, makes such product pressing flow more simplified, greatly promotes life
Efficiency is produced, the material in bonding processes is more simple, and production cost is more saved, and internal layer has been changed in the operation process of new departure
Folded structure, by the folded structure mode of original（Layer of prepreg+pure glue-line+layer of prepreg）It is changed to now fold structure mode（Pure glue-line+without copper
Hardboard substrate layer+pure glue-line）, the advantage of this mode is exactly to take full advantage of the high fillibility and high viscosity of pure glue, can make product
Firmly combined with polyimides, so as to which the synchronous pressing of internal layer and outer layer can be realized, i.e., only need one step press to realize interior
The overall combination of layer, outer layer.
The present invention can be on the premise of the thickness of internal layer and hardness be ensured by changing the folded structure of internal layer, so as to which original be passed
Pressure mode is changed to existing fast pressure mode, and to realize improved efficiency and cost savings, its is simple in construction, easy to operate.This hair
The bright folded structure for changing internal layer simultaneously ensures that all conditions all meet product requirement.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills
Art field, is included within the scope of the present invention.
Claims (3)
1. a kind of preparation method of demixing plate, demixing plate includes internal layer and outer layer, and the outer layer is arranged on the upper and lower of the internal layer
Two sides, the outer layer include layers of copper and polyimide layer, and layers of copper and polyimide layer are superimposed together, polyimide layer fitting institute
Internal layer setting is stated, hole is provided with the internal layer, it is characterised in that：The internal layer includes pure glue-line and without copper hardboard substrate layer, pure
Glue-line is arranged on the upper and lower surface of no copper hardboard substrate layer；
Preparation method using above demixing plate includes：
（1）Overlapped successively by pure glue-line, without copper hardboard substrate layer and pure glue-line, by pure glue-line, hard without copper by way of pressing
Plate substrate layer and pure glue-line are firmly combined together to form internal layer；
（2）Internal layer is drilled by power auger and is punched into windowing figure；
（3）In the upper and lower surface stack unification outer layer for the internal layer being punched, the polyimide layer fitting internal layer of outer layer is set, and
This five layer material is bonded together by false patch mode；
（4）This five layer material is firmly bonded by fast press and is finally formed by curing an entirety.
A kind of 2. preparation method of demixing plate according to claim 1, it is characterised in that：The windowing figure is rectangular.
A kind of 3. preparation method of demixing plate according to claim 1, it is characterised in that：The false patch mode is close patch
Conjunction mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610416571.2A CN106079627B (en) | 2016-06-15 | 2016-06-15 | A kind of preparation method of demixing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610416571.2A CN106079627B (en) | 2016-06-15 | 2016-06-15 | A kind of preparation method of demixing plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106079627A CN106079627A (en) | 2016-11-09 |
| CN106079627B true CN106079627B (en) | 2018-01-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610416571.2A Active CN106079627B (en) | 2016-06-15 | 2016-06-15 | A kind of preparation method of demixing plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN106079627B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604570A (en) * | 2016-12-21 | 2017-04-26 | 深圳市景旺电子股份有限公司 | Flexible laminated board and making method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102111961B (en) * | 2010-12-20 | 2012-11-14 | 胜宏电子（惠阳）有限公司 | Method for detecting process capability of inner and outer layers of circuit board |
| CN103025084A (en) * | 2012-12-24 | 2013-04-03 | 胜宏科技（惠州）股份有限公司 | Solder resist plug hole air guide tool and manufacturing method thereof |
| CN105392279A (en) * | 2015-12-17 | 2016-03-09 | 王朝 | PCB board edge multi-row bonding pad and preparation method of multi-row edge ponding pad PCB board |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN106079627A (en) | 2016-11-09 |
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Address after: 215000 Jiangsu Suzhou Xiangcheng District Huangqiao Street Mu Xiang Village Suzhou City Huayang electronic Limited by Share Ltd Patentee after: SUZHOU HUAYANG ELECTRONICS Co.,Ltd. Address before: 215132 Muxiang Village, Huangqiao Street, Xiangcheng District, Suzhou City, Jiangsu Province Patentee before: SUZHOU SMARTRON TECHNOLOGY Corp.,Ltd. |