CN106062118A - Anisotropic conductive adhesive, method for producing connector and method for connecting electronic component - Google Patents

Anisotropic conductive adhesive, method for producing connector and method for connecting electronic component Download PDF

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Publication number
CN106062118A
CN106062118A CN201580013038.5A CN201580013038A CN106062118A CN 106062118 A CN106062118 A CN 106062118A CN 201580013038 A CN201580013038 A CN 201580013038A CN 106062118 A CN106062118 A CN 106062118A
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mentioned
light
absorption peak
photoepolymerizationinitiater initiater
optical absorption
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Granted
Application number
CN201580013038.5A
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Chinese (zh)
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CN106062118B (en
Inventor
稻濑圭亮
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Dexerials Corp
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Dexerials Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
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  • Spectroscopy & Molecular Physics (AREA)
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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
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  • Conductive Materials (AREA)
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  • Adhesive Tapes (AREA)

Abstract

An electronic component is connected at a low temperature and connection failure of the electronic component is improved by using a photocurable adhesive. An anisotropic conductive adhesive which comprises a binder resin layer supported by a releasing base, and wherein the binder resin layer contains a photopolymerizable compound, a photopolymerization initiator, a light absorbent, and conductive particles. The light absorption peak wavelength of the light absorbent is larger than the light absorption peak wavelength of the photopolymerization initiator by 20 nm or more.

Description

Anisotropically conducting adhesive, the manufacture method of connector and the connection of electronic unit Method
Technical field
The present invention relates to: the anisotropic conductive containing photopolymerizable compound, Photoepolymerizationinitiater initiater and light absorber glues Connect agent, use the manufacture method of its connector and the method for attachment of electronic unit.The application with on March 11st, 2014 in Japan Claiming priority based on Japanese patent application No. Japanese Patent Application 2014-047585 of state's application, this application is received by seeing Enter in this application.
Background technology
In the past, as TV or PC display, smart mobile phone, portable game machine, digital audio-frequency player, flat board PC, The various display units of Wearable terminal or vehicle-mounted display etc. or display input block, use liquid crystal indicators or Touch-panel device.In recent years, in such display device or touch-panel device, from fine pitch, lightweight slim Changing from the viewpoint of waiting, employing has: so-called COG (glass flip chip (the chip on being directly installed on substrate by IC chip ) or will be formed with the so-called FOG (membrane of flip chip (film that the flexible substrate of various circuit is directly installed on substrate glass) on glass))。
Such as, as it is shown in fig. 7, use the liquid crystal indicator 100 of COG mounting means to have performance for liquid crystal display The display panels 104 of the function of tonic chord, this display panels 104 has mutually opposing two piece being made up of glass substrate etc. Transparent substrates 102,103.And, for display panels 104, the two transparent substrates 102,103 is close by frame-shaped Envelope 105 and bonded to each other, simultaneously by two transparent substrates 102,103 and seal 105 around space in be provided with and enclosed liquid crystal The panel display unit 107 of 106.
Transparent substrates 102,103 is formed, on two mutually opposing inner surfaces, by structures such as ITO (tin indium oxide) A pair transparency electrode 108,109 of the striated become is the most crossing.And, two transparent substrates 102,103 are transparent by the two This intersection area of electrode 108,109 and constitute the pixel of the least unit as liquid crystal display.
In two transparent substrates 102,103, planar dimension is relatively compared with another transparent substrates 102 for transparent substrates 103 The earth is formed, and the edge 103a of the transparent substrates 103 that this is formed significantly is formed with portion of terminal 109a of transparency electrode 109.Separately Outward, two transparency electrodes 108,109 are formed with the alignment films 111,112 implementing set friction treatment, by this alignment films 111, the initial orientation of 112 regulation liquid crystal molecules.Additionally, the outside of two transparency electrodes 108,109 is equipped with a pair polarization plates 118,119, the direction of vibration of the transmission light of the light source 120 from backlight etc. is specified by the two polarization plates 118,119.
It is connected to liquid crystal drive IC 115 across anisotropic conductive film 114 hot pressing in portion of terminal 109a.Anisotropy is led Electrolemma 114 is to be mixed into electroconductive particle in the adhesive resin of thermohardening type and make membranaceous and obtain, by between 2 conductors Carry out adding thermo-compressed, utilize conducting particles to obtain conducting between conductor, keep the machinery between conductor even by adhesive resin Connect.Liquid crystal drive IC 115 by pixel selection is applied liquid crystal drive voltage, can make the alignment portion ground of liquid crystal Change and carry out set liquid crystal display.Additionally, as the bonding agent of composition anisotropic conductive film 114, generally use reliable The bonding agent of the Thermocurable that property is the highest.
In the situation that across such anisotropic conductive film 114, liquid crystal drive IC 115 is connected to portion of terminal 109a Under, first, by not shown interim crimping unit, anisotropic conductive film 114 is crimped on temporarily the end of transparency electrode 109 On sub-portion 109a.Then, after anisotropic conductive film 114 carries liquid crystal drive IC 115, as shown in Figure 8, pass through The first-class thermo-compressed unit 121 of thermo-compressed by liquid crystal drive IC 115 together with anisotropic conductive film 114 towards portion of terminal 109a side presses, and makes thermo-compressed unit 121 generate heat.By the heating of this thermo-compressed unit 121, anisotropic conductive film 114 there is heat cure reaction, thus, across anisotropic conductive film 114, liquid crystal drive IC 115 are adhered to portion of terminal On 109a.
But, in the method for attachment using such anisotropic conductive film, hot pressed temperature is high, uses liquid crystal drive The electronic unit of IC 115 grade or the thermal shock of transparent substrates 103 are big.In addition, after being connected to anisotropic conductive film, will When temperature is reduced to room temperature, owing to abutting with this thermo-compressed unit 121 between electronic unit and the transparent substrates 103 of (when connecing) Temperature difference, portion of terminal 109a in transparent substrates 103 can produce warpage.Therefore, there is following worry: cause portion of terminal 109a week The display speckle produced on the liquid crystal panel on limit or the liquid crystal drive problem of the bad connection etc. of IC 115.This tendency is along with thoroughly Bright substrate 103 hold frame (holding under the arm) or the slimming of glass under the arm and the most notable.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2008-252098 publication.
Summary of the invention
Invent problem to be solved
Therefore, replace the anisotropic conductive film 114 of such use heat curable adhesive, use ultraviolet is also proposed The method of attachment of line curing type bonding agent.In the method for attachment using ultraviolet hardening bonding agent, do not use hot pressing order Unit, at normal temperatures the pressing liquid crystal drive electronic unit of IC 115 grade, from the backside illuminated ultraviolet of transparent substrates 103, by This makes adhesive resin solidify.Accordingly it is possible to prevent the transparent lining caused by the heating-up temperature difference of electronic unit or transparent substrates The end 103 or the liquid crystal drive warpage of IC 115.
But, for using the method for attachment of ultraviolet hardening bonding agent, also there is following worry: if in binding agent tree Pressurize under the state that the viscosity of fat is high, then can not be pressed into electroconductive particle fully, even if initial to connect resistance good connecting Good, also due to after Lian Jieing through time, the factor of environment, conducting resistance rising.
The present invention solves above-mentioned problem, its object is to provide: by using light-cured type bonding agent, at low temperatures Carry out the connection of electronic unit, improve the anisotropically conducting adhesive of the bad connection of electronic unit simultaneously；The system of connector Make the method for attachment of method and electronic unit.
For solving the means of problem
In order to solve above-mentioned problem, the anisotropically conducting adhesive of the present invention contains photopolymerizable compound, photopolymerization causes Agent and light absorber, the optical absorption peak value wavelength of the optical absorption peak above-mentioned Photoepolymerizationinitiater initiater of value wavelength ratio of above-mentioned light absorber Long, and it is separated by (difference) more than 20nm.
It addition, in the manufacture method of the connector of the present invention, across photocuring in the transparent substrates carried on the table It is that anisotropically conducting adhesive configures electronic unit, by crimping tool, above-mentioned electronic unit is pressed towards above-mentioned transparent substrates Pressure, carries out light irradiation by light illuminator simultaneously, and wherein, above-mentioned photocuring system anisotropically conducting adhesive contains optical polymerism Compound, Photoepolymerizationinitiater initiater and light absorber, the optical absorption peak above-mentioned Photoepolymerizationinitiater initiater of value wavelength ratio of above-mentioned light absorber Optical absorption peak value wavelength long, and be separated by more than 20nm, above-mentioned light illuminator irradiates and includes that the light of above-mentioned Photoepolymerizationinitiater initiater is inhaled Receive the light of the wavelength of the optical absorption peak value of peak value and above-mentioned light absorber.
It addition, in the method for attachment of the electronic unit of the present invention, solid across light in the transparent substrates carried on the table Change is that anisotropically conducting adhesive configures electronic unit, by crimping tool by above-mentioned electronic unit towards above-mentioned transparent substrates Pressing, carries out light irradiation by light illuminator simultaneously, and wherein, above-mentioned photocuring system anisotropically conducting adhesive contains photopolymerization Property compound, Photoepolymerizationinitiater initiater and light absorber, the optical absorption peak above-mentioned photopolymerization of value wavelength ratio of above-mentioned light absorber causes The optical absorption peak value wavelength of agent is long, and is separated by more than 20nm, and above-mentioned light illuminator irradiates the light including above-mentioned Photoepolymerizationinitiater initiater The light of the wavelength of the optical absorption peak value of absorption peak and above-mentioned light absorber.
Invention effect
According to the present invention, use a kind of anisotropically conducting adhesive, wherein, as Photoepolymerizationinitiater initiater and light absorber, light Optical absorption peak long more than the 20nm of value wavelength of the optical absorption peak value wavelength ratio Photoepolymerizationinitiater initiater of absorbent.Thus, it is possible at light In the case of the respective ultra-violet absorption of polymerization initiator and light absorber does not hinders, carry out respectively: adhesive resin The carrying out of curing reaction and the fusing of adhesive resin based on heating.Therefore, it can to manufacture have good internuncial Connector.
Accompanying drawing explanation
Fig. 1 is the sectional view of the display panels showing an example as connector.
Fig. 2 is the sectional view of the connection operation showing liquid crystal drive IC and transparent substrates.
Fig. 3 is the sectional view showing anisotropic conductive film.
Fig. 4 is Photoepolymerizationinitiater initiater and the optical absorption peak value ripple of light absorber of the anisotropic conductive film showing the present invention The chart of long relation.
Fig. 5 is the side view of the operation of the amount of warpage showing the connector sample measuring embodiment and comparative example.
Fig. 6 is the oblique view of the operation connecting resistance of the connector sample showing and measuring embodiment and comparative example.
Fig. 7 is the sectional view of display panels.
Fig. 8 is shown in the transparent substrates of display panels connecting the sectional view of the operation of IC chip.
Detailed description of the invention
Hereinafter, see accompanying drawing and explain anisotropically conducting adhesive, the manufacture of connector that the present invention is suitable for Method and the method for attachment of electronic unit.Additionally, the present invention is not limited only to following embodiment, without departing from the present invention's In the range of thought, certainly can carry out various changes.It addition, accompanying drawing is schematic, the ratio of each size etc. may be with reality Border is different.For concrete size etc., it should see the following description and judge.It addition, accompanying drawing also wraps each other certainly Include mutual size relationship or the different part of ratio.
Hereinafter, illustrate in case of carrying out so-called COG (glass flip chip (chiponglass)) installation, its In, the glass substrate of display panels is installed the liquid crystal drive IC chip as electronic unit.This LCD Plate 10 is as it is shown in figure 1, the two pieces of transparent substrates 11,12 being made up of glass substrate etc. are arranged opposite, and these transparent substrates 11,12 are led to Cross the sealing 13 of frame-shaped and bonded to each other.And, display panels 10 by by transparent substrates 11,12 around space in Enclose liquid crystal 14 and be formed with panel display unit 15.
Transparent substrates 11,12 is formed, and on two mutually opposing inner surfaces, is made up of ITO (tin indium oxide) etc. A pair transparency electrode 16,17 of striated the most crossing.And, two transparency electrodes 16,17 by the two transparency electrode 16, This intersection area of 17 and constitute the pixel of the least unit as liquid crystal display.
In two transparent substrates 11,12, planar dimension is significantly compared with another transparent substrates 11 for transparent substrates 12 Being formed, the edge 12a of the transparent substrates 12 that this is formed significantly is provided with: install liquid crystal drive IC 18 as electronic unit The COG installation portion 20 obtained, it addition, be provided with: install and be formed with the liquid crystal as electronic unit near the outside of COG installation portion 20 FOG installation portion 22 obtained by the flexible substrate 21 of drive circuit.Additionally, COG installation portion 20 is formed: the terminal of transparency electrode 17 Portion 17a, and the substrate side alignment mark 23 overlapping with the IC side alignment mark 24 that liquid crystal drive IC 18 is provided with.
Additionally, liquid crystal drive IC 18 can make taking of liquid crystal by pixel selection is applied liquid crystal drive voltage Set liquid crystal display is carried out to partly changing.It addition, as in figure 2 it is shown, liquid crystal drive IC 18 be formed across each to Anisotropic conductive film 1 turns on, with portion of terminal 17a of transparency electrode 17, the electrode terminal 19 being connected.Electrode terminal 19 can use suitably Such as copper bump or au bump or implement on copper bump gold-plated obtained by terminal etc..
It addition, liquid crystal drive IC 18 is formed on installed surface 18a: by overlapping with substrate side alignment mark 23 next Carry out the IC side alignment mark 24 of the alignment relative to transparent substrates 12.Additionally, due to the transparency electrode 17 of transparent substrates 12 Wire distribution distance or the liquid crystal drive propelling of the fine pitch of the electrode terminal 19 of IC 18, to liquid crystal drive with IC 18 with saturating Bright substrate 12 requires that high-precision alignment adjusts.
Each installation portion 20,22 is formed with portion of terminal 17a of transparency electrode 17.In portion of terminal 17a, anisotropy is used to lead Electrolemma 1 connects as the adhesive for circuit connection containing Photoepolymerizationinitiater initiater liquid crystal drive IC 18 or flexible substrate 21. Anisotropic conductive film 1 is containing electroconductive particle 4, and liquid crystal drive is with IC 18 or the electrode of flexible substrate 21 with in transparent substrates Portion of terminal 17a of the transparency electrode 17 that the edge 12a of 12 is formed electrically connects via electroconductive particle 4.This anisotropic conductive film 1 It is ultraviolet hardening bonding agent, by utilizing crimp head while utilizing ultraviolet radiation device 35 irradiation ultraviolet radiation described later 33 press and flow, and electroconductive particle 4 is pressed into each electrode of portion of terminal 17a and liquid crystal drive IC 18 or flexible substrate 21 Between, and solidify under the bulged-in state of electroconductive particle 4.Thus, anisotropic conductive film 1 is to transparent substrates 12 and liquid crystal Driving IC 18 or flexible substrate 21 carry out electricity, the connection of machinery.
It addition, be formed with the alignment films 24 implementing set friction treatment in two transparency electrodes 16,17, taken by this The initial orientation of liquid crystal molecule is specified to film 24.Additionally, the outside of two transparent substrates 11,12 is equipped with a pair polarization plates 25,26, The direction of vibration of the transmission light of the light source (not shown) from backlight etc. is specified by the two polarization plates 25,26.
[photocuring system anisotropic conductive film]
The present invention uses the anisotropic conductive film (ACF:Anisotropic Conductive Film) 1 of photocuring system. Anisotropic conductive film 1 can be any one of light cation system or optical free radical system, can properly select according to purpose.
As it is shown on figure 3, anisotropic conductive film 1 is being formed containing conductive grain as on the stripping film 2 of matrix material The adhesive resin layer (bond layer) 3 of son 4.As in figure 2 it is shown, anisotropic conductive film 1 is by making adhesive resin layer 3 Portion of terminal 17a and liquid crystal drive IC 18 in the transparency electrode 17 formed in the transparent substrates 12 of display panels 10 Electrode terminal 19 between, display panels 10 and liquid crystal drive IC 18 are connected, and make the two turn on.
As stripping film 2, it is usable in normally used such as polyethylene terephthalate in anisotropic conductive film The matrix material of ester film etc..
Anisotropic conductive film 1 contains film-forming resin, Photoepolymerizationinitiater initiater, optical polymerism in adhesive resin layer 3 Compound, light absorber and electroconductive particle 4.Anisotropic conductive film 1 is due to containing light absorber, so driving at liquid crystal described later Employing in the connection operation of IC 18, light absorber is irradiated by ultraviolet and generates heat, and makes adhesive resin soften.Thus, respectively to Electroconductive particle 4 can be pressed into fully between portion of terminal 17a and electrode terminal 19 by anisotropic conductive film 1 by crimp head 33. The heating temp of light absorber be with for press-in electroconductive particle 4 sufficiently degree make that adhesive resin softens same Time, the most do not exist transparent substrates 13 or the determined temperature of the thermal shock effect of liquid crystal drive IC 18, the most preferably 80～90 About DEG C, can select according to the material of light absorber and suitably set.
[light cation system]
The anisotropic conductive film 1 of light cation system causes containing film-forming resin, light cationic polymerization in adhesive resin layer 3 Agent, cationically photopolymerizable compound and light absorber.
As the resin that film-forming resin, preferably mean molecule quantity are 10000～about 80000.As film-forming resin, can arrange Lift phenoxy resin, epoxy resin, the various resins of modification (shape) epoxy resin, polyurethane resin etc..Wherein, formed from film From the viewpoint of state, connection reliability etc., phenoxy resin is particularly preferred.
As light cationic polymerization initiators, can use such as: iodine salt, sulfosalt, aromatic diazonium salt, phosphorus The salt of salt, selenium salt etc., or the complex compounds of metal-arene complex, silanol/aluminium complex etc., benzoin toluene sulphur Acid esters (benzoin tosylate), toluenesulfonic acid neighbour's p-Nitrobenzyl etc..It addition, as balance anion during formation salt, make With propylene carbonate salt, hexafluoro antimonate, hexafluorophosphate, tetrafluoroborate, four (pentafluorophenyl group) borate salt etc..
Light cationic polymerization initiators can only be used alone a kind, it is possible to two or more is used in mixed way.Wherein, aromatic series sulfur Salt also has Ultraviolet Light in the wavelength region of more than 300nm, and curable is excellent, therefore can use suitably.
Cationically photopolymerizable compound is the compound with the functional group being polymerized by cation kind, can enumerate ring Oxygen compound, vinyl ether compound, cyclic ether compound etc..
Epoxide is the compound of the epoxy radicals in 1 molecule with more than 2, can enumerate such as: by chloropropylene oxide The bisphenol-type epoxy resin derivative with bisphenol-A or Bisphenol F etc., poly epihydric alcohol base ether, poly epihydric alcohol base ester, aromatic epoxies Compound, cycloaliphatic epoxy, novolak type epoxy compounds, glycidyl group amine system epoxide or shrink sweet Oil base ester system epoxide etc..
Light absorber is generated heat by illuminated ultraviolet in the connection operation of liquid crystal drive IC 18, makes binding agent Resin melting.For light absorber, when making to use light cationic polymerization initiators as Photoepolymerizationinitiater initiater, can use suitably The such as UV absorbent of benzotriazole system, triazine system, benzophenone series etc., according to the absorption of light cationic polymerization initiators Peak wavelength, the light splitting distribution of ultraviolet radiation device 35 and the compatibility of other compositions of adhesive resin, ultra-violet absorption energy Power etc. properly select.During additionally, use cation system polymerization initiator as Photoepolymerizationinitiater initiater, as by absorbing ultraviolet Line and the light absorber that generates heat, it is possible to use optical free radical polymerization initiator.
[optical free radical system]
The anisotropic conductive film 1 of optical free radical system causes containing film-forming resin, optical free radical polymerization in adhesive resin layer 3 Agent, optical free radical polymerizable compound and light absorber.
As film-forming resin, it is possible to use with the film-forming resin as light cation system.
As optical free radical polymerization initiator, have: the benzoin ether of benzoin ethyl ether, isopropyl benzoin ether etc., benzene The benzil ketals (benzyl ketal) of even acyl (benzil), hydroxycyclohexylphenylketone etc., benzophenone, 1-Phenylethanone. etc. Ketone and derivant thereof, thioxanthene ketone, double imidazoles etc.；Also dependent on needs in these Photoepolymerizationinitiater initiaters with arbitrary proportion Add the sensitizer of amine, sulphur compound, phosphorus compound etc..At this time, it may be necessary to according to the wavelength of light source used, desired solidification Characteristics etc. select optimal light trigger.
It addition, produce the compound of living radical as being irradiated by light, organic peroxide system can be used to solidify Agent.As organic peroxide, can use following one kind or two or more: diacyl peroxide, dialkyl peroxide, mistake Aoxidize two carbonic esters, peroxyester, ketal peroxide, hydrogen peroxide, silicyl peroxide etc..
Optical free radical polymerizable compound is the material with the functional group being polymerized by living radical, can enumerate: Acrylate compounds, methacrylate compound, maleimide compound etc..
Optical free radical polymerizable compound can use with any state of monomer, oligomer, it is also possible to and with monomer with Oligomer.
As acrylate compounds, methacrylate compound, can enumerate: epoxy acrylate oligomer, amino The optical polymerism oligomer of formic acid esters acrylate oligomer, polyether acrylate oligomer, polyester acrylate oligomers etc., Trimethylolpropane trimethacrylate, polyethyleneglycol diacrylate, poly alkylene glycol diacrylate, tetramethylolmethane propylene Acid esters, 2 cyanoethyl acrylate, cyclohexyl acrylate, acrylic acid dicyclopentenyl ester, acrylic acid dicyclopentenyl epoxide ethyl ester, Acrylic acid 2-(2-ethoxy ethoxy) ethyl ester, acrylic acid 2-ethoxy ethyl ester, 2-EHA, acrylic acid are just own Ester, acrylic acid 2-hydroxy methacrylate, hydroxypropyl acrylate, isobornyl acrylate, isodecyl acrylate, Isooctyl acrylate monomer, Acrylic acid dodecyl ester, acrylic acid 2-methoxy acrylate, acrylic acid 2-phenoxy ethyl, acrylic acid tetrahydro furfuryl ester, new The simple function of the optical polymerism of Diacrylate, dipentaerythritol acrylate etc. and polyfunctional acrylate list Body etc..They can use a kind or by 2 kind uses mixed above.
Light absorber can use the UV absorbent of such as benzotriazole system, triazine system, benzophenone series etc. suitably, Absorption peak wavelength, the light splitting distribution of ultraviolet radiation device 35 and adhesive resin according to optical free radical polymerization initiator The compatibility of other compositions, ultra-violet absorption energy etc. properly select.
Additionally, adhesive resin also can contain additive or the inorganic filler of silane coupler etc..As silane coupler, Can enumerate: epoxy, amino system, sulfydryl-sulfide-based, urea groups system etc..By adding silane coupler, organic material can be improved Cementability with the interface of inorganic material.
As electroconductive particle 4, the known any electroconductive particle used can be set forth in anisotropic conductive film.Make For electroconductive particle 4, can enumerate such as: the various metal or metal alloy of nickel, ferrum, copper, aluminum, stannum, lead, chromium, cobalt, silver, gold etc. Particle, metal-oxide, carbon, graphite, glass, pottery, plastics etc. particle surface cladding metal obtained by particle, or Particle etc. obtained by these particle surfaces further coated insulation thin film.For at grain obtained by the surface clad of resin particle In the case of son, as resin particle, can enumerate such as: epoxy resin, phenolic resin, acrylic resin, acrylonitrile-styrene (AS) particle of resin, benzoguanamine resin, divinyl benzene series resin, phenylethylene resin series etc..
[the optical absorption peak value wavelength of Photoepolymerizationinitiater initiater and light absorber]
For the anisotropic conductive film 1 of the photocuring system of the present invention, the optical absorption peak value wavelength ratio photopolymerization of light absorber is drawn The optical absorption peak value wavelength sending out agent is long, and is separated by more than 20nm.For anisotropic conductive film 1, if by ultraviolet described later Line irradiator 35 irradiating ultraviolet light, then Photoepolymerizationinitiater initiater absorbs ultraviolet light and produces acid or free radical.It addition, light absorber is also Similarly absorb ultraviolet light and generate heat.
Here, if the optical absorption peak value of the optical absorption peak value of Photoepolymerizationinitiater initiater and light absorber is close, then ultraviolet light Absorb by mutual obstruction, curing reaction or generate heat insufficient.Thus, there is following worry: do not melt at adhesive resin Change, carry out under state that the press-in of electroconductive particle 4 is not enough the solidification of adhesive resin, further, since after Lian Jieing through time-varying Changing or environmental change, conducting resistance rises.
It addition, the respective optical absorption peak value wavelength of light absorber and Photoepolymerizationinitiater initiater typically has the song shown in Fig. 4 Line (profile), this is because, if the optical absorption peak value ripple of the optical absorption peak value wavelength ratio Photoepolymerizationinitiater initiater of light absorber Length, then, even if being separated by more than 20nm, the repetition scope of the absorbing wavelength beyond peak value is big, and the absorption of ultraviolet light is by phase Mutual obstruction, curing reaction or generate heat insufficient.
On the other hand, as light absorber and Photoepolymerizationinitiater initiater, by using the optical absorption peak value wavelength of light absorber The ratio material of optical absorption peak long more than the 20nm of value wavelength of Photoepolymerizationinitiater initiater, can absorb not hindering Photoepolymerizationinitiater initiater and light In the case of the respective ultra-violet absorption of agent, carry out respectively: the carrying out of the curing reaction of adhesive resin and based on heating The fusing of adhesive resin.
It addition, the optical absorption peak value wavelength of the Photoepolymerizationinitiater initiater of the present invention is preferably 290nm～330nm, light absorber Optical absorption peak value wavelength be preferably 320nm～360nm.
Such as, use the light cationic polymerization initiators that absorption peak is 310nm of ultraviolet light, and use the suction of ultraviolet light Receipts peak value is the UV absorbent of 340～360nm, thus, and can be in light cationic polymerization initiators and UV absorbent phase Mutual UV Absorption promotes curing reaction and heating in the case of the most mutually being hindered.
[attachment means]
It follows that to being connected to obtained by transparent substrates 12 connect by liquid crystal drive IC 18 across anisotropic conductive film 1 The attachment means 30 used in the manufacturing process of body illustrates.
As it is shown in figure 1, attachment means 30 has: have the workbench 31 of light transmission, transparent to carry on workbench 31 Liquid crystal drive IC 18 carried across anisotropic conductive film 1 on substrate 12 carries out the crimp head 33 pressed, and is located at work The ultraviolet radiation device 35 of the reverse side of platform 31.
The material that workbench 31 is had light transmission by such as quartz etc. is formed.It addition, workbench 31 is transparent in surface carrying The edge 12a of substrate 12, meanwhile, relative with crimp head 33, it is configured with ultraviolet radiation device 35 overleaf.
Crimp head 33 in transparent substrates 12 across anisotropic conductive film 1 carry liquid crystal drive IC 18 carry out by Pressure, by being maintained on not shown head moving mechanism, the most close, away from workbench 31.
Ultraviolet radiation device 35 is by from the setting of portion of terminal 17a to transparent substrates 12 of the reverse side of workbench 31 Anisotropic conductive film 1 irradiating ultraviolet light, makes light absorber generate heat, simultaneously by portion of terminal 17a of transparency electrode 17 and liquid crystal Adhesive resin is made to solidify under the state that the electrode terminal 19 of driving IC 18 clamps electroconductive particle 4, so that liquid crystal drive It is connected with the portion of terminal 17a conducting of transparent substrates 12 with IC 18.
Ultraviolet radiation device 35 is usable in the absorption peak wavelength region of Photoepolymerizationinitiater initiater and has maximum emission wavelength Burdick lamp.It addition, ultraviolet radiation device 35 is used as: have Photoepolymerizationinitiater initiater absorption peak wavelength region and The absorption peak wavelength region of light absorber has point photodistributed finsen lamp of peak value, or is including Photoepolymerizationinitiater initiater and light The metal halide lamp etc. of the wavelength region internal radiation ultraviolet of the absorption peak wavelength of both absorbent.It addition, ultraviolet shines Emitter 35 also can and be used: the absorption peak wavelength region at Photoepolymerizationinitiater initiater has the LED of peak value and at light absorber Absorption peak wavelength region has the LED of peak value.
[connection operation]
It follows that the connection operation of liquid crystal drive IC 18 using above-mentioned attachment means 30 is illustrated.First, facing Time laminating workbench on carry transparent substrates 12, anisotropic conductive film 1 is crimped in transparency electrode 17 temporarily.For The interim method crimping anisotropic conductive film 1, is positioned at adhesive resin layer 3 in the transparency electrode 17 of transparent substrates 12 The mode of prescribed electrode 17 side configures anisotropic conductive film 1.
And, after adhesive resin layer 3 is configured in transparency electrode 17, by the thermocompression head of interim laminating from Adhesive resin layer 3 is heated and pressurizes by stripping film 2 side, is peeled off by stripping film 2, thus from adhesive resin layer 3 Only make adhesive resin layer 3 fit in transparency electrode 17 temporarily.For utilizing the interim pressure of the thermocompression head of interim laminating Connecing, the upper surface at stripping film 2 presses towards transparency electrode 17 side with a little pressure (such as about 0.1MPa～2MPa), Carry out heating (such as about 70～100 DEG C) simultaneously.
Then, transparent substrates 12 is carried on workbench 31, with transparency electrode 17 and the liquid crystal drive of transparent substrates 12 Liquid crystal drive IC 18 is configured across the mode that adhesive resin layer 3 is opposed with the electrode terminal 19 of IC 18.
Then, irradiate set ultraviolet light by ultraviolet radiation device 35 from the reverse side of workbench 31, pass through simultaneously Crimp head 33 is with the upper surface of set pressure pressing liquid crystal drive IC 18.Ultraviolet light transmission workbench 31, transparent substrates 12 After incide in adhesive resin layer 3, be photopolymerized initiator and light absorber and absorb.Photoepolymerizationinitiater initiater is by absorbing ultraviolet Light and produce acid or free radical, thus carry out the curing reaction of adhesive resin.It addition, light absorber is by absorption ultraviolet light With set temperature heating (such as 80～90 DEG C), adhesive resin is made to melt.
That is, in this connection operation, adhesive resin is made to melt by the heating of light absorber, in this condition, by pressure Joint 33 presses, and adhesive resin can be made from transparency electrode 17 and portion of terminal 17a and the electrode terminal of liquid crystal drive IC 18 Flow out between 19, substantially simultaneously press-in electroconductive particle 4.And, portion of terminal 17a and liquid crystal drive in transparency electrode 17 are used Adhesive resin is made to solidify under the state clamping electroconductive particle 4 between the electrode terminal 19 of IC 18.Therefore, this connection operation In, by room temperature pressing liquid crystal drive IC 18, can be in the impact of suppression warpage or to liquid crystal drive IC 18 etc. Electronic unit thermal shock impact while, manufacture good with the conductance general character of liquid crystal drive IC 18 and mechanical connection Good connector.
Now, as described previously for anisotropic conductive film 1, make to use up suction as Photoepolymerizationinitiater initiater and light absorber Receive the material of optical absorption peak long more than the 20nm of value wavelength of the optical absorption peak value wavelength ratio Photoepolymerizationinitiater initiater of agent.Thus, it is possible to In the case of the respective ultra-violet absorption of Photoepolymerizationinitiater initiater and light absorber is the most mutually hindered, carry out respectively: bonding The carrying out of the curing reaction of agent resin and the fusing of adhesive resin based on heating.
It addition, the heating of light absorber is delivered to transparent substrates 12 and liquid crystal drive IC 18 equably, therefore, with logical Cross when crimp head 33 heats different, do not produce thermal gradient between transparent substrates 12 and liquid crystal drive IC 18, greatly improve and add The problems such as the bad connection showing speckle or electronic unit that the warpage that hot temperature difference causes produces and warpage accompanies.
Additionally, for the irradiation time of ultraviolet radiation device 35, illumination, total irradiation dose, according to the composition of adhesive resin, The pressure of crimp head 33 and time, suitably set the pressure of carrying out and the crimp head 33 realizing curing reaction based on adhesive resin The connection reliability that enters, the condition of the raising of adhesive strength.
Thereafter, attachment means 30 terminates liquid crystal drive IC by making crimp head 33 move to the top of workbench 31 The real crimping process of 18.
After liquid crystal drive IC 18 being connected in the transparency electrode 17 of transparent substrates 12, similarly operate to carry out So-called FOG (membrane of flip chip (film on glass)) installs, and wherein flexible substrate 21 is installed on the saturating of transparent substrates 12 On prescribed electrode 17.At this time it is also possible to likewise by using anisotropic conductive film 1, absorb from ultraviolet radiation device 35 Ultraviolet light, the fusing carrying out adhesive resin by the heating of light absorber and the curing reaction produced based on acid or free radical.
Transparent substrates 12 and liquid crystal drive IC 18 or flexibility is connected across anisotropic conductive film 1 thus, it is possible to manufacture The connector of substrate 21.Additionally, these COG install and FOG installs and also can carry out simultaneously.
Above, install with the COG that liquid crystal drive IC is directly mounted in the glass substrate of display panels and incite somebody to action The FOG that flexible substrate is directly mounted on the substrate of display panels is illustrated as a example by installing, but, as long as use The manufacturing process of the connector of light-cured type bonding agent, this technology can also be applied to except installing the ministry of electronics industry on a transparent substrate Various connections beyond part.
[other]
It addition, in addition to using above-mentioned ultraviolet hardening conductive adhesive, the present invention can also use such as by red The light of other wavelength such as outer light and the light-cured type conductive adhesive that solidifies.
Above the anisotropic conductive film 1 as conductive adhesive with film shape is illustrated, but pasty state The most no problem.It addition, adhesive resin layer 3 can also be made up of the adhesive resin not containing electroconductive particle 4 exhausted Edge bond layer and the knot of conductive adhesive layer stackup being made up of the adhesive resin containing electroconductive particle 4 Structure.Preferably, in this case, insulating properties bond layer and conductive adhesive layer contain absorption peak wavelength interval respectively and open Light absorber and Photoepolymerizationinitiater initiater.
It addition, present invention may also apply to connection operation based on the bonding paste of insulating properties, wherein, the bonding paste of this insulating properties makes With: the insulating properties adhesive film being made up of the adhesive resin layer not containing electroconductive particle 4 and the paste not containing electroconductive particle 4 Shape adhesive resin.As long as the bonding agent of the present invention is the circuit connecting adhesive containing Photoepolymerizationinitiater initiater and light absorber Agent, does not the most concern the modes such as the presence or absence of electroconductive particle 4, film or paste.
Additionally, in this connection operation, it is possible to the heating arrangements of heater etc. is set on workbench 31, is absorbing based on light Heating transparent substrate 12 at a temperature of below the heating temp of agent.It addition, in this connection operation, it is possible to by crimp head 33 at base Liquid crystal drive IC 18 is heated at a temperature of below the heating temp of light absorber.Thus, it is possible to the heating of light absorber Combine and make adhesive resin layer 3 melt fully, between portion of terminal 17a and electrode terminal 19, be reliably pressed into electroconductive particle 4, improve connectivity.
Embodiment
It follows that the embodiment of this technology is illustrated.The present embodiment changes the blending of anisotropic conductive film and consolidates Change condition and manufacture the connector sample of transparent substrates and IC chip, and evaluate IC core by conduction resistance value (Ω) and amount of warpage Sheet and the connection status of transparent substrates.
As the bonding agent for connecting, prepare by containing light cationic polymerization initiators and cationically polymerizable compound Adhesive resin layer constitute anisotropic conductive film.
As evaluating element, employ profile 1.8mm × 34mm, thickness 0.5mm, be formed with commenting of conducting mensuration wiring Valency IC.
As the evaluation matrix material of connection evaluation IC, use ITO cladding plate (the U テ ィ Application グ ラ of thickness 0.5mm ス)。
In this glass substrate across anisotropic conductive film configure evaluation IC, by crimping tool (10.0mm × 40.0mm) pressurization, is irradiated by ultraviolet simultaneously and connects, be consequently formed connector sample.On the pressurized plane of crimping tool in fact Execute the fluororesin processing of thickness 0.05mm.It addition, for ultraviolet radiation device (SP-9:USHIO Electric Co., Ltd system) Illumination, is 300mW/cm under 365nm2, it is 210mW/cm under 310nm2, ultraviolet irradiation size is: width about 4.0mm × length about 44.0mm.
[embodiment 1]
In embodiment 1, as the adhesive resin layer of anisotropic conductive film, use the layer of following formation: make following thing The resin solution that matter mixes, is coated with this resin solution on a pet film, is dried, is configured to the membranaceous of thickness 20 μm,
Phenoxy resin (YP-70: Nippon Steel & Sumitomo Metal Corporation's system)；20 mass parts
Liquid epoxy resin (EP828: Mitsubishi chemical Co., Ltd's system)；30 mass parts
Solid epoxy (YD014: Nippon Steel & Sumitomo Metal Corporation's system)；20 mass parts
Electroconductive particle (AUL704: Sekisui Chemical Co., Ltd's system)；30 mass parts
Light cationic polymerization initiators (SP-170:ADEKA Co., Ltd. system)；5 mass parts
Light absorber (LA-36:ADEKA Co., Ltd. system)；5 mass parts.
The absorption peak wavelength of light cationic polymerization initiators (SP-170) is about 310nm, the suction of light absorber (LA-36) Receiving peak wavelength and be about 340nm, its difference is 30nm.
The press condition of crimping tool is: under room temperature, 70MPa, 5 seconds.The irradiation time of ultraviolet radiation device is 5 seconds.
[embodiment 2]
In embodiment 2, adhesive resin layer blends the light absorber (LA-31:ADEKA Co., Ltd. system) of 5 mass parts, removes Outside this, blend same as in Example 1ly, use so obtained anisotropic conductive film.
The absorption peak wavelength of light cationic polymerization initiators (SP-170) is about 310nm, the suction of light absorber (LA-31) Receipts peak wavelength is 345nm, and its difference is 35nm.
The press condition of crimping tool and the irradiation time of ultraviolet radiation device are same as in Example 1.
[embodiment 3]
In embodiment 3, adhesive resin layer blends optical free radical polymerization initiator (the OXE1:BASF company of 5 mass parts System) as light absorber, in addition, blend same as in Example 1ly, use so obtained anisotropic conductive film.
The absorption peak wavelength of light cationic polymerization initiators (SP-170) is about 310nm, the suction of light absorber (OXE01) Receipts peak value is 330nm, and its difference is 20nm.
The press condition of crimping tool and the irradiation time of ultraviolet radiation device are same as in Example 1.
[comparative example 1]
In comparative example 1, adhesive resin layer does not blend light absorber, in addition, blends same as in Example 1ly, make Use so obtained anisotropic conductive film.
The press condition of crimping tool and the irradiation time of ultraviolet radiation device are same as in Example 1.
[comparative example 2]
In comparative example 2, adhesive resin layer blends the light absorber (LA-46:ADEKA Co., Ltd. system) of 5 mass parts, removes Outside this, blend same as in Example 1ly, use so obtained anisotropic conductive film.
The absorption peak wavelength of light cationic polymerization initiators (SP-170) is about 310nm, the suction of light absorber (LA-46) Receiving peak wavelength and be about 290nm, the optical absorption peak value wavelength of the optical absorption peak value wavelength ratio Photoepolymerizationinitiater initiater of light absorber is short, Its difference is 20nm.
The press condition of crimping tool and the irradiation time of ultraviolet radiation device are same as in Example 1.
[comparative example 3]
In comparative example 3, to make the press condition of crimping tool be 100 DEG C, 70MPa, 5 seconds, in addition, use phase with comparative example 1 Same condition.
[mensuration of warpage]
For the assay method of warpage, use contact pin type surface roughness meter (the little slope research of SE-3H: Co., Ltd. is made), such as Fig. 5 Shown in, start to scan contact pilotage 41, the glass after the connection of evaluation of measuring IC from glass substrate 40 lower surface of conjugant sample The amount of warpage (μm) of substrate surface.
[mensuration of conducting resistance]
For embodiment 1,2, the connector of comparative example 1～3, use digital multimeter, determine that connection is initial and reliability is real Conducting resistance (Ω) after testing.Digital multimeter as shown in Figure 6, is connected to and evaluates the convex of use IC by the mensuration of conduction resistance value The wiring 43 of the ITO cladding plate of point 42 connection, utilizes so-called 4 terminal methods to determine conduction resistance value when flowing through 2mA electric current.Can By property experiment condition it is: 85 DEG C of 85%RH 500hr.
[table 1]
As shown in table 1, for embodiment 1～3, although amount of warpage is equal with comparative example 1, but the enforcement containing light absorber Example 1～3 is compared with comparative example 1, and the connection resistance after initial connection resistance and failtests is the lowest, it is shown that good company Connecing property.This is because: in embodiment 1～3, press when adhesive resin layer is melted by the heating of light absorber Pressure, it is possible to be pressed into electroconductive particle fully by getting rid of adhesive resin, can solidify in this condition.Separately On the one hand, in comparative example 1, because at room temperature crimping, so cannot be carried out adhesive resin row between electrode terminal Remove, from being unable to be pressed into fully electroconductive particle.Therefore, compared with embodiment 1 and 2, connect initial conducting resistance high, After failtests, conducting resistance is further up.
In comparative example 2, although the difference of the respective absorption peak wavelength of light absorber and light cationic polymerization initiators is 20nm, but the optical absorption peak value wavelength of the optical absorption peak value wavelength ratio Photoepolymerizationinitiater initiater of light absorber is short, so absorbing ripple Length exists in a wide range, and the UV Absorption of light cationic polymerization initiators is hindered by light absorber, curing reaction Carry out insufficient.Therefore, although amount of warpage is substantially reduced, but it is high initially to connect resistance, and after failtests, conducting resistance is big Width rises.
In comparative example 3, by crimping tool, evaluation IC is carried out heating and press, irradiation ultraviolet radiation on one side.Therefore, The heat deflection that crimping tool produces is evaluated and is transmitted with IC, crimping tool leave after quick refrigeration time, evaluate with the change of IC side Shape is big compared with glass substrate.And, in comparative example 3, the difference of this deflection is not fully absorbed by adhesive resin layer, amount of warpage Become big.
On the other hand, in embodiment 1～3, adhesive resin layer absorbs ultraviolet by light absorber and generates heat, therefore, Evaluation IC is applied roughly the same heat with glass substrate.Therefore, the deflection of evaluation IC and glass substrate substantially phase With, the difference of deflection can be absorbed by adhesive resin layer, it is possible to relatively reduce amount of warpage.
By embodiment 1 the most relatively, then embodiment 2 achieves low resistance compared with Example 1.This be because of For: in embodiment 2, the absorbance of light absorber is high, sends higher reaction heat compared with Example 1, so adhesive resin layer Fusing significantly more carry out.Thus, in embodiment 2, electroconductive particle is prone to press-in, realizes the most further Low resistance.
It addition, in embodiment 3, although employ optical free radical polymerization initiator as light absorber, but, owing to being oneself By the initiator of base system, so open loop is also not involved in polymerization, and only produce heat.Therefore, by utilizing heat at that time to make binding agent Resin bed melts, and can be pressed into electroconductive particle fully, be solidified by light curing agent in this condition, thus can be good Ground connects.
Description of reference numerals
1 anisotropic conductive film, 2 stripping films, 3 adhesive resin layers, 4 electroconductive particles, 10 display panels, 11, 12 transparent substrates, 13 seal, 14 liquid crystal, 15 panel display unit, 16,17 transparency electrodes, 18 liquid crystal drive IC, and 20 COG installation portion, 21 flexible substrate, 22 FOG installation portions, 24 join thick film, 25,26 polarization plates, 30 attachment means, 31 work Platform, 33 crimp head, 35 ultraviolet radiation devices.

Claims (10)

1. photocuring system anisotropically conducting adhesive, wherein, absorbs containing photopolymerizable compound, Photoepolymerizationinitiater initiater and light Agent, the optical absorption peak value wavelength of the optical absorption peak above-mentioned Photoepolymerizationinitiater initiater of value wavelength ratio of above-mentioned light absorber is long, and is separated by More than 20nm.
2. the photocuring system anisotropically conducting adhesive described in claim 1, wherein, above-mentioned light absorber is ultra-violet absorption Agent or radical polymerization initiator.
3. the photocuring system anisotropically conducting adhesive described in claim 1 or 2, wherein, above-mentioned Photoepolymerizationinitiater initiater is light Cationic polymerization initiators.
4. the photocuring system anisotropically conducting adhesive described in claim 1 or 2, wherein, above-mentioned Photoepolymerizationinitiater initiater is light Radical polymerization initiator, above-mentioned light absorber is UV absorbent.
5. the photocuring system anisotropically conducting adhesive described in claim 1 or 2, wherein, the light of above-mentioned Photoepolymerizationinitiater initiater Absorption peak wavelength is 290nm～330nm, and the optical absorption peak value wavelength of above-mentioned light absorber is 320nm～360nm.
6. the photocuring system anisotropically conducting adhesive described in claim 1 or 2, wherein, described photocuring system anisotropy Electrically conducting adhesive is supported on stripping matrix material, is formed as membranaceous.
7. the manufacture method of connector,
Wherein, across the anisotropically conducting adhesive configuration ministry of electronics industry of photocuring system in the transparent substrates carried on the table Part,
By crimping tool, above-mentioned electronic unit is pressed towards above-mentioned transparent substrates, carry out illumination by light illuminator simultaneously Penetrate,
Wherein, above-mentioned photocuring system anisotropically conducting adhesive contains photopolymerizable compound, Photoepolymerizationinitiater initiater and light suction Receiving agent, the optical absorption peak value wavelength of the optical absorption peak above-mentioned Photoepolymerizationinitiater initiater of value wavelength ratio of above-mentioned light absorber is long, and is separated by More than 20nm,
Above-mentioned light illuminator irradiates optical absorption peak value and the optical absorption peak of above-mentioned light absorber including above-mentioned Photoepolymerizationinitiater initiater The light of the wavelength of value.
8. the manufacture method of the connector described in claim 7, wherein, at room temperature by crimping tool by above-mentioned electronic unit Press towards above-mentioned transparent substrates, carry out light irradiation by light illuminator simultaneously.
9. the manufacture method of the connector described in claim 7, above-mentioned workbench and/or above-mentioned crimping tool are by above-mentioned light Heat at a temperature of below the temperature that absorbent absorbs the light irradiated from above-mentioned light illuminator and generates heat.
10. the method for attachment of electronic unit,
Wherein, across the anisotropically conducting adhesive configuration ministry of electronics industry of photocuring system in the transparent substrates carried on the table Part,
By crimping tool, above-mentioned electronic unit is pressed towards above-mentioned transparent substrates, carry out illumination by light illuminator simultaneously Penetrate,
Wherein, above-mentioned photocuring system anisotropically conducting adhesive contains photopolymerizable compound, Photoepolymerizationinitiater initiater and light suction Receiving agent, the optical absorption peak value wavelength of the optical absorption peak above-mentioned Photoepolymerizationinitiater initiater of value wavelength ratio of above-mentioned light absorber is long, and is separated by More than 20nm,
Above-mentioned light illuminator irradiates optical absorption peak value and the optical absorption peak of above-mentioned light absorber including above-mentioned Photoepolymerizationinitiater initiater The light of the wavelength of value.
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