CN106067427A - Partial exposure exception defect automatic testing method - Google Patents
Partial exposure exception defect automatic testing method Download PDFInfo
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- CN106067427A CN106067427A CN201610356816.7A CN201610356816A CN106067427A CN 106067427 A CN106067427 A CN 106067427A CN 201610356816 A CN201610356816 A CN 201610356816A CN 106067427 A CN106067427 A CN 106067427A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention provides a kind of partial exposure exception defect automatic testing method, including: use the flaw indication of defect checking machine platform detection wafer, and generate flaw indication file according to testing result；Being bianry image file by flaw indication file translations, each of which defect point constitutes a valid pixel；The all valid pixels utilizing clustering algorithm to constitute defect point carry out cluster analysis, obtain the information of clustering defect, and record this clustering defect positional information on wafer；According to Wafer identification information, from manufacturing execution system, obtain the machine station information of the technique board that described wafer is passed through；Described Wafer identification information, described machine station information, described clustering flaw indication and the clustering defect positional information on wafer is preserved to data base；Whether all clustering defects that traversal obtains, according to clustering defect characteristic and machine station information, have the defect meeting similarity Condition to occur in the database in retrieval specified time interval.
Description
Technical field
The present invention relates to field of semiconductor manufacture and areas of information technology, it is more particularly related to a kind of office
The abnormal defect automatic testing method of portion's exposure.
Background technology
Currently, in semiconductor technology processes, the method for the detection of partial exposure exception defect is: Defect Scanning machine
Platform carries out Defect Scanning to wafer, and after testing result is delivered to corresponding defect report system, artificial investigation constitutes clustering
(cluster) defect, if there is such defect, then compares the wafer of same batch, if there being similar clustering to lack
Fall into and occur in identical position, then it is assumed that this defect is partial exposure exception defect.
But, such scheme disadvantageously, on the one hand, artificial manually behaviour lacks promptness；And on the other hand, not
With being also required to carry out artificial judgment when comparing between wafer, thus it is difficult to ensure that the accuracy of artificial judgment.
Accordingly, it is desirable to can provide a kind of manually-operated need not realize the side that partial exposure exception defect detects automatically
Method.
Summary of the invention
The technical problem to be solved is for there is drawbacks described above in prior art, it is provided that one can be in nothing
Must be effectively realized, in the case of manual operation, the improved method that partial exposure exception defect detects automatically.
In order to realize above-mentioned technical purpose, according to the present invention, it is provided that a kind of partial exposure exception defect side of detection automatically
Method, including:
First step: use the flaw indication of defect checking machine platform detection wafer, and generate defect according to testing result
Signal file；
Second step: be bianry image file by flaw indication file translations, each of which defect point constitutes one to be had
Effect pixel；
Third step: all valid pixels utilizing clustering algorithm to constitute defect point carry out cluster analysis, obtains clustering
The information of defect, and record this clustering defect positional information on wafer；
4th step: according to Wafer identification information, obtain the technique machine that described wafer is passed through from manufacturing execution system
The machine station information of platform；
5th step: by described Wafer identification information, described machine station information, described clustering flaw indication and clustering defect
Positional information on wafer preserves to data base；
6th step: all clustering defects that traversal obtains, according to clustering defect characteristic and machine station information, at described number
According to whether there being the defect meeting similarity Condition in storehouse is retrieved specified time interval occur.
Preferably, described partial exposure exception defect automatic testing method also includes: if retrieved in the database
To meeting the result of similarity Condition, then judge that the clustering defect detected is an effective partial exposure exception defect.
Preferably, described partial exposure exception defect automatic testing method also includes: if do not had in the database
Retrieve the result meeting similarity Condition, then judge that the clustering defect detected is that an invalid partial exposure is abnormal scarce
Fall into.
Preferably, have what the defect meeting similarity Condition was to occur in wafer same position to have identical clustering described in
Defect characteristic and the defect of identical machine station information.
Preferably, described clustering defect characteristic is the position of clustering defect.
Preferably, described clustering defect characteristic is the shape of clustering defect.
Preferably, described Wafer identification information is wafer identification code.
Preferably, described Wafer identification information is wafer lot identification codes.
In the present invention, automatically detected possible partial exposure exception defect by clustering algorithm, by corresponding backtracking
Whether algorithm inspection exists same flaw indication by other wafer of same board in same position, if there is then thinking
It it is correct partial exposure exception flaw indication.Thus, whether the present invention can efficiently solve artificial judgment clustering signal and exist
Accuracy and promptness relatively low problem during same position, find problematic wafer in time.
Accompanying drawing explanation
In conjunction with accompanying drawing, and by with reference to detailed description below, it will more easily the present invention is had more complete understanding
And its adjoint advantage and feature is more easily understood, wherein:
Fig. 1 schematically shows partial exposure exception defect automatic testing method according to the preferred embodiment of the invention
Flow chart.
It should be noted that accompanying drawing is used for illustrating the present invention, and the unrestricted present invention.Note, represent that the accompanying drawing of structure can
Can be not necessarily drawn to scale.Further, in accompanying drawing, same or like element indicates same or like label.
Detailed description of the invention
In order to make present disclosure more clear and understandable, below in conjunction with specific embodiments and the drawings in the present invention
Appearance is described in detail.
In the present invention, automatically detected possible partial exposure exception defect by clustering algorithm, by corresponding backtracking
Whether algorithm inspection exists same flaw indication by other wafer of same board in same position, if there is then thinking
It it is correct partial exposure exception flaw indication.
The present invention is described below has preferred embodiment.
Fig. 1 schematically shows partial exposure exception defect automatic testing method according to the preferred embodiment of the invention
Flow chart.
As it is shown in figure 1, partial exposure exception defect automatic testing method includes according to the preferred embodiment of the invention:
First step S1: use the flaw indication of defect checking machine platform detection wafer, and generate according to testing result scarce
Fall into signal file；
Such as, described defect checking machine platform be model be the board of KLA-Tencor 2825.KLA-Tencor 2825 machine
Platform can generate the flaw indication file of standard after flaw indication being detected.However, it is desirable to explanation, fall into the model of detection board
It is not limited to the board that model is KLA-Tencor 2825, can normally generate KLARF reticle it practice, the most all
The scanning machine of formula file is all applicable to the present invention.
Second step S2: be bianry image file by flaw indication file translations, each of which defect point constitutes one
Valid pixel；
Third step S3: all valid pixels utilizing clustering algorithm to constitute defect point carry out cluster analysis, obtain group
The information of poly-defect, and record this clustering defect positional information on wafer；
4th step S4: according to Wafer identification information, obtain the technique that described wafer is passed through from manufacturing execution system
The machine station information of board；
Such as, described Wafer identification information is wafer lot identification codes and/or wafer identification code.
5th step S5: described Wafer identification information, described machine station information, described clustering flaw indication and clustering are lacked
The positional information being trapped on wafer preserves to data base；
6th step S6: all clustering defects that traversal obtains, according to clustering defect characteristic and machine station information, described
The defect meeting similarity Condition whether is had to occur in data base retrieves specified time interval.
Thus, if retrieving the result meeting similarity Condition in the database, then the clustering detected is judged
Defect is an effective partial exposure exception defect.Similarity is met whereas if the most do not retrieve
The result of condition, then judge that the clustering defect detected is an invalid partial exposure exception defect.
Specifically, have what the defect meeting similarity Condition was to occur in wafer same position to have identical clustering described in
Defect characteristic and the defect of identical machine station information.
For instance, it is preferred that described clustering defect characteristic is position and/or the shape of clustering defect of clustering defect.
And, such as, specifically, described specified time interval refer to before predetermined number of days within.
In the present invention, automatically detected possible partial exposure exception defect by clustering algorithm, by corresponding backtracking
Whether algorithm inspection exists same flaw indication by other wafer of same board in same position, if there is then thinking
It it is correct partial exposure exception flaw indication.Thus, whether the present invention can efficiently solve artificial judgment clustering signal and exist
Accuracy and promptness relatively low problem during same position, find problematic wafer in time.
Furthermore, it is necessary to explanation, unless stated otherwise or point out, otherwise the term in description " first ", " the
Two ", " the 3rd " etc. describe be used only for distinguishing in description each assembly, element, step etc. rather than for representing each
Logical relation between assembly, element, step or ordering relation etc..
Although it is understood that the present invention discloses as above with preferred embodiment, but above-described embodiment being not used to
Limit the present invention.For any those of ordinary skill in the art, without departing under technical solution of the present invention ambit,
Technical solution of the present invention is made many possible variations and modification by the technology contents that all may utilize the disclosure above, or is revised as
Equivalent embodiments with change.Therefore, every content without departing from technical solution of the present invention, according to the technical spirit pair of the present invention
Any simple modification made for any of the above embodiments, equivalent variations and modification, all still fall within the scope of technical solution of the present invention protection
In.
Claims (9)
1. a partial exposure exception defect automatic testing method, it is characterised in that including:
First step: use the flaw indication of defect checking machine platform detection wafer, and generate flaw indication according to testing result
File；
Second step: be bianry image file by flaw indication file translations, each of which defect point constitutes an effective picture
Element；
Third step: all valid pixels utilizing clustering algorithm to constitute defect point carry out cluster analysis, obtains clustering defect
Information, and record this clustering defect positional information on wafer；
4th step: according to Wafer identification information, obtains the technique board that described wafer passed through from manufacturing execution system
Machine station information；
5th step: by described Wafer identification information, described machine station information, described clustering flaw indication and clustering defect at crystalline substance
Positional information on circle preserves to data base；
6th step: all clustering defects that traversal obtains, according to clustering defect characteristic and machine station information, described data base
The defect meeting similarity Condition whether is had to occur in middle retrieval specified time interval.
Partial exposure exception defect automatic testing method the most according to claim 1, it is characterised in that also include: if
Described data base retrieves the result meeting similarity Condition, then judges that the clustering defect detected is an effective local
The abnormal defect of exposure.
Partial exposure exception defect automatic testing method the most according to claim 1 and 2, it is characterised in that also include: as
Fruit does not the most retrieve the result meeting similarity Condition, then judge that the clustering defect detected is a nothing
The partial exposure exception defect of effect.
Partial exposure exception defect automatic testing method the most according to claim 1 and 2, it is characterised in that described in have symbol
What the defect of conjunction similarity Condition was to occur in wafer same position has identical clustering defect characteristic and identical board letter
The defect of breath.
Partial exposure exception defect automatic testing method the most according to claim 1 and 2, it is characterised in that described clustering
Defect characteristic is the position of clustering defect.
Partial exposure exception defect automatic testing method the most according to claim 1 and 2, it is characterised in that described clustering
Defect characteristic is the shape of clustering defect.
Partial exposure exception defect automatic testing method the most according to claim 1 and 2, it is characterised in that described wafer
Identification information is wafer identification code.
Partial exposure exception defect automatic testing method the most according to claim 1 and 2, it is characterised in that described wafer
Identification information is wafer lot identification codes.
Partial exposure exception defect automatic testing method the most according to claim 1 and 2, it is characterised in that described defect
The type of detection board is all wafer defect scanning machines.
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| CN201610356816.7A CN106067427B (en) | 2016-05-25 | 2016-05-25 | Partial exposure exception defect automatic testing method |
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Cited By (6)
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| CN108899288A (en) * | 2018-07-20 | 2018-11-27 | 上海华虹宏力半导体制造有限公司 | The determination method of monitoring method and laser incising board the alignment position of wafer mark |
| CN109449093A (en) * | 2018-10-24 | 2019-03-08 | 武汉新芯集成电路制造有限公司 | Wafer detection method |
| CN109522931A (en) * | 2018-10-18 | 2019-03-26 | 深圳市华星光电半导体显示技术有限公司 | Judge the method and its system of the folded figure aggregation of defect |
| CN110610214A (en) * | 2019-09-23 | 2019-12-24 | 桂林电子科技大学 | Wafer map fault mode identification method and system based on DCNN |
| CN115667915A (en) * | 2020-05-01 | 2023-01-31 | Pdf决策公司 | Root cause analysis based on wafer bin maps |
| CN117471292A (en) * | 2023-12-28 | 2024-01-30 | 深圳市森美协尔科技有限公司 | Wafer crack identification method and related device |
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| CN108899288A (en) * | 2018-07-20 | 2018-11-27 | 上海华虹宏力半导体制造有限公司 | The determination method of monitoring method and laser incising board the alignment position of wafer mark |
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| CN109522931A (en) * | 2018-10-18 | 2019-03-26 | 深圳市华星光电半导体显示技术有限公司 | Judge the method and its system of the folded figure aggregation of defect |
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| CN110610214A (en) * | 2019-09-23 | 2019-12-24 | 桂林电子科技大学 | Wafer map fault mode identification method and system based on DCNN |
| CN115667915A (en) * | 2020-05-01 | 2023-01-31 | Pdf决策公司 | Root cause analysis based on wafer bin maps |
| CN117471292A (en) * | 2023-12-28 | 2024-01-30 | 深圳市森美协尔科技有限公司 | Wafer crack identification method and related device |
| CN117471292B (en) * | 2023-12-28 | 2024-03-19 | 深圳市森美协尔科技有限公司 | Wafer crack identification method and related device |
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| CN106067427B (en) | 2019-03-26 |
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