CN106048321A - Nanosized titanium nitride modified and reinforced aluminium-magnesium alloy material for automobile electronic packaging and preparation method of alloy material - Google Patents
Nanosized titanium nitride modified and reinforced aluminium-magnesium alloy material for automobile electronic packaging and preparation method of alloy material Download PDFInfo
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- CN106048321A CN106048321A CN201610550284.0A CN201610550284A CN106048321A CN 106048321 A CN106048321 A CN 106048321A CN 201610550284 A CN201610550284 A CN 201610550284A CN 106048321 A CN106048321 A CN 106048321A
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- Prior art keywords
- titanium nitride
- nano titanium
- alloy material
- hydronalium
- prefabricated component
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1026—Alloys containing non-metals starting from a solution or a suspension of (a) compound(s) of at least one of the alloy constituents
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0005—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with at least one oxide and at least one of carbides, nitrides, borides or silicides as the main non-metallic constituents
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
Abstract
The invention discloses a nanosized titanium nitride modified and reinforced aluminium-magnesium alloy material for automobile electronic packaging. The nanosized titanium nitride modified and reinforced aluminium-magnesium alloy material for the automobile electronic packaging is produced by the following raw materials, in parts by weight, 5-8% of magnesium, 4-5% of lithium, 2-3% of copper, 1-2% of boron, 0.1-0.2% of cerium oxide, 40-50% of nanosized titanium nitride sol, 1-2% of pore-forming agent and 0.5-1% of absolute ethyl alcohol, with the balance being aluminium.
Description
Technical field
The present invention relates to electronic package material technical field, particularly relate to a kind of automotive electronics encapsulation Nano titanium nitride and change
Property strengthen hydronalium and preparation method thereof.
Background technology
Automotive electronics is the general name of electronic control device for vehicle and vehicular automotive electronic device, and automotive electronics is in automotive engineering
In occupy vital position, be exploitation new model, improve the most important technical measures of automotive performance.Owing to automotive interior is deposited
In the adverse circumstances factor such as extreme operating temperature range, strong mechanical vibration and spot be more, it is to be ensured that automotive electronics
Properties of product are interference-free, it is necessary to carry out the encapsulation work of product, the encapsulating material chosen with realize industry lower cost,
The technology trends such as higher function, higher reliability.
Intensity that preferably electronic package material thermal coefficient of expansion to be possessed heat conduction low, high, air-tightness are good, enough and just
Spending, be easy to the advantage such as machine-shaping and welding and lightweight light weight, the most conventional a few class wrapper materials mainly have Plastic Package
Several big class of material, ceramic packaging material, Materials for Metal Packaging and metal-base composites, the wherein encapsulation of metal-based compound electronics
Material has the advantages such as intensity is high, heat conductivity is good becomes the focus of industry research, especially aluminium based metal material, its lightweight excellent
Point is extensively favored at automotive field, and the combination property improving aluminum-based packaging material is also study hotspot." vacuum heating-press sintering legal system
Standby diamond/Al-Cu based composites " to utilize the mode of vacuum heating-press sintering to improve diamond bad instead with the interface of aluminum for a literary composition
Should, it being simultaneously introduced Cu powder and improve performance, this method uses micron-sized diamond powder body, although obtain high heat conductance
Composite, but the intensity of alloy material, plasticity reduce the most to a certain extent, range is limited, nano grade inorganic
Material has prominent advantage in terms of improving alloy property, but the dispersibility that nanometer materials are in the alloy is the most not to the utmost such as people
Meaning.
Summary of the invention
The object of the invention is contemplated to make up the defect of prior art, it is provided that a kind of automotive electronics encapsulation Nano titanium nitride
Modified enhancing hydronalium and preparation method thereof.
The present invention is achieved by the following technical solutions:
A kind of automotive electronics encapsulation Nano titanium nitride modification strengthens hydronalium, and this alloy material is by following weight portion
Raw material is made: magnesium 5-8%, lithium 4-5%, copper 2-3%, boron 1-2%, cerium oxide 0.1-0.2%, Nano titanium nitride colloidal sol 40-50%, pore-creating
Agent 1-2%, dehydrated alcohol 0.5-1, surplus are aluminum.
Described Nano titanium nitride colloidal sol is formulated by following methods: Dodecyl trimethyl ammonium chloride put into anhydrous
In ethanol, stirring puts into Nano titanium nitride, sonic oscillation dispersion 5-10h to it after being completely dissolved, to obtain final product；Wherein nano silicon nitride
Titanium, dehydrated alcohol, the weight ratio of Dodecyl trimethyl ammonium chloride three are 1:5:0.1.
Described pore creating material is the one in sodium chloride, sodium carbonate, spherical carbamide.
Described a kind of automotive electronics encapsulation Nano titanium nitride modification strengthens the preparation method of hydronalium and includes
Following steps:
(1) first by aluminum, magnesium, lithium, copper, boron, cerium oxide, pore creating material, dehydrated alcohol mixing, with 100-200 turn/rotating speed of min mixes
Powder 10-15min, gained mixed material obtains green compact through compacting densification, is put into by green compact in mould at vacuum bar subsequently
Thermocompressed sintering and forming under part, sintering process is: system is warming up to 500-550 DEG C with the programming rate of 15-20 DEG C/min, in temperature
Reaching pressurization when 450 DEG C, pressure is 30-50MPa, and heat preservation sintering 50-60min naturally cools to release after room temperature, gained subsequently
Product is put in water and is dried after dissolution pore creating material, obtains Al-Mg alloy foam prefabricated component standby；
(2) the Al-Mg alloy foam prefabricated component of step (1) gained is put in mould, be subsequently added Nano titanium nitride colloidal sol ,-
Oozing long-pending 40-60min under 0.01--0.05MPa, process recovers normal pressure after terminating, and takes out prefabricated component, dry in 80-100 DEG C of baking oven
Dry process 2-3h, is placed again into prefabricated component in mould subsequently, 650-750 DEG C, again sinter 30-under 20-30MPa pressure
40min, release of finally lowering the temperature, i.e. obtain described encapsulation alloy material after being cooled to room temperature.
The invention have the advantage that
(1) encapsulating material of the present invention is using almag as base material, and blends the raw materials such as lithium, copper, boron, cerium oxide wherein,
Obtain the alloy material with excellent comprehensive mechanical property, this alloy material have lightweight, inhale ripple, damping noise reduction etc. excellent
Point, has prominent application advantage in automobile component field.
(2) alloy powder is first processed into Al-Mg alloy foam prefabricated component in technique by the present invention, and by Nano titanium nitride
Oozing with the form vacuum of colloidal sol and amass in alloy components, then prepare finished product after double sintering, this technological process improves to be received
The phenomenon that rice titanium nitride is easily reunited, it is thus achieved that good modified reinforced effects, improves the resistance to corrosion of material；Alloy material
Internal structure also there occurs change, there is certain pore structure, ensureing sqouynd absorption lowering noise effect on the basis of material thermal conductivity
Significantly, can improve the internal medium of automotive system, electronic unit is preferably protected, for manufacturing high performance automotive electronics system
System is laid a good foundation.
Detailed description of the invention
A kind of automotive electronics encapsulation Nano titanium nitride modification strengthens hydronalium, and this alloy material is by following weight
The raw material of part is made: magnesium 5%, lithium 4%, copper 2%, boron 1%, cerium oxide 0.1%, Nano titanium nitride colloidal sol 40%, pore creating material 1%, anhydrous second
Alcohol 0.5, surplus are aluminum.
Wherein Nano titanium nitride colloidal sol is formulated by following methods: Dodecyl trimethyl ammonium chloride puts into anhydrous second
In alcohol, stirring puts into Nano titanium nitride, sonic oscillation dispersion 5h to it after being completely dissolved, to obtain final product；Wherein Nano titanium nitride, anhydrous
Ethanol, the weight ratio of Dodecyl trimethyl ammonium chloride three are 1:5:0.1.
Wherein pore creating material is sodium chloride.
The preparation method of this alloy material comprises the following steps:
(1) first by aluminum, magnesium, lithium, copper, boron, cerium oxide, pore creating material, dehydrated alcohol mixing, powder is mixed with the rotating speed of 100 turns/min
10min, gained mixed material obtains green compact through compacting densification, is put into by green compact in mould hot under vacuum subsequently
Pressure sinter molding, sintering process is: system is warming up to 500 DEG C with the programming rate of 15 DEG C/min, adds when temperature reaches 450 DEG C
Pressure, pressure is 30MPa, and heat preservation sintering 50min naturally cools to release after room temperature subsequently, and products obtained therefrom is put into dissolution in water and made
It is dried after the agent of hole, obtains Al-Mg alloy foam prefabricated component standby；
(2) the Al-Mg alloy foam prefabricated component of step (1) gained is put in mould, be subsequently added Nano titanium nitride colloidal sol ,-
Ooze long-pending 60min under 0.01MPa, process terminate after recover normal pressure, take out prefabricated component, dried 3h in 80 DEG C of baking ovens, subsequently
Prefabricated component is placed again in mould, 750 DEG C, again sinter 40min under 30MPa pressure, release of finally lowering the temperature, be cooled to room
Described encapsulation alloy material is i.e. obtained after temperature.
Taking obtained material and prepare standard specimen, carry out performance test according to relevant criterion, test result is:
Density: 2.56g/cm3；Bending strength: 56MPa；Thermal conductivity: 202W/m.k；Thermal coefficient of expansion: 3.4 × 10-6m/k；Whether
Solderable: to be.
Claims (4)
1. an automotive electronics encapsulation Nano titanium nitride modification strengthens hydronalium, it is characterised in that this alloy material
It is made up of the raw material of following weight portion: magnesium 5-8%, lithium 4-5%, copper 2-3%, boron 1-2%, cerium oxide 0.1-0.2%, Nano titanium nitride
Colloidal sol 40-50%, pore creating material 1-2%, dehydrated alcohol 0.5-1, surplus are aluminum.
2. a kind of automotive electronics encapsulation Nano titanium nitride modification as claimed in claim 1 strengthens hydronalium, and it is special
Levying and be, described Nano titanium nitride colloidal sol is formulated by following methods: Dodecyl trimethyl ammonium chloride put into anhydrous
In ethanol, stirring puts into Nano titanium nitride, sonic oscillation dispersion 5-10h to it after being completely dissolved, to obtain final product；Wherein nano silicon nitride
Titanium, dehydrated alcohol, the weight ratio of Dodecyl trimethyl ammonium chloride three are 1:5:0.1.
3. a kind of automotive electronics encapsulation Nano titanium nitride modification as claimed in claim 1 strengthens hydronalium, and it is special
Levying and be, described pore creating material is the one in sodium chloride, sodium carbonate, spherical carbamide.
A kind of automotive electronics encapsulation Nano titanium nitride modification the most as claimed in claim 1 strengthens the preparation of hydronalium
Method, it is characterised in that described preparation method comprises the following steps:
(1) first by aluminum, magnesium, lithium, copper, boron, cerium oxide, pore creating material, dehydrated alcohol mixing, with 100-200 turn/rotating speed of min mixes
Powder 10-15min, gained mixed material obtains green compact through compacting densification, is put into by green compact in mould at vacuum bar subsequently
Thermocompressed sintering and forming under part, sintering process is: system is warming up to 500-550 DEG C with the programming rate of 15-20 DEG C/min, in temperature
Reaching pressurization when 450 DEG C, pressure is 30-50MPa, and heat preservation sintering 50-60min naturally cools to release after room temperature, gained subsequently
Product is put in water and is dried after dissolution pore creating material, obtains Al-Mg alloy foam prefabricated component standby；
(2) the Al-Mg alloy foam prefabricated component of step (1) gained is put in mould, be subsequently added Nano titanium nitride colloidal sol ,-
Oozing long-pending 40-60min under 0.01--0.05MPa, process recovers normal pressure after terminating, and takes out prefabricated component, dry in 80-100 DEG C of baking oven
Dry process 2-3h, is placed again into prefabricated component in mould subsequently, 650-750 DEG C, again sinter 30-under 20-30MPa pressure
40min, release of finally lowering the temperature, i.e. obtain described encapsulation alloy material after being cooled to room temperature.
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| CN102296218A (en) * | 2011-08-24 | 2011-12-28 | 吴江市精工铝字制造厂 | High-strength heat-resistant magnalium alloy |
| CN103540878A (en) * | 2013-09-24 | 2014-01-29 | 李伟 | Method for treating CeO2 reinforced Al-Si-Zn aluminum alloy |
| CN103556015A (en) * | 2013-11-20 | 2014-02-05 | 江苏江旭铸造集团有限公司 | Aluminum-magnesium alloy |
| CN104745894A (en) * | 2015-03-17 | 2015-07-01 | 江苏思莱姆智能科技有限公司 | Multiphase nano ceramic particle reinforced Al-based composite material and laser 3D printing forming method thereof |
| CN104894418A (en) * | 2015-07-01 | 2015-09-09 | 天津大学 | In-situ synthesized spinel whisker reinforced aluminum-based composite foam and preparation method thereof |
| CN105603265A (en) * | 2016-03-21 | 2016-05-25 | 中南大学 | Foam graphene skeleton reinforced aluminum-base composite material and preparation method thereof |
| CN105671354A (en) * | 2016-03-21 | 2016-06-15 | 中南大学 | Foam diamond skeleton reinforced aluminum-based composite material and preparation method thereof |
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2016
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| CN1676644A (en) * | 2005-04-26 | 2005-10-05 | 河北工业大学 | Ceramic granule reinforced aluminium-base composite material and its preparing method |
| CN101565176A (en) * | 2009-05-31 | 2009-10-28 | 四川大学 | Method for dispersing nanometer TiN powder |
| CN102296218A (en) * | 2011-08-24 | 2011-12-28 | 吴江市精工铝字制造厂 | High-strength heat-resistant magnalium alloy |
| CN103540878A (en) * | 2013-09-24 | 2014-01-29 | 李伟 | Method for treating CeO2 reinforced Al-Si-Zn aluminum alloy |
| CN103556015A (en) * | 2013-11-20 | 2014-02-05 | 江苏江旭铸造集团有限公司 | Aluminum-magnesium alloy |
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Application publication date: 20161026 |