CN106048565A - Activate fluid used for electroless copper plating of plastic surface - Google Patents
Activate fluid used for electroless copper plating of plastic surface Download PDFInfo
- Publication number
- CN106048565A CN106048565A CN201610545336.5A CN201610545336A CN106048565A CN 106048565 A CN106048565 A CN 106048565A CN 201610545336 A CN201610545336 A CN 201610545336A CN 106048565 A CN106048565 A CN 106048565A
- Authority
- CN
- China
- Prior art keywords
- polyethylene glycol
- silver nitrate
- electroless copper
- copper plating
- serves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
The invention discloses activate fluid used for electroless copper plating of the plastic surface. One liter of the fluid comprises, by mass, 3.0 g-15 g of silver nitrate, 40 g-120 g of 17%-28% ammonium hydroxide, 0.5 g-14 g of soluble amylopectin, 0.001 g-0.3 g of polyethylene glycol and 6 g-30 g of sodium potassium tartrate tetrahydrate. The silver nitrate provides a silver source, the ammonium hydroxide serves as a complexing agent, the soluble amylopectin serves as a stabilizer, the polyethylene glycol serves as a protective agent preventing silver particles from being gathered and the like, and the sodium potassium tartrate tetrahydrate serves as a reducing agent. The activate fluid is utilized for replacing palladium activate fluid to achieve plastic surface copper plating, copper plating is conducted after activating treatment, the bonding strength test is good, the phenomenon of skip plating is avoided, and a plating film layer is even.
Description
Technical field
The present invention relates to plastics copper facing technical field, particularly relate to a kind of activating solution for frosting electroless copper.
Background technology
At present, in the most full-fledged chemical-copper-plating process, the main activating solution used is noble metal activating solution, i.e.
Palladium activating solution (colloidal pd activation solution used such as ROHM AND HAAS), due to its price costly, governs plastic chemical plating always
Development；In order to reduce cost, people have carried out a lot of tentative research to non-noble metal activating solution in recent years, but these methods
Electroless copper effect is poor, and activation capacity is unstable, and the most high reason of adhesion strength can not realize commercial Application always.
Summary of the invention
The invention solves the problems that the problem that above-mentioned prior art exists, it is provided that a kind of activation for frosting electroless copper
Liquid, adhesion strength is good, and without plating leakage phenomenon, film plating layer is uniform.
The present invention solves the technical scheme that its technical problem uses: this solution of 1L is made up of the raw material of following quality proportioning:
Silver nitrate 3.0g～15g, mass percent 17%～28% ammonia 40g～120g, soluble Amylopectin 0.5g～14g, poly-
Ethylene glycol 0.001g～0.3g, sodium potassium tartrate tetrahydrate 6g～30g.
Preferred version, this solution of 1L is made up of the raw material of following quality proportioning: silver nitrate 10g, and 25% ammonia 80g is solvable
Property amylopectin 10g, Polyethylene Glycol 0.2g, sodium potassium tartrate tetrahydrate 20g.
Wherein silver nitrate provides silver source, and ammonia is made as stabilizer, Polyethylene Glycol as chelating agent, soluble Amylopectin
Prevent the reunion etc. of Argent grain for protective agent, sodium potassium tartrate tetrahydrate is as reducing agent.
Compound method: activating solution compound method: first take 200ml distilled water, is heated to 95～100 DEG C, adds solubility
Amylopectin, after heating 5 minutes, is cooled to room temperature, is separately added into ammonia and silver nitrate, after stirring and dissolving, adds poly-second two
Alcohol, is eventually adding sodium potassium tartrate tetrahydrate, after stirring and dissolving, adds water to 1 liter, is heated to 40～45 DEG C, heat time heating time 10～20 minutes,
It is cooled to room temperature stand-by.(medicine order of addition can not change, and the activating solution otherwise prepared does not has activity function or activity function
Not good enough).
The invention have the advantages that: the present invention utilizes this activating solution to replace palladium activating solution to realize plastic surface copper plating, and
Copper facing after activation processing, carries out adhesion strength test good, and without plating leakage phenomenon, film plating layer is uniform.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described:
Embodiment one, this solution of 1L is made up of the raw material of following quality proportioning: silver nitrate 3.0g, and 17% ammonia 40g is solvable
Property amylopectin 0.5g, Polyethylene Glycol 0.001g；Sodium potassium tartrate tetrahydrate 6g.
Compound method: activating solution compound method: first take 200ml distilled water, is heated to 95 DEG C, adds solubility side chain and forms sediment
Powder, after heating 5 minutes, is cooled to room temperature, is separately added into ammonia and silver nitrate, after stirring and dissolving, add Polyethylene Glycol, finally
Add sodium potassium tartrate tetrahydrate, after stirring and dissolving, add water to 1 liter, be heated to 40 DEG C, 10 minutes heat time heating times, be cooled to room temperature stand-by.
Embodiment two, this solution of 1L is made up of the raw material of following quality proportioning: silver nitrate 15g, and 28% ammonia 120g is solvable
Property amylopectin 14g, Polyethylene Glycol 0.3g；Sodium potassium tartrate tetrahydrate 30g.
Compound method: activating solution compound method: first take 200ml distilled water, is heated to 100 DEG C, adds solubility side chain
Starch, after heating 5 minutes, is cooled to room temperature, is separately added into ammonia and silver nitrate, after stirring and dissolving, add Polyethylene Glycol,
Rear addition sodium potassium tartrate tetrahydrate, after stirring and dissolving, adds water to 1 liter, is heated to 45 DEG C, 20 minutes heat time heating times, is cooled to room temperature and treats
With.
Embodiment three, this solution of 1L is made up of the raw material of following quality proportioning: silver nitrate 10g, and 25% ammonia 80g is solvable
Property amylopectin 10g, Polyethylene Glycol 0.2g；Sodium potassium tartrate tetrahydrate 20g.
Compound method: activating solution compound method: first take 200ml distilled water, is heated to 100 DEG C, adds solubility side chain
Starch, after heating 5 minutes, is cooled to room temperature, is separately added into ammonia and silver nitrate, after stirring and dissolving, add Polyethylene Glycol,
Rear addition sodium potassium tartrate tetrahydrate, after stirring and dissolving, adds water to 1 liter, is heated to 45 DEG C, 20 minutes heat time heating times, is cooled to room temperature and treats
With.
Use the activating solution of above three groups of embodiment proportionings, and prepare according to above-mentioned collocation method, and for frosting
Carrying out copper facing, the coating that frosting is formed is uniform, carries out adhesion strength test good, without plating leakage phenomenon.
Although the present invention is by being described with reference to preferred embodiment, but, those skilled in the art should
Work as understanding, in the range of claims, the various change in form and details can be made.
Claims (3)
1., for an activating solution for frosting electroless copper, it is characterized in that: this solution of 1L is by the raw material of following quality proportioning
Composition: silver nitrate 3.0g～15g, 17%～28% ammonia 40g～120g, soluble Amylopectin 0.5g～14g, Polyethylene Glycol
0.001g～0.3g, sodium potassium tartrate tetrahydrate 6g～30g.
Activating solution for frosting electroless copper the most according to claim 1, is characterized in that: this solution of 1L is by following
The raw material composition of quality proportioning: silver nitrate 10g, 25% ammonia 80g, soluble Amylopectin 10g, Polyethylene Glycol 0.2g, winestone
Acid potassium sodium 20g.
3. the compound method of activating solution used in claim 1 or 2 for frosting electroless copper: first take
200ml distilled water, is heated to 95～100 DEG C, adds soluble Amylopectin, after heating 5 minutes, is cooled to room temperature, adds respectively
Enter ammonia and silver nitrate, after stirring and dissolving, add Polyethylene Glycol, be eventually adding sodium potassium tartrate tetrahydrate, after stirring and dissolving, add water to
1 liter, it is heated to 40～45 DEG C, heat time heating time 10～20 minutes, is cooled to room temperature stand-by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610545336.5A CN106048565A (en) | 2016-07-07 | 2016-07-07 | Activate fluid used for electroless copper plating of plastic surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610545336.5A CN106048565A (en) | 2016-07-07 | 2016-07-07 | Activate fluid used for electroless copper plating of plastic surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106048565A true CN106048565A (en) | 2016-10-26 |
Family
ID=57186059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610545336.5A Pending CN106048565A (en) | 2016-07-07 | 2016-07-07 | Activate fluid used for electroless copper plating of plastic surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106048565A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003129249A (en) * | 2001-10-22 | 2003-05-08 | Kinzoku Kako Gijutsu Kenkyusho:Kk | Activator for silver mirror |
| CN103525154A (en) * | 2013-09-29 | 2014-01-22 | 哈尔滨工业大学 | Ion metallic paint for electroless copper plating pretreatment of plastic matrix and process |
| CN104862677A (en) * | 2015-05-13 | 2015-08-26 | 电子科技大学 | Method for achieving chemical nickel plating by activating surface of PCB |
-
2016
- 2016-07-07 CN CN201610545336.5A patent/CN106048565A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003129249A (en) * | 2001-10-22 | 2003-05-08 | Kinzoku Kako Gijutsu Kenkyusho:Kk | Activator for silver mirror |
| CN103525154A (en) * | 2013-09-29 | 2014-01-22 | 哈尔滨工业大学 | Ion metallic paint for electroless copper plating pretreatment of plastic matrix and process |
| CN104862677A (en) * | 2015-05-13 | 2015-08-26 | 电子科技大学 | Method for achieving chemical nickel plating by activating surface of PCB |
Non-Patent Citations (1)
| Title |
|---|
| 高向华: "纳米银／天然高聚物复合抗菌溶胶的合成及其性能研究", 《太原理工大学博士研究生学位论文》 * |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161026 |
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| RJ01 | Rejection of invention patent application after publication |