CN106015994A - Embedded waterproof LED light source support - Google Patents
Embedded waterproof LED light source support Download PDFInfo
- Publication number
- CN106015994A CN106015994A CN201610529475.9A CN201610529475A CN106015994A CN 106015994 A CN106015994 A CN 106015994A CN 201610529475 A CN201610529475 A CN 201610529475A CN 106015994 A CN106015994 A CN 106015994A
- Authority
- CN
- China
- Prior art keywords
- light source
- led light
- main body
- gold
- insulating main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims abstract description 28
- 238000001746 injection moulding Methods 0.000 claims abstract description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 102100040160 Rabankyrin-5 Human genes 0.000 description 1
- 101710086049 Rabankyrin-5 Proteins 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention relates to the technical field of LED packaging, in particular to an embedded waterproof LED light source support which comprises an insulating main body and a conductive bent five-gold-piece, wherein the upper part of the insulating main body is provided with a mounting hole for mounting a light source, and the lower end of the conductive bent five-gold-piece extends out of the bottom of the insulating main body and then is bent to form an electric connection terminal. The conductive bending hardware sheet is formed in the insulating main body in an embedding and injection molding mode, so that the packaging quality of the embedded waterproof LED light source is improved, the contact area between the insulating main body and the electric connection terminal and between the insulating main body and the conductive bending hardware sheet is larger, the welding is better and tight, the conductive bending hardware sheet is completely sealed in the insulating main body, the contact between the conductive bending hardware sheet and moisture in the air is avoided, and the waterproof sealing performance is greatly improved; only need the waterproof glue of coating less thickness can guarantee to connect the terminal to completely isolated with external, reduced waterproof gluey use amount greatly, further reduced the processing cost of LED lamp plate.
Description
Technical field
The present invention relates to LED encapsulation technology field, refer in particular to a kind of embedded Waterproof LED
Light source bracket.
Background technology
Along with popularizing on a large scale of LED light source, LED is applied to all trades and professions already, and
Different applied environments, requires the most different to the aging resistance of LED light source.
Need such as outdoor display screen, outdoor lamp, LED when LED light source makees outdoor use
There is good water resistance, LED lamp holder, generally include a plastic body and some gold
Belonging to pin, it is solid that plastic body carries out location before injection mo(u)lding within mould to metallic pin
Fixed, after plastic body injection mo(u)lding, within metallic pin is i.e. embedded in plastic body, tradition
LED light source support complete the anti-of LED light source side face by this injection structure
Water, prevents water from penetrating into along metallic pin from LED light source side face, but actually used
During, will not be fused to completely with plastic body due to metallic pin together with, still can deposit
In gap, moisture still can penetrate into along metallic pin, therefore conventional LED chip support exists close
The shortcoming that envelope water resistance is bad, easily causes the problems such as LED chip is short-circuit, burn out.
Summary of the invention
The technical problem to be solved in the present invention is to provide one and avoids metal parts to expose completely,
Effectively prevent moisture from penetrating into the embedded Waterproof LED light source bracket in LED lamp.
In order to solve above-mentioned technical problem, the present invention adopts the following technical scheme that
A kind of embedded Waterproof LED light source bracket, including insulating body and to be embedded in insulation main
Internal conduction bending Five-gold-sheet, the top of insulating body offers the peace for installing light source
Dress hole, it is characterised in that: the lower end of described conduction bending Five-gold-sheet is from the bottom of insulating body
Electrical termination it is bent to form after stretching out.
Preferably, the outwards bending of described electrical termination, the outer end of this electrical termination with described absolutely
The sidewall of edge main body is concordant.
Preferably, the lateral wall surrounding of described insulating body is provided with evagination step.
Preferably, described installing hole is taper type, and the inwall of this installing hole is provided with inner convex platform
Rank, the height of this evagination step is more than the thickness of conduction bending Five-gold-sheet.
Preferably, described electrical termination sub and described conduction bending Five-gold-sheet is one-body molded.
Preferably, described conduction bending Five-gold-sheet takes shape in described by the way of embedding and injection molding
In insulating body.
The beneficial effects of the present invention is:
The invention provides a kind of embedded Waterproof LED light source bracket, at LED light source
Producing in encapsulation process, described conduction bending Five-gold-sheet takes shape in by the way of embedding and injection molding
In described insulating body, described electrical termination sub and described conduction bending Five-gold-sheet is one-body molded,
Not only increase the package quality of embedded Waterproof LED light source, insulating body and electrical termination
And the contact area between described conduction bending Five-gold-sheet is bigger, welding is more preferably tight, and lead
Electricity bending Five-gold-sheet is fully sealed in insulating body, has stopped itself and moisture in air
Contact, waterproof seal is greatly improved.It addition, the thickness of electrical termination is only
About 0.1-0.3MM, in the actual application of LED light source, is positioned at the electricity bottom insulating body
Connecting terminal is welded with pcb board by paster mode, only needs afterwards on pcb board
The marine glue of 0.15-0.35MM thickness to be coated can ensure electrical termination son with the external world completely every
Top-secret envelope, substantially reduces the usage amount of marine glue, reduce further adding of LED lamp panel
Work cost, cost performance is higher.
Accompanying drawing explanation
Fig. 1 is the sectional structure schematic diagram of the present invention embedded Waterproof LED light source bracket.
Fig. 2 is the plan structure schematic diagram of the present invention embedded Waterproof LED light source bracket.
Detailed description of the invention
For the ease of the understanding of those skilled in the art, below in conjunction with embodiment with accompanying drawing to this
Invention is further described, the content that embodiment is mentioned not limitation of the invention.
As depicted in figs. 1 and 2, a kind of embedded Waterproof LED light source bracket, including insulation
Main body 1 and the conduction bending Five-gold-sheet 2 being embedded in insulating body 1, insulating body 1 upper
Portion offers the installing hole 3 for installing light source, the lower end of described conduction bending Five-gold-sheet 2 from
The bottom of insulating body 1 is bent to form electrical termination 4 after stretching out.
In the production encapsulation process of LED light source, described conduction bending Five-gold-sheet 2 is by edge
The mode of embedding injection takes shape in described insulating body 1, and described electrical termination 4 is led with described
Electricity bending Five-gold-sheet 2 is one-body molded, not only increases embedded Waterproof LED light source bracket
Package quality, between insulating body 1 and electrical termination 4 and described conduction bending Five-gold-sheet 2
Contact area bigger, welding is more preferably tight, and conduction bending Five-gold-sheet 2 is fully sealed
In insulating body, having stopped its contacting with moisture in air, waterproof seal obtains very
Big raising.It addition, the thickness of electrical termination 4 is only about 0.1-0.3MM, LED light source
Actual application in, be positioned at electrical termination 4 bottom insulating body 1 by paster mode with
Pcb board welds, and needs only to afterwards coat 0.15-0.35MM thickness on pcb board
Marine glue can ensure electrical termination son 4 with the external world completely cut off sealing completely, substantially reduce anti-
The usage amount of glue, reduce further the processing cost of LED lamp panel, and cost performance is higher.
In the present embodiment, the lateral wall surrounding of described insulating body 1 is provided with evagination step
5, concrete, described installing hole 3 is taper type, and the inwall of this installing hole 3 is provided with convex
Step 6, the height of this evagination step 5 is more than the thickness of conduction bending Five-gold-sheet 2.Work as rainwater
When falling on insulating body 1, due to the setting of evagination step 5, moisture content rests on outer lug boss
Rank 5 and convex step 6, thus prevent part moisture content from flowing on pcb board, not only reduce
Moisture content contacts with LED lamp panel, has also speeded up the evaporation rate of moisture content in LED lamp bead,
Service life is longer.
In the present embodiment, described electrical termination 4 becomes with described conduction bending Five-gold-sheet 2 one
Type, it is main that described conduction bending Five-gold-sheet 2 takes shape in described insulation by the way of embedding and injection molding
In body 1, on the premise of ensureing LED light source support machining accuracy, simplify it and manufacture work
Sequence, improves the production efficiency of LED light source support.
Embodiment described above only have expressed one embodiment of the present invention, and it describes more
Concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.Should
When it is noted that for the person of ordinary skill of the art, without departing from structure of the present invention
On the premise of think of, it is also possible to make some deformation and improvement, these broadly fall into the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (6)
1. an embedded Waterproof LED light source bracket, including insulating body (1) and inlay
Conduction bending Five-gold-sheet (2) in insulating body (1), the top of insulating body (1)
Offer the installing hole (3) for installing light source, it is characterised in that: described conduction bending five
The lower end of gold plaque (2) is bent to form electrical termination after the bottom of insulating body (1) is stretched out
(4)。
Embedded Waterproof LED light source bracket the most according to claim 1, its feature
It is: described electrical termination (4) outwards bends.
Embedded Waterproof LED light source bracket the most according to claim 1, its feature
It is: the lateral wall surrounding of described insulating body (1) is provided with evagination step (5), should
The height of evagination step (5) is more than the thickness of conduction bending Five-gold-sheet (2).
Embedded Waterproof LED light source bracket the most according to claim 1, its feature
It is: described installing hole (3) is taper type, in the inwall of this installing hole (3) is provided with
Boss rank (6).
Embedded Waterproof LED light source bracket the most according to claim 1, its feature
It is: described electrical termination (4) is one-body molded with described conduction bending Five-gold-sheet (2).
Embedded Waterproof LED light source bracket the most according to claim 5, its feature
Be: described conduction bending Five-gold-sheet (2) take shape in by the way of embedding and injection molding described absolutely
In edge main body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610529475.9A CN106015994A (en) | 2016-07-06 | 2016-07-06 | Embedded waterproof LED light source support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610529475.9A CN106015994A (en) | 2016-07-06 | 2016-07-06 | Embedded waterproof LED light source support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106015994A true CN106015994A (en) | 2016-10-12 |
Family
ID=57107771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610529475.9A Pending CN106015994A (en) | 2016-07-06 | 2016-07-06 | Embedded waterproof LED light source support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106015994A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040232435A1 (en) * | 2003-02-28 | 2004-11-25 | Osram Opto Semiconductors Gmbh | Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body |
| CN101420002A (en) * | 2007-10-26 | 2009-04-29 | 宋文恭 | LED encapsulation construction and manufacturing method thereof |
| CN103117350A (en) * | 2011-11-17 | 2013-05-22 | 佛山市国星光电股份有限公司 | Surface-mounting highly-waterproof light emitting diode (LED) support used for outdoor display screen and products thereof |
| CN203823686U (en) * | 2014-03-18 | 2014-09-10 | 木林森股份有限公司 | Outdoor side-surface waterproof LED (light emitting diode) light source bracket |
| CN205919142U (en) * | 2016-07-06 | 2017-02-01 | 木林森股份有限公司 | Embedded waterproof LED light source support |
-
2016
- 2016-07-06 CN CN201610529475.9A patent/CN106015994A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040232435A1 (en) * | 2003-02-28 | 2004-11-25 | Osram Opto Semiconductors Gmbh | Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body |
| CN101420002A (en) * | 2007-10-26 | 2009-04-29 | 宋文恭 | LED encapsulation construction and manufacturing method thereof |
| CN103117350A (en) * | 2011-11-17 | 2013-05-22 | 佛山市国星光电股份有限公司 | Surface-mounting highly-waterproof light emitting diode (LED) support used for outdoor display screen and products thereof |
| CN203823686U (en) * | 2014-03-18 | 2014-09-10 | 木林森股份有限公司 | Outdoor side-surface waterproof LED (light emitting diode) light source bracket |
| CN205919142U (en) * | 2016-07-06 | 2017-02-01 | 木林森股份有限公司 | Embedded waterproof LED light source support |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161012 |